STM32F072x8 STM32F072xB Electrical characteristics
Table 27. Programmable voltage detector characteristics (continued)
Symbol Parameter Conditions Min Typ Max
V
PVD4
V
PVD5
V
PVD6
V
PVD7
PVD threshold 4
PVD threshold 5
PVD threshold 6
PVD threshold 7
V
PVDhyst
(1)
I
DD(PVD)
PVD hysteresis
PVD current consumption
1. Guaranteed by design, not tested in production.
Rising edge
Falling edge
Rising edge
Falling edge
Rising edge
Falling edge
Rising edge
Falling edge
-
-
2.66
2.56
2.76
2.66
2.47
2.37
2.57
2.47
-
-
2.58
2.69
2.48
2.59
2.68
2.79
2.58
2.69
2.78
2.68
2.88
2.78
2.9
2.8
3
2.9
100 -
0.15
0.26
(1)
Unit
V
V
V
V
V
V
V
V mV
µA
6.3.5
The parameters given in
Table 28 are derived from tests performed under the ambient
temperature and supply voltage conditions summarized in Table 24: General operating conditions
.
Symbol
Table 28. Embedded internal reference voltage
Parameter Conditions Min Typ Max Unit
V
∆ t t
REFINT
START
S_vrefint
V
REFINT
Internal reference voltage –40 °C < T
A
< +105 °C
ADC_IN17 buffer startup time
-
ADC sampling time when reading the internal reference voltage
Internal reference voltage spread over the temperature range
V
DDA
-
= 3 V
T
Coeff
Temperature coefficient
1. Guaranteed by design, not tested in production.
-
1.2
1.23
1.25
-
4
(1)
-
- 100
(1)
-
-
10
(1)
-
10
(1)
V
µs
µs mV
100
(1) ppm/°C
Supply current characteristics
The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code.
The current consumption is measured as described in
Figure 14: Current consumption measurement scheme
.
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Electrical characteristics STM32F072x8 STM32F072xB
All Run-mode current consumption measurements given in this section are performed with a reduced code that gives a consumption equivalent to CoreMark code.
Typical and maximum current consumption
The MCU is placed under the following conditions:
• All I/O pins are in analog input mode
• All peripherals are disabled except when explicitly mentioned
• The Flash memory access time is adjusted to the f
HCLK
frequency:
– 0 wait state and Prefetch OFF from 0 to 24 MHz
– 1 wait state and Prefetch ON above 24 MHz
• When the peripherals are enabled f
PCLK
= f
HCLK
The parameters given in
Table 29 to
Table 31 are derived from tests performed under
ambient temperature and supply voltage conditions summarized in
Table 24: General operating conditions
.
I
DD
Table 29. Typical and maximum current consumption from V
DD
supply at V
DD
= 3.6 V
All peripherals enabled All peripherals disabled
Conditions f
HCLK
Max @ T
A
(1)
Max @ T
A
(1)
Typ Typ
25 °C 85 °C 105 °C 25 °C 85 °C 105 °C
Unit
HSI48
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
48 MHz 24.3
48 MHz 24.1
32 MHz 16.0
24 MHz 12.3
8 MHz 4.52
1 MHz 1.25
48 MHz 24.1
32 MHz 16.1
24 MHz 12.4
HSI clock,
PLL off
8 MHz 4.52
1.39
27.1
18.2
14.0
26.9
26.8
18.3
13.7
5.25
5.25
1.58
27.6
18.9
14.4
27.2
27.0
18.6
14.3
5.28
5.35
1.87
27.8
19.3
14.8
27.9
27.7
19.2
