BALF-NRG-02D3
50 ohm nominal input / conjugate match to BlueNRG tranceiver, with integrated harmonic filter
Datasheet - production data
Description
This device is an ultra-miniature balun which integrates matching network and harmonics filter.
Matching impedance has been customized for the BlueNRG ST transceiver.
The BALF-NRG-02D3 uses STMicroelectronics
IPD technology on non-conductive glass substrate which optimizes RF performance.
Figure 1: Pin configuration (bump view)
Features
50 Ω nominal input / conjugate match to
BlueNRG device
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Benefits
Small footprint
RF BOM reduction
High RF performance
Applications
Bluetooth low energy impedance matched balun filter
Optimized for ST BlueNRG RFIC
June 2017 DocID030797 Rev 1 1/11 www.st.com
Application schematic
1 Application schematic
BALF-NRG-02D3
Figure 2: Application diagram example (refer to BlueNRG reference design)
2/11 DocID030797 Rev 1
BALF-NRG-02D3
2 Characteristics
Symbol
Characteristics
Table 1: Absolute maximum ratings (limiting values)
Value
Parameter
Min. Typ. Max.
Unit
P
IN
V
ESD
T
OP
Input power RFIN
ESD ratings human body model, all I/O one at a time while others connected to GND
ESD ratings machine model
(MM: C = 200 pF, R = 25 Ω, L = 500 nH)
Operating temperature
2000
200
-40
-
-
-
-
10
+105 dBm
V
°C
Symbol
Z
Z
I diff
ANT f
L
RL
SE
RL
DIFF
H2
H3
H4
H5
H6
H7
Φ imb
A imb
Table 2: Electrical characteristics (T amb
= 25 °C)
Definition
Nominal differential impedance
Nominal antenna impedance
Frequency range (bandwidth)
Insertion loss in bandwidth
Single ended return loss in bandwidth
Differential return loss in bandwidth
Second harmonic attenuation (differential mode)
Third harmonic attenuation (differential mode)
Fourth harmonic attenuation (differential mode)
Fifth harmonic attenuation (differential mode)
Fifth harmonic attenuation (differential mode)
Fifth harmonic attenuation (differential mode)
Output phase imbalance
Output amplitude imbalance
Value
Unit
Min. Typ. Max.
Match to BlueNRG
2400
Ω
50 Ω
2500 MHz
1.33 1.85
21 30
17 19
40 49
46 55 dB
42 50
31 56
29 45
30 42
-3.5 0 3.5 °
-1 0 1 dB
DocID030797 Rev 1 3/11
Characteristics
2.1 RF measurement
Figure 3: Differential transmission (dB)
BALF-NRG-02D3
Figure 4: Insertion loss (dB)
Figure 5: Return loss single ended (dB)
Figure 6: Return loss differential (dB)
Figure 7: H2 harmonic attenuation (dB) Figure 8: H3 harmonic attenuation (dB)
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BALF-NRG-02D3
Figure 9: H4 harmonic attenuation (dB)
Characteristics
Figure 10: H5 harmonic attenuation (dB)
Figure 11: H6 harmonic attenuation (dB) Figure 12: H7 harmonic attenuation (dB)
Figure 13: Amplitude imbalance in dB Figure 14: Phase imbalance in deg
DocID030797 Rev 1 5/11
Application information
3
3.1
Application information
BALF-NRG-02D3 with BlueNRG
Figure 15: Recommended balun land pattern
BALF-NRG-02D3
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BALF-NRG-02D3
4
4.1
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
CSPG 0.4 package information
Figure 16: CSPG package outline (bump view)
DocID030797 Rev 1 7/11
Package information
Figure 17: Footprint - 3 mils stencil -non solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
BALF-NRG-02D3
Figure 18: Footprint - 3 mils stencil - solder mask defined
Solder mask opening:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Copper pad diameter:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 19: Footprint - 5 mils stencil -non solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder stencil opening:
220 µm recommended
Figure 20: Footprint - 5 mils stencil - solder mask defined
Solder mask opening:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Copper pad diameter:
320 µm recommended
300 µm minimum
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
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BALF-NRG-02D3
4.2 CSPG 0.4 packing information
Figure 21: Marking
Package information
Figure 22: Flip Chip tape and reel specifications
More packing information is available in the application note:
AN2348 FlipChip: “Package description and recommendations for use”
DocID030797 Rev 1 9/11
Ordering information
5 Ordering information
Figure 23: Ordering information scheme
BALF-NRG-02D3
6
BAL F - NRG – 02 D3
Balun
Integrated Harmonics
Filter
Custom impedance
NRG = BlueNRG from STMicroelectronics
Package type
D3=Flip Chip on Glass
250µm ball diameter
Design version
Order code
BALF-NRG-02D3
Marking
Table 4: Ordering information
Package Weight Base qty.
TK CSPG 1.37 mg 5000
Delivery mode
Tape and reel
Revision history
Date
Table 5: Document revision history
Revision
23-Jun-2017 1 Initial release.
Changes
10/11 DocID030797 Rev 1
BALF-NRG-02D3
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– All rights reserved
DocID030797 Rev 1 11/11
