NXP i.MX27 Multimedia Applications Processors - Robust Security Reference Manual
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An addendum, entitled Addendum to Rev. 0.3 of MCIMX27 Multimedia Applications Processor Reference Manual (Rev. 0.4) has been added at the end of this document. MCIMX27 Multimedia Applications Processor Reference Manual MCIMX27RM Rev. 0.4 06/2012 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. 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Contents Paragraph Number Title Page Number Contents Chapter 1 Introduction to the i.MX27 Multimedia Applications Processor 1.1 1.2 1.2.1 1.2.2 1.2.2.1 1.2.2.2 1.2.3 1.2.3.1 1.2.3.2 1.2.3.3 1.2.3.4 1.2.3.5 1.2.3.6 1.2.4 1.2.4.1 1.2.4.2 1.2.4.3 1.2.5 1.2.5.1 1.2.5.2 1.2.5.3 1.2.5.4 1.2.6 1.2.6.1 1.2.6.2 1.2.6.3 1.2.6.4 1.2.6.4.1 1.2.6.4.2 1.2.6.4.3 1.2.6.4.4 1.2.7 1.2.7.1 1.2.7.2 1.2.7.3 1.2.7.4 1.2.7.5 i.MX27 Applications Processor Block Diagram ............................................................. 1-2 Summary of Core and Modules ....................................................................................... 1-2 ARM9™ Platform ....................................................................................................... 1-2 System Control ............................................................................................................ 1-4 Clock Controller Module (CCM) ............................................................................ 1-4 JTAG Controller (JTAGC) ....................................................................................... 1-4 Standard System Resources ......................................................................................... 1-4 General Purpose Timer (GPT) ................................................................................. 1-5 Pulse-Width Modulator (PWM) .............................................................................. 1-5 Real Time Clock (RTC) ........................................................................................... 1-5 Watchdog Timer Module (WDOG) ......................................................................... 1-5 General-Purpose I/O Ports (GPIO).......................................................................... 1-6 Direct Memory Access Controller (DMAC) ........................................................... 1-6 Power Management and Backup Modes...................................................................... 1-6 SCC, RTC, and Oscillator Power Supply ................................................................ 1-6 Enter/Exit Mode....................................................................................................... 1-7 Reset Strategy ..................................................................................................... 1-7 System Security ........................................................................................................... 1-7 Security Controller Module (SCC).......................................................................... 1-7 Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) ............. 1-7 Run-Time Integrity Checkers (RTIC) ...................................................................... 1-8 IC Identification Module (IIM)................................................................................ 1-8 Connectivity................................................................................................................. 1-9 Configurable Serial Peripheral Interfaces (CSPI).................................................... 1-9 Inter-IC Connectivity (I2C) Bus Module ............................................................... 1-10 Synchronous Serial Interface (SSI) ....................................................................... 1-10 Bus Control ............................................................................................................ 1-10 AHB-Lite IP Interface Module (AIPI) .............................................................. 1-11 ARM926EJ-S Interrupt Controller (AITC) ....................................................... 1-11 Intellectual Property Bus Multiplexer (IPMUX) ............................................... 1-11 Multi-Layer AHB Crossbar Switch (MAX) ...................................................... 1-11 Wireline Connectivity ................................................................................................ 1-11 Universal Asynchronous Receiver/Transmitter (UART) ....................................... 1-11 High Speed USB 2.0 Interface (USB) ................................................................... 1-12 1-Wire Interface (1-Wire) ...................................................................................... 1-12 Advanced Technology Attachment (ATA)............................................................. 1-12 Fast Ethernet Controller (FEC).............................................................................. 1-12 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor iii Contents Paragraph Number 1.2.8 1.2.8.1 1.2.8.2 1.2.8.3 1.2.8.4 1.2.8.5 1.2.9 1.2.9.1 1.2.9.2 1.2.10 1.2.10.1 1.2.10.2 1.2.10.2.1 1.2.10.2.2 1.2.10.3 1.2.11 1.2.11.1 1.2.12 1.2.12.1 1.2.12.2 1.2.12.3 1.2.13 Title Page Number External Memory Interface........................................................................................ 1-13 Multi-Master Memory Interface (M3IF) ............................................................... 1-13 SDRAM Controller (SDRAMC) ........................................................................... 1-14 NAND Flash Controller (NFC) ............................................................................. 1-15 Personal Computer Memory Card International Association (PCMCIA)............. 1-15 External Interface Module (EIM) .......................................................................... 1-16 Memory Expansion.................................................................................................... 1-16 Memory Stick Host Controller (MSHC) ............................................................... 1-16 Secured Digital Host Controller (SDHC) .............................................................. 1-17 Video Codec and enhanced Multimedia Accelerator Lite (eMMA_lt) ..................... 1-17 Video Codec........................................................................................................... 1-17 enhanced Multimedia Accelerator Lite (eMMA_lt).............................................. 1-19 Image Pre-Processor (PrP)................................................................................. 1-20 Post-Processor (PP) ........................................................................................... 1-21 Digital Audio Multiplexer (AUDMUX) ................................................................ 1-22 MultiMedia Interface ................................................................................................. 1-23 CMOS Sensor Interface (CSI) ............................................................................... 1-23 Human Interface ........................................................................................................ 1-23 Liquid Crystal Display Controller (LCDC) ........................................................... 1-24 Smart Liquid Crystal Display Controller (SLCDC) .............................................. 1-24 Keypad Port (KPP) ................................................................................................ 1-25 Packaging Information............................................................................................... 1-25 Chapter 2 System Memory and Register Map 2.1 2.2 2.2.1 2.3 Introduction...................................................................................................................... 2-1 Memory Space ................................................................................................................. 2-1 Detailed Memory Map................................................................................................. 2-1 Register Map.................................................................................................................... 2-7 Chapter 3 Clocks, Power Management, and Reset Control 3.1 3.2 3.2.1 3.2.2 3.3 3.3.1 3.3.2 Introduction...................................................................................................................... 3-1 Clock Controller Architecture Block Diagram ................................................................ 3-1 High Frequency Clock Source and Distribution.......................................................... 3-4 Output Frequency Calculations ................................................................................... 3-5 Power Management ......................................................................................................... 3-5 PLL Operation at Power-Up ........................................................................................ 3-5 PLL Operation at Wake-Up ......................................................................................... 3-5 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 iv Freescale Semiconductor Contents Paragraph Number 3.3.3 3.3.3.1 3.3.3.2 3.3.4 3.3.5 3.3.6 3.4 3.4.1 3.4.2 3.4.3 3.4.4 3.4.5 3.4.6 3.4.7 3.4.8 3.4.8.1 3.4.9 3.4.10 3.4.11 3.4.12 3.4.13 3.4.14 3.5 3.5.1 3.5.2 Title Page Number i.MX27 Processor Low-Power Modes......................................................................... 3-5 Doze Mode............................................................................................................... 3-6 Sleep Mode .............................................................................................................. 3-6 SDRAM Power Modes ................................................................................................ 3-8 Power Management in the PLL Clock Controller ....................................................... 3-8 Power Management Using Frequency Control............................................................ 3-8 Memory Map and Register Definition ............................................................................. 3-9 Register Summary........................................................................................................ 3-9 Clock Source Control Register (CSCR) .................................................................... 3-10 MPLL Control Register 0 (MPCTL0) ....................................................................... 3-13 MCU and System PLL Control Register 1 (MPCTL1) ............................................. 3-15 Programming the Serial Peripheral PLL (SPLL)....................................................... 3-16 SPLL Control Register 0 (SPCTL0).......................................................................... 3-17 SPLL Control Register 1 (SPCTL1).......................................................................... 3-19 Oscillator 26M Register............................................................................................. 3-20 Adjusting the 26 MHz Oscillator Trim.................................................................. 3-20 Peripheral Clock Divider Register 0 (PCDR0) .......................................................... 3-21 Peripheral Clock Divider Register 1 (PCDR1) .......................................................... 3-23 Peripheral Clock Control Register 0 (PCCR0) .......................................................... 3-25 Peripheral Clock Control Register 1 (PCCR1) .......................................................... 3-28 Clock Control Status Register (CCSR)...................................................................... 3-31 Wakeup Guard Mode Control Register (WKGDCTL) .............................................. 3-33 Functional Description of the Reset Module ................................................................. 3-34 Global Reset............................................................................................................... 3-34 ARM9 Platform Reset ............................................................................................... 3-36 Chapter 4 System Control 4.1 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.2.7 4.2.8 4.2.9 4.2.10 Introduction...................................................................................................................... 4-1 Memory Map and Register Definition ............................................................................. 4-1 Chip ID Register (CID)................................................................................................ 4-3 Function Multiplexing Control Register (FMCR) ....................................................... 4-4 Global Peripheral Control Register (GPCR) ............................................................... 4-7 Well Bias System ......................................................................................................... 4-8 Well Bias Control Register (WBCR) ........................................................................... 4-9 Drive Strength Control Register 1 (DSCR1) ............................................................. 4-11 Drive Strength Control Register 2 (DSCR2) ............................................................. 4-13 Drive Strength Control Register 3 ............................................................................. 4-15 Drive Strength Control Register 4 ............................................................................. 4-17 Drive Strength Control Register 5 ............................................................................. 4-19 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor v Contents Paragraph Number 4.2.11 4.2.12 4.2.13 4.2.14 4.2.15 4.2.16 4.2.17 4.2.18 4.2.19 4.2.20 4.2.21 4.2.22 4.2.23 4.2.24 4.2.25 4.2.26 4.3 Title Page Number Drive Strength Control Register 6 ............................................................................. 4-21 Drive Strength Control Register 7 ............................................................................. 4-24 Drive Strength Control Register 8 ............................................................................. 4-26 Drive Strength Control Register 9 ............................................................................. 4-28 Drive Strength Control Register 10 ........................................................................... 4-31 Drive Strength Control Register 11 ........................................................................... 4-33 Drive Strength Control Register 12 ........................................................................... 4-35 Drive Strength Control Register 13 ........................................................................... 4-37 Pull Strength Control Register (PSCR) ..................................................................... 4-39 Priority Control and Select Register (PCSR)............................................................. 4-41 Power Management Control Register (PMCR) ......................................................... 4-42 DPTC Comparator Value Register 0 (DCVR0) ......................................................... 4-44 DPTC Comparator Value Register 1 (DCVR1) ......................................................... 4-44 DPTC Comparator Value Register 2.......................................................................... 4-45 DPTC Comparator Value Register 3.......................................................................... 4-46 PMIC Pad Control Register (PPCR).......................................................................... 4-46 System Boot Mode Selection......................................................................................... 4-47 Chapter 5 Signal Descriptions and Pin Assignments 5.1 5.2 5.3 5.3.1 5.3.2 5.3.3 Introduction...................................................................................................................... 5-1 Signal Descriptions .......................................................................................................... 5-1 I/O Power Supply and Signal Multiplexing Scheme ....................................................... 5-9 Pull/Pull Strength/Open Drain Descriptions.............................................................. 5-10 GPIO Default and Pull-Up Configuration ................................................................. 5-10 I/O Mode and Supply Level....................................................................................... 5-10 Chapter 6 General-Purpose I/O (GPIO) 6.1 6.2 6.3 6.4 6.5 6.6 6.6.1 6.6.2 6.6.3 6.6.4 Introduction...................................................................................................................... 6-1 Overview.......................................................................................................................... 6-3 GPIO Features.................................................................................................................. 6-3 External Signals Description ........................................................................................... 6-4 Interrupts .......................................................................................................................... 6-4 Memory Map and Register Definitions ........................................................................... 6-4 Register Summary........................................................................................................ 6-8 Data Direction Register (PTn_DDIR) ......................................................................... 6-9 Output Configuration Register 1 (OCR1).................................................................. 6-10 Output Configuration Register 2 (OCR2).................................................................. 6-11 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 vi Freescale Semiconductor Contents Paragraph Number 6.6.5 6.6.6 6.6.7 6.6.8 6.6.9 6.6.10 6.6.11 6.6.11.1 6.6.11.2 6.6.11.3 6.6.11.4 6.6.11.5 6.6.11.6 6.6.12 6.6.13 6.6.14 6.6.15 6.6.16 6.6.17 6.6.18 6.6.19 6.6.20 Title Page Number Input Configuration Register A1 (ICONFA1) ........................................................... 6-12 Input Configuration Register A2 (ICONFA2) ........................................................... 6-13 Input Configuration Register B1 (ICONFB1) ........................................................... 6-14 Input Configuration Register B2 (ICONFB2) ........................................................... 6-15 Data Register (DR) .................................................................................................... 6-16 GPIO IN USE Registers (GIUS) ............................................................................... 6-17 GPIO IN USE Register Reset Values ........................................................................ 6-17 GPIO IN USE Register A (PTA_GIUS)................................................................ 6-18 GPIO IN USE Register B (PTB_GIUS) ................................................................ 6-18 GPIO IN USE Register C (PTC_GIUS) ................................................................ 6-19 GPIO IN USE Register D (PTD_GIUS) ............................................................... 6-19 GPIO IN USE Register E (PTE_GIUS) ................................................................ 6-20 GPIO IN USE Register F (PTF_GIUS)................................................................. 6-20 Sample Status Register (SSR).................................................................................... 6-21 Interrupt Configuration Register 1 (ICR1) ................................................................ 6-22 Interrupt Configuration Register 2 (ICR2) ................................................................ 6-23 Interrupt Mask Register (IMR) .................................................................................. 6-24 Interrupt Status Register (ISR) .................................................................................. 6-25 General Purpose Register (GPR) ............................................................................... 6-26 Software Reset Register (SWR)................................................................................. 6-27 Pull-Up Enable Register (PUEN) .............................................................................. 6-28 Port Interrupt Mask Register (PMASK) .................................................................... 6-29 Chapter 7 JTAG Controller (JTAGC) 7.1 7.2 7.3 7.4 7.5 7.6 7.6.1 7.6.2 7.7 7.8 7.8.1 7.8.2 7.8.3 7.8.4 7.8.5 Introduction...................................................................................................................... 7-1 Features ............................................................................................................................ 7-1 Implementation ................................................................................................................ 7-1 JTAG Controller Pin List ................................................................................................. 7-2 JTAG Overview................................................................................................................ 7-3 JTAG Modes .................................................................................................................... 7-3 ARM926 Platform mode ............................................................................................ 7-3 i.MX27 JTAG Controller mode .................................................................................. 7-3 Boundary Scan Register................................................................................................... 7-3 Instruction Register.......................................................................................................... 7-4 EXTEST Instruction .................................................................................................... 7-4 SAMPLE/PRELOAD Instruction................................................................................ 7-4 IDCODE Instruction.................................................................................................... 7-5 ENABLE_ExtraDebug Instruction .............................................................................. 7-5 HIGHZ Instruction....................................................................................................... 7-5 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor vii Contents Paragraph Number 7.8.6 7.8.7 7.9 7.9.1 7.9.2 7.9.3 7.10 Title Page Number CLAMP Instruction ..................................................................................................... 7-6 BYPASS Instruction .................................................................................................... 7-6 TMS Sequences ............................................................................................................... 7-6 TMS Sequence to Check ID Code............................................................................... 7-6 TMS Sequence to Write to ExtraDebug Register ........................................................ 7-7 TMS Sequence to Read ExtraDebug Register ............................................................. 7-8 i.MX27 JTAG Restrictions............................................................................................... 7-8 Chapter 8 Bootstrap Mode Operation 8.1 8.2 8.3 8.4 8.4.1 8.4.1.1 8.4.1.2 8.4.1.3 8.4.1.4 Introduction...................................................................................................................... 8-1 UART/USB Configuration............................................................................................... 8-1 Enter Bootstrap Mode Configuration............................................................................... 8-1 Bootstrap Flow................................................................................................................. 8-2 Bootstrap Protocol and Definition ............................................................................... 8-3 Synchronization Operation ...................................................................................... 8-3 Write Register Operation ......................................................................................... 8-3 Download Operation................................................................................................ 8-4 Bootstrap End Indication Operation ........................................................................ 8-5 Chapter 9 ARM9 Platform 9.1 9.1.1 9.1.2 9.1.2.1 9.2 9.2.1 9.2.1.1 9.2.1.2 9.2.2 9.2.3 9.2.3.1 9.2.3.2 9.2.3.3 9.2.3.4 9.2.4 9.2.5 9.2.5.1 Introduction.................................................................................................................... 10-1 Design Methodology Summary ................................................................................. 10-2 Performance Characteristics ...................................................................................... 10-3 Performance Target................................................................................................ 10-3 ARM9 Platform Sub-Modules....................................................................................... 10-3 ARM926EJ-S Processor ............................................................................................ 10-3 ARM926EJ-S Co-Processor Interface ................................................................... 10-3 TCM Interfaces...................................................................................................... 10-4 ARM9 Embedded Trace Macrocell and Embedded Trace Buffer............................. 10-4 The 6 x 3 Multi-Layer AHB Crossbar Switch (MAX).............................................. 10-4 MAX Configuration Registers............................................................................... 10-4 Master Ports ........................................................................................................... 10-5 Slave Ports ............................................................................................................. 10-5 Debug Support ....................................................................................................... 10-5 ARM Interrupt Controller (AITC)............................................................................. 10-5 Memory Controller and BIST Engine (MCTL)......................................................... 10-6 RAM ...................................................................................................................... 10-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 viii Freescale Semiconductor Contents Paragraph Number 9.2.5.2 9.2.6 9.2.7 9.2.8 9.2.8.1 9.2.9 9.2.10 9.2.11 9.3 9.4 9.5 9.5.1 9.5.2 9.5.3 9.5.4 9.6 9.6.1 9.6.2 9.6.2.1 9.6.3 9.6.4 9.7 9.7.1 9.7.2 9.8 9.8.1 9.8.2 9.8.3 9.8.4 9.9 9.9.1 9.9.2 9.9.3 9.9.4 9.9.5 9.9.5.1 9.9.5.2 9.9.5.3 9.9.5.4 9.9.5.5 9.9.5.6 Title Page Number ROM ...................................................................................................................... 10-6 AHB IP Bus Interface (AIPI)..................................................................................... 10-7 PAHBMUX–Primary AHB Mux............................................................................... 10-7 ROMPATCH .............................................................................................................. 10-7 External Boot ......................................................................................................... 10-7 Clock Control Module (CLKCTL) ............................................................................ 10-8 JAM............................................................................................................................ 10-8 Test Wrapper.............................................................................................................. 10-9 ARM9 Platform Hierarchy ............................................................................................ 10-9 JTAG ID Register......................................................................................................... 10-10 System Memory Map................................................................................................... 10-10 ARM9 Platform Memory Map ................................................................................ 10-10 External Peripheral Space........................................................................................ 10-11 External Boot ........................................................................................................... 10-11 Memory Map Considerations .................................................................................. 10-12 Platform Clocking........................................................................................................ 10-12 ARM926EJ-S Clock Considerations ....................................................................... 10-12 ARM926EJ-S JTAG Port Clocking Considerations ................................................ 10-14 JTAG_TCK .......................................................................................................... 10-14 External Alternate Bus Master Interfaces................................................................ 10-14 External Secondary AHB Ports ............................................................................... 10-14 Platform Resets ............................................................................................................ 10-15 HRESET .................................................................................................................. 10-15 POR and JTAG_TRST............................................................................................. 10-15 Power Management ..................................................................................................... 10-16 Register Level Clock Gating.................................................................................... 10-16 Block Level Clock Gating ....................................................................................... 10-16 External Clock Gating ............................................................................................. 10-16 Well Biasing............................................................................................................. 10-17 Platform AHB Interfaces ............................................................................................. 10-18 Definition of AHB-Lite ........................................................................................... 10-18 Alternate Bus Master Ports ...................................................................................... 10-18 Single Master Seamless Connection to ABM Port.................................................. 10-19 Multiple External Masters Connection to ABM Port .............................................. 10-20 Alternate Bus Master Design Considerations.......................................................... 10-20 Edge Based Design .............................................................................................. 10-21 htrans [1:0]........................................................................................................... 10-21 hlock/hmastlock................................................................................................... 10-21 hmaster................................................................................................................. 10-21 hresp0—Bus Error ............................................................................................... 10-22 Unaligned Transfers............................................................................................. 10-22 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor ix Contents Paragraph Number 9.9.5.7 9.9.5.8 9.9.6 9.9.6.1 9.9.6.2 9.9.7 9.9.7.1 9.9.7.2 9.9.7.3 9.9.7.4 9.9.7.5 9.9.7.6 9.10 9.11 9.12 9.13 9.13.1 9.13.2 9.13.2.1 9.13.3 9.13.4 9.13.5 9.13.6 9.13.7 Title Page Number Alternate Bus Master Throttle Control ................................................................ 10-22 Halt Request (ccm_br) ......................................................................................... 10-22 MAX AHB Slave Ports............................................................................................ 10-23 Slave Port 0—Primary AHB (Internal) ............................................................... 10-23 Secondary AHB Slave Ports 1 and 2 ................................................................... 10-24 Endian Modes .......................................................................................................... 10-25 Affected Modules ................................................................................................ 10-26 Unaffected Modules............................................................................................. 10-26 Un-Aligned Transfers .......................................................................................... 10-26 Endian Mode and Alternate Bus Masters ............................................................ 10-26 Little Endian Operation ....................................................................................... 10-26 Big Endian Operation .......................................................................................... 10-27 Preliminary Size Estimate............................................................................................ 10-28 Power Consumption..................................................................................................... 10-29 ARM9 Platform I/O Signal List................................................................................... 10-30 Electrical Specifications............................................................................................... 10-38 Conditions................................................................................................................ 10-39 Well Bias Mode ....................................................................................................... 10-39 Functional Operation in Well Bias Mode ............................................................ 10-39 clk and jtag_tck Relationship................................................................................... 10-39 Clocks and Reset Timing ......................................................................................... 10-39 Alternate Bus Master (ABM) Interface Timing....................................................... 10-40 Secondary AHB Timing .......................................................................................... 10-42 RAM and ROM Interface Timing............................................................................ 10-44 Chapter 10 ARM926EJ-S Interrupt Controller (AITC) 10.1 10.1.1 10.1.2 10.2 10.2.1 10.2.2 10.2.3 10.2.4 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 Overview........................................................................................................................ 11-1 Features...................................................................................................................... 11-2 Modes of Operation ................................................................................................... 11-2 Memory Map and Register Definition ........................................................................... 11-3 Memory Map ............................................................................................................. 11-3 Register Summary...................................................................................................... 11-4 Interrupt Control Register (INTCNTL) ..................................................................... 11-8 Normal Interrupt Mask Register (NIMASK)........................................................... 11-10 Interrupt Enable Number Register (INTENNUM) .................................................. 11-11 Interrupt Disable Number Register (INTDISNUM)................................................ 11-12 Interrupt Enable Register High (INTENABLEH) and Low (INTENABLEL)........ 11-13 Interrupt Type Register High (INTTYPEH) and Low (INTTYPEL) ...................... 11-14 Normal Interrupt Priority Level Registers (NIPRIORITYn)................................... 11-15 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 x Freescale Semiconductor Contents Paragraph Number 10.2.10 10.2.11 10.2.12 10.2.12.1 10.2.12.2 10.2.13 10.2.14 10.2.15 10.3 10.3.1 10.3.2 10.3.3 10.3.4 10.3.5 10.3.6 10.3.7 Title Page Number Normal Interrupt Vector and Status Register (NIVECSR) ...................................... 11-23 Fast Interrupt Vector and Status Register (FIVECSR) ............................................ 11-24 Interrupt Source Register High (INTSRCH) and Low (INTSRCL) ........................ 11-25 Interrupt Assignments High................................................................................. 11-26 Interrupt Assignments Low ................................................................................. 11-27 Interrupt Force Register High (INTFRCH) and Low (INTFRCL) .......................... 11-28 Normal Interrupt Pending Register High (NIPNDH) and Low (NIPNDL)............. 11-29 Fast Interrupt Pending Register High (FIPNDH) and Low (FIPNDL).................... 11-30 ARM926EJ-S Interrupt Controller Operation ............................................................. 11-31 ARM926EJ-S Prioritization of Exception Sources ................................................. 11-31 AITC Prioritization of Interrupt Sources ................................................................. 11-31 Assigning and Enabling Interrupt Sources .............................................................. 11-32 Enabling Interrupt Sources ...................................................................................... 11-32 Typical Interrupt Entry Sequences........................................................................... 11-32 Writing Reentrant Normal Interrupt Routines ......................................................... 11-33 AHB Interface of AITC ........................................................................................... 11-34 Chapter 11 Security Controller (SCC) 11.1 11.2 Overview........................................................................................................................ 12-2 External Signal Description ........................................................................................... 12-2 Chapter 12 Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) 12.1 Features .......................................................................................................................... 13-1 Chapter 13 Run-Time Integrity Checker (RTIC) 13.1 13.1.1 13.2 13.2.1 Features .......................................................................................................................... 14-1 Modes of Operation ................................................................................................... 14-2 Initialization/Application Information ........................................................................... 