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TS4990
1
Absolute maximum ratings and operating conditions
Absolute maximum ratings and operating conditions
Table 1.
Symbol
Absolute maximum ratings (AMR)
V
CC
V in
T oper
T stg
T j
Parameter
Supply voltage
(1)
Input voltage
(2)
Operating free-air temperature range
Storage temperature
Maximum junction temperature
R thja
Thermal resistance junction to ambient
Flip-chip
(3)
MiniSO-8
DFN8
Value
6
GND to V
CC
-40 to + 85
-65 to +150
150
Unit
V
V
°C
°C
°C
P diss
ESD
Power dissipation
HBM: Human body model
(4)
MM: Machine model
(5)
Latch-up immunity
250
215
120
Internally limited
2
200
200
°C/W kV
V mA
Lead temperature (soldering, 10sec)
Lead temperature (soldering, 10sec) for lead-free version
250
260
°C
1.
All voltage values are measured with respect to the ground pin.
2.
The magnitude of the input signal must never exceed V
CC
+ 0.3 V / GND - 0.3 V.
3.
The device is protected in case of over temperature by a thermal shutdown active at 150° C.
4.
Human body model: A 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 k
Ω resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating.
5.
Machine model: A 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5
Ω
). This is done for all couples of connected pin combinations while the other pins are floating.
Table 2.
Symbol
Operating conditions
Parameter
V
CC
V icm
Supply voltage
Common mode input voltage range
V
STBY
Standby voltage input:
Device ON
Device OFF
R
L
T
SD
Load resistor
Thermal shutdown temperature
R thja
Thermal resistance junction to ambient
Flip-chip
(1)
MiniSO-8
DFN8
(2)
1.
This thermal resistance is reached with a 100 mm
2
copper heatsink surface.
2.
When mounted on a 4-layer PCB.
Value
2.2 to 5.5
1.2V to V
CC
1.35
≤
V
STBY
GND
≤
V
STBY
≤
V
CC
≤
0.4
≥
4
150
100
190
40
Unit
V
V
V
Ω
°C
°C/W
Doc ID 9309 Rev 13 3/33
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Table of contents
- 3 Absolute maximum ratings and operating conditions
- 4 Typical application schematics
- 5 Electrical characteristics
- 18 Application information
- 18 BTL configuration principle
- 18 Gain in a typical application
- 18 Low and high frequency response
- 19 Power dissipation and efficiency
- 20 Decoupling of the circuit
- 21 Standby time
- 22 Pop performance
- 23 Application example: differential input, BTL power amplifier
- 25 Package information
- 25 Flip-chip package information
- 28 MiniSO-8 package information
- 29 DFN8 package information
- 31 SO-8 package information
- 32 Ordering information
- 33 Revision history