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STF200N12F7 N-channel 120 V, 3.9 mΩ typ., 70 A STripFET™ F7 Power MOSFET in a TO-220FP package Datasheet - preliminary data Prerelease product(s) Features Order code VDS RDS(on) max. ID PTOT STF200N12F7 120 V 4.6 mΩ 70 A 43 W Among the lowest RDS(on) on the market Excellent figure of merit (FOM ) Low Crss /Ciss ratio for EMI immunity High avalanche ruggedness Applications TO-220FP Figure 1: Internal schematic diagram Switching applications Description This N-channel Power MOSFET utilizes STripFET™ F7 technology with an enhanced trench gate structure that results in very low onstate resistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. Table 1: Device summary Order code Marking Package Packing STF200N12F7 200N12F7 TO-220FP Tube July 2015 DocID028113 Rev 1 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/11 www.st.com Contents STF200N12F7 Contents 1 Electrical ratings ............................................................................... 3 2 Electrical characteristics ................................................................. 4 3 Test circuits ...................................................................................... 6 4 Package information ........................................................................ 7 4.1 Revision history .............................................................................. 10 Prerelease product(s) 5 TO-220FP package information ........................................................ 8 2/11 DocID028113 Rev 1 STF200N12F7 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol Value Unit VDS Drain-source voltage 120 V VGS Gate source voltage ± 20 V Drain current (continuous) at TC = 25 °C 70 A ID(1) Drain current (continuous) at TC = 100 °C 50 A IDM(2) Drain current (pulsed) 280 A PTOT Total dissipation at TC = 25 °C 43 W EAS Single pulse avalanche energy TBD mJ Insulation withstand voltage (RMS) from all three leads to external heat sink( t = 1s; Tc= 25 °C) 2500 V -55 to 175 °C (3) VISO Prerelease product(s) Parameter TJ Operating junction temperature Tstg Storage temperature Notes: (1) Current limited by package (2) Pulse width limited by safe operating area (3) Starting Tj = 25°C, ID = TBD A, VDD = 60 V Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 3.5 °C/W Rthj-amb Thermal resistance junction-ambient 62.5 °C/W DocID028113 Rev 1 3/11 Electrical characteristics 2 STF200N12F7 Electrical characteristics (TC = 25 °C unless otherwise specified) Table 4: On /off states Symbol V(BR)DSS Parameter Test conditions Drain-source breakdown voltage VGS = 0 V, ID= 1mA Min. Typ. Max. Unit V 120 1 µA VGS= 0 V, VDS=120 V,TC= 125 °C 100 µA Gate-body leakage current VDS = 0 V, VGS = 20 V 100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 μA 4.5 V RDS(on) Static drain-source onresistance VGS = 10 V, ID = 35 A 3.9 4.6 mΩ Min. Typ. Max. Unit - 8100 - pF - 1300 - pF - 100 - pF - 110 - nC - TBD - nC - TBD - nC Min. Typ. Max. Unit - TBD - ns - TBD - ns - TBD - ns - TBD - ns IDSS Zero gate voltage drain current IGSS VGS= 0 V, VDS=120 V 2.5 Prerelease product(s) Table 5: Dynamic Symbol Parameter Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge Test conditions VDS = 60 V, f = 1 MHz,VGS= 0 V VDD = 60 V, ID = 70 A VGS = 10 V (see Figure 3: "Gate charge test circuit") Table 6: Switching times Symbol td(on) Turn-on delay time tr Rise time td(off) Turn-off delay time tf 4/11 Parameter Test conditions VDD = 60V, ID = 35 A, RG = 4.7 Ω, VGS = 10 V (see Figure 2: "Switching times test circuit for resistive load"and Figure 7: "Switching time waveform") Fall time DocID028113 Rev 1 STF200N12F7 Electrical characteristics Table 7: Source-drain diode Symbol VSD(1) Parameter Forward on voltage trr Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current Test conditions Min. Typ. Max. Unit 1.2 V ISD = 70A, VGS = 0 V - ISD = 70 A, di/dt = 100 A/µs VDD = 96 V (see Figure 4: "Test circuit for inductive load switching and diode recovery times") - TBD ns - TBD nC - TBD A Notes: (1) Prerelease product(s) Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID028113 Rev 1 5/11 Test circuits Prerelease product(s) 3 STF200N12F7 Test circuits Figure 2: Switching times test circuit for resistive load Figure 3: Gate charge test circuit Figure 4: Test circuit for inductive load switching and diode recovery times Figure 5: Unclamped inductive load test circuit Figure 6: Unclamped inductive waveform Figure 7: Switching time waveform 6/11 DocID028113 Rev 1 STF200N12F7 4 Package information Package information Prerelease product(s) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID028113 Rev 1 7/11 Package information 4.1 STF200N12F7 TO-220FP package information Prerelease product(s) Figure 8: TO-220FP package outline 8/11 DocID028113 Rev 1 STF200N12F7 Package information Table 8: TO-220FP package mechanical data mm Dim. Min. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 Prerelease product(s) Typ. 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 DocID028113 Rev 1 9/11 Revision history 5 STF200N12F7 Revision history Table 9: Document revision history Revision 16-Jul-2015 1 Prerelease product(s) Date 10/11 DocID028113 Rev 1 Changes First release. STF200N12F7 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. Prerelease product(s) ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID028113 Rev 1 11/11 ">
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