BALF-SPI2-02D3
Datasheet
50 Ω nominal input / conjugate matched balun to ST S2-LP, 433 MHz with integrated harmonic filter
Flip-Chip (6 bumps) package
Pinout diagram - Top view
GND ANT GND
RXP RXN
Product status
BALF-SPI2-02D3
TX
Features
• 50 Ω nominal input / conjugate matched to ST S2-LP for 433 MHz frequency operation
• Low insertion loss
• Low amplitude imbalance
• Low phase imbalance
• Small footprint
• Very low profile < 620 μm after reflow
• High RF performance
• RF BOM and area reduction
• ECOPACK ® 2 compliant component
Applications
• 433 MHz impedance matched balun filter
• Optimized for ST S2-LP sub GHz RFIC
Description
This device is an ultra-miniature balun. The BALF-SPI2-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST
S2-LP transceiver. The BALF-SPI2-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
DS12508 - Rev 1 - May 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1
BALF-SPI2-02D3
Characteristics
Characteristics
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Symbol Parameter
V
P
IN
ESD
Input power RF
IN
ESD ratings human body model (JESD22-A114), all I/O one at a time while others connected to
GND
T
OP
ESD ratings machine model (JESD22-A115), all I/O
Operating temperature
Value
20
Unit dBm
2000
V
200
-40 to +105 °C
Table 2. Impedances (T amb
= 25 °C)
Symbol
Z
RX
Z
TX
Z
ANT
Parameter
Nominal differential RX balun impedance
Nominal TX filter impedance
Antenna impedance
Min.
-
-
Value
Typ.
matched ST S2-LP
50
Max.
Unit
Ω
Ω
Symbol f
IL
RX-ANT
IL
TX-ANT
RL
RX-ANT
RL
TX-ANT ɸ imb
A imb
Att
Table 3. Electrical characteristics and RF performances (T amb
= 25 °C)
Parameter Test condition
Frequency range
Insertion loss in bandwidth without mismatch loss (RX balun)
Insertion loss in bandwidth without mismatch loss (TX filter)
Input return loss in bandwidth (RX balun)
Input return loss in bandwidth (TX filter)
Output phase imbalance (RX balun)
Output amplitude imbalance (RX balun)
Harmonic levels (TX filter)
Attenuation at 2fo
Attenuation at 3fo
Attenuation at 4fo
Attenuation at 5fo
Attenuation at 6fo
Attenuation at 7fo
11
6.5
-2.1
-1.1
52
53
54
54
55
56
Value
Min.
Typ.
Max.
433
1.95
2.20
3.15
3.60
12
8.0
58
63
55
55
56
57
2.1
1.1
Unit
MHz dB dB dB dB
° dB dB
DS12508 - Rev 1 page 2/13
BALF-SPI2-02D3
RF measurements (Rx balun)
1.1
RF measurements (Rx balun)
Figure 1. Insertion loss
0.0
(dB)
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
430 435 440 445 450 455 f(MHz)
460 465 470
1.5
(dB)
1.0
0.5
0.0
-0.5
-1.0
-1.5
430 435
Figure 3. Amplitude imbalance
440 445 450 455 f(MHz)
460 465 470
Figure 2. Return loss on antenna
-10
-15
0
(dB)
-5
-20
-25
430 435 440 445 450 455 460 f(MHz)
465 470
Figure 4. Phase imbalance
0
-1
-2
-2
3
2
4
(deg)
1
-4
430 435 440 445 450 455 460 f(MHz)
465 470
DS12508 - Rev 1 page 3/13
BALF-SPI2-02D3
RF measurements (Tx filter)
1.2
RF measurements (Tx filter)
Figure 5. Transmission
0
(dB)
-10
-20
-30
-40
-50
-60
-70
0.0
0.5
1.0
1.5
2.0
2.5
f(GHz)
3.0
3.5
Figure 6. Insertion loss
0.0
(dB)
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
430 435 440 445 450 455 f(MHz)
460 465 470
Figure 7. Return loss on antenna
0
(dB)
-5
-10
-15
-20
-25
430 435 440 445 450 455 460 f(MHz)
465 470
DS12508 - Rev 1 page 4/13
BALF-SPI2-02D3
ST S2-LP application diagram example
1.3
ST S2-LP application diagram example
Figure 8. ST S2-LP application diagram example
DS12508 - Rev 1 page 5/13
2
2.1
BALF-SPI2-02D3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
Flip-Chip 6 bumps package information
Figure 9. Flip-Chip 6 bumps package outline (bottom and side view) fD2 D1 D2 fD1 A2 A1
E
Diam : b
DS12508 - Rev 1
D
Parameter
D
D1
D2
E
E1 fD1 fD2 fE1 fE2
A
A1
A2 b
Table 4. Flip-Chip 6 bumps dimensions (in mm)
Min.
