BALF-NRG-01D3
50 ohm nominal input / conjugate match balun balun to BlueNRG tranceiver, with integrated harmonic filter
Datasheet - production data
Flip-Chip (4 bumps) package
Description
STMicroelectronics BALF-NRG-01D3 is an ultra miniature balun. The BALF-NRG-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the
BlueNRG ST transceiver (both QFN and WLCSP versions). It is using STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Figure 1: Application schematic with QFN type
BlueNRG
Features
50 Ω nominal input / conjugate match to
BlueNRG device
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Wafer level chip scale package (WLCSP)
Benefits
Very low profile < 670 μm
High RF performance
RF BOM reduction
Small footprint
Applications
Bluetooth low energy impedance matched balun filter
Optimized for ST BlueNRG RFIC
Figure 2: Application schematic with WLCSP type
BlueNRG
Solder a 10u_0805 between 1-2 or a 0R0_0805 between 1-3
May 2017 DocID026543 Rev 5
This is information on a product in full production.
1/15 www.st.com
Characteristics
1 Characteristics
BALF-NRG-01D3
Symbol
P
IN
V
ESD
T
OP
Table 1: Absolute maximum ratings (limiting values)
Parameter
Value
Min. Typ. Max.
Input power RFIN
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω, air discharge)
ESD ratings machine model (MM: C = 200 pF, R = 25 W, L
= 500 nH)
Operating temperature
-
2000 -
200
-40
-
-
Unit
20 dBm
V
+105 °C
Table 2: Impedances (T amb
= 25 °C)
Value
Symbol Parameter Unit
Z
OUT
Z
IN
Nominal differential output impedance
Nominal input impedance
Min.
-
-
Typ.
Match to BlueNRG
50
Max.
-
-
Ω
Ω
Table 3: RF performance (T amb
= 25 °C)
Symbol Parameter Test condition
Value
Min. Typ. Max.
Unit f
S
11
S
21
Frequency range (bandwidth)
Input return loss bandwidth
Insertion loss
2400 2500 MHz dB dB
S
21 ɸ imb
A imb
Harmonic rejection (differential mode)
Output phase imbalance
Output amplitude imbalance
H2
H3
H4
H5
-20
-1.1
-8
-38
-31
-23
7
0.5 dB
° dB
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BALF-NRG-01D3
1.1 RF measurement
Figure 3: Differential transmission
0
-10
-20
-30
-40
-50
-60
-70
-80
0 dB
2 4 6 8 10 f(GHz)
12 14
Figure 5: Insertion loss
-0.8
dB
-0.9
-1.0
-1.1
-1.2
-1.3
-1.4
2.40
f(GHz)
2.42
2.44
2.46
2.48
2.50
Figure 7: H3 filtering
-30 dB
-35
-40
-45
-50
-55 f(GHz)
-60
7.20
7.25
7.30
7.35
7.40
7.45
7.50
-20 dB
-25
-30
-35
-40
-45
-50
9.60
Characteristics
Figure 4: Return loss
-19
-20 dB
-21
-22
-23
-24
-25
2.40
2.42
2.44
2.46
f(GHz)
2.48
2.50
Figure 6: H2 filtering
-5 dB
-7
-9
-11
-13
-15
4.80
4.84
4.88
4.92
f(GHz)
4.96
5.00
Figure 8: H4 filtering
9.70
9.80
9.90
f(GHz)
10
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Characteristics
Figure 9: H5 filtering
1.0
dB
BALF-NRG-01D3
Figure 10: Amplitude imbalance
-15 dB
-20
-25
-30 f(GHz)
-35
12.00
12.10
12.20
12.30
12.40
12.50
0.8
0.6
0.4
0.2
0
2.40
2.42
2.44
Figure 11: Phase imbalance
10 deg
8
6
4
2
0
2.40
2.42
2.44
2.46
f(GHz)
2.48
2.50
2.46
f(GHz)
2.48
2.50
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BALF-NRG-01D3
2
BALF-NRG-01D3 with QFN type BlueNRG
BALF-NRG-01D3 with QFN type BlueNRG
Figure 12: Application board EVB (2 layers)
Figure 13: Recommended balun land pattern (EVB)
254 µm
SMT = 320 µm
TOP and SPT = 220 µm
180 µm
DocID026543 Rev 5 5/15
BALF-NRG-01D3 with QFN type BlueNRG
2.1 BALF-NRG-01D3 measurements on QFN EVB
Figure 14: Harmonics