14-2 System Application.................................................................................................... 14-2 Chapter 14 IC Identification (IIM) 14.1 14.1.1 Overview........................................................................................................................ 15-1 Features...................................................................................................................... 15-1 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xi Contents Paragraph Number Title Page Number Chapter 15 External Memory Interface (EMI) 15.1 15.2 15.3 15.3.1 15.3.2 15.3.3 15.4 15.4.1 15.4.1.1 15.4.1.2 15.5 15.6 15.6.1 15.7 15.7.1 15.7.2 15.8 Overview........................................................................................................................ 16-1 Features .......................................................................................................................... 16-3 PCMCIA Host Adapter.................................................................................................. 16-4 Interrupt Generation................................................................................................... 16-5 Card Extraction.......................................................................................................... 16-5 TrueIDE Support........................................................................................................ 16-5 NAND Flash Controller (NFC)...................................................................................... 16-5 Operation ................................................................................................................... 16-6 Internal and External Communications ................................................................. 16-6 Sharing of I/O Pins ................................................................................................ 16-7 Enhanced SDRAM Controller (ESDRAMC) ................................................................ 16-7 M3IF AHB MUX........................................................................................................... 16-7 Overview of EMI AHB MUX Operation .................................................................. 16-7 M3IF I/O MUX.............................................................................................................. 16-7 Overview of EMI I/O MUX Operation ..................................................................... 16-8 EMI Input/Output Signals........................................................................................ 16-22 Memory Map and Register Definitions ....................................................................... 16-29 Chapter 16 Multi-Master Memory Interface (M3IF) 16.1 16.1.1 16.1.2 16.2 16.2.1 16.3 16.3.1 16.3.2 16.3.3 16.3.3.1 16.3.3.2 16.3.3.3 16.3.3.4 16.3.3.5 16.4 16.4.1 16.4.1.1 Overview........................................................................................................................ 17-1 M3IF Interfaces.......................................................................................................... 17-1 Features...................................................................................................................... 17-3 External Signal Description ........................................................................................... 17-4 Overview.................................................................................................................... 17-4 Memory Map and Register Definition ........................................................................... 17-6 Memory Map ............................................................................................................. 17-6 Register Summary...................................................................................................... 17-7 Register Descriptions ............................................................................................... 17-10 M3IF Control Register (M3IFCTL) .................................................................... 17-10 M3IF Snooping Configuration Register 0 (M3IFSCFG0) .................................. 17-12 M3IF Snooping Configuration Register 1–2 (M3IFSCFG1–2) .......................... 17-13 M3IF Snooping Status Register 0–1 (M3IFSSR0–1) .......................................... 17-15 M3IF Master Lock WEIM CSx Register (M3IFMLWEx) .................................. 17-17 Functional Description................................................................................................. 17-18 Master Port Gasket (MPG) ...................................................................................... 17-18 Overview of MPG Operation............................................................................... 17-18 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xii Freescale Semiconductor Contents Paragraph Number 16.4.1.2 16.4.1.3 16.4.1.4 16.4.1.5 16.4.1.6 16.4.1.7 16.4.2 16.4.2.1 16.4.2.2 16.4.2.3 16.4.2.4 16.4.2.5 16.4.2.6 16.4.2.7 16.4.3 16.4.3.1 16.4.3.2 16.4.3.3 16.4.4 16.4.4.1 16.4.4.2 16.4.4.3 16.4.5 16.5 16.5.1 Title Page Number MPG Basic Transfer ............................................................................................ 17-23 MPG Transfer Type ............................................................................................. 17-24 MPG Transfer Response...................................................................................... 17-25 MPG Burst Operation .......................................................................................... 17-26 MPG Early Burst Termination............................................................................. 17-27 Multi-Endianness................................................................................................. 17-28 Master Port Gasket 64 (MPG64) ............................................................................. 17-29 Overview.............................................................................................................. 17-29 MPG64 Basic Transfer ........................................................................................ 17-31 MPG64 Transfer Type ......................................................................................... 17-31 Mpg64 Transfer Response ................................................................................... 17-32 MPG64 Burst Operation ...................................................................................... 17-32 MPG64 Early Burst Termination......................................................................... 17-32 Multi Endianness ................................................................................................. 17-32 M3IF Arbitration (M3A) ......................................................................................... 17-33 Overview.............................................................................................................. 17-33 M3A–Find First 1 (FF1) Algorithm .................................................................... 17-35 Bus_free Signal Algorithm .................................................................................. 17-37 Master Arbitration and Buffering (MAB)................................................................ 17-37 Overview of MAB Operation .............................................................................. 17-37 M3B–Find First 1 (FF1) Algorithm..................................................................... 17-37 M3IF Operation During HMASTLOCK Accesses ............................................. 17-39 Snooping Logic........................................................................................................ 17-40 Initialization/Application Information ......................................................................... 17-41 M3IF in a System..................................................................................................... 17-41 Chapter 17 Wireless External Interface Module (WEIM) 17.1 17.2 17.3 17.4 17.5 17.5.1 17.5.2 17.5.3 17.5.3.1 17.5.3.2 17.5.3.3 17.5.3.4 Features .......................................................................................................................... 18-1 Overview........................................................................................................................ 18-1 External Signal Description ........................................................................................... 18-3 Detailed Signal Descriptions ......................................................................................... 18-4 Memory Map and Register Definition ........................................................................... 18-7 Memory Map ............................................................................................................. 18-8 Register Summary...................................................................................................... 18-9 Register Descriptions ............................................................................................... 18-10 Chip Select x Upper Control Register (CSCRxU) .............................................. 18-13 Chip Select x Lower Control Register (CSCRxL)............................................... 18-17 Chip Select x Additional Control Register (CSCRxA) ....................................... 18-20 WEIM Configuration Register (WCR)................................................................ 18-23 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xiii Contents Paragraph Number 17.6 17.6.1 17.6.2 17.6.3 17.6.4 17.6.5 17.6.6 17.6.7 17.6.8 17.6.9 17.6.10 17.6.11 17.6.12 17.6.13 17.7 17.8 17.8.1 17.8.1.1 17.8.1.2 17.8.2 17.8.2.1 17.8.3 17.8.3.1 17.8.4 17.8.4.1 17.8.4.2 17.8.5 17.8.5.1 17.8.5.2 17.8.6 17.8.6.1 17.8.6.2 Title Page Number Functional Description................................................................................................. 18-24 Configurable Bus Sizing.......................................................................................... 18-24 WEIM Operational Modes....................................................................................... 18-25 Burst Mode Memory Operation............................................................................... 18-25 Burst Clock Divisor ................................................................................................. 18-26 Burst Clock Start...................................................................................................... 18-26 Page Mode Emulation.............................................................................................. 18-26 PSRAM Mode Operation......................................................................................... 18-27 Multiplexed Address/Data mode ............................................................................. 18-27 Mixed AHB/Memory Burst Modes Support ........................................................... 18-27 AHB Bus Cycles Support ........................................................................................ 18-27 DTACK Mode.......................................................................................................... 18-29 Internal Input Data Capture ..................................................................................... 18-29 Error Conditions ...................................................................................................... 18-29 Initialization/Application Information ......................................................................... 18-30 External Bus Timing Diagrams.................................................................................... 18-30 Asynchronous Memory Accesses Timing Diagrams............................................... 18-32 AHB Halfword Access to Halfword Width Memory .......................................... 18-32 AHB Word Access to Halfword Width Memory................................................. 18-39 Page Mode Timing Diagrams .................................................................................. 18-50 AHB Word Accesses to Halfword Width Memory ............................................. 18-50 DTACK Mode Memory Accesses Timing Diagrams .............................................. 18-51 AHB Word Accesses to Word-Width Memory.................................................... 18-51 Burst Memory Accesses Timing Diagrams ............................................................. 18-54 AHB Word Accesses to Halfword Width Memory ............................................. 18-54 AHB Accesses to Word-Width Burst Memory.................................................... 18-57 Synchronous Accesses Timing Diagrams with PSRAM ......................................... 18-65 AHB Sequential Accesses to Halfword Width PSRAM Memory....................... 18-65 AHB Sequential Accesses to Word-Width PSRAM Memory ............................. 18-67 Multiplexed A/D Mode............................................................................................ 18-68 Asynchronous Word Accesses to Word-Width Memory ..................................... 18-68 Synchronous Accesses with Word-Width Memory ............................................. 18-70 Chapter 18 Enhanced SDRAM Controller (ESDRAMC) 18.1 18.1.1 18.1.2 18.1.3 18.1.4 Overview........................................................................................................................ 19-1 SDRAM Command Controller .................................................................................. 19-1 Bank Model................................................................................................................ 19-1 Decoder and Address MUX....................................................................................... 19-1 ESDRAMC Control and Configuration Registers ..................................................... 19-3 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xiv Freescale Semiconductor Contents Paragraph Number 18.1.5 18.1.6 18.1.7 18.1.8 18.1.8.1 18.1.9 18.1.10 18.2 18.2.1 18.3 18.3.1 18.3.2 18.3.3 18.3.3.1 18.3.3.2 18.3.3.3 18.3.3.4 18.3.3.5 18.4 18.4.1 18.4.1.1 18.4.1.2 18.4.1.3 18.4.2 18.4.2.1 18.4.2.2 18.4.3 18.4.4 18.4.5 18.4.5.1 18.4.5.2 18.4.5.3 18.4.5.3.1 18.4.5.4 18.4.5.4.1 18.4.5.5 18.4.5.6 18.4.6 18.4.6.1 18.4.7 18.4.7.1 Title Page Number Refresh Sequencer ..................................................................................................... 19-3 Command Sequencer ................................................................................................. 19-3 Size Logic .................................................................................................................. 19-3 Mobile/Low Power DDR (LPDDR) Interface ........................................................... 19-3 Power Down Timer................................................................................................ 19-4 Features...................................................................................................................... 19-4 Modes of Operation ................................................................................................... 19-5 External Signal Description ........................................................................................... 19-6 Detailed Signal Descriptions ..................................................................................... 19-7 Memory Map and Register Definition ........................................................................... 19-9 Memory Map ............................................................................................................. 19-9 Register Summary.................................................................................................... 19-10 Register Descriptions ............................................................................................... 19-13 ESDCTL0 and ESDCTL1 Control Registers ...................................................... 19-14 ESDRAMC Configuration Registers (ESDCFG0 /ESDCFG1) .......................... 19-18 ESDMISC Miscellaneous Register (ESDMISC)................................................. 19-31 MDDR Delay Line 1–5 Configuration Debug Register ...................................... 19-33 MDDR Delay Line Cycle Length Debug Register .............................................. 19-35 Functional Description................................................................................................. 19-36 Enhanced SDRAM Controller Optimization Strategy............................................. 19-37 MIF1—No optimization/Sequential Accesses .................................................... 19-41 MIF2—Medium Level Optimization/Command Anticipation............................ 19-42 Latency Hiding .................................................................................................... 19-42 Address Multiplexing .............................................................................................. 19-44 Multiplexed Address Bus..................................................................................... 19-44 Bank Addresses ................................................................................................... 19-47 Multiplexed Address Bus—During “Special” Mode (SMODE 1 or 3)................... 19-47 Refresh ..................................................................................................................... 19-47 Low Power Operating Modes .................................................................................. 19-49 Self Refresh Mode for SDRAM/LPDDR Devices .............................................. 19-49 Manual Self Refresh Mode for SDRAM/LPDDR Devices ................................. 19-51 Precharge Power Down Mode ............................................................................. 19-53 SDRAM Precharge Power Down Mode .......................................................... 19-53 Active Power Down Mode................................................................................... 19-57 SDRAM/LPDDR Active Power Down Mode ................................................. 19-57 Precharge Bank(s)—Low Power Mode ............................................................... 19-60 LPDDR Frequency Change ................................................................................. 19-60 SDRAM (SDR and LPDDR) Command Encoding................................................. 19-60 Reset .................................................................................................................... 19-61 Normal READ/WRITE Mode ................................................................................. 19-61 SDR Cycle Accurate Enhanced SDRAM Controller Accesses........................... 19-84 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xv Contents Paragraph Number 18.4.7.1.1 18.4.7.1.2 18.4.7.1.3 18.4.7.2 18.4.7.2.1 18.4.7.3 18.4.8 18.4.9 18.4.10 18.4.11 18.5 18.5.1 18.5.2 18.5.3 18.5.4 18.5.4.1 18.5.4.1.1 18.5.4.1.2 18.5.4.2 18.5.4.3 18.5.4.3.1 18.5.4.3.2 18.5.4.3.3 18.5.4.3.4 18.5.4.3.5 18.5.4.3.6 18.5.4.3.7 18.5.4.3.8 18.5.4.3.9 18.5.4.3.10 18.5.4.3.11 18.5.4.3.12 18.5.4.3.13 18.5.4.3.14 18.5.4.3.15 18.5.4.3.16 Title Page Number Single Read Word Access to 16-Bit Memory.................................................. 19-84 Misaligned INCR4 Burst Read Access to 16-Bit Memory ............................. 19-85 Misaligned WRAP8 Burst Read Access to 32-Bit Memory ........................... 19-87 Single Write Word Access to 32-Bit Memory..................................................... 19-89 INCR4 Burst Write Word Access to 32-Bit Memory...................................... 19-90 SDRAM Command Sequence for Burst Accesses .............................................. 19-91 Precharge Command Mode ..................................................................................... 19-92 Auto-Refresh Mode ................................................................................................. 19-93 Manual Self Refresh Mode ...................................................................................... 19-94 Set Mode Register Mode ......................................................................................... 19-94 Initialization/Application Information ......................................................................... 19-96 Memory Device Selection........................................................................................ 19-96 Configuring Controller for SDRAM Memory Array .............................................. 19-96 CAS Latency............................................................................................................ 19-96 SDRAM/LPDDR Initialization Sequence ............................................................... 19-97 SDRAM Initialization.......................................................................................... 19-97 SDR SDRAM Initialization............................................................................. 19-97 LPDDR SDRAM Initialization ....................................................................... 19-98 SDR SDRAM Load Mode Register .................................................................. 19-100 SDRAM Memory Configuration Examples ...................................................... 19-101 Single 64Mb (4Mx16) SDRAM Configuration............................................. 19-102 Single 128 Mb (8MBx16) SDRAM Configuration ....................................... 19-103 Single 256 Mb (16MBx16) SDRAM Configuration ..................................... 19-104 Single 512 Mb (32MBx16) SDRAM Configuration ..................................... 19-105 Single 1-Gb (64MBx16) SDRAM Configuration ......................................... 19-106 Dual 64 Mb (4MBx16) SDRAM Configuration ........................................... 19-107 Dual 128 Mb (8MBx16) SDRAM Configuration ......................................... 19-108 Dual 256 Mb (16MBx16) SDRAM Configuration ....................................... 19-109 Single 64-Mbyte (2MBx32) SDRAM Configuration.................................... 19-110 Single 128-Mbyte (4MBx32) SDRAM Configuration.................................. 19-111 Single 256-Mb (8MBx32) SDRAM Configuration....................................... 19-112 Single 512-Mb (16MBx32) SDRAM Configuration..................................... 19-113 Single 1-Gb (32Mx32) SDRAM Configuration ............................................ 19-114 Single 2-Gb (64MBx32) SDRAM Configuration ......................................... 19-115 Single 512-Mb (16MBx32) Mobile DDR SDRAM Configuration............... 19-116 Single 512-Mb (32MBx16) Mobile DDR SDRAM Configuration............... 19-117 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xvi Freescale Semiconductor Contents Paragraph Number Title Page Number Chapter 19 NAND Flash Controller (NFC) 19.1 19.2 19.3 19.4 19.4.1 19.4.2 19.5 19.5.1 19.6 19.6.1 19.6.2 19.7 19.7.1 19.7.2 19.7.3 19.7.4 19.7.5 19.7.6 19.7.7 19.7.8 19.7.9 19.7.10 19.7.11 19.7.12 19.7.13 19.7.14 19.7.15 19.7.16 19.8 19.8.1 19.8.2 19.8.3 Overview........................................................................................................................ 20-1 Operation ....................................................................................................................... 20-2 Features .......................................................................................................................... 20-2 External Signal Description ........................................................................................... 20-3 Overview.................................................................................................................... 20-3 Detailed Signal Descriptions ..................................................................................... 20-3 NFC Buffer Memory Space ........................................................................................... 20-5 Main and Spare Area Buffers .................................................................................... 20-5 Memory Map and Register Definition ........................................................................... 20-7 Memory Map ............................................................................................................. 20-7 Register Summary...................................................................................................... 20-8 Register Descriptions ..................................................................................................... 20-9 Internal SRAM SIZE (NFC_BUFSIZE).................................................................... 20-9 Buffer Number for Page Data Transfer (RAM_BUFFER_ADDRESS).................. 20-10 NAND Flash Address (NAND_FLASH_ADD)...................................................... 20-10 NAND Flash Command (NAND_FLASH_CMD).................................................. 20-11 NFC Internal Buffer Lock Control (NFC_CONFIGURATION)............................. 20-11 Controller Status and Result of Flash Operation (ECC_STATUS_RESULT)......... 20-12 ECC Error Position of Main Area Data Error x8 (ECC_RSLT_MAIN_AREA) .............................................................................. 20-12 ECC Error Position of Main Area Data Error x16 (ECC_RSLT_MAIN_AREA) .............................................................................. 20-13 ECC Error Position of Spare Area Data Error x8 (ECC_RSLT_SPARE_AREA) ............................................................................ 20-14 ECC Error Position of Spare Area Data Error x16 (ECC_RSLT_SPARE_AREA) ............................................................................ 20-14 NAND Flash Write Protection (NF_WR_PROT).................................................... 20-15 Address to Unlock in Write Protection Mode—Start (UNLOCK_START_BLK_ADD) ....................................................................... 20-15 Address to Unlock in Write Protection Mode—End (UNLOCK_END_BLK_ADD) ........................................................................... 20-16 NAND Flash Write Protection Status (NAND_FLASH_WR_PR_ST) .................. 20-16 NAND Flash Operation Configuration (NAND_FLASH_CONFIG1) ................... 20-17 NAND Flash Operation Configuration 2 (NAND_FLASH_CONFIG2) ................ 20-18 Functional Description................................................................................................. 20-19 Modes of Operation ................................................................................................. 20-19 Booting From a NAND Flash Device...................................................................... 20-20 NAND Flash Control ............................................................................................... 20-22 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xvii Contents Paragraph Number 19.8.4 19.8.5 19.8.6 19.8.7 19.8.8 19.8.9 19.8.10 19.8.11 19.8.11.1 19.8.11.2 19.8.12 19.9 19.9.1 19.9.1.1 19.9.1.1.1 19.9.1.1.2 19.9.1.1.3 19.9.1.1.4 19.9.1.1.5 19.9.1.2 19.9.1.2.1 19.9.1.3 19.9.1.3.1 19.9.1.4 19.9.1.5 19.9.1.6 19.9.1.7 19.9.2 19.9.2.1 19.9.2.2 19.9.2.3 19.9.3 19.9.3.1 19.9.3.2 19.9.3.3 19.9.3.4 19.9.3.4.1 19.9.3.4.2 19.9.3.4.3 19.9.4 Title Page Number Error Code Correction (ECC) Control..................................................................... 20-23 Address Control ....................................................................................................... 20-23 RAM Buffer (SRAM) .............................................................................................. 20-24 Registers (Command, Address, Status, and Others.) ............................................... 20-24 Read and Write Control ........................................................................................... 20-24 Data Output Control................................................................................................. 20-24 Host Control............................................................................................................. 20-24 AHB BUS INTERFACE.......................................................................................... 20-24 Big/Little Endian ................................................................................................. 20-24 Burst Access Support........................................................................................... 20-25 I/O Pins Sharing....................................................................................................... 20-25 Initialization/Application Information ......................................................................... 20-25 Normal Operation .................................................................................................... 20-26 Fundamental Building Block Operations ............................................................ 20-26 Preset Operation .............................................................................................. 20-26 NAND Flash Command Input Operation ........................................................ 20-27 NAND Flash Address Input Operation............................................................ 20-28 NAND Flash Data Input Operation ................................................................. 20-29 NAND Flash Data Output Operation .............................................................. 20-30 NAND Flash ID Read Operation......................................................................... 20-31 NAND Flash ID Data Formats ........................................................................ 20-31 NAND Flash Status Read Operation ................................................................... 20-32 NAND Flash Status Data Format .................................................................... 20-32 Read NAND Flash Data Operation ..................................................................... 20-33 Program NAND Flash Data Operation................................................................ 20-34 Erase NAND Flash Data Operation..................................................................... 20-35 Hot Reset (Controller and NAND Flash Reset)................................................... 20-35 ECC Operation......................................................................................................... 20-36 ECC Normal Operation ....................................................................................... 20-36 ECC Bypass Operation ........................................................................................ 20-36 How to Operate ECC ........................................................................................... 20-36 Write Protection Operation...................................................................................... 20-37 Write Protection for RAM Buffer (LSB 1 Kbyte) ............................................... 20-37 Write Protection Modes....................................................................................... 20-38 Write Protection Commands................................................................................ 20-38 Write Protection Status ........................................................................................ 20-39 Lock Sequence................................................................................................. 20-39 Unlock Sequence ............................................................................................. 20-40 Lock-tight Sequence ........................................................................................ 20-40 Memory Configuration Examples ........................................................................... 20-40 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xviii Freescale Semiconductor Contents Paragraph Number Title Page Number Chapter 20 Personal Computer Memory Card International Association (PCMCIA) Controller 20.1 20.2 20.3 20.3.1 20.4 20.4.1 20.4.1.1 20.4.1.2 20.4.1.3 20.4.1.4 20.4.1.5 20.4.1.6 20.4.1.7 20.4.1.8 20.5 20.5.1 20.5.2 20.5.2.1 20.5.3 20.5.4 20.5.4.1 20.5.5 20.5.6 20.5.7 20.5.8 20.5.9 20.5.10 20.5.11 20.5.12 20.5.13 20.6 Overview........................................................................................................................ 21-1 Features .......................................................................................................................... 21-3 External Signal Description ........................................................................................... 21-3 Detailed Signal Descriptions ..................................................................................... 21-3 Memory Map and Register Definition ........................................................................... 21-6 Register Summary...................................................................................................... 21-7 PCMCIA Input Pins Register (PIPR) .................................................................... 21-9 PCMCIA Status Change Register (PSCR) .......................................................... 21-10 PCMCIA Enable Register (PER)......................................................................... 21-12 PCMCIA Base Registers 0–4 (PBR0–PBR4)...................................................... 21-14 PCMCIA Option Registers 0–4 (POR0–POR4).................................................. 21-15 PCMCIA Offset Registers 0–4 (POFR0–POFR4)............................................... 21-18 PCMCIA General Control Register (PGCR)....................................................... 21-19 PCMCIA General Status Register (PGSR).......................................................... 21-20 Functional Description................................................................................................. 21-21 Modes of Operation ................................................................................................. 21-21 Windowing Capabilities........................................................................................... 21-21 Window Overlapping........................................................................................... 21-21 WAIT Signal ............................................................................................................ 21-21 Interrupts.................................................................................................................. 21-22 Error Interrupt Conditions ................................................................................... 21-22 Power Control .......................................................................................................... 21-23 Reset and Three-Score Control................................................................................ 21-23 Write Protect ............................................................................................................ 21-23 16-Bit/8-Bit Support ................................................................................................ 21-24 Data and Control Signals Relations ......................................................................... 21-24 True IDE Mode Access............................................................................................ 21-25 Card Extraction ........................................................................................................ 21-26 TrueIDE Support...................................................................................................... 21-26 Endianness Support.................................................................................................. 21-27 Timing Diagrams ......................................................................................................... 21-28 Chapter 21 1-Wire Interface (1-Wire) 21.1 21.2 21.3 Overview........................................................................................................................ 22-1 Port Definitions .............................................................................................................. 22-2 Pin Configuration........................................................................................................... 22-2 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xix Contents Paragraph Number 21.4 21.5 21.5.1 21.5.2 21.5.3 21.5.4 21.5.5 21.6 21.6.1 21.6.1.1 21.6.2 21.6.3 Title Page Number Clock Enable and AIPI Configuration........................................................................... 22-3 Functional Description................................................................................................... 22-3 Low-Power Modes..................................................................................................... 22-3 Reset Sequence with Reset Pulse Presence Pulse...................................................... 22-3 Write 0 ....................................................................................................................... 22-4 Write 1 and Read Data............................................................................................... 22-4 Program Pulse ............................................................................................................ 22-5 Memory Map and Register Definition ........................................................................... 22-5 Register Summary...................................................................................................... 22-5 Control Register (CONTROL) .............................................................................. 22-7 Time Divider Register (TIME_DIVIDER)................................................................ 22-9 Reset Register .......................................................................................................... 22-11 Chapter 22 Advanced Technology Attachment (ATA) 22.1 22.2 22.3 22.4 22.4.1 22.5 22.5.1 22.5.1.1 22.5.1.2 22.5.1.3 22.5.1.4 22.5.1.5 22.5.1.6 22.5.1.7 22.5.1.8 22.5.1.9 22.6 22.6.1 22.6.2 22.6.3 22.6.3.1 22.6.3.1.1 22.6.3.1.2 22.6.3.1.3 Overview........................................................................................................................ 23-1 Features .......................................................................................................................... 23-2 Operation ....................................................................................................................... 23-3 PIO Mode....................................................................................................................... 23-3 DMA Mode (Multi-Word DMA and Ultra DMA) .................................................... 23-3 External Signal Description ........................................................................................... 23-4 Detailed Signal Descriptions ..................................................................................... 23-5 ipp_do_ata_reset_b (out) ....................................................................................... 23-5 ipp_do_ata_dior (out) ............................................................................................ 23-5 ipp_do_ata_diow (out)........................................................................................... 