14.7
5.61
5.61
13.1
14.8
13.0
14.6
8.76
9.56
7.36
7.94
2.89
3.17
0.93
1.06
12.9
14.7
8.82
9.69
7.31
7.92
2.87
3.16
1.15
14.9
9.83
8.34
14.9
14.8
9.73
8.37
3.26
3.25
mA
1.34
15.5
10.7
8.75
15.5
15.4
10.6
8.81
3.34
3.33
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STM32F072x8 STM32F072xB Electrical characteristics
Table 29. Typical and maximum current consumption from V
DD
supply at V
DD
= 3.6 V (continued)
All peripherals enabled All peripherals disabled
Conditions f
HCLK
Max @ T
A
(1)
Max @ T
A
(1)
Unit
Typ Typ
25 °C 85 °C 105 °C 25 °C 85 °C 105 °C
HSI48
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
48 MHz 23.1
25.4
48 MHz 23.0
25.3
(2)
32 MHz 15.4
24 MHz 11.4
8 MHz 4.21
17.3
12.9
4.6
1 MHz 0.78
48 MHz 23.1
32 MHz 15.4
24 MHz 11.5
0.9
24.5
17.4
13.0
0.92
25.0
17.7
13.6
25.8
26.6
25.7
26.5
(2)
17.8
13.5
4.89
18.3
13.7
5.25
1.15
25.2
18.2
13.9
12.8
13.5
12.6 13.3
(2)
7.96
8.92
6.48
8.04
2.07
2.3
0.36
0.48
12.6
13.7
8.05
8.85
6.49
8.06
0.59
13.9
9.16
8.21
13.7
13.9
13.5
13.8
(2)
9.17
8.23
2.35
9.73
8.41
2.94
0.82
14.0
9.94
8.47
I
DD
HSI clock,
PLL off
HSI48
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
8 MHz 4.34
4.75
48 MHz 15.1
16.6
48 MHz 15.0
16.5
(2)
32 MHz 9.9
11.4
24 MHz 7.43
8 MHz 2.83
1 MHz 0.42
48 MHz 15.0
32 MHz 9.93
24 MHz 7.53
8.17
3.09
0.54
17.2
11.3
8.45
5.03
5.41
16.8
17.5
16.7
17.3
(2)
11.6
11.9
8.71
3.26
0.55
17.3
11.6
8.87
8.82
3.66
0.67
17.9
11.7
8.95
2.11
2.36
3.08
3.43
2.93 3.28
(2)
2.0
2.24
1.63
1.82
0.76
0.88
0.28
0.39
3.04
3.37
2.11
2.35
1.64
1.83
2.38
2.98
3.56
3.61
3.41
3.46
(2)
2.32
2.49
1.88
0.91
0.41
3.41
2.44
1.9
1.9
0.93
0.43
3.46
2.65
1.93
HSI clock,
PLL off
8 MHz 2.95
3.24
3.41
3.8
0.8
0.92
0.94
0.97
1. Data based on characterization results, not tested in production unless otherwise specified.
2. Data based on characterization results and tested in production (using one common test limit for sum of I
DD
and I
DDA
).
mA
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Electrical characteristics STM32F072x8 STM32F072xB
Symbol
Table 30. Typical and maximum current consumption from the V
DDA
supply
V
DDA
= 2.4 V V
DDA
= 3.6 V
Parameter
Conditions
(1) f
HCLK
Typ
Max @ T
A
(2)
Typ
Max @ T
A
(2)
25 °C 85 °C 105 °C 25 °C 85 °C 105 °C
Unit
I
DDA
Supply current in
Run or
Sleep mode, code executing from
Flash memory or RAM
HSI48
HSE bypass,
PLL on
HSE bypass,
PLL off
HSI clock,
PLL on
48 MHz 311 326
48 MHz 152 170
(3)
32 MHz
8 MHz
1 MHz
105
24 MHz 81.9
2.7
2.7
121
95.9
3.8
3.8
48 MHz 223 244
32 MHz 176 195
24 MHz 154 171
334
178 182
126
99.5
4.3
4.3
255
203
178
343
(3)
128
4.6
260
206
181
322 337 345
165 184
(3)
196
354
200
(3)
113 129 136 138
101 88.7
102 107
4.6
3.6
4.7
5.2
3.6
4.7
5.2
245 265 279
193 212 221
168 185 192
108
5.5
5.5
284
224
195
µA
HSI clock,
PLL off
8 MHz 74.2
83.4
86.4
87.3
83.4
92.5
95.3
96.6
1. Current consumption from the V in Run or Sleep mode or executing from Flash memory or RAM. Furthermore, when the PLL is off, I the frequency.
