- Computers & electronics
- Computer components
- System components
- Motherboards
- Congatec
- conga-TS170
- User manual
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8.2
8.2.1
8.2.2
Intel
®
Processor Features
Intel
®
Turbo Boost Technology
Intel ® Turbo Boost Technology allows processor cores to run faster than the base operating frequency if it’s operating below power, current, and temperature specification limits. Intel ® Turbo Boost Technology is activated when the Operating System (OS) requests the highest processor performance state. The maximum frequency of Intel ® Turbo Boost Technology is dependent on the number of active cores. The amount of time the processor spends in the Intel Turbo Boost 2 Technology state depends on the workload and operating environment. Any of the following can set the upper limit of Intel ® Turbo Boost Technology on a given workload:
• Number of active cores
• Estimated current consumption
• Estimated power consumption
• Processor temperature
When the processor is operating below these limits and the user’s workload demands additional performance, the processor frequency will dynamically increase by 100 MHz on short and regular intervals until the upper limit is met or the maximum possible upside for the number of active cores is reached. For more information about Intel ® Turbo Boost 2 Technology visit the Intel ® website.
Note
Only conga-TS170 module variants that feature the Xeon, Core™ i7 and i5 processors support Intel ® Turbo Boost 2 Technology .
Refer to the power consumption tables in section 2.5 of this document for information about the maximum turbo frequency available for each variant of the conga-TS170.
Adaptive Thermal Monitor and Catastrophic Thermal Protection
Intel ® Xeon, Core™ i7/i5/i3 and Celeron ® processors have a thermal monitor feature that helps to control the processor temperature. The integrated TCC (Thermal Control Circuit) activates if the processor silicon reaches its maximum operating temperature. The activation temperature that the Intel ® Thermal Monitor uses to activate the TCC can be slightly modified via TCC Activation Offset in BIOS setup submenu “CPU submenu”.
The Adaptive Thermal Monitor controls the processor temperature using two methods:
• Adjusting the processor’s operating frequency and core voltage (EIST transitions)
• Modulating (start/stop) the processor’s internal clocks at a duty cycle of 25% on and 75% off
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Table of contents
- 11 1 Introduction
- 14 2 Specifications
- 14 Feature List
- 15 Supported Operating Systems
- 15 Mechanical Dimensions
- 16 Supply Voltage Standard Power
- 16 Electrical Characteristics
- 16 Rise Time
- 17 Power Consumption
- 18 Supply Voltage Battery Power
- 19 Environmental Specifications
- 20 Block Diagram
- 21 Cooling Solutions
- 21 CSA Dimensions
- 22 CSP Dimensions
- 23 4.3 Heatspreader
- 25 Heatspreader Thermal Imagery
- 26 Onboard Temperature Sensors
- 28 Connector Rows
- 28 Primary Connector Rows A and B
- 28 Serial ATA™ (SATA)
- 28 High Definition Audio (HDA) Interface
- 29 Gigabit Ethernet
- 29 LPC Bus
- 29 I²C Bus Fast Mode
- 29 PCI Express
- 30 6.1.8 ExpressCard
- 30 6.1.9 VGA
- 30 6.1.10 LVDS/eDP
- 31 General Purpose Serial Interface
- 31 6.1.12 GPIOs
- 31 Power Control
- 35 Power Management
- 36 Secondary Connector Rows C and D
- 36 PCI Express
- 36 PCI Express Graphics (PEG)
- 37 Digital Display Interface
- 38 6.2.3.1 HDMI
- 38 6.2.3.2 DVI
- 38 DisplayPort (DP)
- 40 Additional Features
- 40 congatec Board Controller (cBC)
- 40 Board Information
- 40 7.3 Watchdog
- 40 C Bus
- 40 Power Loss Control
- 41 OEM BIOS Customization
- 41 OEM Default Settings
- 41 OEM Boot Logo
- 41 OEM POST Logo
- 41 OEM BIOS Code/Data
- 42 OEM DXE Driver
- 42 congatec Battery Management Interface
- 42 API Support (CGOS)
- 43 Security Features
- 43 Suspend to Ram
- 44 conga Tech Notes
- 44 PCH Features
- 44 Rapid Storage Technology
- 44 8.1.1.1 AHCI
- 44 8.1.1.2 RAID
- 44 Smart Response Technology
- 45 Processor Features
- 45 Turbo Boost Technology
- 46 Processor Performance Control
- 47 64 Architecture
- 47 Virtualization Technology
- 48 Thermal Management
- 49 ACPI Suspend Modes and Resume Events
- 49 DDR4 Memory
- 50 Signal Descriptions and Pinout Tables
- 51 A-B Connector Signal Descriptions
- 60 A-B Connector Pinout
- 62 C-D Connector Signal Descriptions
- 71 C-D Connector Pinout
- 73 Boot Strap Signals
- 74 System Resources
- 74 I/O Address Assignment
- 74 LPC Bus
- 75 PCI Configuration Space Map
- 76 SM Bus
- 77 BIOS Setup Description
- 77 Entering the BIOS Setup Program
- 77 Boot Selection Popup
- 77 Setup Menu and Navigation
- 78 Main Setup Screen
- 79 Platform Information Submenu
- 80 Advanced Setup
- 81 Graphics Submenu
- 85 Display Interface Signal Integrity Settings Submenu
- 86 Watchdog Submenu
- 88 Module Serial Ports Submenu
- 89 Hardware Health Monitoring Submenu
- 90 Ethernet Connection (H) I219-LM Submenu
- 90 NIC Configuration Submenu
- 90 Driver Health Submenu
- 91 Trusted Computing Submenu
- 91 RTC Wake Settings Submenu
- 91 ACPI Submenu
- 92 ICC Submenu
- 93 AMT Configuration Submenu
- 94 PCH-FW Configuration Submenu
- 94 SMART Settings Submenu
- 95 Super IO Submenu
- 95 Serial Port Console Redirection Submenu
- 96 11.4.15.1 Console Redirection Settings Submenu
- 97 CPU Submenu
- 101 Secure Erase Submenu
- 101 SATA Submenu
- 103 11.4.18.1 Software Feature Mask Configuration
- 104 Acoustic Management Submenu
- 104 PCI Express Configuration Submenu
- 105 11.4.20.1 BIOS Hot Plug Settings Submenu
- 106 PCI Express Configuration Submenu
- 107 11.4.21.1 PCI Express Gen3 Eq Lanes Submenu
- 107 11.4.21.2 PCI Express Settings Submenu
- 108 11.4.21.3 PCI Express GEN2 Settings Submenu
- 109 11.4.21.4 PCI Express Port 0 - 7 Submenu
- 111 11.4.21.5 PCI Express Graphics (PEG) Port Submenu
- 113 UEFI Network Stack Submenu
- 114 CSM & Option ROM Control Submenu
- 115 NVMe Configuration Submenu
- 115 SDIO Configuration Submenu
- 115 USB Submenu
- 116 Diagnostics Settings Submenu
- 117 PC Speaker Submenu
- 118 Chipset Setup
- 118 Processor (Integrated Components) Submenu
- 119 DMI/OPI Configuration Submenu
- 120 Memory Configuration Submenu
- 122 Platform Controller Hub (PCH) Submenu
- 123 Platform Thermal Configuration Submenu
- 124 Security Setup
- 124 Security Settings
- 124 BIOS Security Features
- 127 Hard Disk Security Features
- 128 Boot Setup
- 128 Boot Settings Configuration
- 130 Save & Exit Menu
- 131 Additional BIOS Features
- 131 Supported Flash Devices
- 131 Updating the BIOS
- 132 Industry Specifications