23-5 ipp_do_ata_cs0, ipp_do_ata_cs1, ipp_do_ata_da2, ipp_do_ata_da1, ipp_do_ata_da0 (out) ......................................................................................... 23-5 ipp_ind_ata_dmarq (in) ......................................................................................... 23-5 ipp_do_ata_dmack (out) ........................................................................................ 23-5 ipp_ind_ata_intrq (in) ............................................................................................ 23-5 ipp_ind_ata_iordy (in) ........................................................................................... 23-5 ipp_do_ata_data[15:0] (out) .................................................................................. 23-6 Memory Map and Register Definition ........................................................................... 23-6 Memory Map ............................................................................................................. 23-6 Register Summary...................................................................................................... 23-7 Register Descriptions ............................................................................................... 23-10 Timing Registers.................................................................................................. 23-10 TIME_CONFIG0............................................................................................. 23-11 TIME_CONFIG1............................................................................................. 23-12 TIME_CONFIG2............................................................................................. 23-13 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xx Freescale Semiconductor Contents Paragraph Number 22.6.3.1.4 22.6.3.1.5 22.6.3.1.6 22.6.3.2 22.6.3.2.1 22.6.3.2.2 22.6.3.3 22.6.3.4 22.6.3.5 22.6.3.6 22.6.3.7 22.7 22.8 22.8.1 22.8.2 22.8.3 22.8.4 Title Page Number TIME_CONFIG3............................................................................................. 23-14 TIME_CONFIG4............................................................................................. 23-15 TIME_CONFIG5............................................................................................. 23-16 FIFO Data Registers ............................................................................................ 23-16 FIFO_DATA_32 Register in 32-bit Mode ....................................................... 23-17 FIFO_DATA_16 Register ................................................................................ 23-17 FIFO_FILL Register ............................................................................................ 23-18 ATA_CONTROL Register ................................................................................... 23-19 INT_PENDING, INT_ENABLE, INT_CLEAR Registers ................................. 23-20 FIFO Alarm Register ........................................................................................... 23-23 Drive Registers Mapped to Host Module ............................................................ 23-23 Functional Description................................................................................................. 23-24 Initialization/Application Information ......................................................................... 23-25 Resetting ATA Bus................................................................................................... 23-25 Access to ATA Bus in PIO Mode ............................................................................ 23-25 Using DMA Mode to Receive Data from ATA bus ................................................. 23-25 Using DMA Mode to Transmit Data to ATA bus .................................................... 23-26 Chapter 23 Configurable Serial Peripheral Interface (CSPI) 23.1 23.1.1 23.2 23.2.1 23.2.2 23.2.2.1 23.2.2.2 23.2.2.3 23.2.2.4 23.2.2.5 23.2.3 23.2.4 23.2.5 23.3 23.3.1 23.4 23.4.1 23.4.2 23.4.3 23.4.3.1 Features .......................................................................................................................... 24-1 External Signals Description ..................................................................................... 24-2 Operation ....................................................................................................................... 24-2 Phase and Polarity Configurations............................................................................. 24-3 Master Mode .............................................................................................................. 24-3 Master Mode with SPI_RDY................................................................................. 24-4 Master Mode with Wait States............................................................................... 24-5 Master Mode with Continuation............................................................................ 24-6 Master Mode with SSCTL Control........................................................................ 24-6 Master Mode with various configurations of WAIT, BURST and SSCTL ........... 24-7 Slave Mode ................................................................................................................ 24-7 Interrupt Control ........................................................................................................ 24-8 DMA Control............................................................................................................. 24-9 Initialization/Application Information ......................................................................... 24-10 Software Restrictions............................................................................................... 24-11 Memory Map and Register Definition ......................................................................... 24-11 Memory Map ........................................................................................................... 24-12 Register Summary.................................................................................................... 24-12 Register Descriptions ............................................................................................... 24-15 Receive Data Register (RXDATA) ...................................................................... 24-15 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxi Contents Paragraph Number 23.4.3.2 23.4.3.3 23.4.3.4 23.4.3.5 23.4.3.6 23.4.3.7 23.4.3.8 Title Page Number Transmit Data Register (TXDATA) ..................................................................... 24-16 Control Register (CONREG)............................................................................... 24-17 Interrupt Control and Status Register (INTREG) ................................................ 24-20 Test Control Register (TESTREG) ...................................................................... 24-23 Sample Period Control Register (PERIODREG) ................................................ 24-24 DMA Control Register (DMAREG) ................................................................... 24-25 Soft Reset Register .............................................................................................. 24-27 Chapter 24 Inter-Integrated Circuit (I2C) 24.1 24.1.1 24.2 24.2.1 24.3 24.3.1 24.3.2 24.3.3 24.3.3.1 24.3.3.2 24.3.3.3 24.3.3.4 24.3.3.5 24.4 24.4.1 24.4.2 24.4.2.1 24.4.2.2 24.4.2.3 24.4.2.4 24.4.2.5 24.4.3 24.4.4 24.4.5 24.4.6 24.4.7 24.4.8 24.5 24.5.1 24.5.2 Overview........................................................................................................................ 25-2 Features...................................................................................................................... 25-2 External Signal Description ........................................................................................... 25-3 Detailed External Signal Descriptions....................................................................... 25-3 Memory Map and Register Definition ........................................................................... 25-4 I2C Memory Map....................................................................................................... 25-4 Register Summary...................................................................................................... 25-4 Register Descriptions ................................................................................................. 25-6 I2C Address Register (IADR)................................................................................ 25-6 I2C Frequency Register (IFDR)............................................................................. 25-6 I2C Control Register (I2CR).................................................................................. 25-8 I2C Status Register (I2SR)..................................................................................... 25-9 I2C Data Register (I2DR) .................................................................................... 25-10 Functional Description................................................................................................. 25-11 I2C System Configuration........................................................................................ 25-11 I2C Protocol ............................................................................................................. 25-11 START Signal ...................................................................................................... 25-12 Slave Address Transmission ................................................................................ 25-12 Data Transfer ....................................................................................................... 25-12 STOP Signal ........................................................................................................ 25-13 Repeat Start.......................................................................................................... 25-13 Arbitration Procedure .............................................................................................. 25-13 Clock Synchronization............................................................................................. 25-13 Handshaking ............................................................................................................ 25-14 Clock Stretching ...................................................................................................... 25-14 IP Bus Accesses ....................................................................................................... 25-14 Generation of Transfer Error on IP Bus................................................................... 25-14 Initialization/Application Information ......................................................................... 25-14 Initialization Sequence............................................................................................. 25-14 Generation of START .............................................................................................. 25-15 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxii Freescale Semiconductor Contents Paragraph Number 24.5.3 24.5.4 24.5.5 24.5.6 24.5.7 24.5.8 Title Page Number Post-Transfer Software Response ............................................................................ 25-15 Generation of STOP................................................................................................. 25-15 Generation of Repeated START .............................................................................. 25-16 Slave Mode .............................................................................................................. 25-16 Arbitration Lost........................................................................................................ 25-16 Timing Section......................................................................................................... 25-18 Chapter 25 Keypad Port (KPP) 25.1 25.1.1 25.1.2 25.2 25.2.1 25.2.1.1 25.2.1.2 25.3 25.3.1 25.3.2 25.3.3 25.3.3.1 25.3.3.2 25.3.3.3 25.3.3.4 25.4 25.4.1 25.4.2 25.4.3 25.4.4 25.4.5 25.4.6 25.4.6.1 25.4.7 25.5 25.5.1 25.5.2 25.5.3 Overview........................................................................................................................ 26-1 Features...................................................................................................................... 26-2 Modes of Operation ................................................................................................... 26-2 External Signal Description ........................................................................................... 26-2 Overview.................................................................................................................... 26-2 Input Pins ............................................................................................................... 26-2 Output Pins ............................................................................................................ 26-2 Memory Map and Register Definition ........................................................................... 26-3 KPP Memory Map ..................................................................................................... 26-3 Register Summary...................................................................................................... 26-3 Register Descriptions ................................................................................................. 26-5 Keypad Control Register (KPCR) ......................................................................... 26-5 Keypad Status Register (KPSR) ............................................................................ 26-6 Keypad Data Direction Register (KDDR) ............................................................. 26-7 Keypad Data Register (KPDR).............................................................................. 26-8 Functional Description................................................................................................... 26-9 Keypad Matrix Construction...................................................................................... 26-9 Keypad Port Configuration ........................................................................................ 26-9 Keypad Matrix Scanning ........................................................................................... 26-9 Keypad Standby ...................................................................................................... 26-10 Glitch Suppression on Keypad Inputs...................................................................... 26-10 Multiple Key Closures ............................................................................................. 26-11 Ghost Key Problem and Correction..................................................................... 26-13 3-Point Contact Keys Support ................................................................................. 26-14 Initialization/Application Information ......................................................................... 26-15 Typical Keypad Configuration and Scanning Sequence.......................................... 26-15 Key Press Interrupt Scanning Sequence .................................................................. 26-15 Additional Comments .............................................................................................. 26-16 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxiii Contents Paragraph Number Title Page Number Chapter 26 Memory Stick Host Controller (MSHC) 26.1 26.1.1 26.1.2 26.2 26.2.1 26.2.1.1 26.3 26.3.1 26.3.1.1 26.3.1.2 26.3.1.2.1 26.3.1.2.2 26.3.1.2.3 26.4 26.4.1 26.4.2 26.4.2.1 26.4.2.2 26.4.2.2.1 26.4.2.3 26.4.2.4 26.4.2.5 Overview........................................................................................................................ 27-2 Features...................................................................................................................... 27-2 Modes of Operation ................................................................................................... 27-2 External Signal Description ........................................................................................... 27-3 Overview.................................................................................................................... 27-3 Memory Stick Interface ......................................................................................... 27-3 Memory Map and Register Definition ........................................................................... 27-3 Register Descriptions ................................................................................................. 27-4 SMSC Registers..................................................................................................... 27-4 Gasket Register ...................................................................................................... 27-5 Gasket Timeout Register ................................................................................... 27-5 Gasket Interrupt Status/Clear Register .............................................................. 27-5 Gasket Interrupt Enable Register....................................................................... 27-6 Functional Description................................................................................................... 27-7 Sony Memory Stick Controller (SMSC) ................................................................... 27-7 MSHC Gasket ............................................................................................................ 27-7 Resetting and Clocking.......................................................................................... 27-7 Memory Stick Interface ......................................................................................... 27-9 Back-to-Back Transfer..................................................................................... 27-10 Transfer Error ...................................................................................................... 27-11 Transfer Wait Condition ...................................................................................... 27-12 Gasket Interrupt ................................................................................................... 27-12 Chapter 27 Secured Digital Host Controller (SDHC) 27.1 27.1.1 27.2 27.3 27.3.1 27.3.2 27.3.3 27.3.3.1 27.3.3.2 27.3.3.3 27.3.3.4 27.3.3.5 Overview........................................................................................................................ 28-2 Features...................................................................................................................... 28-2 External Signal Description ........................................................................................... 28-3 Memory Map and Register Definition ........................................................................... 28-3 Memory Map ............................................................................................................. 28-3 Register Summary...................................................................................................... 28-4 Register Descriptions ................................................................................................. 28-8 SDHC Clock Control Register (STR_STP_CLK)................................................. 28-8 SDHC Status Register (STATUS).......................................................................... 28-9 SDHC Clock Rate Register (CLK_RATE).......................................................... 28-14 SDHC Command and Data Control Register (CMD_DAT_CONT)................... 28-16 SDHC Response Time Out Register (RES_TO) ................................................. 28-17 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxiv Freescale Semiconductor Contents Paragraph Number 27.3.3.6 27.3.3.7 27.3.3.8 27.3.3.9 27.3.3.10 27.3.3.11 27.3.3.12 27.3.3.13 27.3.3.14 27.4 27.4.1 27.4.1.1 27.4.1.2 27.4.1.3 27.4.1.4 27.4.1.5 27.4.2 27.4.2.1 27.4.3 27.4.4 27.4.4.1 27.4.4.2 27.4.4.3 27.4.5 27.4.6 27.4.6.1 27.4.6.2 27.4.7 27.4.8 27.4.9 27.5 27.5.1 27.5.2 27.5.2.1 27.5.2.2 27.5.2.3 27.5.2.4 27.5.3 27.5.3.1 27.5.3.1.1 27.5.3.1.2 Title Page Number SDHC Read Time Out Register (READ_TO) ..................................................... 28-19 SDHC Block Length Register (BLK_LEN) ........................................................ 28-20 SDHC Number of Blocks Register (NOB).......................................................... 28-21 SDHC Revision Number Register (REV_NO).................................................... 28-23 SDHC Interrupt Control Register (INT_CNTR) ................................................. 28-24 SDHC Command Number Register (CMD)........................................................ 28-28 SDHC CMD Argument Register (ARG) ............................................................. 28-29 SDHC Response FIFO Access Register (RES_FIFO) ........................................ 28-30 SDHC Data Buffer Access Register (BUFFER_ACCESS) ................................ 28-31 Functional Description................................................................................................. 28-32 Data Buffers ............................................................................................................. 28-32 Data Buffer Access .............................................................................................. 28-32 Write Operation Sequence................................................................................... 28-33 Read Operation Sequence.................................................................................... 28-33 Data Buffer Size................................................................................................... 28-34 Dividing Large Data Transfer .............................................................................. 28-34 DMA Interface......................................................................................................... 28-36 DMA Request ...................................................................................................... 28-36 Memory Controller .................................................................................................. 28-37 SDIO Card Interrupt ................................................................................................ 28-37 Interrupts in 1-Bit Mode ...................................................................................... 28-37 Interrupt in 4-Bit Mode........................................................................................ 28-37 Card Interrupt Handling....................................................................................... 28-38 Card Insertion and Removal Detection.................................................................... 28-39 Power Management and Wake-Up Events............................................................... 28-40 Dynamic Voltage/Frequency Scaling (DVFS) Operation.................................... 28-41 Setting Wake-Up Events ...................................................................................... 28-41 Command/Data Interpreter ...................................................................................... 28-41 System Clock Controller.......................................................................................... 28-43 DAT/CMD Transceiver ............................................................................................ 28-44 Initialization/Application of SDHC ............................................................................. 28-44 Command Submit—Response Receive Basic Operation ........................................ 28-45 Card Identification Mode......................................................................................... 28-46 Card Detect .......................................................................................................... 28-47 Reset .................................................................................................................... 28-47 Voltage Validation................................................................................................ 28-48 Card Registry ....................................................................................................... 28-49 Card Access ............................................................................................................. 28-51 Block Access—Block Write and Block Read ..................................................... 28-51 Block Write...................................................................................................... 28-51 Block Read ...................................................................................................... 28-52 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxv Contents Paragraph Number 27.6 Page Number Title Commands for MMC/SD/SDIO .................................................................................. 28-54 Chapter 28 Universal Asynchronous Receiver/Transmitters (UART) 28.1 28.1.1 28.1.2 28.2 28.2.1 28.3 28.3.1 28.3.2 28.3.3 28.3.4 28.3.4.1 28.3.4.2 28.3.4.3 28.3.4.4 28.3.4.5 28.3.4.6 28.3.4.7 28.3.4.8 28.3.4.9 28.3.4.10 28.3.4.11 28.3.4.12 28.3.4.13 28.3.4.14 28.3.4.15 28.3.4.16 28.4 28.4.1 28.4.2 28.4.2.1 28.4.2.2 28.4.3 28.4.3.1 28.4.3.2 28.4.3.3 28.4.3.4 Overview........................................................................................................................ 29-1 Features...................................................................................................................... 29-2 Modes of Operation ................................................................................................... 29-2 External Signal Description ........................................................................................... 29-3 Overview.................................................................................................................... 29-3 Memory Map and Register Definition ........................................................................... 29-3 Memory Map and Register Summary........................................................................ 29-3 Memory Map ............................................................................................................. 29-4 Register Summary...................................................................................................... 29-5 Register Descriptions ................................................................................................. 29-8 UART Receiver Register (URXD)......................................................................... 29-8 UART Transmitter Register (UTXD) .................................................................... 29-9 UART Control Register 1 (UCR1) ...................................................................... 29-10 UART Control Register 2 (UCR2) ...................................................................... 29-12 UART Control Register 3 (UCR3) ...................................................................... 29-14 UART Control Register 4 (UCR4) ...................................................................... 29-16 UART FIFO Control Register Summary (UFCR) ............................................... 29-18 UART Status Register 1 Summary (USR1)......................................................... 29-19 UART Status Register 2 (USR2) ......................................................................... 29-21 UART Escape Character Register Summary (UESC) ......................................... 29-23 UART Escape Timer Register Summary (UTIM) ............................................... 29-23 UART BRM Incremental Register (UBIR) ......................................................... 29-24 UART BRM Modulator Register Summary (UBMR)......................................... 29-24 UART Baud Rate Count Register Summary (UBRC) ......................................... 29-25 UART One Millisecond Register (ONEMS) ....................................................... 29-26 UART Test Register (UTS).................................................................................. 29-26 Functional Description................................................................................................. 29-28 Interrupts and DMA Requests ................................................................................. 29-28 Clocking Considerations.......................................................................................... 29-28 Minimum and Maximum Clock Frequencies...................................................... 29-28 Clocking in Low-Power Modes ........................................................................... 29-31 General UART Definitions ...................................................................................... 29-31 RTS—UART Request To Send............................................................................ 29-32 RTS Edge Triggered Interrupt ............................................................................. 29-32 Clear To Send (CTS)............................................................................................ 29-33 Programmable CTS Deassertion.......................................................................... 29-33 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxvi Freescale Semiconductor Contents Paragraph Number 28.4.3.5 28.4.3.5.1 28.4.4 28.4.4.1 28.4.4.1.1 28.4.4.1.2 28.4.4.2 28.4.4.2.1 28.4.4.2.2 28.4.4.2.3 28.4.4.2.4 28.4.4.2.5 28.4.4.2.6 28.4.5 28.4.6 28.4.6.1 28.4.6.2 28.4.6.3 28.4.6.3.1 28.4.7 28.4.7.1 28.4.7.2 28.4.7.3 28.4.7.4 28.4.7.5 28.4.8 28.4.9 28.5 28.5.1 28.5.2 Title Page Number TXD—UART Transmit ....................................................................................... 29-33 RXD—UART Receive..................................................................................... 29-33 Sub-Block Description............................................................................................. 29-34 Transmitter........................................................................................................... 29-35 Transmitter FIFO Empty Interrupt Suppression.............................................. 29-35 Transmitting a Break Condition ...................................................................... 29-36 Receiver ............................................................................................................... 29-37 Idle Line Detect ............................................................................................... 29-37 Idle Condition Detect Configuration ............................................................... 29-37 Aging Character Detect ................................................................................... 29-38 Receiver Wake ................................................................................................. 29-38 Receiving a BREAK Condition....................................................................... 29-39 Vote Logic........................................................................................................ 29-39 Binary Rate Multiplier (BRM) ................................................................................ 29-40 Baud Rate Automatic Detection Logic.................................................................... 29-42 Baud Rate Automatic Detection Protocol............................................................ 29-43 Baud Rate Automatic Detection Protocol Improved ........................................... 29-43 New Baudrate Determination .............................................................................. 29-44 New Autobaud Counter Stopped Bit and Interrupt ......................................... 29-44 Escape Sequence Detection ..................................................................................... 29-44 Generalities .......................................................................................................... 29-46 Inverted Transmission and Reception Bits (INVT and INVR)............................ 29-46 InfraRed Special Case (IRSC) Bit ....................................................................... 29-46 IrDA Interrupt ...................................................................................................... 29-47 Conclusion About IrDA....................................................................................... 29-48 UART Operation in Low-Power System States....................................................... 29-48 UART Operation in System Debug State ................................................................ 29-49 Programming IrDA Interface ....................................................................................... 29-50 High Speed............................................................................................................... 29-50 Low Speed ............................................................................................................... 29-51 Chapter 29 Fast Ethernet Controller (FEC) 29.1 29.2 29.2.1 29.3 29.3.1 29.3.2 29.3.2.1 Introduction.................................................................................................................... 30-1 Overview........................................................................................................................ 30-1 Features...................................................................................................................... 30-1 Modes of Operation ....................................................................................................... 30-2 Full and Half Duplex Operation ................................................................................ 30-2 Interface Options........................................................................................................ 30-2 10 Mbps and 100 Mbps MII Interface ................................................................... 30-2 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxvii Contents Paragraph Number 29.3.2.2 29.3.3 29.3.4 29.4 29.5 29.5.1 29.5.1.1 29.5.2 29.5.3 29.5.4 29.5.5 29.5.6 29.5.7 29.5.8 29.5.9 29.5.10 29.5.11 29.5.12 29.5.13 29.5.14 29.5.14.1 29.5.14.1.1 29.5.14.1.2 29.5.14.1.3 29.5.14.1.4 29.5.14.2 29.5.14.2.1 29.5.14.2.2 29.5.14.2.3 29.5.14.2.4 29.5.14.2.5 29.6 29.6.1 29.6.2 29.6.3 29.6.4 29.6.4.1 29.6.4.2 29.6.4.3 29.6.4.4 29.6.4.5 Title Page Number 10 Mpbs 7-Wire Interface Operation..................................................................... 30-2 Address Recognition Options .................................................................................... 30-2 Internal Loopback...................................................................................................... 30-3 FEC Top-Level Functional Diagram.............................................................................. 30-3 Functional Description................................................................................................... 30-4 Initialization Sequence............................................................................................... 30-4 Hardware Controlled Initialization ........................................................................ 30-4 User Initialization (Prior to Asserting ECR[ETHER_EN])....................................... 30-5 Microcontroller Initialization..................................................................................... 30-6 User Initialization (After Asserting ECR[ETHER_EN]) .......................................... 30-6 Network Interface Options......................................................................................... 30-6 FEC Frame Transmission .......................................................................................... 30-7 FEC Frame Reception................................................................................................ 30-8 Ethernet Address Recognition ................................................................................... 30-9 Hash Algorithm........................................................................................................ 30-11 Full Duplex Flow Control........................................................................................ 30-14 Inter-Packet Gap (IPG) Time ................................................................................... 30-15 Collision Handling................................................................................................... 30-15 Internal and External Loopback............................................................................... 30-15 Ethernet Error-Handling Procedure ......................................................................... 30-15 Transmission Errors ............................................................................................. 30-16 Transmitter Underrun ...................................................................................... 30-16 Retransmission Attempts Limit Expired ......................................................... 30-16 Late Collision .................................................................................................. 30-16 Heartbeat.......................................................................................................... 30-16 Reception Errors .................................................................................................. 30-16 Overrun Error................................................................................................... 30-16 Non-Octet Error (Dribbling Bits) .................................................................... 30-17 CRC Error........................................................................................................ 30-17 Frame Length Violation................................................................................... 30-17 Truncation........................................................................................................ 30-17 Memory Map and Register Definition ......................................................................... 30-17 High-Level Module Memory Map........................................................................... 30-17 Detailed Memory Map (Control/Status Registers) .................................................. 30-18 MIB Block Counters Memory Map......................................................................... 30-18 Register Descriptions ............................................................................................... 30-20 Ethernet Interrupt Event Register (EIR) .............................................................. 30-21 Interrupt Mask Register (EIMR) ......................................................................... 30-23 Receive Descriptor Active Register (RDAR) ...................................................... 30-24 Transmit Descriptor Active Register (TDAR) ..................................................... 30-24 Ethernet Control Register (ECR)......................................................................... 