DDA
supply is independent of whether the digital peripherals are enabled or disabled, being
DDA
is independent from
2. Data based on characterization results, not tested in production unless otherwise specified.
3. Data based on characterization results and tested in production (using one common test limit for sum of I
DD
and I
DDA
).
58/128 DS9826 Rev 6
STM32F072x8 STM32F072xB Electrical characteristics
Symbol
Table 31. Typical and maximum consumption in Stop and Standby modes
Typ @V
DD
(V
DD
= V
DDA
) Max
(1)
Parameter
Conditions
2.0 V 2.4 V 2.7 V 3.0 V 3.3 V 3.6 V
T
A
=
25 °C
T
A
=
85 °C
T
A
=
105 °C
Unit
I
I
DD
DDA
Supply current in
Stop mode
Regulator in run mode, all oscillators OFF
Regulator in lowpower mode, all oscillators OFF
Supply current in
Standby mode
LSI ON and IWDG
ON
LSI OFF and IWDG
OFF
Supply current in
Stop mode
Supply current in
Standby mode
Supply current in
Stop mode
Supply current in
Standby mode
Regulator in run mode, all oscillators
OFF
Regulator in low-power mode, all oscillators
OFF
LSI ON and
IWDG ON
LSI OFF and
IWDG OFF
Regulator in run mode, all oscillators
OFF
Regulator in low-power mode, all oscillators
OFF
LSI ON and
IWDG ON
LSI OFF and
IWDG OFF
15.4
15.5
15.6
15.7
15.8
15.9
23
(2)
3.2
0.8
0.6
2.1
2.1
2.5
1.9
1.3
1.3
1.7
1.2
3.3
1.0
0.7
2.2
2.2
2.7
2.1
1.3
1.3
1.8
1.2
3.4
1.1
0.9
2.3
2.3
2.8
2.2
1.4
1.4
1.9
1.2
3.5
1.2
0.9
2.5
2.5
3.0
2.3
1.4
1.4
2.0
1.3
3.6
1.3
1.0
2.6
2.6
3.2
2.5
1.5
1.5
2.1
1.3
3.7
1.4
1.1
2.8
2.8
3.5
2.6
1.5
1.5
2.2
1.4
8
-
-
-
-
-
(2)
2.1
3.5
3.5
-
3.5
(2)
(2)
(2)
(2)
49
33
-
2.6
3.6
3.6
-
3.6
-
-
-
-
68
51
-
3.1
4.6
4.6
-
4.6
-
-
-
-
(2)
(2)
(2)
(2)
(2)
(2)
1. Data based on characterization results, not tested in production unless otherwise specified.
2. Data based on characterization results and tested in production (using one common test limit for sum of I
DD
and I
DDA
).
µA
DS9826 Rev 6 59/128
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Electrical characteristics STM32F072x8 STM32F072xB
Table 32. Typical and maximum current consumption from the V
BAT
supply
Typ @ V
BAT
Max (1)
Symbol Parameter Conditions
T
A
=
25 °C
T
A
=
85 °C
T
A
=
105 °C
Unit
I
DD_VBAT
RTC domain supply current
LSE & RTC ON; “Xtal mode”: lower driving capability;
LSEDRV[1:0] = '00'
LSE & RTC ON; “Xtal mode” higher driving capability;
LSEDRV[1:0] = '11'
