Package information
7.5.1 Reference documents
STM32MP157C/F
JESD51-6 Integrated Circuit Thermal Test Method Environmental Conditions - Forced
Convection (Moving Air). Available from www.jedec.org.
JESD51-8 Integrated Circuit Thermal Test Method Environmental Conditions —Junction-to-
Board. Available from www.jedec.org.
JESD51-9 Test Boards for Area Array Surface. Mount Package Thermal. Measurements.
Available from www.jedec.org.
JESD51-12 Guidelines for Reporting and Using Electronic Package Thermal Information.
Available from www.jedec.org.
256/262 DS12505 Rev 6