30-25 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxviii Freescale Semiconductor Contents Paragraph Number 29.6.4.6 29.6.4.7 29.6.4.8 29.6.4.9 29.6.4.10 29.6.4.11 29.6.4.12 29.6.4.13 29.6.4.14 29.6.4.15 29.6.4.16 29.6.4.17 29.6.4.18 29.6.4.19 29.6.4.20 29.6.4.21 29.6.4.22 29.6.4.23 29.6.5 29.6.5.1 29.6.5.1.1 29.6.5.1.2 29.6.5.2 29.6.5.3 Title Page Number MII Management Frame Register (MMFR) ........................................................ 30-26 MII Speed Control Register (MSCR) .................................................................. 30-27 MIB Control Register (MIBC) ............................................................................ 30-28 Receive Control Register (RCR) ......................................................................... 30-29 Transmit Control Register (TCR) ........................................................................ 30-30 Physical Address Low Register (PALR).............................................................. 30-31 Physical Address High Register (PAUR)............................................................. 30-32 Opcode/Pause Duration Register (OPD) ............................................................. 30-32 Descriptor Individual Upper Address Register (IAUR) ...................................... 30-33 Descriptor Individual Lower Address Register (IALR) ...................................... 30-33 Descriptor Group Upper Address Register (GAUR) ........................................... 30-34 Descriptor Group Lower Address Register (GALR) ........................................... 30-34 Transmit FIFO Watermark Register (TFWR)...................................................... 30-35 FIFO Receive Bound Register (FRBR) ............................................................... 30-35 FIFO Receive Start Register (FRSR)................................................................... 30-36 Receive Buffer Descriptor Ring Start Register (ERDSR) ................................... 30-36 Transmit Buffer Descriptor Ring Start Register (ETDSR).................................. 30-37 Receive Buffer Size Register (EMRBR) ............................................................. 30-37 Buffer Descriptors.................................................................................................... 30-38 Driver/DMA Operation with Buffer Descriptors................................................. 30-38 Driver/DMA Operation with Transmit BDs .................................................... 30-39 Driver/DMA Operation with Receive BDs...................................................... 30-39 Ethernet Receive Buffer Descriptor (RxBD) ....................................................... 30-40 Ethernet Transmit Buffer Descriptor (TxBD)...................................................... 30-42 Chapter 30 High-Speed USB On-The-Go (HS USB-OTG) 30.1 30.2 30.3 30.3.1 30.3.1.1 30.3.1.2 30.3.1.3 30.4 30.4.1 30.4.2 30.5 30.5.1 30.5.1.1 Overview........................................................................................................................ 31-2 Features .......................................................................................................................... 31-2 Modes of Operation ....................................................................................................... 31-2 Operational Modes..................................................................................................... 31-3 Normal Mode......................................................................................................... 31-3 Bypass Mode ......................................................................................................... 31-3 Low Power Mode................................................................................................... 31-4 External Signal Description ........................................................................................... 31-4 Overview.................................................................................................................... 31-4 Detailed Signal Descriptions ..................................................................................... 31-4 Memory Map and Register Definitions ......................................................................... 31-4 Register Descriptions ................................................................................................. 31-7 USBCONTROL—USB Control Register (USB_CTRL)...................................... 31-7 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxix Contents Paragraph Number 30.5.1.2 30.5.1.3 30.6 30.6.1 30.6.1.1 30.6.2 30.6.2.1 30.6.3 30.6.3.1 30.6.3.2 30.6.3.3 30.6.3.4 30.6.4 30.6.4.1 30.6.4.2 30.6.4.2.1 30.6.4.2.2 30.6.5 30.6.5.1 30.6.5.2 30.6.5.3 30.6.6 30.6.6.1 30.6.6.2 30.6.7 30.6.8 30.6.8.1 30.6.8.2 30.7 30.7.1 30.7.1.1 30.7.1.2 30.7.2 30.7.2.1 30.8 30.8.1 30.8.1.1 30.8.1.2 30.8.1.2.1 30.8.1.2.2 30.8.1.2.3 Title Page Number OTGMIRROR—OTG port Mirror Register ........................................................ 31-10 USB Core Register .............................................................................................. 31-11 Functional Description................................................................................................. 31-11 USB HOST Controller 1.......................................................................................... 31-11 Host Controller 1 to Host Port 1 Interface........................................................... 31-11 USB Host Controller 2............................................................................................. 31-12 Host Port 2 Signal Connections and Signal Muxing ........................................... 31-12 USB OTG Controller ............................................................................................... 31-13 Host Mode ........................................................................................................... 31-14 Peripheral (Device) Mode.................................................................................... 31-14 Special Considerations......................................................................................... 31-14 OTG Port Signal Connections and Signal Muxing.............................................. 31-14 USB Power Control Module.................................................................................... 31-15 Entering Suspend Mode....................................................................................... 31-16 Wake-up Events ................................................................................................... 31-16 Host Mode Events............................................................................................ 31-16 Device mode events ......................................................................................... 31-16 TLL Mode................................................................................................................ 31-17 TLL Functional Description ................................................................................ 31-17 Host Port 1 ........................................................................................................... 31-18 Host Port 2 ........................................................................................................... 31-18 USB Bypass Mode................................................................................................... 31-19 Bypass Mode operation ....................................................................................... 31-19 OTG and Host 1 pin functions ............................................................................. 31-20 ULPI/Serial MUX.................................................................................................... 31-20 Interrupts.................................................................................................................. 31-20 USB Core Interrupts ............................................................................................ 31-20 USB Wake-Up Interrupts..................................................................................... 31-20 Initialization/Application Information ......................................................................... 31-21 Software Model........................................................................................................ 31-21 Device Data Structure.......................................................................................... 31-22 Host Data Structure.............................................................................................. 31-22 Register Interface ..................................................................................................... 31-22 Configuration, Control and Status Register Set................................................... 31-23 Summary of Register Layouts ..................................................................................... 31-27 Identification Registers ............................................................................................ 31-30 ID ......................................................................................................................... 31-30 HWGENERAL .................................................................................................... 31-30 HWHOST ........................................................................................................ 31-31 HWDEVICE.................................................................................................... 31-32 HWTXBUF ..................................................................................................... 31-32 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxx Freescale Semiconductor Contents Paragraph Number 30.8.1.2.4 30.8.1.3 30.8.1.3.1 30.8.1.3.2 30.8.1.3.3 30.8.1.3.4 30.8.1.3.5 30.8.1.4 30.8.1.4.1 30.8.1.4.2 30.8.1.4.3 30.8.1.4.4 30.8.1.5 30.8.1.5.1 30.8.1.5.2 30.8.1.5.3 30.8.1.5.4 30.8.1.5.5 30.8.1.5.6 30.8.1.5.7 30.8.1.5.8 30.8.1.5.9 30.8.1.5.10 30.8.1.5.11 30.8.1.5.12 30.8.1.5.13 30.8.1.5.14 30.8.1.5.15 30.8.1.5.16 30.8.1.5.17 30.8.1.5.18 30.8.1.5.19 30.8.1.5.20 30.8.1.5.21 30.8.1.6 30.8.1.6.1 30.8.1.6.2 30.8.2 30.8.2.1 30.8.2.2 30.8.2.3 Title Page Number HWRXBUF ..................................................................................................... 31-33 Device/Host Capability Registers ........................................................................ 31-34 CAPLENGTH—EHCI Compliant .................................................................. 31-34 HCIVERSION—EHCI Compliant.................................................................. 31-34 HCSPARAMS—EHCI Compliant with Extensions ....................................... 31-34 HCCPARAMS—EHCI Compliant.................................................................. 31-36 DCCPARAMS (Non-EHCI)............................................................................ 31-38 Device/Host Timer Registers (Non-EHCI).......................................................... 31-38 GPTIMER0LD (Non-EHCI) ........................................................................... 31-39 GPTIMER0CTRL (Non-EHCI) ...................................................................... 31-39 GPTIMER1LD (Non-EHCI) ........................................................................... 31-40 GPTIMER1CTRL (Non-EHCI) ...................................................................... 31-40 Device/Host Operational Registers...................................................................... 31-41 USBCMD ........................................................................................................ 31-41 USBSTS........................................................................................................... 31-43 USBINTR ........................................................................................................ 31-46 FRINDEX........................................................................................................ 31-48 CTRLDSSEGMENT ....................................................................................... 31-49 PERIODICLISTBASE; DEVICEADDR ........................................................ 31-49 ASYNCLISTADDR; ENDPOINTLISTADDR............................................... 31-51 BURSTSIZE .................................................................................................... 31-52 TXFILLTUNING ............................................................................................ 31-52 ULPI VIEWPORT (Optional) ......................................................................... 31-54 CONFIGFLAG ................................................................................................ 31-56 PORTSCx ........................................................................................................ 31-57 OTGSC ............................................................................................................ 31-63 USBMODE...................................................................................................... 31-65 ENDPTSETUPSTAT ....................................................................................... 31-66 ENDPTPRIME ................................................................................................ 31-67 ENDPTFLUSH................................................................................................ 31-68 ENDPTSTAT ................................................................................................... 31-69 ENDPTCOMPLETE ....................................................................................... 31-70 ENDPTCTRL0 ................................................................................................ 31-71 ENDPTCTRL1—ENDPTCTRL15 ................................................................. 31-72 OTG Operations................................................................................................... 31-74 Register Bits..................................................................................................... 31-74 Hardware Assist............................................................................................... 31-75 Host Data Structures ................................................................................................ 31-76 Periodic Frame List.............................................................................................. 31-77 Asynchronous List Queue Head Pointer.............................................................. 31-78 Isochronous (High-Speed) Transfer Descriptor (iTD)......................................... 31-79 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxxi Contents Paragraph Number 30.8.2.3.1 30.8.2.3.2 30.8.2.3.3 30.8.2.4 30.8.2.4.1 30.8.2.4.2 30.8.2.4.3 30.8.2.4.4 30.8.2.4.5 30.8.2.5 30.8.2.5.1 30.8.2.5.2 30.8.2.5.3 30.8.2.5.4 30.8.2.6 30.8.2.6.1 30.8.2.6.2 30.8.2.7 30.8.2.7.1 30.8.2.7.2 30.8.3 30.8.3.1 30.8.3.2 30.8.3.2.1 30.8.3.2.2 30.8.3.2.3 30.8.3.2.4 30.8.3.2.5 30.8.3.3 30.8.3.3.1 30.8.3.4 30.8.3.4.1 30.8.3.5 30.8.3.6 30.8.3.7 30.8.3.7.1 30.8.3.7.2 30.8.3.8 30.8.3.8.1 30.8.3.8.2 30.8.3.8.3 Title Page Number Next Link Pointer ............................................................................................ 31-80 iTD Transaction Status and Control List ......................................................... 31-80 iTD Buffer Page Pointer List (Plus) ................................................................ 31-81 Split Transaction Isochronous Transfer Descriptor (siTD).................................. 31-83 Next Link Pointer ............................................................................................ 31-84 siTD Endpoint Capabilities/Characteristics..................................................... 31-84 siTD Transfer State.......................................................................................... 31-85 siTD Buffer Pointer List (plus)........................................................................ 31-86 siTD Back Link Pointer ................................................................................... 31-87 Queue Element Transfer Descriptor (qTD) ......................................................... 31-88 Next qTD Pointer............................................................................................. 31-88 Alternate Next qTD Pointer............................................................................. 31-89 qTD Token ....................................................................................................... 31-89 qTD Buffer Page Pointer List .......................................................................... 31-93 Queue Head ......................................................................................................... 31-94 Endpoint Capabilities/Characteristics.............................................................. 31-95 Transfer Overlay .............................................................................................. 31-98 Periodic Frame Span Traversal Node (FSTN) .................................................... 31-99 FSTN Normal Path Pointer ........................................................................... 31-100 FSTN Back Path Link Pointer ...................................................................... 31-100 Host Operational Model ........................................................................................ 31-101 Host Controller Initialization ............................................................................ 31-101 Port Routing and Control .................................................................................. 31-102 Port Routing Control via EHCI Configured (CF) Bit ................................... 31-104 Port Routing Control via PortOwner and Disconnect Event ........................ 31-104 Example Port Routing State Machine .......................................................... 31-106 Port Power .................................................................................................... 31-107 Port Reporting Over-Current ........................................................................ 31-107 Suspend/Resume ............................................................................................... 31-108 Port Suspend/Resume ................................................................................... 31-109 [Schedule Traversal Rules ................................................................................ 31-110 Example—Preserving Micro-Frame Integrity .............................................. 31-112 Periodic Schedule Frame Boundaries vs Bus Frame Boundaries ..................... 31-115 Periodic Schedule ............................................................................................. 31-117 Managing Isochronous Transfers Using iTDs .................................................. 31-118 Host Controller Operational Model for iTDs ............................................... 31-118 Software Operational Model for iTDs .......................................................... 31-120 Asynchronous Schedule .................................................................................... 31-122 Adding Queue Heads to Asynchronous Schedule ......................................... 31-124 Removing Queue Heads from Asynchronous Schedule ............................... 31-124 Empty Asynchronous Schedule Detection ................................................... 31-127 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxxii Freescale Semiconductor Contents Paragraph Number 30.8.3.8.4 30.8.3.8.5 30.8.3.8.6 30.8.3.9 30.8.3.9.1 30.8.3.10 30.8.3.10.1 30.8.3.10.2 30.8.3.10.3 30.8.3.10.4 30.8.3.10.5 30.8.3.10.6 30.8.3.10.7 30.8.3.10.8 30.8.3.11 30.8.3.12 30.8.3.12.1 30.8.3.12.2 30.8.3.12.3 30.8.3.13 30.8.3.14 30.8.3.15 30.8.3.15.1 30.8.3.15.2 30.8.4 30.8.4.1 30.8.4.1.1 30.8.4.1.2 30.8.4.1.3 30.8.4.1.4 30.8.4.1.5 30.8.4.2 30.8.4.3 30.8.4.3.1 30.8.4.3.2 30.8.4.4 30.8.4.4.1 30.8.4.5 30.8.4.5.1 30.8.4.5.2 30.8.4.5.3 Title Page Number Restarting Asynchronous Schedule Before EOF .......................................... 31-127 Asynchronous Schedule Traversal : Start Event ........................................... 31-130 Reclamation Status Bit (USBSTS Register) ................................................. 31-130 Operational Model for Nak Counter.................................................................. 31-131 Nak Count Reload Control ........................................................................... 31-132 Managing Control/Bulk/Interrupt Transfers via Queue Heads.......................... 31-133 Fetch Queue Head ........................................................................................ 31-134 Advance Queue ............................................................................................. 31-135 Execute Transaction ...................................................................................... 31-136 Write Back qTD ............................................................................................ 31-141 Follow Queue Head Horizontal Pointer ........................................................ 31-141 Buffer Pointer List Use for Data Streaming with qTDs ............................... 31-141 Adding Interrupt Queue Heads to the Periodic Schedule ............................. 31-143 Managing Transfer Complete Interrupts from Queue Heads ....................... 31-143 Ping Control ...................................................................................................... 31-144 Split Transactions ............................................................................................. 31-145 Split Transactions for Asynchronous Transfers ............................................ 31-145 Split Transaction Interrupt ............................................................................ 31-147 Split Transaction Isochronous ...................................................................... 31-160 Host Controller Pause ....................................................................................... 31-173 Port Test Modes ................................................................................................ 31-174 Interrupts ........................................................................................................... 31-174 Transfer/Transaction Based Interrupts .......................................................... 31-175 Host Controller Event Interrupts .................................................................. 31-178 EHCI Deviation ..................................................................................................... 31-179 Embedded Transaction Translator Function...................................................... 31-180 Capability Registers....................................................................................... 31-180 Operational Registers..................................................................................... 31-180 Discovery....................................................................................................... 31-180 Data Structures .............................................................................................. 31-181 Operational Model ......................................................................................... 31-181 Device Operation ............................................................................................... 31-184 USBMODE Register ......................................................................................... 31-184 Non-Zero Fields the Register File. ................................................................ 31-184 SOF Interrupt ................................................................................................. 31-184 Embedded Design Interface............................................................................... 31-184 Frame Adjust Register ................................................................................... 31-184 Miscellaneous Variations from EHCI................................................................ 31-185 Programmable Physical Interface Behaviour ................................................ 31-185 Discovery....................................................................................................... 31-185 Port Test Mode............................................................................................... 31-186 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxxiii Contents Paragraph Number 30.8.5 30.8.5.1 30.8.5.1.1 30.8.5.1.2 30.8.5.1.3 30.8.5.1.4 30.8.5.2 30.8.6 30.8.6.1 30.8.6.2 30.8.6.2.1 30.8.6.2.2 30.8.6.2.3 30.8.6.2.4 30.8.6.2.5 30.8.6.2.6 30.8.6.3 30.8.6.3.1 30.8.6.3.2 30.8.6.3.3 30.8.6.4 30.8.6.4.1 30.8.6.4.2 30.8.6.5 30.8.6.5.1 30.8.6.5.2 30.8.6.5.3 30.8.6.5.4 30.8.6.5.5 30.8.6.5.6 30.8.6.6 30.8.6.6.1 30.8.6.6.2 30.8.6.6.3 Title Page Number Device Data Structures .......................................................................................... 31-186 Endpoint Queue Head (dQH) ............................................................................ 31-187 Endpoint Capabilities/Characteristics............................................................ 31-187 Transfer Overlay ............................................................................................ 31-188 Current dTD Pointer ...................................................................................... 31-188 Set-up Buffer ................................................................................................. 31-189 Endpoint Transfer Descriptor (dTD) ................................................................. 31-189 Device Operational Model..................................................................................... 31-191 Device Controller Initialization ......................................................................... 31-191 Port State and Control........................................................................................ 31-192 Bus Reset ....................................................................................................... 31-193 Suspend/Resume............................................................................................ 31-194 Managing Endpoints...................................................................................... 31-195 Endpoint Initialization ................................................................................... 31-196 Stalling........................................................................................................... 31-196 Data Toggle ................................................................................................... 31-197 Operational Model For Packet Transfers ........................................................... 31-197 Interrupt/Bulk Endpoint Operational Model ................................................. 31-198 Control Endpoint Operation Model ............................................................... 31-200 Isochronous Endpoint Operational Model..................................................... 31-203 Managing Queue Heads..................................................................................... 31-205 Queue Head Initialization.............................................................................. 31-206 Operational Model For Setup Transfers ........................................................ 31-206 Managing Transfers with Transfer Descriptors ................................................. 31-207 Software Link Pointers .................................................................................. 31-207 Building a Transfer Descriptor ...................................................................... 31-207 Executing A Transfer Descriptor ................................................................... 31-207 Transfer Completion ...................................................................................... 31-208 Flushing/De-priming an Endpoint ................................................................. 31-209 Device Error Matrix....................................................................................... 31-209 Servicing Interrupts ........................................................................................... 31-210 High-Frequency Interrupts............................................................................. 31-210 Low-Frequency Interrupts ............................................................................. 31-210 Error Interrupts .............................................................................................. 31-210 Chapter 31 General Purpose Timer (GPT) 31.1 31.2 31.2.1 Introduction.................................................................................................................... 32-1 Operation ....................................................................................................................... 32-2 Clocks ........................................................................................................................ 32-3 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxxiv Freescale Semiconductor Contents Paragraph Number 31.2.2 31.2.3 31.2.4 31.2.5 31.3 31.3.1 31.3.2 31.3.3 31.3.4 31.3.5 31.3.6 Title Page Number Operation During Low-Power Mode ......................................................................... 32-3 Capture Event ............................................................................................................ 32-3 Compare Event .......................................................................................................... 32-3 Modes of Operation ................................................................................................... 32-4 Programming Model ...................................................................................................... 32-4 GPT Control Registers............................................................................................... 32-7 GPT Prescaler Register .............................................................................................. 32-9 GPT Compare Register............................................................................................ 32-10 GPT Capture Register.............................................................................................. 32-11 GPT Counter Register.............................................................................................. 32-12 GPT Status Register................................................................................................. 32-13 Chapter 32 Pulse-Width Modulator (PWM) 32.1 32.2 32.2.1 32.2.1.1 32.3 32.3.1 32.3.2 32.3.2.1 32.3.2.2 32.3.2.3 32.3.2.4 32.3.2.5 32.3.2.6 32.4 32.4.1 32.4.1.1 32.4.1.2 32.4.1.3 32.4.1.4 32.4.1.5 32.5 32.5.1 32.5.2 Overview........................................................................................................................ 33-1 Signal Description.......................................................................................................... 33-2 External Signals ......................................................................................................... 33-3 PWMO Signal........................................................................................................ 33-4 Memory Map and Register Definition ........................................................................... 33-4 Register Summary...................................................................................................... 33-4 Register Descriptions ................................................................................................. 33-6 PWM Control Register (PWMCR)........................................................................ 33-6 PWM Status Register (PWMSR)........................................................................... 33-8 PWM Interrupt Register (PWMIR) ....................................................................... 33-9 PWM Sample Register (PWMSAR) ................................................................... 33-10 PWM Period Register (PWMPR) ........................................................................ 33-11 PWM Counter Register (PWMCNR) .................................................................. 33-12 Functional Description................................................................................................. 33-12 Operation ................................................................................................................. 33-12 Clocks .................................................................................................................. 33-13 FIFO..................................................................................................................... 33-13 Rollover and Compare Event............................................................................... 33-14 Low Power Mode Behavior ................................................................................. 33-14 Debug Mode Behavior......................................................................................... 33-14 PWM Clocking ............................................................................................................ 33-15 PWM Clock Inputs .................................................................................................. 33-16 ipg_enable_clk Generation ...................................................................................... 33-17 Chapter 33 Real Time Clock (RTC) MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxxv Contents Paragraph Number 33.1 33.2 33.2.1 33.2.2 33.3 33.3.1 33.4 33.4.1 33.4.2 33.4.3 33.4.3.1 33.4.3.2 33.4.3.3 33.4.3.4 33.4.3.5 33.4.3.6 33.4.3.7 33.4.3.8 33.4.3.9 33.4.3.10 33.5 33.5.1 33.5.2 33.5.3 33.5.4 33.6 33.6.1 33.6.2 Title Page Number Introduction.................................................................................................................... 34-1 Overview........................................................................................................................ 34-2 Features...................................................................................................................... 34-2 Modes of Operation ................................................................................................... 34-2 External Signal Description ........................................................................................... 34-3 Overview.................................................................................................................... 34-3 Memory Map and Register Definition ........................................................................... 34-3 Memory Map ............................................................................................................. 34-3 Register Summary...................................................................................................... 34-4 Register Descriptions ................................................................................................. 34-6 RTC Hours and Minutes Counter Register (HOURMIN) ..................................... 34-6 RTC Seconds Counter Register (SECONDS) ....................................................... 34-7 RTC Hours and Minutes Alarm Register (ALRM_HM) ....................................... 34-8 RTC Seconds Alarm Register (ALRM_SEC) ....................................................... 34-9 RTC Control Register (RTCCTL)........................................................................ 34-10 RTC Interrupt Status Register (RTCISR) ............................................................ 34-11 RTC Interrupt Enable Register (RTCIENR)........................................................ 34-13 RTC Stopwatch Minutes Register (STPWCH).................................................... 34-15 RTC Days Counter Register (DAYR) .................................................................. 34-16 RTC Day Alarm Register (DAYALARM) ........................................................... 34-17 Functional Description................................................................................................. 34-18 Prescaler and Counter .............................................................................................. 34-18 Alarm ....................................................................................................................... 34-18 Sampling Timer ....................................................................................................... 34-18 Minute Stopwatch .................................................................................................... 34-19 Initialization/Application Information ......................................................................... 34-20 Flowchart of RTC Operation ................................................................................... 34-20 Code Example of ARM Instruction ......................................................................... 34-20 Chapter 34 Watchdog Timer (WDOG) 34.1 34.1.1 34.2 34.2.1 34.2.1.1 34.2.2 34.3 34.3.1 34.3.2 Overview........................................................................................................................ 35-1 Features...................................................................................................................... 35-2 External Signal Description ........................................................................................... 35-2 Detailed External Signal Descriptions....................................................................... 35-2 IPP_WDOG, IPP_WDOG_OE.............................................................................. 35-2 Internal Port Signals................................................................................................... 35-3 Memory Map and Register Definitions ......................................................................... 35-4 Watchdog Timer Memory Map.................................................................................. 35-4 Register Summary...................................................................................................... 35-4 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxxvi Freescale Semiconductor Contents Paragraph Number 34.4 34.4.1 34.4.2 34.4.2.1 34.5 34.5.1 34.5.2 34.5.3 34.5.3.1 34.5.3.2 34.5.3.3 34.5.3.4 34.5.4 34.5.5 34.5.5.1 34.5.5.2 34.5.6 34.5.7 34.6 34.6.1 Title Page Number Register Descriptions ..................................................................................................... 35-5 Watchdog Control Register (WCR) ........................................................................... 35-5 Watchdog Service Register (WSR)............................................................................ 35-6 Watchdog Reset Status Register (WRSR) ............................................................. 35-7 Functional Description................................................................................................... 35-8 Timing Specifications ................................................................................................ 35-8 Watchdog During Reset ............................................................................................. 35-8 Watchdog After Reset ................................................................................................ 