0.5
0.8
0.6
0.9
1. Data based on characterization results, not tested in production.
0.7
1.1
0.8
1.2
1.1
1.4
1.2
1.6
1.3
1.7
1.7
2.1
2.3
2.8
µA
Typical current consumption
The MCU is placed under the following conditions:
• V
DD
= V
DDA
= 3.3 V
• All I/O pins are in analog input configuration
• The Flash memory access time is adjusted to f
HCLK
frequency:
– 0 wait state and Prefetch OFF from 0 to 24 MHz
– 1 wait state and Prefetch ON above 24 MHz
• When the peripherals are enabled, f
PCLK
= f
HCLK
• PLL is used for frequencies greater than 8 MHz
• AHB prescaler of 2, 4, 8 and 16 is used for the frequencies 4 MHz, 2 MHz, 1 MHz and
500 kHz respectively
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Table 33. Typical current consumption, code executing from Flash memory,
running from HSE 8 MHz crystal
Typical consumption in
Run mode
Typical consumption in
Sleep mode
Symbol Parameter f
HCLK
Unit
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
I
DD
I
DDA
48 MHz
36 MHz
32 MHz
Current consumption from V
DD supply
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
48 MHz
36 MHz
32 MHz
Current consumption from V
DDA supply
24 MHz
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
24.1
18.3
16.5
12.9
8.9
4.8
3.1
2.1
1.6
1.3
163.3
124.3
111.9
87.1
62.5
2.5
2.5
2.5
2.5
2.5
13.5
10.5
9.6
7.6
5.3
3.1
2.1
1.6
1.3
1.2
14.6
11.1
10.0
7.8
5.5
3.1
2.2
1.6
1.4
1.2
2.2
1.7
1.2
1.1
3.5
2.9
2.7
1.0
1.0
1.0
mA
μ A
I/O system current consumption
The current consumption of the I/O system has two components: static and dynamic.
I/O static current consumption
All the I/Os used as inputs with pull-up generate current consumption when the pin is externally held low. The value of this current consumption can be simply computed by using the pull-up/pull-down resistors values given in
Table 53: I/O static characteristics
.
For the output pins, any external pull-down or external load must also be considered to estimate the current consumption.
Additional I/O current consumption is due to I/Os configured as inputs if an intermediate voltage level is externally applied. This current consumption is caused by the input Schmitt
DS9826 Rev 6 61/128
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Electrical characteristics STM32F072x8 STM32F072xB trigger circuits used to discriminate the input value. Unless this specific configuration is required by the application, this supply current consumption can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should be configured as analog inputs.
Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently, as a result of external electromagnetic noise. To avoid current consumption related to floating pins, they must either be configured in analog mode, or forced internally to a definite digital value. This can be done either by using pull-up/down resistors or by configuring the pins in output mode.
I/O dynamic current consumption
In addition to the internal peripheral current consumption measured previously (see
Table 35: Peripheral current consumption ), the I/Os used by an application also contribute
to the current consumption. When an I/O pin switches, it uses the current from the I/O supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load
(internal or external) connected to the pin:
I
SW
= V
DDIOx
×
f
SW
×
C where
I
SW
is the current sunk by a switching I/O to charge/discharge the capacitive load
V
DDIOx
is the I/O supply voltage f
SW
is the I/O switching frequency
C is the total capacitance seen by the I/O pin: C = C
INT
+ C
EXT
+ C
S
C
S
is the PCB board capacitance including the pad pin.
The test pin is configured in push-pull output mode and is toggled by software at a fixed frequency.