0.580
0.180
0.380
0.230
2.050
1.500
Typ.
0.630
0.205
0.400
0.255
2.100
1.210
0.500
1.550
1.060
0.195
0.195
0.195
0.295
A
Max.
0.680
0.230
0.420
0.280
2.150
1.600
page 6/13
BALF-SPI2-02D3
Flip-chip 6 bumps packing information
2.2
Flip-chip 6 bumps packing information
Figure 10. Marking
Dot, ST logo
ECOPACK grade xx = marking z = manufacturing location yww = datecode
x y x w z w
Figure 11. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
0.22
2.0
4.0
Ø 1.50
x yy x xx z w z
0.72
All dimensions are typical values in mm
1.64
4.0
User direction of unreeling z
DS12508 - Rev 1 page 7/13
3
PCB assembly recommendations
3.1
Land pattern
Figure 12. Recommended balun land pattern
BALF-SPI2-02D3
PCB assembly recommendations
Note: (*)Clearance 250 µm is needed to ensure good sensitivity.
(**)1000 µm length between S2-LP & balun (between center QFN pads to center IPD pads).
Figure 13. PCB stack-up recommendations
DS12508 - Rev 1 page 8/13
BALF-SPI2-02D3
Stencil opening design
3.2
Stencil opening design
Figure 14. Footprint - 3 mils stencil -non solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Figure 15. Footprint - 3 mils stencil - solder mask defined
Solder mask opening:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Copper pad diameter:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
Solder stencil opening:
220 µm recommended
Figure 16. Footprint - 5 mils stencil -non solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Figure 17. Footprint - 5 mils stencil - solder mask defined
Solder mask opening:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Copper pad diameter:
320 µm recommended
300 µm minimum
3.3
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Use solder paste with fine particles: powder particle size 20-38 µm.
DS12508 - Rev 1 page 9/13
BALF-SPI2-02D3
Placement
3.4
3.5
3.6
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3.
Standard tolerance of ±0.05 mm is recommended.
4.
1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open vias.
2.
The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
Reflow profile
Figure 18. ST ECOPACK ® recommended soldering reflow profile for PCB mounting
250
200
Temperature (°C)
2 - 3 °C/s
240-245 °C
60 sec
(90 max)
-2 °C/s
150
100
50
-3 °C/s
-6 °C/s
0 30
0.9 °C/s
60 90 120 150
Time (s)
180 210 240 270 300
Note:
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
More information is available in the application note:
• AN2348 Flip-Chip: “Package description and recommendations for use”
DS12508 - Rev 1 page 10/13
4
BALF-SPI2-02D3
Ordering information
Ordering information
Order code
BALF-SPI2-02D3
Marking
TN
Table 5. Ordering information
Package
Flip-Chip 6 bumps
Weight
3.4 mg
Base qty.
5000
Delivery mode
Tape and reel
DS12508 - Rev 1 page 11/13
BALF-SPI2-02D3
Revision history
Date
02-May-2018
Table 6. Document revision history
Revision
1 Initial release.
Changes
DS12508 - Rev 1 page 12/13
BALF-SPI2-02D3
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© 2018 STMicroelectronics – All rights reserved
DS12508 - Rev 1 page 13/13