35-8 Initial Load............................................................................................................. 35-8 Timer Countdown .................................................................................................. 35-8 Reloading the Counter ........................................................................................... 35-9 Time-Out................................................................................................................ 35-9 Generation of Transfer Error on the IP Bus............................................................... 35-9 Low-Power and DEBUG Modes ............................................................................... 35-9 Low-Power Mode (WAIT, STOP) ......................................................................... 35-9 DEBUG Mode ..................................................................................................... 35-10 Watchdog Reset Control .......................................................................................... 35-10 WDOG Operation.................................................................................................... 35-10 Initialization/Application Information ......................................................................... 35-11 State Machine .......................................................................................................... 35-11 Chapter 35 AHB-Lite IP Interface (AIPI) Module 35.1 35.1.1 35.1.2 35.2 35.3 35.3.1 35.3.2 35.3.3 Programming Model ...................................................................................................... 36-2 Peripheral Size Registers[1:0] ................................................................................... 36-3 Peripheral Access Register ........................................................................................ 36-4 AIPI1 and AIPI2 Peripheral Widths and PSR Setting ................................................... 36-4 Interface Timing............................................................................................................. 36-6 Read Cycles ............................................................................................................... 36-6 Write Cycles .............................................................................................................. 36-7 Aborted Cycles .......................................................................................................... 36-7 Chapter 36 Multi-Layer AHB Crossbar Switch (MAX) 36.1 36.2 36.3 36.4 36.4.1 Features .......................................................................................................................... 37-1 Overview........................................................................................................................ 37-1 General Operation.......................................................................................................... 37-2 Memory Map and Register Definition ........................................................................... 37-3 Register Summary...................................................................................................... 37-3 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxxvii Contents Paragraph Number 36.4.2 36.4.3 36.4.4 36.4.5 36.4.6 36.4.7 36.4.8 36.4.8.1 36.5 36.5.1 36.5.1.1 36.5.1.2 36.5.1.3 36.5.2 36.5.2.1 36.5.3 36.5.3.1 36.5.3.2 36.5.3.3 36.5.3.4 36.5.3.5 36.5.3.5.1 36.5.3.5.2 36.5.4 36.5.4.1 36.5.4.2 36.5.4.3 36.5.4.4 36.5.4.4.1 36.5.4.4.2 36.5.4.4.3 36.5.4.4.4 36.5.4.4.5 36.6 36.7 36.7.1 36.7.2 Title Page Number Memory Map ............................................................................................................. 37-4 Register Summary...................................................................................................... 37-4 MAX Register Descriptions....................................................................................... 37-6 Master Priority Registers (MPR0–MPR2)................................................................. 37-6 Alternate Master Priority Register for Slave Port 0–2 (AMPR0–2).......................... 37-7 General Purpose Control Register for Slave Port 0–2 (SGPCR0–2) ......................... 37-9 Alternate SGPCR for Slave Port 0–2 (ASGPCR0–2).............................................. 37-11 General Purpose Control Register for Master Port 0–5 (MGPCR0–5) ............... 37-13 Function ....................................................................................................................... 37-14 Arbitration................................................................................................................ 37-14 Arbitration During Undefined Length Bursts...................................................... 37-14 Fixed Priority Operation ...................................................................................... 37-15 Round-Robin Priority Operation ......................................................................... 37-15 Priority Assignment ................................................................................................. 37-15 Context Switching ............................................................................................... 37-16 Master Port Functionality ........................................................................................ 37-16 General................................................................................................................. 37-16 Decoders .............................................................................................................. 37-17 Capture Unit......................................................................................................... 37-18 Registers .............................................................................................................. 37-18 State Machine ...................................................................................................... 37-18 States................................................................................................................ 37-18 Slave Swapping................................................................................................ 37-19 Slave Port Functionality........................................................................................... 37-19 General................................................................................................................. 37-19 Muxes .................................................................................................................. 37-19 Registers .............................................................................................................. 37-20 State Machine ...................................................................................................... 37-21 States................................................................................................................ 37-21 Arbitration ....................................................................................................... 37-21 Master Hand-Off.............................................................................................. 37-21 Parking............................................................................................................. 37-23 Halt Mode ........................................................................................................ 37-25 Initialization/Application Information ......................................................................... 37-25 Interface ....................................................................................................................... 37-26 Master Ports ............................................................................................................. 37-26 Slave Ports ............................................................................................................... 37-26 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xxxviii Freescale Semiconductor Contents Paragraph Number Title Page Number Chapter 37 Direct Memory Access Controller (DMAC) 37.1 37.2 37.2.1 37.2.2 37.3 37.4 37.4.1 37.4.2 37.4.3 37.4.3.1 37.4.3.2 37.4.3.3 37.4.3.4 37.4.3.5 37.4.3.6 37.4.3.7 37.4.3.8 37.4.4 37.4.4.1 37.4.4.2 37.4.4.3 37.4.5 37.4.5.1 37.4.5.2 37.4.5.3 37.4.5.4 37.4.5.5 37.4.5.6 37.4.5.7 37.4.5.8 37.4.5.9 37.5 37.6 37.6.1 37.6.2 37.7 37.7.1 37.7.2 Features .......................................................................................................................... 38-1 DMA Request and Acknowledge .................................................................................. 38-2 DMA Request ............................................................................................................ 38-2 External DMA Request and Grant............................................................................. 38-2 DMA Request Mapping................................................................................................. 38-3 Memory Map and Register Definition ........................................................................... 38-5 DMAC Memory Map ................................................................................................ 38-5 Register Summary...................................................................................................... 38-6 General Registers ..................................................................................................... 38-11 DMA Control Register (DCR)............................................................................. 38-11 DMA Interrupt Status Register (DISR) ............................................................... 38-12 DMA Interrupt Mask Register (DIMR)............................................................... 38-13 DMA Burst Time-Out Status Register (DBTOSR) ............................................. 38-14 DMA Request Time-Out Status Register (DRTOSR) ......................................... 38-15 DMA Transfer Error Status Register (DSESR) ................................................... 38-16 DMA Buffer Overflow Status Register (DBOSR) .............................................. 38-17 DMA Burst Time-Out Control Register (DBTOCR) .......................................... 38-18 2D Memory Registers (A and B) ............................................................................. 38-19 W-Size Registers (WSRA, WSRB) ..................................................................... 38-20 X-Size Registers (XSRA, XSRB)........................................................................ 38-21 Y-Size Registers (YSRA, YSRB) ........................................................................ 38-22 Channel Registers .................................................................................................... 38-23 Channel Source Address Registers (SAR0–SAR15)........................................... 38-23 Destination Address Registers (DAR0–DAR15)................................................. 38-24 Channel Count Registers (CNTR0–CNTR15) .................................................... 38-25 Channel Control Registers (CCR0–CCR15) ....................................................... 38-26 Channel Request Source Select Registers (RSSR0–RSSR15) ............................ 38-28 Channel Burst Length Registers (BLR0–BLR15) ............................................... 38-29 Channel Request Time-Out Registers (RTOR0–RTOR15) ................................. 38-30 Channel Bus Utilization Control Registers (BUCR0–BUCR15) ........................ 38-31 Channel Counter Registers (CCNR0–CCNR15)................................................. 38-32 DMA Chaining ............................................................................................................ 38-32 Special Cases of Burst Length and Access Size Settings ............................................ 38-33 Memory Increment .................................................................................................. 38-33 Memory Decrement ................................................................................................. 38-34 Special Cases When CCNR and CNTR Values Differ ................................................ 38-34 CNTR Not A Multiple of Destination Access Size ................................................. 38-34 BL is Not a Multiple of Destination Access Size, CNTR Is.................................... 38-35 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xxxix Contents Paragraph Number 37.8 37.9 37.10 Title Page Number Application Note.......................................................................................................... 38-35 DMA Burst Termination .............................................................................................. 38-36 Glossary of Terms Used............................................................................................... 38-36 Chapter 38 Digital Audio MUX (AUDMUX) 38.1 38.2 38.3 38.4 38.5 38.6 38.7 38.8 38.9 38.10 38.11 38.11.1 38.11.2 38.11.3 38.11.4 38.12 38.12.1 38.12.2 38.12.3 38.12.4 Features .......................................................................................................................... 39-1 Overview........................................................................................................................ 39-1 Internal Network Mode.................................................................................................. 39-4 Tx/Rx Switch and External Network Mode................................................................... 39-4 Frame Sync and Clocks ................................................................................................. 39-6 Synchronous Mode (4-Wire Interface) .......................................................................... 39-7 Asynchronous Mode (6-Wire Interface) ........................................................................ 39-7 SSI to Peripheral Connection......................................................................................... 39-8 SSI to SAP ................................................................................................................... 39-11 Peripheral Port to Peripheral Port ................................................................................ 39-11 Memory Map and Register Definition ......................................................................... 39-14 AUDMUX Memory Map......................................................................................... 39-14 Register Summary.................................................................................................... 39-14 Host Port Configuration Register (HPCR1–2) ........................................................ 39-16 Peripheral Port Configuration Registers (PPCR1–2)............................................... 39-18 Peripheral Connectivity Through AUDMUX Configuration....................................... 39-20 Generic Configuration ............................................................................................. 39-21 AUDMUX Configuration with SSI1 and SAP as Master........................................ 39-23 Tx-Rx Switch Enabled............................................................................................. 39-24 Internal/External Network Mode ............................................................................. 39-25 Chapter 39 CMOS Sensor Interface (CSI) 39.1 39.2 39.2.1 39.3 39.3.1 39.3.2 39.3.3 39.3.4 39.3.5 39.4 CSI Architecture ............................................................................................................ 40-1 CSI Interface Signal Description ................................................................................... 40-3 Signals from CSI to eMMA Pre-Processor Block (PrP)............................................ 40-3 Principles of Operation .................................................................................................. 40-3 Gated Clock Mode ..................................................................................................... 40-4 Non-Gated Clock Mode............................................................................................. 40-4 CCIR656 Interlace Mode........................................................................................... 40-4 CCIR656 Progressive Mode ...................................................................................... 40-6 Error Correction for CCIR656 Coding ...................................................................... 40-7 Interrupt Generation....................................................................................................... 40-7 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xl Freescale Semiconductor Contents Paragraph Number 39.4.1 39.4.2 39.4.3 39.4.4 39.4.5 39.4.6 39.4.6.1 39.4.6.2 39.4.7 39.5 39.5.1 39.5.2 39.5.3 39.5.4 39.5.5 39.5.6 39.5.7 39.5.8 39.5.9 Title Page Number Start Of Frame Interrupt (SOF_INT)......................................................................... 40-7 End Of Frame Interrupt (EOF_INT).......................................................................... 40-8 Change Of Field Interrupt (COF_INT)...................................................................... 40-8 CCIR Error Interrupt (ECC_INT).............................................................................. 40-8 Data Packing Style..................................................................................................... 40-8 RX FIFO Path ............................................................................................................ 40-9 RGB565 Data......................................................................................................... 40-9 RGB888 Data....................................................................................................... 40-10 STAT FIFO Path ...................................................................................................... 40-10 Memory Map and Register Definition ......................................................................... 40-11 CSI Memory Map .................................................................................................... 40-11 Register Summary.................................................................................................... 40-11 CSI Control Register 1 (CSICR1) ........................................................................... 40-14 CSI Control Register 2 (CSICR2) ........................................................................... 40-17 CSI Control Register 3 (CSICR3) ........................................................................... 40-19 CSI Status Register (CSISR) ................................................................................... 40-20 CSI STATFIFO Register (CSISTATFIFO) .............................................................. 40-22 CSI RxFIFO Register (CSIRFIFO) ......................................................................... 40-23 CSI RX Count Register (CSIRXCNT) .................................................................... 40-23 Chapter 40 Video Codec (Video_Codec) 40.1 40.2 40.3 40.3.1 40.3.2 40.4 40.4.1 40.4.2 40.4.3 40.4.3.1 40.4.3.2 40.4.3.3 40.4.3.4 40.4.3.5 40.4.3.6 40.4.3.7 40.5 40.5.1 Features .......................................................................................................................... 41-1 Overview........................................................................................................................ 41-2 Clock Domain and Reset ............................................................................................... 41-3 Clocks ........................................................................................................................ 41-3 Reset........................................................................................................................... 41-3 Memory Map and Register Definition ........................................................................... 41-4 Memory Map ............................................................................................................. 41-4 Register Summary...................................................................................................... 41-5 Register Descriptions ................................................................................................. 41-7 Video Codec Code Run Register (CodeRun) ........................................................ 41-7 Video Codec BIT Boot Code Download Data Register (CodeDown)................... 41-8 Video Codec Host Interrupt Request Register (HostIntReq)................................. 41-9 Video Codec BIT Interrupt Clear Register (BitIntClear)....................................... 41-9 Video Codec BIT Interrupt Status Register (BitIntSts) ....................................... 41-10 Video Codec BIT Code Reset Register (BitCodeReset)...................................... 41-11 Video Codec BIT Current PC Register (BitCurPc) ............................................. 41-12 Functional Description................................................................................................. 41-12 Video Codec Architecture........................................................................................ 41-12 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xli Contents Paragraph Number 40.5.1.1 40.5.1.2 40.5.2 40.6 40.7 40.7.1 40.7.1.1 40.7.1.2 40.7.1.3 40.7.1.4 40.7.1.5 40.7.1.6 40.7.1.7 40.7.1.8 40.7.2 Title Page Number Embedded BIT processor .................................................................................... 41-12 Codec Hardware Accelerator............................................................................... 41-13 Interrupts.................................................................................................................. 41-15 Initialization Information ............................................................................................. 41-15 Application Information .............................................................................................. 41-16 Video Codec Processing Control ............................................................................. 41-16 Video Codec Processing Flow ............................................................................. 41-16 Video Codec Processing Finish Detection........................................................... 41-18 Video Codec Processing Flow Example.............................................................. 41-19 Frame Buffer........................................................................................................ 41-20 BIT Processor Program Memory......................................................................... 41-24 Working Buffer .................................................................................................... 41-24 Bitstream Buffer .................................................................................................. 41-24 Buffer Requirement Summary............................................................................. 41-25 Application Using Cases.......................................................................................... 41-25 Chapter 41 enhanced Multimedia Accelerator Light (eMMA_lt) 41.1 41.1.1 41.2 41.2.1 41.2.2 41.2.3 41.3 41.3.1 41.3.2 41.3.3 41.3.4 41.3.5 41.3.6 41.4 41.4.1 41.4.2 41.4.3 41.4.4 41.4.5 41.4.6 41.4.7 41.4.8 Introduction.................................................................................................................... 42-1 Features...................................................................................................................... 42-1 eMMA_lt Architecture .................................................................................................. 42-2 Pre-Processor (PrP).................................................................................................... 42-3 Post-Processor (PP).................................................................................................... 42-3 64-Bit Gasket ............................................................................................................. 42-4 Post-Processor (PP)........................................................................................................ 42-5 Color Space Conversion (CSC) ................................................................................. 42-7 Input Interface............................................................................................................ 42-9 Output Interface ....................................................................................................... 42-10 Data Flow................................................................................................................. 42-11 Relationship of Register Fields Related to the Input Frame.................................... 42-11 Relationship of Register Fields Related to Output Frame ....................................... 42-12 Post Processor (PP) Programming Model ................................................................... 42-13 PP Control Register ................................................................................................. 42-14 PP Interrupt Control Register .................................................................................. 42-16 PP Interrupt Status Register..................................................................................... 42-17 PP Source Y Address Register................................................................................. 42-18 PP Source Cb Address Register............................................................................... 42-18 PP Source Cr Address Register ............................................................................... 42-19 PP Destination RGB Frame Start Address Register ................................................ 42-20 PP Quantizer Start Address Register ....................................................................... 42-20 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xlii Freescale Semiconductor Contents Paragraph Number 41.4.9 41.4.10 41.4.11 41.4.12 41.4.13 41.4.14 41.4.15 41.4.16 41.4.17 41.5 41.5.1 41.5.2 41.5.2.1 41.5.2.2 41.5.2.3 41.5.2.4 41.5.2.5 41.5.3 41.5.3.1 41.5.3.2 41.5.3.3 41.5.3.4 41.5.3.5 41.5.3.6 41.5.4 41.5.5 41.5.5.1 41.5.5.2 41.5.6 41.5.7 41.5.8 41.5.9 41.5.10 41.5.11 41.5.12 41.5.13 41.5.14 41.6 41.6.1 41.6.2 41.6.3 Title Page Number PP Process Frame Parameter Register ..................................................................... 42-21 PP Source Frame Width Register............................................................................. 42-22 PP Destination Display Width Register ................................................................... 42-23 PP Destination Image Size Register ........................................................................ 42-23 PP Destination Frame Format Control Register ...................................................... 42-24 PP Resize Table Index Register ............................................................................... 42-25 PP CSC COEF 123 Register.................................................................................... 42-27 PP CSC COEF_4 Register ....................................................................................... 42-28 PP Resize Coefficient Table..................................................................................... 42-29 Pre-Processor ............................................................................................................... 42-30 Features.................................................................................................................... 42-31 Input Data Formats .................................................................................................. 42-31 Input Size ............................................................................................................. 42-31 Resize Ratios ....................................................................................................... 42-31 Output Formats .................................................................................................... 42-32 Output Data.......................................................................................................... 42-32 Output Size .......................................................................................................... 42-32 Resize....................................................................................................................... 42-32 Bilinear Resize in PrP.......................................................................................... 42-32 Averaging Resize in PrP ...................................................................................... 42-33 Combined Bilinear and Averaging ...................................................................... 42-34 Resize Output Image Size.................................................................................... 42-34 Channel-1 Output................................................................................................. 42-34 Channel-2 Output................................................................................................. 42-35 Color Space Conversion (CSC) ............................................................................... 42-35 RGB to YUV ........................................................................................................... 42-35 YUV to RGB ....................................................................................................... 42-36 Clipping of RGB and YUV Outputs.................................................................... 42-36 Frame Skip............................................................................................................... 42-36 LOOP Mode (LEN) ................................................................................................. 42-37 Channel-1 and Channel-2 Enable ............................................................................ 42-37 Channel-2 Flow Control .......................................................................................... 42-38 Line Buffer Overflow............................................................................................... 42-38 Relationship of Register Fields Related to the Input Frame.................................... 42-39 Relationship of Register Fields Related to Channel-1 Output Frame ..................... 42-40 CSI Frame Cropping................................................................................................ 42-40 CSI-PrP Link............................................................................................................ 42-42 Pre-Processor (PrP) Programming Model ................................................................... 42-43 PrP Control Register ................................................................................................ 42-45 PrP Interrupt Control Register ................................................................................. 42-48 PrP Interrupt Status Register.................................................................................... 42-49 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xliii Contents Paragraph Number 41.6.4 41.6.5 41.6.6 41.6.7 41.6.8 41.6.9 41.6.10 41.6.11 41.6.12 41.6.13 41.6.14 41.6.15 41.6.16 41.6.17 41.6.18 41.6.19 41.6.20 41.6.21 41.6.22 41.6.23 41.6.24 41.6.25 41.6.26 41.6.27 41.6.28 41.6.29 41.6.30 41.6.31 41.6.32 41.6.33 Title Page Number PrP Source Y Address Register ............................................................................... 42-50 PrP Source Cb Address Register ............................................................................. 42-51 PrP Source Cr Address Register .............................................................................. 42-51 PrP Destination RGB1 Frame Start Address Register............................................. 42-52 PrP Destination RGB2 Frame Start Address Register............................................. 42-53 PrP Destination Y Address Register ........................................................................ 42-53 PrP Destination Cb Address Register ...................................................................... 42-54 PrP Destination Cr Address Register....................................................................... 42-55 PrP Source Frame Size Register .............................................................................. 42-55 PrP Destination Channel-1 Line Stride Register ..................................................... 42-56 PrP Source Pixel Format Control Register .............................................................. 42-57 PrP Channel-1 Pixel Format Control Register......................................................... 42-59 PrP Destination Channel-1 Output Image Size Register ......................................... 42-60 PrP Destination Channel-2 Output Image Size Register ......................................... 42-61 PrP Source Line Stride Register .............................................................................. 42-62 PrP CSC Coefficient 012 ......................................................................................... 42-63 PrP CSC Coefficient 345 ......................................................................................... 42-64 PrP CSC Coefficient 678 ......................................................................................... 42-65 PrP Channel 1 Horizontal Resize Coefficient-1 ...................................................... 42-66 PrP Channel1 Horizontal Resize Coefficient-2 ....................................................... 42-67 PrP Channel 1 Horizontal Resize Valid ................................................................... 42-69 PrP Channel1 Vertical Resize Coefficient-1 ............................................................ 42-70 PrP Channel 1 Vertical Resize Coefficient 2 ........................................................... 42-71 PrP Channel 1 Vertical Resize Valid........................................................................ 42-72 PrP Channel-2 Horizontal Resize Coefficient-1 ...................................................... 42-73 PrP Channel-2 Horizontal Resize Coefficient-2 ...................................................... 42-74 PrP Channel-2 Horizontal Resize Valid................................................................... 42-75 PrP Channel2 Vertical Resize Coefficient-1 ............................................................ 42-76 PrP Channel 2 Vertical Resize Coefficient 2 ........................................................... 42-77 PrP Channel 2 Vertical Resize Valid........................................................................ 42-78 Chapter 42 Synchronous Serial Interface (SSI) 42.1 42.1.1 42.1.2 42.1.2.1 42.1.2.1.1 42.1.2.1.2 42.1.2.2 Overview........................................................................................................................ 43-2 Features...................................................................................................................... 43-3 Modes of Operation ................................................................................................... 43-3 Normal Mode......................................................................................................... 43-5 Normal Mode Transmit ..................................................................................... 43-5 Normal Mode Receive ....................................................................................... 43-6 Network Mode ....................................................................................................... 43-8 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xliv Freescale Semiconductor Contents Paragraph Number 42.1.2.2.1 42.1.2.2.2 42.1.2.3 42.1.2.4 42.1.2.5 42.1.2.5.1 42.1.2.5.2 42.1.2.6 42.1.2.7 42.2 42.2.1 42.2.2 42.2.2.1 42.2.2.2 42.2.2.3 42.2.2.4 42.2.2.5 42.2.2.6 42.2.3 42.3 42.3.1 42.3.2 42.3.3 42.3.3.1 42.3.3.2 42.3.3.3 42.3.3.4 42.3.3.5 42.3.3.6 42.3.3.7 42.3.3.8 42.3.3.9 42.3.3.10 42.3.3.11 42.3.3.12 42.3.3.13 42.3.3.14 42.3.3.15 42.3.3.16 42.3.3.17 Title Page Number Network Mode Transmit.................................................................................... 43-9 Network Mode Receive ................................................................................... 43-10 Gated Clock Mode............................................................................................... 43-12 I2S Mode ............................................................................................................. 43-14 AC97 Mode.......................................................................................................... 43-16 AC97 Fixed Mode (SACNT[1]=0) .................................................................. 43-18 AC97 Variable Mode (SACNT[1]=1).............................................................. 43-18 External Frame and Clock Operation .................................................................. 43-18 Data Alignment Formats Supported .................................................................... 43-18 External Signal Description ......................................................................................... 43-20 Overview.................................................................................................................. 43-20 Detailed Signal Descriptions ................................................................................... 43-20 SRCK—Serial Receive Clock ............................................................................. 43-20 SRFS—Serial Receive Frame Sync..................................................................... 43-21 SRXD—Serial Receive Data ............................................................................... 43-21 STCK—Serial Transmit Clock............................................................................ 43-21 STFS—Serial Transmit Frame Sync ................................................................... 43-21 STXD—Serial Transmit Data.............................................................................. 43-21 Internal I/O Signal Description................................................................................ 43-25 Memory Map and Register Definition ......................................................................... 43-27 R/WSSI Memory Map ............................................................................................. 43-27 Register Summary.................................................................................................... 43-28 Register Descriptions ............................................................................................... 43-32 SSI Transmit Data Registers 0 and 1 (STX0/1)................................................... 43-33 SSI Transmit FIFO 0 and 1 Registers .................................................................. 43-33 SSI Transmit Shift Register (TXSR) ................................................................... 43-34 SSI Receive Data Registers 0 and 1 (SRX0/1) .................................................... 