62/128 DS9826 Rev 6
STM32F072x8 STM32F072xB Electrical characteristics
Symbol
I
SW
Table 34. Switching output I/O current consumption
Parameter Conditions
(1)
I/O toggling frequency (f
SW
)
I/O current consumption
V
DDIOx
= 3.3 V
C =C
INT
V
DDIOx
= 3.3 V
C
EXT
= 0 pF
C = C
INT
+ C
EXT
+ C
S
V
DDIOx
= 3.3 V
C
EXT
= 10 pF
C = C
INT
+ C
EXT
+ C
S
V
DDIOx
= 3.3 V
C
EXT
= 22 pF
C = C
INT
+ C
EXT
+ C
S
V
DDIOx
= 3.3 V
C
EXT
= 33 pF
C = C
INT
+ C
EXT
+ C
S
V
DDIOx
= 3.3 V
C
EXT
= 47 pF
C = C
INT
+ C
EXT
+ C
S
C = C int
V
DDIOx
= 2.4 V
C
EXT
= 47 pF
C = C
INT
+ C
EXT
+ C
S
C = C int
4 MHz
48 MHz
4 MHz
8 MHz
16 MHz
24 MHz
48 MHz
4 MHz
8 MHz
8 MHz
16 MHz
24 MHz
48 MHz
4 MHz
8 MHz
16 MHz
24 MHz
16 MHz
24 MHz
4 MHz
8 MHz
16 MHz
24 MHz
4 MHz
8 MHz
16 MHz
4 MHz
8 MHz
16 MHz
24 MHz
1. C
S
= 7 pF (estimated value).
Typ
0.07
2.188
0.32
0.64
1.25
2.23
4.442
0.49
0.94
0.18
0.37
0.76
1.39
0.15
0.31
0.53
0.92
3.24
5.02
0.81
1.7
2.38
3.99
0.64
1.25
3.67
0.66
1.43
2.45
4.97
Unit mA
DS9826 Rev 6 63/128
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Electrical characteristics STM32F072x8 STM32F072xB
On-chip peripheral current consumption
The current consumption of the on-chip peripherals is given in
Table 35 . The MCU is placed
under the following conditions:
• All I/O pins are in analog mode
• All peripherals are disabled unless otherwise mentioned
• The given value is calculated by measuring the current consumption
– with all peripherals clocked off
– with only one peripheral clocked on
•
Ambient operating temperature and supply voltage conditions summarized in Table 21:
Voltage characteristics
• The power consumption of the digital part of the on-chip peripherals is given in
Table 35 . The power consumption of the analog part of the peripherals (where
applicable) is indicated in each related section of the datasheet.
AHB
Table 35. Peripheral current consumption
Peripheral Typical consumption at 25 °C
BusMatrix
(1)
CRC
DMA
Flash memory interface
GPIOA
GPIOB
GPIOC
GPIOD
GPIOE
GPIOF
SRAM
TSC
All AHB peripherals
2.3
1.9
2.2
1.2
0.9
5.0
52.6
2.2
1.6
5.7
13.0
8.2
8.5
Unit
µA/MHz
64/128 DS9826 Rev 6
STM32F072x8 STM32F072xB Electrical characteristics
APB
Table 35. Peripheral current consumption (continued)
Peripheral Typical consumption at 25 °C
APB-Bridge
(2)
2.8
ADC (3) 4.1
CAN
CEC
CRS
DAC
(3)
12.4
1.5
0.8
4.7
DEBUG (MCU debug feature)
I2C1
I2C2
PWR
0.1
3.9
4.0
1.3
SPI1
SPI2
SYSCFG & COMP
TIM1
TIM2
TIM3
TIM6
TIM7
8.7
8.5
1.7
14.9
15.5
11.4
2.5
2.3
TIM14
TIM15
TIM16
TIM17
USART1
USART2
USART3
USART4
USB
WWDG
All APB peripherals
5.4
5.4
7.2
1.4
182
5.3
9.1
6.6
6.8
17.0
16.7
Unit
µA/MHz
1. The BusMatrix is automatically active when at least one master is ON (CPU, DMA).
2. The APB Bridge is automatically active when at least one peripheral is ON on the Bus.
3. The power consumption of the analog part (I
DDA
) of peripherals such as ADC, DAC, Comparators, is not included. Refer to the tables of characteristics in the subsequent sections.
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