BALF-NRG-01D3
Figure 15: Sensitivity
6/15 DocID026543 Rev 5
BALF-NRG-01D3 BALF-NRG-01D3 with QFN type BlueNRG
Figure 16: P out
DocID026543 Rev 5 7/15
BALF-NRG-01D3 with WLCSP type BlueNRG
3
BALF-NRG-01D3
BALF-NRG-01D3 with WLCSP type BlueNRG
Figure 17: Recommended balun land pattern (WLCSP)
800 µm
220 µm
Figure 18: PCB stack-up recommendation
µ
µ
µ
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BALF-NRG-01D3
3.1
BALF-NRG-01D3 with WLCSP type BlueNRG
BALF-NRG-01D3 measurements on WLCSP EVB
Figure 19: Harmonics
Figure 20: Sensitivity
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BALF-NRG-01D3 with WLCSP type BlueNRG
Figure 21: P out
BALF-NRG-01D3
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BALF-NRG-01D3
4
4.1
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
Epoxy meets UL94, V0
Lead-free package
Flip-Chip 4 bumps package information
Figure 22: Flip-Chip 4 bumps package outline
Parameter
A
A1
A2 b
D
D1
E
E1
SE fD fE ccc
Ø
Table 4: Flip-Chip 5 bumps dimensions
Dimesions (in mm)
Min. Typ.
0.580
0.180
0.380
0.630
0.205
0.400
0.230
1.375
0.990
0.825
0.390
0.170
0.195
0.255
1.400
1.000
0.850
0.400
0.200
0.200
0.225
0.025
Max.
0.680
0.230
0.420
0.280
1.425
1.010
0.875
0.410
0.230
0.255
0.050
DocID026543 Rev 5 11/15
Package information
Figure 23: Footprint - 3 mils stencil -non solder mask defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
BALF-NRG-01D3
Figure 24: Footprint - 3 mils stencil - solder mask defined
Solder mask opening:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Copper pad diameter:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 25: Footprint - 5 mils stencil -non solder
Copper pad diameter: mask defined
220 µm recommended
180 µm minimum
260 µm maximum
Solder stencil opening:
220 µm recommended
Figure 26: Footprint - 5 mils stencil - solder mask defined
Solder mask opening:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Copper pad diameter:
320 µm recommended
300 µm minimum
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
12/15 DocID026543 Rev 5
BALF-NRG-01D3
4.2 Flip-chip 4 bumps packing information
Figure 27: Marking
Package information
Ball
A1
A2
B1
B2
Table 5: Document revision history
Name Description
ANT
GND
Rx_P
Rx_N
Antenna connection
Ground
Balun receive positive output
Balun receive negative output
Figure 28: Flip Chip tape and reel specifications
More packing information is available in the application note:
AN2348 FlipChip: “Package description and recommendations for use”
DocID026543 Rev 5 13/15
Ordering information
5
BALF-NRG-01D3
Ordering information
Order code
BALF-NRG-01D3
Marking
SV
Table 6: Ordering information
Package Weight Base qty.
Flip-Chip package
(4 bumps)
1.35 mg 5000
Delivery mode
Tape and reel (7'')
6 Revision history
Date Revision
Table 7: Document revision history
Changes
17-Jun-2014
17-Jul-2014
18-Aug-2014
29-Sep-2015
1
2
3
4
5
Initial release.
Updated Figure 13, Figure 17, Figure 22 and package view on cover page. Corrected typo error on Table 2.
Updated title and description in cover page.
Updated Figure 22. Added Figure 25 and Figure 26. Reformatted to current standards.
Updated Figure 2: "Application schematic with WLCSP type BlueNRG" .
04-May-2017
14/15 DocID026543 Rev 5
BALF-NRG-01D3
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– All rights reserved
DocID026543 Rev 5 15/15