43-36 SSI Receive FIFO 0 and 1 Registers.................................................................... 43-36 SSI Receive Shift Register (RXSR)..................................................................... 43-37 SSI Control Register (SCR)................................................................................. 43-39 SSI Interrupt Status Register (SISR) ................................................................... 43-41 SSI Interrupt Enable Register (SIER).................................................................. 43-46 SSI Transmit Configuration Register (STCR) ..................................................... 43-47 SSI Receive Configuration Register (SRCR) ...................................................... 43-49 SSI Transmit and Receive Clock Control Registers ( STCCR and SRCCR)....................................................................................... 43-51 SSI FIFO Control/Status Register (SFCSR)........................................................ 43-53 SSI Test Register (STR)....................................................................................... 43-56 SSI Option Register (SOR).................................................................................. 43-57 SSI AC97 Control Register (SACNT) ................................................................. 43-58 SSI AC97 Command Address Register (SACADD) ........................................... 43-60 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xlv Contents Paragraph Number 42.3.3.18 42.3.3.19 42.3.3.20 42.3.3.21 42.3.3.22 42.3.3.23 42.3.3.24 42.4 42.4.1 42.4.2 42.4.2.1 42.4.2.2 42.4.3 42.4.4 42.4.5 42.4.5.1 42.4.5.2 42.4.5.3 42.5 Title Page Number SSI AC97 Command Data Register (SACDAT).................................................. 43-61 SSI AC97 Tag Register (SATAG) ........................................................................ 43-62 SSI Transmit Time Slot Mask Register (STMSK) .............................................. 43-63 SSI Receive Time Slot Mask Register (SRMSK)................................................ 43-64 SSI AC97 Channel Status Register (SACCST) ................................................... 43-65 SSI AC97 Channel Enable Register (SACCEN) ................................................. 43-66 SSI AC97 Channel Disable Register (SACCDIS) ............................................... 43-67 Functional Description................................................................................................. 43-67 SSI Architecture....................................................................................................... 43-67 SSI Clocking ............................................................................................................ 43-67 SSI Clock and Frame Sync Generation ............................................................... 43-68 DIV2, PSR and PM Bit Description .................................................................... 43-69 Receive Interrupt Enable Bit Description ................................................................ 43-72 Transmit Interrupt Enable Bit Description .............................................................. 43-72 IP Bus Interface ....................................................................................................... 43-73 Transfer Lengths Supported................................................................................. 43-73 Transfer Bus Errors.............................................................................................. 43-73 Clock Rate ........................................................................................................... 43-73 Initialization/Application Information ......................................................................... 43-73 Chapter 43 Liquid Crystal Display Controller (LCDC) 43.1 43.2 43.2.1 43.2.2 43.2.3 43.2.4 43.2.5 43.2.6 43.2.7 43.2.8 43.2.9 43.2.9.1 43.2.9.2 43.2.9.3 43.2.10 43.2.10.1 43.2.10.2 43.3 Features .......................................................................................................................... 44-1 Overview........................................................................................................................ 44-3 LCD Screen Format ................................................................................................... 44-3 Graphic Window on Screen ....................................................................................... 44-4 Panning ...................................................................................................................... 44-5 Display Data Mapping ............................................................................................... 44-5 Black-and-White Operation....................................................................................... 44-7 Gray-Scale Operation ................................................................................................ 44-7 Color Generation........................................................................................................ 44-8 Frame Rate Modulation Control (FRC)..................................................................... 44-9 Panel Interface Signals and Timing ......................................................................... 44-10 Pin Configuration for LCDC ............................................................................... 44-11 Passive Matrix Panel Interface Signals................................................................ 44-11 Passive Panel Interface Timing............................................................................ 44-13 8 bpp Mode Color STN Panel.................................................................................. 44-13 Active Matrix Panel Interface Signals ................................................................. 44-14 Active Panel Interface Timing ............................................................................. 44-17 Memory Map and Register Definitions ....................................................................... 44-18 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xlvi Freescale Semiconductor Contents Paragraph Number 43.3.1 43.3.2 43.3.3 43.3.4 43.3.5 43.3.6 43.3.7 43.3.8 43.3.9 43.3.10 43.3.11 43.3.12 43.3.13 43.3.14 43.3.15 43.3.16 43.3.17 43.3.18 43.3.19 43.3.20 43.3.21 43.3.22 43.3.23 43.3.24 43.3.25 43.3.26 43.3.27 43.3.28 43.3.28.1 43.3.28.2 43.3.28.3 43.3.28.4 43.3.28.5 Title Page Number Register Summary.................................................................................................... 44-19 LCDC Screen Start Address Register (LSSAR)...................................................... 44-23 LCDC Size Register (LSR)...................................................................................... 44-24 LCDC Virtual Page Width Register (LVPWR)........................................................ 44-25 LCDC Cursor Position Register (LCPR)................................................................. 44-25 LCDC Cursor Width Height and Blink Register (LCWHB) ................................... 44-26 LCDC Color Cursor Mapping Register (LCCMR) ................................................. 44-27 LCDC Panel Configuration Register (LPCR).......................................................... 44-28 LCDC Horizontal Configuration Register (LHCR)................................................. 44-31 LCDC Vertical Configuration Register (LVCR)...................................................... 44-32 LCDC Panning Offset Register (LPOR).................................................................. 44-33 LCDC Sharp Configuration Register (LSCR) ........................................................ 44-34 LCDC PWM Contrast Control Register (LPCCR).................................................. 44-36 LCDC DMA Control Register (LDCR)................................................................... 44-37 LCDC Refresh Mode Control Register (LRMCR).................................................. 44-38 LCDC Interrupt Configuration Register (LICR) ..................................................... 44-39 LCDC Interrupt Enable Register (LIER)................................................................. 44-40 LCDC Interrupt Status Register (LISR) .................................................................. 44-41 LCDC Graphic Window Start Address Register (LGWSAR) ................................. 44-42 LCDC Graphic Window Size Register (LGWSR)................................................... 44-43 LCDC Graphic Window Virtual Page Width Register (LGWVPWR) .................... 44-44 LCDC Graphic Window Panning Offset Register (LGWPOR)............................... 44-44 LCDC Graphic Window Position Register (LGWPR) ............................................ 44-45 LCDC Graphic Window Control Register (LGWCR)............................................. 44-46 LCDC Graphic Window DMA Control Register (LGWDCR)............................... 44-47 LCDC AUS Mode Control Register (LAUSCR) ..................................................... 44-48 LCDC AUS Mode Cursor Control Register (LAUSCCR) ...................................... 44-49 BGLUT and GWLUT.............................................................................................. 44-49 Four Bits Per Pixel Gray-Scale Mode.................................................................. 44-50 Four Bits Per Pixel Passive Matrix Color Mode.................................................. 44-50 Eight Bits Per Pixel Passive Matrix Color Mode................................................. 44-51 Four Bits Per Pixel Active Matrix Color Mode ................................................... 44-51 Eight Bits Per Pixel Active Matrix Color Mode.................................................. 44-51 Chapter 44 Smart Liquid Crystal Display Controller (SLCDC) 44.1 44.2 44.2.1 44.2.2 SLCDC Module Pin List................................................................................................ 45-1 Functional Description................................................................................................... 45-2 Word Size Definition ................................................................................................. 45-3 Image Endianness ...................................................................................................... 45-3 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xlvii Contents Paragraph Number 44.2.3 44.2.3.1 44.2.3.1.1 44.2.3.1.2 44.2.3.1.3 44.2.3.2 44.2.4 44.2.5 44.2.6 44.2.7 44.2.8 44.2.9 44.2.10 44.2.11 44.2.12 44.2.13 44.2.14 44.2.15 44.2.16 44.2.17 44.2.18 44.2.19 44.3 44.3.1 44.3.2 44.4 44.5 Title Page Number Accessing the LCD Controller................................................................................... 45-3 Automatic SLCDC Transfers................................................................................. 45-4 Automatic Display Data Transfers (AUTOMODE[1:0]=10) ............................ 45-4 Automatic Command Data Transfers (AUTOMODE[1:0]=00)...................... 45-13 Automatic Command Data Transfers (AUTOMODE[1:0]=01)...................... 45-13 Direct Register Access......................................................................................... 45-14 Aborting SLCDC Transfers ..................................................................................... 45-14 Low-Power Mode Operation ................................................................................... 45-14 Memory Map ........................................................................................................... 45-14 Register Summary.................................................................................................... 45-15 SLDC Register Descriptions.................................................................................... 45-16 Data Buffer Base Address Register (DATABASEADR) ......................................... 45-18 Data Buffer Size Register (DATABUFSIZE) .......................................................... 45-18 Command Buffer Base Address Register (COMBASEADR) ................................. 45-19 Command Buffer Size Register (COMBUFSIZ)..................................................... 45-19 Command String Size Register (COMSTRINGSIZ)............................................... 45-20 FIFO Configuration Register (FIFOCONFIG)........................................................ 45-21 LCD Controller Configuration Register (LCDCONFIG)........................................ 45-21 LCD Transfer Configuration Register (LCDTRANSCONFIG).............................. 45-22 SLCDC Control/Status Register (SLCDCCONTROL/STATUS) ........................... 45-23 LCD Clock Configuration Register (LCDCLOCKCONFIG) ................................. 45-26 LCD Write Data Register (LCDWRITEDATA) ...................................................... 45-26 LCD Controller Interface............................................................................................. 45-27 Serial Interface......................................................................................................... 45-27 Parallel Interface ...................................................................................................... 45-29 LCD Clock Configuration............................................................................................ 45-30 R-AHB Interface and SLCDC FIFOs .......................................................................... 45-31 Appendix A Revision History A.1 Changes From Revision 02. to Revision 0.3................................................................... A-1 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xlviii Freescale Semiconductor Figures Figure Number 1-1 1-2 1-3 1-4 1-5 1-6 1-7 2-1 2-2 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 3-10 3-11 3-12 3-13 3-14 3-15 3-16 3-17 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 4-12 4-13 4-14 4-15 Title Page Number Figures i.MX27 Processor Functional Block Diagram ........................................................................ 1-2 i.MX27 Connectivity Example ............................................................................................... 1-9 Video Codec Architecture Diagram ...................................................................................... 1-18 eMMA_lt Architecture.......................................................................................................... 1-20 Pre-Processor Data Flow....................................................................................................... 1-20 Post-Processor ....................................................................................................................... 1-21 Typical AUDMUX Application ............................................................................................ 1-22 Detailed Block Diagram for the i.MX27 Processor ................................................................ 2-2 i.MX27 Processor’s Physical Memory Map (4 Gbytes) ......................................................... 2-5 i.MX27 Clock Distribution Block Diagram (1 of 2)............................................................... 3-2 i.MX27 Clock Distribution Block Diagram (2 of 2)............................................................... 3-3 Key to Register Fields ............................................................................................................. 3-9 Clock Source Control Register (CSCR)................................................................................ 3-10 MPLL Control Register 0 (MPCTL0)................................................................................... 3-13 MCU and System PLL Control Register 1 (MPCTL1) ........................................................ 3-15 SPLL Control Register 0 (SPCTL0) ..................................................................................... 3-17 SPLL Control Register 1 (SPCTL1) ..................................................................................... 3-19 Oscillator 26M Control Register (OSC26MCTL) ................................................................ 3-20 Peripheral Clock Divider Register 0 (PCDR0) ..................................................................... 3-21 Peripheral Clock Divider Register 1(PCDR1) ...................................................................... 3-23 Peripheral Clock Control Register 0 (PCCR0) ..................................................................... 3-25 Peripheral Clock Control Register 1(PCCR1) ...................................................................... 3-28 Clock Control Status Register (CCSR) ................................................................................. 3-31 Wakeup Guard Mode Control Register (WKGDCTL) ......................................................... 3-33 Reset Module Clock Diagram............................................................................................... 3-34 DRAM and Internal Reset Timing Diagram ......................................................................... 3-36 Key to Register Fields ............................................................................................................. 4-2 Chip ID Register (CID)........................................................................................................... 4-3 Function Multiplexing Control Register (FMCR) .................................................................. 4-4 Global Peripheral Control Register (GPCR)........................................................................... 4-7 Well Bias Control Register (WBCR) ...................................................................................... 4-9 Drive Strength Control Register (DSCR1)............................................................................ 4-11 Drive Strength Control Register 2 (DSCR2)......................................................................... 4-13 Drive Strength Control Register 3 (DSCR3)......................................................................... 4-15 Drive Strength Control Register 4 (DSCR4)......................................................................... 4-17 Drive Strength Control Register 5 (DSCR5)......................................................................... 4-19 Drive Strength Control Register 6 (DSCR6)......................................................................... 4-21 Drive Strength Control Register 7 (DSCR7)......................................................................... 4-24 Drive Strength Control Register 8 (DSCR8)......................................................................... 4-26 Drive Strength Control Register 9 (DSCR9)......................................................................... 4-28 Drive Strength Control Register 10 (DSCR10)..................................................................... 4-31 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xlix Figures Figure Number 4-16 4-17 4-18 4-19 4-20 4-21 4-22 4-23 4-24 4-25 4-26 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 6-13 6-14 6-15 6-16 6-17 6-18 6-19 6-20 6-21 6-22 6-23 6-24 6-25 6-26 6-27 7-1 7-2 7-3 Title Page Number Drive Strength Control Register 11 (DSCR11)..................................................................... 4-33 Drive Strength Control Register 12 (DSCR12)..................................................................... 4-35 Drive Strength Control Register 13 (DSCR13)..................................................................... 4-37 Pull Strength Control Register (PSCR)................................................................................. 4-39 Priority Control and Select Register (PCSR) ........................................................................ 4-41 Power Management Control Register (PMCR) .................................................................... 4-42 DPTC Comparator Value Register 0 (DCVR0) .................................................................... 4-44 DPTC Comparator Value Register 1 (DCVR1) .................................................................... 4-44 DPTC Comparator Value Register 2 (DCVR2) .................................................................... 4-45 DPTC Comparator Value Register 3 (DCVR3) .................................................................... 4-46 PMIC Pad Control Register (PPCR) ..................................................................................... 4-46 Functional Block Diagram of GPIO ....................................................................................... 6-2 GPIO Block Diagram for an Individual Port .......................................................................... 6-3 Key to Register Fields ............................................................................................................. 6-8 Data Direction Register (PTn_DDIR)..................................................................................... 6-9 Output Configuration Register 1 (OCR1) ............................................................................. 6-10 Output Configuration Register 2 (OCR2) ............................................................................. 6-11 Input Configuration Register A1 (ICONFA1) ...................................................................... 6-12 Input Configuration Register A2 (ICONFA2) ...................................................................... 6-13 Input Configuration Register B1 (ICONFB1)....................................................................... 6-14 Input Configuration Register B1 (ICONFB2)....................................................................... 6-15 Data Register (DR)................................................................................................................ 6-16 GPIO IN USE Register (GIUS) ............................................................................................ 6-17 GPIO IN USE Register A Reset Values (PTA_GIUS).......................................................... 6-18 GPIO IN USE Register B Reset Values (PTB_GIUS).......................................................... 6-18 GPIO IN USE Register C Reset Values (PTC_GIUS).......................................................... 6-19 GPIO IN USE Register D Reset Values (PTD_GIUS) ......................................................... 6-19 GPIO IN USE Register E Reset Values (PTE_GIUS) .......................................................... 6-20 GPIO IN USE Register F Reset Values (PTF_GIUS)........................................................... 6-20 Sample Status Register (SSR)............................................................................................... 6-21 Interrupt Configuration Register 1 (ICR1)............................................................................ 6-22 Interrupt Configuration Register 2 (ICR2)............................................................................ 6-23 Interrupt Mask Register (IMR) ............................................................................................. 6-24 Interrupt Status Register (ISR).............................................................................................. 6-25 General Purpose Register...................................................................................................... 6-26 Software Reset Register (SWR)............................................................................................ 6-27 Pull-Up Enable Register (PUEN).......................................................................................... 6-28 Port Interrupt Mask Register (PMASK) ............................................................................... 6-29 JTAG Signals Timing Diagram ............................................................................................... 7-1 i.MX27 JTAG Block Diagram ................................................................................................ 7-3 ID Register Configuration....................................................................................................... 7-5 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 l Freescale Semiconductor Figures Figure Number 8-1 8-2 8-3 8-4 8-5 9-1 9-2 9-3 9-4 9-5 9-6 9-7 9-8 9-9 9-10 9-11 9-12 9-13 10-1 10-2 10-3 10-4 10-5 10-6 10-7 10-8 10-9 10-10 10-11 10-12 10-13 10-14 10-15 10-16 10-17 10-18 10-19 10-20 10-21 10-22 10-23 Title Page Number Flow Diagram for Bootstrap Mode ......................................................................................... 8-2 iROM Status Command .......................................................................................................... 8-3 Write Register Command........................................................................................................ 8-3 Download Command .............................................................................................................. 8-4 Bootstrap End Indication Operation Diagram ........................................................................ 8-5 ARM9 Platform Block Diagram ........................................................................................... 10-2 ARM9 Platform Hierarchy.................................................................................................... 10-9 AHB Clock Relationship .................................................................................................... 10-13 Example hclk to clk Synchronization when clk is Faster ................................................... 10-14 ARM9 Platform Resets ....................................................................................................... 10-15 ARM9 Platform Clocking Strategy..................................................................................... 10-17 Example of Two External Masters Connected to an ABM Port ......................................... 10-20 The Primary AHB ............................................................................................................... 10-23 Endian Configuration Routing ............................................................................................ 10-25 ARM9 Platform AHB Clock and Reset Timing Relationship ............................................ 10-40 Alternate Bus Master Timing Parameters ........................................................................... 10-41 Secondary AHB AC TIming Parameters ............................................................................ 10-43 RAM and ROM Interface AC Timing Parameters .............................................................. 10-45 AITC Block Diagram............................................................................................................ 11-1 Key to Register Fields ........................................................................................................... 11-4 Interrupt Control Register Format......................................................................................... 11-8 Normal Interrupt Mask Register Format............................................................................. 11-10 Interrupt Enable Number Register Format.......................................................................... 11-11 Interrupt Enable Number Register Format.......................................................................... 11-12 Interrupt Enable Register High Format............................................................................... 11-13 Interrupt Enable Register Low Format................................................................................ 11-13 Interrupt Type Register High Format .................................................................................. 11-14 Interrupt Type Register Low Format................................................................................... 11-14 Normal Interrupt Priority Level 7 Register Format............................................................. 11-15 Normal Interrupt Priority Level 6 Register Format............................................................. 11-16 Normal Interrupt Priority Level 5 Register Format............................................................. 11-17 Normal Interrupt Priority Level 4 Register Format............................................................. 11-18 Normal Interrupt Priority Level 3 Register Format............................................................. 11-19 Normal Interrupt Priority Level 2 Register Format............................................................. 11-20 Normal Interrupt Priority Level 1 Register Format............................................................. 11-21 Normal Interrupt Priority Level 1 Register Format............................................................. 11-22 Normal Interrupt Vector and Status Register Format.......................................................... 11-23 Fast Interrupt Vector and Status Register Format ............................................................... 11-24 Interrupt Source Register High Format............................................................................... 11-25 Interrupt Source Register High Format............................................................................... 11-25 Interrupt Force Register Format.......................................................................................... 11-29 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor li Figures Figure Number 10-24 11-1 13-1 13-2 15-1 15-2 15-3 15-4 15-5 16-1 16-2 16-3 16-4 16-5 16-6 16-7 16-8 16-9 16-10 16-11 16-12 16-13 16-14 16-15 16-16 16-17 16-18 16-19 16-20 16-21 16-22 16-23 16-24 16-25 16-26 16-27 16-28 17-1 17-2 17-3 17-4 Title Page Number Fast Interrupt Pending Register High and Low Format ...................................................... 11-31 Security Controller Block Diagram ...................................................................................... 12-1 RTIC Block Diagram ............................................................................................................ 14-1 System Diagram .................................................................................................................... 14-2 M3IF System Block Diagram ............................................................................................... 16-2 PCMCIA Host Adapter Simplified Block Diagram.............................................................. 16-4 NAND Flash Controller Simplified Block Diagram............................................................. 16-6 EMI AHB MUX Interface Diagram ..................................................................................... 16-9 EMI I/O MUX Interface Diagram....................................................................................... 16-10 M3IF Block Diagram—System Overview............................................................................ 17-2 Key to Register Fields ........................................................................................................... 17-7 M3IF Control Register ........................................................................................................ 17-10 M3IF Snooping Configuration Register 0 (M3IFSCFG0).................................................. 17-12 M3IF Snooping Configuration Register 1 (M3IFSCFG1).................................................. 17-13 M3IF Snooping Configuration Register 2 (M3IFSCFG2).................................................. 17-14 M3IF Snooping Status Register 0 (M3IFSSR0) ................................................................. 17-15 M3IF Snooping Status Register 1 (M3IFSSR1) ................................................................. 17-16 M3IF Lock General Register (M3IFMLGE) ...................................................................... 17-17 Master Port Gasket (MPG) Interface Diagram ................................................................... 17-20 MPG Simple Transfer ......................................................................................................... 17-23 MPG with Wait States......................................................................................................... 17-24 MPG Multiple Transfers ..................................................................................................... 17-24 MPG—Transfer Type Examples ......................................................................................... 17-25 MPG Four Beat Wrapping Burst......................................................................................... 17-27 MPG Four Beat Incrementing Burst ................................................................................... 17-27 MPG Undefined Length Bursts........................................................................................... 17-28 MPG64 Port Interface Diagram .......................................................................................... 17-30 MPG64 Simple Double Word Transfer............................................................................... 17-31 MPG64—8 Beat Incremental Burst of Double Words to 32-bit SDRAM.......................... 17-32 M3A Block Diagram........................................................................................................... 17-34 M3A Simple Transfer Timing Diagram.............................................................................. 17-35 M3A—Round Robin Token Chain—Equal Priority........................................................... 17-36 M3A—Round Robin Token Chain—Masters 1 and 4 has 50% Priority ............................ 17-36 MAB Overview Block Diagram ......................................................................................... 17-38 MAB Arbitration Process Timing Diagram ........................................................................ 17-39 MAB Multi-Master Request Time Diagram ....................................................................... 17-40 M3IF System Example........................................................................................................ 17-42 WEIM Block Diagram .......................................................................................................... 18-2 Key to Register Fields ........................................................................................................... 18-9 Chip Select x Upper Control Register................................................................................. 18-13 Chip Select x Lower Control Register ................................................................................ 18-17 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lii Freescale Semiconductor Figures Figure Number 17-5 17-6 17-7 17-8 17-9 17-10 17-11 17-12 17-13 17-14 17-15 17-16 17-17 17-18 17-19 17-20 17-21 17-22 17-23 17-24 17-25 17-26 17-27 17-28 17-29 17-30 17-31 17-32 17-33 17-34 17-35 17-36 17-37 17-38 17-39 Title Page Number Chip Select x Addition Control Register ............................................................................ 18-20 WCR Register ..................................................................................................................... 18-23 Read Access, WSC=1 ......................................................................................................... 18-32 Write Access, WSC=1, EBWA=1, EBWN=1, LBN=1 ...................................................... 18-33 Read and Write Accesses, WSC=2, WWS=2, EBWA=1, EBWN=2 ................................. 18-34 Read and Write Accesses, WSC=2, WWS=1, EBWA=1, EBWN=2, EDC=1 ................... 18-35 Read and Write Accesses, WSC=3, CSA=1, CSN=1, LBA=1, LBN=1............................. 18-36 Read Accesses, WSC=2, OEA=2, CNC=2, BCM=1, EBRA=2......................................... 18-37 Read and Write Accesses, WSC=2, OEA=2, EBWA=1, EBWN=2, CNC=2, EBRA=2 .......................................................................................................... 18-38 Read Access, WSC=1, OEA=1, EBRA=1.......................................................................... 18-39 Write Access, WSC=1, EBWA=1, EBWN=1..................................................................... 18-40 Read Access, WSC=3, OEA=2, EBRA=2.......................................................................... 18-41 Write Access, WSC=3, EBWA=1, EBWN=3..................................................................... 18-42 Read Access, WSC=3, OEA=4, EBRA=4.......................................................................... 18-43 Write Access, WSC=3, EBWA2, EBWN=3 ....................................................................... 18-44 Read Access, WSC=3, OEN=2, EBRN=2.......................................................................... 18-45 Read Access, WSC=3, OEA=2, OEN=2, EBRA=2, EBRN=2 .......................................... 18-46 Write Access, WSC=2, WWS=1, EBWA=1, EBWN=2..................................................... 18-47 Write Access, WSC=1, WWS=2, EBWA=1, EBWN=2..................................................... 18-48 Write Access, WSC=2, CSA=1, WWS=1, CSN=1 ............................................................ 18-49 Sequential Read Access, WSC=7, OEA=8, PME=1, SYNC=1, DOL=1, EBRA=8 ......................................................................................................................... 18-50 Read Access, WSC=3F, OEA=8, OEN=5, EBRA=8, EBRN=5......................................... 18-51 Sequential Read Accesses, WSC=1, EW=1, DCT=1 ......................................................... 18-52 Sequential Write Accesses, WSC=1, EW=1, RWA=1, RWN=1 ........................................ 18-53 Non-sequential Read Accesses, WSC=2, SYNC=1, DOL=0 ............................................. 18-54 Sequential Read Access, WSC=7, OEA=8, SYNC=1, DOL=1, BCD=1, BCS=1, EBRA=8 ......................................................................................................................... 18-55 Non-sequential Read Accesses, WSC=3, SYNC=1, DOL=1 ............................................. 18-56 Increment 4 AHB Read Access, WSC=2, SYNC=1, DOL=1, WRAP=0 .......................... 18-57 Increment 4 AHB Read Access, WSC=2, SYNC=1, DOL=1, WRAP=0 .......................... 18-58 Increment 4 AHB Read Access, WSC=3, SYNC=1, DOL=1, WRAP=0, EW=0 ............................................................................................................................. 18-59 Increment 4 AHB Read Access, WSC=3, SYNC=1, DOL=1, WRAP=0, EW=1 ............................................................................................................................. 18-60 Increment 4 AHB Read Access, WSC=3, SYNC=1, WRAP=0, EW=1 ............................ 18-61 Increment 4 AHB Read Access, WSC=2, SYNC=1, DOL=1, WRAP=1, PSZ=0............................................................................................................................. 18-62 Wrap 4 AHB Read Access, WSC=2, SYNC=1, DOL=1, WRAP=0.................................. 18-63 Wrap 4 AHB Read Access, WSC=2, SYNC=1, DOL=1, WRAP=1, PSZ=0..................... 18-64 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor liii Figures Figure Number 17-40 17-41 17-42 17-43 17-44 17-45 17-46 18-1 18-2 18-3 18-4 18-5 18-6 18-7 18-8 18-9 18-10 18-11 18-12 18-13 18-14 18-15 18-16 18-17 18-18 18-19 18-20 18-21 18-22 18-23 18-24 18-25 18-26 18-27 18-28 18-29 18-30 18-31 18-32 18-33 18-34 Title Page Number Write Access, BCD=1, BCS=1, WSC=5, SYNC=1, DOL=1, EW=1, PSR=1................... 18-65 Read Access, BCD=1, BCS=1, WSC=5, SYNC=1, DOL=1, EW=1, PSR=1.................... 18-66 Write Access, BCS=1, WSC=4, SYNC=1, PSR=1 ............................................................ 18-67 Read Access, WSC=7, LBA=1, LBN=1, LAH=1, OEA=7................................................ 18-68 Write Access, WSC=7, LBA=1, LBN=1, LAH=1 ............................................................. 18-69 Read Access, BCD=1, SYNC=1, WCS=4, DOL=1, LBN=2, LAH=1, PSR=1 ................. 18-70 Write Access, BCD=1, SYNC=1, WCS=5, DOL=1, LBN=2, LAH=1, PSR=1 ................ 18-71 Enhanced SDR/LPDDR SDRAM Controller Block Diagram.............................................. 19-2 Key to Register Fields ......................................................................................................... 19-10 Data Organization in Memory ............................................................................................ 19-13 Enhanced SDRAM Control Register (ESDCTL0) ............................................................. 19-14 Enhanced SDRAM Control Register (ESDCTL1) ............................................................. 19-14 Enhanced SDRAM Configuration Register 0 (ESDCFG0) ................................................ 19-18 Enhanced SDRAM Configuration Register 1 (ESDCFG1) ................................................ 19-19 tRP—Precharge Delay Timing............................................................................................ 19-23 tWTRtRP Bit Field Encoding ............................................................................................. 19-24 tMRD—SDRAM Load Mode Register to Active Command Timing Diagram ................. 19-24 tWR—WRITE to PRECHARGE Timing Diagram ............................................................ 19-25 tRAS—SDRAM ACTIVE to PRECHARGE Command Timing Diagram ........................ 19-25 tRAS—SELF REFRESH Mode Minimum Time Period.................................................... 19-26 tRRD—Alternating Bank Read Access .............................................................................. 19-26 SDR CAS Latency Timing.................................................................................................. 19-27 Mobile LPDDR CAS Latency Timing................................................................................ 19-28 tRCD—Row to Column Delay Timing............................................................................... 19-29 tRC—Row Cycle Timing.................................................................................................... 19-30 tXP—New Command After Power Down Exit (4 Cycles) ................................................. 19-31 ESDRAMC Miscellaneous Register (ESDMISC) .............................................................. 19-31 MDDR Delay Line 1 Configuration Debug Register.......................................................... 19-33 MDDR Delay Line 2 Configuration Debug Register.......................................................... 19-33 MDDR Delay Line 3 Configuration Debug Register.......................................................... 19-34 MDDR Delay Line 4 Configuration Debug Register.......................................................... 19-34 MDDR Delay Line 5 Configuration Debug Register.......................................................... 19-35 MDDR Delay Line Cycle Length Debug Register ............................................................. 19-35 SDR SDRAM Read Burst Command Sequence Example.................................................. 19-37 LPDDR SDRAM Read Burst Command Sequence Example ............................................ 19-38 SDR SDRAM Optimization Strategies—MIF1 and MIF2 Examples ................................ 19-40 Mobile LPDDR SDRAM Optimization Strategies—MIF1 and MIF2 Examples .............. 19-41 SDR Simple Read after Read Latency Hiding Timing Diagram ........................................ 19-42 Mobile DDR Simple Read after Read Latency Hiding Timing Diagram ........................... 19-43 SDR Miss Write to CSD1 after Read from CSD0 .............................................................. 19-43 Mobile DDR Miss Write to CSD1 after Read from CSD0................................................. 19-44 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 liv Freescale Semiconductor Figures Figure Number 18-35 18-36 18-37 18-38 18-39 18-40 18-41 18-42 18-43 18-44 18-45 18-46 18-47 18-48 18-49 18-50 18-51 18-52 18-53 18-54 18-55 18-56 18-57 18-58 18-59 18-60 18-61 18-62 Title Page Number Hardware Refresh Timing Diagram.................................................................................... 19-48 Hardware Refresh with Pending Bus Cycle Timing Diagram ............................................ 19-48 SDRAM/LPDDR Enter Self Refresh Mode During System Sleep Mode .......................... 19-50 SDRAM/LPDDR Exit Self Refresh Mode During System Sleep Mode ............................ 19-51 Manual Self Refresh Entry Timing Diagram ...................................................................... 19-52 Manual Self Refresh Exit Timing Diagram ........................................................................ 19-53 SDR SDRAM Precharge Power Down Mode Entry Timing Diagram ............................... 19-54 SDR SDRAM Precharge Power Down Mode Exit Timing Diagram ................................. 19-55 Mobile DDR SDRAM Precharge Power Down Mode Entry Timing Diagram .................. 19-56 Mobile DDR SDRAM Precharge Power Down Mode Exit Timing Diagram .................... 19-57 SDR SDRAM Active Power Down Mode Timing Diagram .............................................. 19-58 Mobile DDR SDRAM Active Power Down Mode Timing Diagram ................................. 19-59 Simplified Enhanced SDRAM Controller State Diagram .................................................. 19-62 SDR and LPDDR Off-Page Single Read Timing Diagram (32-Bit Memory for SDR and 16-Bit for LPDDR) ........................................................ 19-64 SDR and LPDDR On-Page Single Read Timing Diagram (32-Bit Memory for SDR, 16-Bit for LPDDR).............................................................. 19-65 SDR and LPDDR Off-Page Burst Read Timing Diagram (32-Bit Memory for SDR or 16-Bit for LPDDR) .......................................................... 19-66 AHB 32-Bit read from a LPDDR: Off-Page Burst Read Timing Diagram (32-Bit) ........................................................................................................................... 19-67 AHB 64-Bit read from a LPDDR: Off-Page Burst Read Timing Diagram (32-Bit) ........................................................................................................................... 19-68 SDR and LPDDR On-Page Burst Read Timing Diagram (32-Bit Memory for SDR and 16-Bit for LPDDR) ........................................................ 19-69 On-Page Burst Read Timing Diagram (16-Bit Memory for SDR, LPDDR 8-Bit Is Not Supported) ...................................................................................................................... 19-70 Off-Page Burst Read Timing Diagram (16-Bit Memory, LPDDR 8-Bit Is Not Supported)........................................................ 19-70 SDR Off-Page Write Followed by On-Page Write Timing Diagram.................................. 19-71 LPDDR Off-Page Write Followed by On-Page Write Timing Diagram ............................ 19-72 Off-Page Burst Write Timing Diagram (32-Bit Memory for SDR and 16-Bit for LPDDR)......................................................................................................... 19-73 AHB 64-Bit Write to LPDDR: Off-Page Burst Write Timing Diagram (32-Bit Memory) ............................................................................................................ 19-74 AHB 32-Bit write to LPDDR: Off-Page Burst Write Timing Diagram (32-Bit Memory) ............................................................................................................ 19-75 On-Page Burst Write Timing Diagram (32-Bit Memory for SDR and 16-Bit for LPDDR)......................................................................................................... 19-76 Off-Page Burst Write Timing Diagram (SDR 16-bit Memory, LPDDR 8-Bit is Not Supported) .................................................................................................. 19-77 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lv Figures Figure Number 18-63 18-64 18-65 18-66 18-67 18-68 18-69 18-70 18-71 18-72 18-73 18-74 18-75 18-76 18-77 18-78 18-79 18-80 18-81 18-82 18-83 18-84 18-85 18-86 18-87 18-88 18-89 18-90 18-91 18-92 18-93 18-94 18-95 18-96 18-97 18-98 19-1 19-2 19-3 19-4 Title Page Number On-Page Burst Write Timing Diagram (SDR 16-Bit Memory, LPDDR 8-Bit Memory is Not Supported) ................................ 19-78 SDR Single Write followed by On-Page Read Timing Diagram........................................ 19-79 LPDDR Single Write Followed by On-Page Read Timing Diagram.................................. 19-80 SDR Single Read Followed by On-Page Write Timing Diagram ....................................... 19-81 LPDDR Single Read Followed by On-Page Write Timing Diagram.................................. 19-82 SDR Burst Read Followed by On-Page Write Timing Diagram ........................................ 19-83 LPDDR Burst Read Followed by On-Page Write Timing Diagram ................................... 19-84 Single on Page Read—Word Access to 16-Bit Memory (Cycle Accurate)........................ 19-85 Misaligned on Page INCR4 Burst Read Access to 16-Bit Memory ................................... 19-86 Misaligned WRAP8 Burst Read Access to 32-Bit Memory............................................... 19-88 Single on Page Write—Word Access to 32-Bit Memory (Cycle Accurate) ....................... 19-89 INCR4 Burst on Page Write—Word Access to 32-Bit Memory (Cycle Accurate) ............ 19-90 Precharge Specific Bank Timing Diagram.......................................................................... 19-92 Precharge All Banks Timing Diagram ................................................................................ 19-93 Software Initiated Auto-Refresh Timing Diagram.............................................................. 19-94 Set Mode Register State Diagram ....................................................................................... 19-95 SDR and LPDDR Set Mode Register Timing Diagram...................................................... 19-95 SDR SDRAM Initialization and Load Mode Register Sequence ....................................... 19-97 Simplified LPDDR SDRAM Initialization and Load Mode Register Sequence ................ 19-99 128 Mbit SDR SDRAM Mode Register ........................................................................... 19-100 Single 64 Mb (4M x 16) SDRAM Connection Diagram .................................................. 19-102 Single 128 Mb (8M x 16) SDRAM Connection Diagram ................................................ 19-103 Single 256 Mb (16M x 16) Connection Diagram ............................................................. 19-104 Single 512 Mb (32M x 16) SDRAM Connection Diagram .............................................. 19-105 Single 1-Gb (64M x 16) SDRAM Connection Diagram .................................................. 19-106 Dual 64 Mb (4M x 16 x 2) SDRAM Connection Diagram .............................................. 19-107 Dual 128 Mb (8M x 16 x 2) SDRAM Connection Diagram ............................................ 19-108 Dual 256-Mbyte (16M x 16 x 2) SDRAM Connection Diagram ..................................... 19-109 Single 64-Mbyte (2MBx32) SDRAM Connection Diagram ............................................ 19-110 Single 128-Mb (4MBx32) SDRAM Connection Diagram ............................................... 19-111 Single 256-MB (8MBx32) SDRAM Connection Diagram .............................................. 19-112 Single 512-Mb (16MBx32) SDRAM Connection Diagram ............................................. 19-113 Single 1-Gb (32MBx32) SDRAM Connection Diagram.................................................. 19-114 Single 2-Gb (64MBx32) SDRAM Connection Diagram.................................................. 19-115 Single 512-Mb (16MBx32) LPDDR SDRAM Connection Diagram ............................... 19-116 Single 512-Mb (32MBx16) LPDDR SDRAM Connection Diagram ............................... 19-117 NAND FLASH Controller Block Diagram........................................................................... 20-1 Warm Reset Operation .......................................................................................................... 20-5 Key to Register Fields ........................................................................................................... 20-8 NFC_BUFSIZE Register ...................................................................................................... 20-9 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lvi Freescale Semiconductor Figures Figure Number 19-5 19-6 19-7 19-8 19-9 19-10 19-11 19-12 19-13 19-14 19-15 19-16 19-17 19-18 19-19 19-20 19-21 19-22 19-23 19-24 19-25 19-26 19-27 19-28 19-29 19-30 19-31 19-32 19-33 19-34 19-35 19-36 19-37 19-38 19-39 19-40 19-41 20-1 20-2 20-3 20-4 Title Page Number RAM Buffer Address Register............................................................................................ 20-10 NAND Flash Address Register ........................................................................................... 20-10 NAND_Flash_CMD Register ............................................................................................. 20-11 NFC_Configuration Register .............................................................................................. 20-11 ECC_Status_Result ............................................................................................................. 20-12 ECC_RSLT_MAIN_AREA Register.................................................................................. 20-12 ECC_RSLT_MAIN_AREA Register.................................................................................. 20-13 ECC_Rslt_Spare_Area Register ......................................................................................... 20-14 ECC_Rslt_Spare_Area Register ......................................................................................... 20-14 NAND Flash Write Protection Register.............................................................................. 20-15 Unlock_Start_Blk_Add Register ........................................................................................ 20-15 UNLOCK_END_BLK_ADD Register ............................................................................... 20-16 NAND_FLASH_WR_PR_ST Register .............................................................................. 20-16 NAND_FLASH_CONFIG1 Register ................................................................................. 20-17 NAND_FLASH_CONFIG2 Register ................................................................................. 20-18 Boot Mode Operation.......................................................................................................... 20-21 Read Operation ................................................................................................................... 20-22 Program Operation .............................................................................................................. 20-22 Erase Operation................................................................................................................... 20-23 Flowchart of Preset Operation ............................................................................................ 20-26 Flowchart of NAND Flash Command Input Operation ...................................................... 20-27 Flowchart of NAND Flash Address Input Operation.......................................................... 20-28 Flowchart of NAND Flash Data Input Operation ............................................................... 20-29 Flowchart of NAND Flash Data Output Operation ............................................................ 20-30 Flowchart of Read NAND Flash ID Operation................................................................... 20-31 NAND Flash ID Data Format (x8)...................................................................................... 20-31 NAND Flash ID Data Format (x16).................................................................................... 20-32 Flowchart of Read NAND Flash Status Operation ............................................................. 20-32 NAND Flash Status Data Format........................................................................................ 20-32 Flowchart of Read NAND Flash Data Operation ............................................................... 20-33 Flowchart of Program NAND Flash Data Operation.......................................................... 20-34 Flowchart of Erase NAND Flash Operation ....................................................................... 20-35 Flowchart of Hot Reset Operation ...................................................................................... 20-35 State Diagram of RAM Buffer Write Protection ................................................................ 20-37 State Diagram of NAND Flash Write Protection................................................................ 20-39 256-Mbit (32 Mbit x 8 Bit) NAND Flash Connection Diagram......................................... 20-41 256 Mbit (16 M x 16 Bit) NAND Flash Connection Diagram ........................................... 20-42 PCMCIA Controller Interface Block Diagram ..................................................................... 21-2 Key to Register Fields ........................................................................................................... 21-7 PCMCIA Input Pins Register (PIPR).................................................................................... 21-9 PCMCIA Status Change Register (PSCR).......................................................................... 21-11 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lvii Figures Figure Number 20-5 20-6 20-7 20-8 20-9 20-10 20-11 20-12 21-1 21-2 21-3 21-4 21-5 21-6 21-7 21-8 21-9 21-10 22-1 22-2 22-3 22-4 22-5 22-6 22-7 22-8 22-9 22-10 22-11 22-12 22-13 22-14 22-15 22-16 23-1 23-2 23-3 23-4 23-5 23-6 23-7 Title Page Number PCMCIA Enable Register (PER) ........................................................................................ 21-12 PCMCIA Base Registers 0–4 (PBR0–PBR4) ..................................................................... 21-14 PCMCIA Option Registers 0–4 (POR0–POR4) ................................................................. 21-15 PCMCIA Offset Registers 0–4 (POFR0–POFR4) .............................................................. 21-18 PCMCIA General Control Register (PGCR) ...................................................................... 21-19 PCMCIA General Status Register (PGSR) ......................................................................... 21-20 Write Accesses PSHT=1, PSST =1..................................................................................... 21-28 Read Cycle PSHT=1, PSST =1........................................................................................... 21-29 1-Wire Connection ................................................................................................................ 22-1 1-Wire Block-Level Description ........................................................................................... 22-2 1-Wire Initialization .............................................................................................................. 22-3 Write 0 Timing ...................................................................................................................... 22-4 Write 1 Timing ...................................................................................................................... 22-4 Read Timing .......................................................................................................................... 22-5 Key to Register Fields ........................................................................................................... 22-5 Control Register .................................................................................................................... 22-7 Time Divider Register ........................................................................................................... 22-9 Reset Register...................................................................................................................... 22-11 ATA Host Controller Block Diagram.................................................................................... 23-1 Key to Register Fields ........................................................................................................... 23-7 ATA TIME_CONFIG0 Register ......................................................................................... 23-11 ATA TIME_CONFIG1 Register ......................................................................................... 23-12 ATA TIME_CONFIG2 Register ......................................................................................... 23-13 ATA TIME_CONFIG3 Register ......................................................................................... 23-14 ATA TIME_CONFIG4 Register ......................................................................................... 23-15 ATA TIME_CONFIG5 Register ......................................................................................... 23-16 ATA FIFO_DATA_32 Register ........................................................................................... 23-17 ATA FIFO_DATA_16 Register ........................................................................................... 23-17 ATA FIFO_FILL Register ................................................................................................... 23-18 ATA_CONTROL Register .................................................................................................. 23-19 ATA INT_PENDING Register............................................................................................ 23-20 ATA INT_ENABLE Register.............................................................................................. 23-21 ATA INT_CLEAR Register ................................................................................................ 23-21 ATA FIFO_ALARM Register ............................................................................................. 23-23 Configurable Serial Peripheral Interface Block Diagram ..................................................... 24-1 Generic CSPI Timing ............................................................................................................ 24-3 Typical SPI Transfer (8-Bit).................................................................................................. 24-4 Relationship between a SPI transfer and the Falling Edge of SPI_RDY.............................. 24-4 Relationship between a SPI Transfer and SPI_RDY ............................................................ 24-5 SPI Transfers with Wait States.............................................................................................. 24-5 SPI continuous transfer with BURST=1............................................................................... 24-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lviii Freescale Semiconductor Figures Figure Number 23-8 23-9 23-10 23-11 23-12 23-13 23-14 23-15 23-16 23-17 23-18 23-19 23-20 23-21 23-22 24-1 24-2 24-3 24-6 24-7 24-8 24-9 24-10 24-11 24-12 24-13 24-14 24-15 25-1 25-2 25-3 25-4 25-5 25-6 25-7 25-8 25-9 25-10 25-11 25-12 26-1 Title Page Number SPI Transfer while SSCTL is Clear ...................................................................................... 24-6 SPI Transfers while SSCTL is Set ........................................................................................ 24-7 Increment Data FIFO by SS Rising Edge ............................................................................. 24-8 Program Sequence of SPI Burst Using Interrupt .................................................................. 24-9 Program Sequence of SPI Burst Using DMA ....................................................................... 24-9 Flow Chart of CSPI Operation ............................................................................................ 24-10 Key to Register Fields ......................................................................................................... 24-12 RXDATA Register Diagram................................................................................................ 24-15 TXDATA Register Diagram ................................................................................................ 24-16 CSPI Control Register......................................................................................................... 24-17 Interrupt Control Register Diagram .................................................................................... 24-20 Test Control Register Diagram............................................................................................ 24-23 Sample Period Control Register Diagram........................................................................... 24-24 DMA Control Register Diagram ......................................................................................... 24-25 Reset Register Diagram....................................................................................................... 24-27 I2C Block Diagram................................................................................................................ 25-1 Connection of Devices to I2C Bus ........................................................................................ 25-2 Key to Register Fields ........................................................................................................... 25-4 I2C Address Register............................................................................................................. 25-6 I2C Frequency Register ......................................................................................................... 25-6 I2C Control Register.............................................................................................................. 25-8 I2C Status Register ................................................................................................................ 25-9 I2C Data Register ................................................................................................................ 25-10 I2C Standard Communication Protocol............................................................................... 25-12 Repeated START................................................................................................................. 25-13 Synchronized Clock SCL.................................................................................................... 25-14 Flowchart of Typical I2C Interrupt Routine ........................................................................ 25-17 Definition of Timing for Devices on I2C Bus ..................................................................... 25-18 KPP Peripheral Block Diagram ............................................................................................ 26-1 Key to Register Fields ........................................................................................................... 26-3 KPCR Register ...................................................................................................................... 26-5 KPSR Register ...................................................................................................................... 26-6 KDDR Register ..................................................................................................................... 26-8 KPDR Register...................................................................................................................... 26-8 Keypad Synchronizer Functional Diagram ......................................................................... 26-11 Multiple Key Presses on Same Column Line (Simplified View)........................................ 26-12 Multiple Key Presses on Same Row Line (Simplified View) ............................................. 26-12 Decoding Wrong Three-Key Presses .................................................................................. 26-13 Matrix with “Ghost” Key Protections ................................................................................. 26-14 KPP Interface with 3-Point Contact Key Matrix (Simplified View)................................... 26-15 Memory Stick Controller Block Diagram............................................................................. 27-1 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lix Figures Figure Number 26-2 26-3 26-4 26-5 26-6 27-1 27-2 27-3 27-4 27-5 27-6 27-7 27-8 27-9 27-10 27-11 27-12 27-13 27-14 27-15 27-16 27-17 27-18 27-19 27-20 27-21 27-22 27-23 27-24 27-25 27-26 27-27 27-28 28-1 28-2 28-3 28-4 28-5 28-6 28-7 28-8 Title Page Number MSHC Clock Structure ......................................................................................................... 27-8 Gasket Memory Interface Logic ........................................................................................... 27-9 Basic Read/Write Timing Diagram..................................................................................... 27-10 Back-to-Back Write/Read Timing Diagram ....................................................................... 27-11 Gasket Interrupt Generation................................................................................................ 27-13 Secure Digital Host Controller Block Diagram .................................................................... 28-1 System Interconnection with the Secure Digital Host Controller......................................... 28-2 Key to Register Fields ........................................................................................................... 28-4 SDHC Clock Control Register .............................................................................................. 28-8 SDHC Status Register ......................................................................................................... 28-10 SDHC Clock Rate Register................................................................................................. 28-14 SDHC Command and Data Control Register...................................................................... 28-16 MMC/SD Response Time Out Register.............................................................................. 28-18 SDHC Read Time Out Register .......................................................................................... 28-19 SDHC Block Length Register............................................................................................. 28-20 SDHC Number of Blocks Register ..................................................................................... 28-22 SDHC Revision Number Register....................................................................................... 28-23 SDHC Interrupt Control Register........................................................................................ 28-24 SDHC Command Number Register .................................................................................... 28-28 SDHC Command Argument Register ................................................................................. 28-29 SDHC Response FIFO Register.......................................................................................... 28-30 SDHC Buffer Access Register ............................................................................................ 28-31 SDHC Buffer Scheme ......................................................................................................... 28-32 Byte Lanes Relationship Between System IP Bus and SD Card Bus ................................. 28-33 Example for Dividing Large Data Transfer ........................................................................ 28-35 DMA Interface Block.......................................................................................................... 28-36 Memory Controller Block Diagram .................................................................................... 28-37 a) Card Interrupt Scheme; b) Card Interrupt Detection and Handling Procedure .............. 28-39 Block Diagram for Command Interpreter ........................................................................... 28-42 Command CRC Shift Register (DATs Has Similar Structure) ........................................... 28-42 Clock Used in SDHC .......................................................................................................... 28-44 Flow Diagram for Card Detection....................................................................................... 28-47 Flow Chart for Reset of SDHC and SD I/O Card ............................................................... 28-48 UART Block Diagram........................................................................................................... 29-1 Key to Register Fields ........................................................................................................... 29-5 Key to Register Fields ........................................................................................................... 29-5 UART Receiver Register (URXD)........................................................................................ 29-8 UART Transmitter (UTXD) Register.................................................................................... 29-9 UART Control Register 1 (UCR1)...................................................................................... 29-10 UART Control Register 2 (UCR2) Summary ..................................................................... 29-12 UART Control Register 3 (UCR3) Summary ..................................................................... 29-14 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lx Freescale Semiconductor Figures Figure Number 28-9 28-10 28-11 28-12 28-13 28-14 28-15 28-16 28-17 28-18 28-19 28-20 28-21 28-22 28-23 28-24 29-1 29-2 29-3 29-4 29-5 29-6 29-7 29-8 29-9 29-10 29-11 29-12 29-13 29-14 29-15 29-16 29-17 29-18 29-19 29-20 29-21 29-22 29-23 29-24 29-25 Title Page Number UART Control Register 4 (UCR4) Summary ..................................................................... 29-16 UART FIFO Control Register (UFCR) Summary .............................................................. 29-18 UART Status Register 1 (USR1) Summary ........................................................................ 29-19 UART Status Register 2 (USR2) Summary ........................................................................ 29-21 UART Escape Character Register Summary (UESC)......................................................... 29-23 UART Escape Timer Register Summary (UTIM)............................................................... 29-23 UART BRM Incremental Register Summary (UBIR) ........................................................ 29-24 UART BRM Modulator Register Summary (UBMR) ........................................................ 29-24 UART Baud Rate Count Register Summary (UBRC) ........................................................ 29-25 UART One Millisecond Register Summary (ONEMS) ...................................................... 29-26 UART Test Register Summary (UTS)................................................................................. 29-26 Examples of Working Relationships Between ipg_clk and ipg_perclk .............................. 29-30 UART Simplified Block and Clock Generation Diagrams ................................................. 29-34 Transmitter FIFO Empty Interrupt Suppression Flow Chart .............................................. 29-36 Majority Vote Results.......................................................................................................... 29-40 Baud Rate Detection Protocol Diagram.............................................................................. 29-43 FEC Block Diagram.............................................................................................................. 30-3 Ethernet Address Recognition—Receive Block Decisions ................................................ 30-10 Ethernet Address Recognition—Microcode Decisions ...................................................... 30-11 Ethernet Interrupt Event Register (EIR) ............................................................................. 30-21 EIMR Register .................................................................................................................... 30-23 RDAR Register ................................................................................................................... 30-24 TDAR Register.................................................................................................................... 30-24 ECR Register....................................................................................................................... 30-25 MMFR Register .................................................................................................................. 30-26 MSCR Register ................................................................................................................... 30-27 MIBC Register .................................................................................................................... 30-28 RCR Register ...................................................................................................................... 30-29 TCR Register....................................................................................................................... 30-30 PALR Register..................................................................................................................... 30-31 PAUR Register .................................................................................................................... 30-32 OPD Register ...................................................................................................................... 30-32 IAUR Register..................................................................................................................... 30-33 IALR Register ..................................................................................................................... 30-33 GAUR Register ................................................................................................................... 30-34 GALR Register.................................................................................................................... 30-34 TFWR Register ................................................................................................................... 30-35 FRBR Register .................................................................................................................... 30-35 FRSR Register..................................................................................................................... 30-36 ERDSR Register.................................................................................................................. 30-36 Transmit Buffer Descriptor Ring Start Register (ETDSR) ................................................. 30-37 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxi Figures Figure Number 29-26 29-27 29-28 30-1 30-2 30-3 30-4 30-5 30-6 30-7 30-8 30-9 30-10 30-11 30-12 30-13 30-14 30-15 30-16 30-17 30-18 30-19 30-20 30-21 30-22 30-23 30-24 30-25 30-26 30-27 30-28 30-29 30-30 30-31 30-32 30-33 30-34 30-35 30-36 30-37 30-38 Title Page Number EMRBR Register ................................................................................................................ 30-37 Receive Buffer Descriptor (RxBD)..................................................................................... 30-40 Transmit Buffer Descriptor (TxBD) ................................................................................... 30-42 USB Block Diagram ............................................................................................................. 31-1 USB Control Register ........................................................................................................... 31-7 OTG Mirror Register (OTGMIRROR) ............................................................................... 31-10 TLL Mux Functional Diagram............................................................................................ 31-17 USB Bypass Mux Functional Diagram............................................................................... 31-19 End Point Queue Head Organization .................................................................................. 31-22 ID—Identification Register................................................................................................. 31-30 HWGENERAL—General Hardware Parameters ............................................................... 31-31 HWHOST—Host Hardware Parameters............................................................................. 31-31 HWDEVICE—Device Hardware Parameters..................................................................... 31-32 HWTXBUF—TX Buffer Hardware Parameters................................................................. 31-33 WRXBUF—RX Buffer Hardware Parameters ................................................................... 31-33 CAPLENGTH—Capability Register Length...................................................................... 31-34 HCIVERSION—Host Interface version number................................................................ 31-34 HCSPARAMS—Host Control Structural Parameters......................................................... 31-35 HCCPARAMS—Host Control Capability Parameters ....................................................... 31-36 DCIVERSION—Device Interface Version Number........................................................... 31-38 DCCPARAMS—Device Control Capability Parameters.................................................... 31-38 GPTIMER0LD—General Purpose Timer #0 Load Register .............................................. 31-39 GPTIMER0LD—General Purpose Timer #0 Controller .................................................... 31-40 USBCMD—USB Command Register ................................................................................ 31-41 USBSTS—USB Status ....................................................................................................... 31-44 USBINTR—USB Interrupt Enable..................................................................................... 31-46 FRINDEX—USB Frame Index .......................................................................................... 31-49 PERIODICLISTBASE—Host Controller Frame List Base Address ................................. 31-50 DEVICEADDR—Device Controller USB Device Address ............................................... 31-50 ASYNCLISTADDR—Host Controller Next Asynch. Address.......................................... 31-51 ENDPOINTLISTADDR—Device Controller Endpoint List Address................................ 31-51 BURSTSIZE—Host Controller Embedded TT Async. Buffer Status ................................ 31-52 TXFILLTUNING ................................................................................................................ 31-53 ULPI VIEWPORT .............................................................................................................. 31-56 PORTSCx—Port Status Control[1:8] ................................................................................. 31-57 OTGSC—OTG Status Control............................................................................................ 31-63 USBMODE -USB Device Mode ........................................................................................ 31-65 ENDPTSETUPSTAT—Endpoint Setup Status................................................................... 31-67 ENDPTPRIME—Endpoint Initialization ........................................................................... 31-67 ENDPTFLUSH—Endpoint De-Initialize ........................................................................... 31-68 ENDPTSTAT—Endpoint Status ......................................................................................... 31-69 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxii Freescale Semiconductor Figures Figure Number 30-39 30-40 30-41 30-42 30-43 30-44 30-45 30-46 30-47 30-48 30-49 30-50 30-51 30-52 30-53 30-54 30-55 30-56 30-57 30-58 30-59 30-60 30-61 30-62 30-63 30-64 30-65 30-66 30-67 30-68 30-69 30-70 30-71 30-72 30-73 30-74 30-75 30-76 30-77 31-1 31-2 Title Page Number ENDPTCOMPLETE—Endpoint Compete......................................................................... 31-70 ENDPTCTRL0—Endpoint Control 0................................................................................. 31-71 ......................................... ENDPTCTRL1—ENDPTCTRL15—Endpoint Control 1 to 1531-72 Controller Mode .................................................................................................................. 31-75 Periodic Schedule Organization.......................................................................................... 31-77 Format of Frame List Element Pointer................................................................................ 31-78 Asynchronous Schedule Organization ................................................................................ 31-79 Split-transaction Isochronous Transaction Descriptor (siTD) ............................................ 31-84 Queue Element Transfer Descriptor Block Diagram .......................................................... 31-88 Queue Head Structure Layout............................................................................................. 31-95 Frame Span Traversal Node Structure Layout .................................................................. 31-100 Example USB 2.0 Host Controller Port Routing Block Diagram..................................... 31-103 Port Owner Handoff State Machine.................................................................................. 31-106 Derivation of Pointer into Frame List Array..................................................................... 31-111 General Format of Asynchronous Schedule List .............................................................. 31-111 Best Fit Approximation..................................................................................................... 31-113 Frame Boundary Relationship between HS bus and FS/LS Bus ...................................... 31-115 Relationship of Periodic Schedule Frame Boundaries to Bus Frame Boundaries ............ 31-116 Example Periodic Schedule .............................................................................................. 31-118 Example Association of iTDs to Client Request Buffer ................................................... 31-121 Generic Queue Head Unlink Scenario .............................................................................. 31-126 Asynchronous Schedule List w/Annotation to Mark Head of List ................................... 31-127 Example State Machine for Managing Asynchronous Schedule Traversal ...................... 31-128 Example HC State Machine for Controlling Nak Counter Reloads ................................. 31-132 Host Controller Queue Head Traversal State Machine ..................................................... 31-134 Example Mapping of qTD Buffer Pointers to Buffer Pages ............................................. 31-142 Host Controller Asynchronous Schedule Split-Transaction State Machine ..................... 31-146 Split Transaction, Interrupt Scheduling Boundary Conditions ......................................... 31-148 General Structure of EHCI Periodic Schedule Utilizing Interrupt Spreading .................. 31-149 Example Host Controller Traversal of Recovery Path via FSTNs.................................... 31-151 Split Transaction State Machine for Interrupt................................................................... 31-154 Split Transaction, Isochronous Scheduling Boundary Conditions ................................... 31-161 siTD Scheduling Boundary Examples .............................................................................. 31-163 Split Transaction State Machine for Isochronous ............................................................. 31-166 End Point Queue Head Organization ................................................................................ 31-186 Endpoint Queue Head (dQH)............................................................................................ 31-187 Endpoint Transfer Descriptor (dTD)................................................................................. 31-189 End Point Queue Head Diagram ....................................................................................... 31-205 Software Link Pointers ..................................................................................................... 31-207 General-Purpose Timer Block Diagram................................................................................ 32-2 GPT Control Register............................................................................................................ 32-7 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxiii Figures Figure Number 31-3 31-4 31-5 31-6 31-7 32-1 32-2 32-3 32-4 32-5 32-6 32-7 32-8 32-9 32-10 32-11 32-12 32-13 33-1 33-2 33-3 33-4 33-5 33-6 33-7 33-8 33-9 33-10 33-11 33-12 33-13 34-1 34-2 34-3 34-4 34-5 34-6 36-1 36-2 36-3 36-4 Title Page Number GPT Control Register............................................................................................................ 32-9 GPT Compare Register ....................................................................................................... 32-10 GPT Capture Register ......................................................................................................... 32-11 GPT Counter Register ......................................................................................................... 32-12 GPT Status Register ............................................................................................................ 32-13 Pulse-Width Modulator Block Diagram ............................................................................... 33-1 PWM Module Signals ........................................................................................................... 33-3 Key to Register Fields ........................................................................................................... 33-4 PWM Control Register (PWMCR) ....................................................................................... 33-6 PWM Status Register (PWMSR) .......................................................................................... 33-8 PWM Interrupt Register (PWMIR)....................................................................................... 33-9 PWM Sample Register (PWMSAR)................................................................................... 33-10 PWM Period Register (PWMPR) ....................................................................................... 33-11 PWM Counter Register (PWMCNR).................................................................................. 33-12 PWM Clocking ................................................................................................................... 33-15 Clock Distribution Inside PWM.......................................................................................... 33-16 Clock Selection and Division Unit...................................................................................... 33-17 ipg_enable_clk Generation Logic ....................................................................................... 33-17 Real Time Clock Block Diagram .......................................................................................... 34-1 Key to Register Fields ........................................................................................................... 34-4 RTC Hours and Minutes Counter Register ........................................................................... 34-6 RTC Seconds Counter Register............................................................................................. 34-7 RTC Hours and Minutes Alarm Register .............................................................................. 34-8 RTC Seconds Alarm Register ............................................................................................... 34-9 RTC Control Register.......................................................................................................... 34-10 RTC Interrupt Status Register ............................................................................................. 34-11 RTC Interrupt Enable Register............................................................................................ 34-13 RTC Stopwatch Minutes Register ....................................................................................... 34-15 RTC Days Counter Register................................................................................................ 34-16 RTC Day Alarm Register .................................................................................................... 34-17 Flowchart of RTC Operation............................................................................................... 34-20 WDOG Block Diagram......................................................................................................... 35-1 Key to Register Fields ........................................................................................................... 35-4 Watchdog Control Register ................................................................................................... 35-5 Watchdog Service Register (WSR) ....................................................................................... 35-6 Watchdog Reset Status Register (WRSR)............................................................................. 35-7 Counter State Machine........................................................................................................ 35-13 MAX Block Diagram............................................................................................................ 37-2 Key to Register Fields ........................................................................................................... 37-4 Slave General Purpose Control Register (SGPCR0-2) ....................................................... 37-10 Alternate SGPCR for Slave Port0–2 (ASGPCR0-2) .......................................................... 37-12 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxiv Freescale Semiconductor Figures Figure Number 36-5 36-6 36-7 36-8 36-9 36-10 36-11 36-12 37-1 37-2 37-3 37-4 37-5 37-6 37-7 37-8 37-9 37-10 37-11 37-12 37-13 37-14 37-15 37-16 37-17 37-18 37-19 37-20 37-21 37-22 37-23 37-24 37-25 37-26 38-1 38-2 38-3 38-4 38-5 38-6 38-7 Title Page Number Master General Purpose Control Registers (MGPCR0-5) .................................................. 37-13 MAX Master Port Block Diagram ...................................................................................... 37-17 MAX Slave Port Block Diagram ........................................................................................ 37-20 Low to High Priority Mastership Change ........................................................................... 37-22 High to Low Priority Mastership Change ........................................................................... 37-22 Round-Robin Mastership Change ....................................................................................... 37-23 Parking on Last Master ....................................................................................................... 37-24 Parking on a Specific Master .............................................................................................. 37-25 Block Diagram of DMAC ..................................................................................................... 38-1 Assertion of DMA External Grant Signal............................................................................. 38-3 Safe Maximum Timings for External Request De-Assertion ............................................... 38-3 Key to Register Fields ........................................................................................................... 38-6 DMA Control Register (DCR) ............................................................................................ 38-11 DMA Interrupt Status Register ........................................................................................... 38-12 DMA Interrupt Status Register (DIMR) ............................................................................. 38-13 DMA Burst Time-Out Status Register (DBTOSR)............................................................. 38-14 DMA Request Time-Out Status Register (DRTOSR)......................................................... 38-15 DMA Transfer Error Status Register (DSESR) .................................................................. 38-16 DMA Buffer Overflow Status Register (DBOSR).............................................................. 38-17 DMA Burst Time-Out Control Register (DBTOCR).......................................................... 38-18 2D Memory Increment Diagram......................................................................................... 38-19 2D Memory Decrement Diagram ....................................................................................... 38-19 W-Size Registers (WSRA, WSRB)..................................................................................... 38-20 X-Size Registers (XSRA, XSRB) ....................................................................................... 38-21 Y Size Registers (YSRA, YSRB) ....................................................................................... 38-22 Channel Source Address Register (SAR0–SAR15)............................................................ 38-23 Channel Destination Address Registers (DAR0–DAR15).................................................. 38-24 Channel Count Registers (CNTR0–CNTR15).................................................................... 38-25 Channel Control Registers (CCR0–CCR15)....................................................................... 38-26 Channel Request Source Select Registers (RSSR0–RSSR15)............................................ 38-28 Channel Burst Length Registers (BLR0–BLR15) .............................................................. 38-29 Channel Request Time-Out Registers (RTOR0–RTOR15)................................................. 38-30 Channel Bus Utilization Control Register (BUCR0–BUCR15) ......................................... 38-31 Channel Counter Register (CCNR0–CCNR15).................................................................. 38-32 AUDMUX Block Diagram ................................................................................................... 39-3 Internal Network Mode ......................................................................................................... 39-4 Tx/Rx Switch ........................................................................................................................ 39-5 Frame Sync and Clock Routing when Peripheral Port is 4-Wire.......................................... 39-6 Frame Sync Routing when Peripheral Port is 6-Wired ......................................................... 39-9 Clock Routing when Peripheral Port is 6-Wired................................................................. 39-10 SSI to Peripheral Port Interconnection................................................................................ 39-12 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxv Figures Figure Number 38-8 38-9 38-10 38-11 38-12 38-13 38-14 38-15 38-16 39-1 39-2 39-3 39-4 39-5 39-6 39-7 39-8 39-9 39-10 39-11 39-12 39-13 39-14 39-15 40-1 40-2 40-3 40-4 40-5 40-6 40-7 40-8 40-9 40-10 40-11 40-12 40-13 40-14 40-15 40-16 Title Page Number SSI to SAP Interconnection ................................................................................................ 39-13 Key to Register Fields ......................................................................................................... 39-14 Host Port Configuration Register (HPCR1–2).................................................................... 39-16 Peripheral Port Configuration Registers (PPCR1–2) .......................................................... 39-18 SAP as Master to SSI2 as Slave Interconnection................................................................ 39-21 Configuration Overview...................................................................................................... 39-22 SSI1 as Master in Internal Network Mode.......................................................................... 39-23 Tx-Rx Switch Restriction.................................................................................................... 39-24 Internal and External Mode Restriction .............................................................................. 39-25 CSI Block Diagram ............................................................................................................... 40-2 Non-Gated Clock Mode Timing Diagram ............................................................................ 40-4 CCIR656 Interlace Mode (PAL) ........................................................................................... 40-5 CCIR656 General Line Timing............................................................................................. 40-5 CCIR656 Progressive Mode (General Case) ........................................................................ 40-7 Sample Timing Diagram for RGB888 Data........................................................................ 40-10 Optional Dummy Byte Packing Scheme............................................................................. 40-10 Key to Register Fields ......................................................................................................... 40-11 CSPI Control Register 1 (CSICR1)..................................................................................... 40-14 CSI Control Register 2 (CSICR2)....................................................................................... 40-17 CSI Control Register 3 (CSICR3)....................................................................................... 40-19 CSI Status Register (CSISR)............................................................................................... 40-20 CSI STATFIFO Register (CSISTATFIFO).......................................................................... 40-22 CSI RxFIFO Register (CSIRFIFO)..................................................................................... 40-23 CSI RX Count Register (CSIRXCNT) ............................................................................... 40-23 Video Codec Block Architecture Diagram ........................................................................... 41-1 Key to Register Fields ........................................................................................................... 41-5 Video Codec Code Run Register........................................................................................... 41-7 Video Codec BIT Boot Code Download Data Register........................................................ 41-8 Video Codec Host Interrupt Request Register ...................................................................... 41-9 Video Codec BIT Interrupt Clear Register............................................................................ 41-9 Video Codec BIT Interrupt Status Register ........................................................................ 41-10 Video Codec BIT Code Reset Register ............................................................................... 41-11 Video Codec BIT Current PC Register ............................................................................... 41-12 Rotation and Mirroring Data Flow...................................................................................... 41-15 Video Codec Interface with Application Software Diagram .............................................. 41-16 Codec Process State Diagram ............................................................................................. 41-17 H.264 Codec Process Flow Example .................................................................................. 41-19 Frame Buffer Configuration................................................................................................ 41-21 Frame Buffer Address Map in Little Endian....................................................................... 41-22 One of Application Using Case: One Channel Encoding and Three Channels Decoding .............................................................................................. 41-26 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxvi Freescale Semiconductor Figures Figure Number 41-1 41-2 41-3 41-4 41-5 41-6 41-7 41-8 41-9 41-10 41-11 41-12 41-13 41-14 41-15 41-16 41-17 41-18 41-19 41-20 41-21 41-22 41-23 41-24 41-25 41-26 41-27 41-28 41-29 41-30 41-31 41-32 41-33 41-34 41-35 41-36 41-37 41-38 41-39 41-40 41-41 Title Page Number eMMA_lt Block Diagram ..................................................................................................... 42-3 eMMA AHB 64-Bit Gasket with Bypass.............................................................................. 42-4 Post-Processor (PP) Block Diagram ..................................................................................... 42-5 PP Input Data Layout (QCIF) ............................................................................................. 42-10 Input Line Stride ................................................................................................................. 42-12 Output Line Stride............................................................................................................... 42-13 PP Control Register............................................................................................................. 42-14 PP Interrupt Control Register.............................................................................................. 42-16 PP Interrupt Status Register ................................................................................................ 42-17 PP Source Y Address Register............................................................................................ 42-18 PP Source Cb Address Register .......................................................................................... 42-18 PP Source Cr Address Register........................................................................................... 42-19 PP Destination RGB Frame Start Address Register ........................................................... 42-20 PP Quantizer Start Address Register................................................................................... 42-20 PP Process Parameter Register............................................................................................ 42-21 PP Source Frame Width Register........................................................................................ 42-22 PP Destination Display Width Register .............................................................................. 42-23 PP Destination Image Size Register.................................................................................... 42-23 PP Destination Frame Format Control Register.................................................................. 42-24 PP Resize Table Index Register .......................................................................................... 42-26 PP CSC Coefficient_123 Register....................................................................................... 42-27 PP CSC Coefficient_4 Register........................................................................................... 42-28 PP Resize Coefficient Table (Array of 32 Resize Coefficients).......................................... 42-29 Memory Image Size and Source Line Stride ...................................................................... 42-40 Memory Image and Output Stride ...................................................................................... 42-40 CSI Frame Cropping ........................................................................................................... 42-41 CSI-PrP Link....................................................................................................................... 42-42 PRP Control Register .......................................................................................................... 42-45 PRP Interrupt Control Register ........................................................................................... 42-48 PrP Interrupt Status Register............................................................................................... 42-49 PrP Source Y Address Register........................................................................................... 42-50 PrP Source Cb Address Register......................................................................................... 42-51 PrP Source Cr Address Register ......................................................................................... 42-51 PrP Destination RGB1 Start Address Register ................................................................... 42-52 PrP Destination RGB2 Start Address Register ................................................................... 42-53 PrP Destination Y Address Register ................................................................................... 42-53 PrP Destination Cb Address Register ................................................................................. 42-54 PrP Destination Cr Address Register .................................................................................. 42-55 PrP Source Frame Size Register ......................................................................................... 42-55 PrP Destination Channel-1 Line Stride Register................................................................. 42-56 PrP Source Pixel Format Control Register.......................................................................... 42-57 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxvii Figures Figure Number 41-42 41-43 41-44 41-45 41-46 41-47 41-48 41-49 41-50 41-51 41-52 41-53 41-54 41-55 41-56 41-57 41-58 41-59 41-60 42-1 42-2 42-3 42-4 42-5 42-6 42-7 42-8 42-9 42-10 42-11 42-12 42-13 42-14 42-15 42-16 42-17 42-18 42-19 42-20 42-21 42-22 Title Page Number PrP CH1 Pixel Format Control Register ............................................................................. 42-59 PrP Destination Channel-1 Output Image Size Register..................................................... 42-60 PrP Destination CH2 Output Image Size Register.............................................................. 42-61 PrP Source Line Stride Register.......................................................................................... 42-62 PrP CSC Coefficient 012..................................................................................................... 42-63 PrP CSC Coefficient 345..................................................................................................... 42-64 PrP CSC Coefficient 678..................................................................................................... 42-65 PrP Channel-1 Horizontal Resize Coefficient 1.................................................................. 42-66 PrP Channel-1 Horizontal Resize Coefficient 2.................................................................. 42-67 PrP Channel-1 Resize Horizontal Valid .............................................................................. 42-69 PrP Channel 1 Vertical Resize Coefficient 1....................................................................... 42-70 PrP Channel-1 Vertical Resize Coefficient 2 ...................................................................... 42-71 PrP Channel1 Vertical Resize Valid .................................................................................... 42-72 PrP Channel-2 Horizontal Resize Coefficient 1.................................................................. 42-73 PrP Channel-2 Horizontal Resize Coefficient 2.................................................................. 42-74 PrP Channel-2 Resize Horizontal Valid .............................................................................. 42-75 PrP Channel2 Vertical Resize Coefficient 1........................................................................ 42-76 PrP Channel-2 Vertical Resize Coefficient 2 ...................................................................... 42-77 PrP Channel2 Vertical Resize Valid .................................................................................... 42-79 SSI Block Diagram ............................................................................................................... 43-2 Normal Mode Timing—Continuous Clock .......................................................................... 43-7 Normal Mode Timing—Internal Gated Clock...................................................................... 43-8 Normal Mode Timing—External Gated Clock..................................................................... 43-8 Network Mode Timing—Continuous Clock....................................................................... 43-12 Internal Gated Mode Timing—Rising Edge Clocking/Falling Edge Latching................... 43-13 Internal Gated Mode Timing—Falling Edge Clocking/Rising Edge Latching................... 43-13 External Gated Mode Timing—Rising Edge Clocking/Falling Edge Latching ................. 43-14 External Gated Mode Timing—Falling Edge Clocking/Rising Edge Latching ................. 43-14 I2S Mode Timing—Serial Clock, Frame Sync, and Serial Data ........................................ 43-14 Asynchronous (SYN=0) SSI Configurations—Continuous Clock ..................................... 43-22 Synchronous SSI Configurations—Continuous and Gated Clock...................................... 43-23 Serial Clock and Frame Sync Timing ................................................................................. 43-24 Key to Register Fields ......................................................................................................... 43-28 SSI Transmit Data Registers ............................................................................................... 43-33 Transmit Data Path (TXBIT0=0, TSHFD=0) (MSB Alignment) ....................................... 43-34 Transmit Data Path (TXBIT0=0, TSHFD=1) (MSB Alignment) ....................................... 43-35 Transmit Data Path (TXBIT0=1, TSHFD=0) (LSB Alignment) ........................................ 43-35 Transmit Data Path (TXBIT0=1, TSHFD=1) (LSB Alignment) ........................................ 43-36 SSI Receive Data Registers................................................................................................. 43-36 Receive Data Path (RXBIT0=0, RSHFD=0) (MSB Alignment) ........................................ 43-37 Receive Data Path (RXBIT0=0, RSHFD=1) (MSB Alignment) ........................................ 43-38 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxviii Freescale Semiconductor Figures Figure Number 42-23 42-24 42-25 42-26 42-27 42-28 42-29 42-30 42-31 42-32 42-33 42-34 42-35 42-36 42-37 42-38 42-39 42-40 42-41 42-42 42-43 42-44 42-45 42-46 42-47 43-1 43-2 43-3 43-4 43-5 43-7 43-6 43-8 43-9 43-10 43-11 43-12 43-13 43-14 43-15 43-16 Title Page Number Receive Data Path (RXBIT0=1, RSHFD=0) (LSB Alignment) ......................................... 43-38 Receive Data Path (RXBIT0=1, RSHFD=1) (LSB Alignment) ......................................... 43-39 SSI Control Register ........................................................................................................... 43-39 SSI Interrupts ...................................................................................................................... 43-41 SSI Interrupt Status Register............................................................................................... 43-42 SSI Interrupt Enable Register.............................................................................................. 43-46 SSI Transmit Configuration Register .................................................................................. 43-47 SSI Receive Configuration Register.................................................................................... 43-49 SSI Transmit and Receive Clock Control Registers ........................................................... 43-51 SSI FIFO Control/Status Register....................................................................................... 43-53 SSI Test Register ................................................................................................................. 43-56 SSI Option Register............................................................................................................. 43-57 SSI AC97 Control Register ................................................................................................. 43-58 SSI AC97 Command Address Register .............................................................................. 43-60 SSI AC97 Command Data Register .................................................................................... 43-61 SSI AC97 Tag Register ....................................................................................................... 43-62 SSI Transmit Time Slot Mask Register............................................................................... 43-63 SSI Receive Time Slot Mask Register ................................................................................ 43-64 SSI AC97 Channel Status Register ..................................................................................... 43-65 SSI AC97 Channel Enable Register.................................................................................... 43-66 SSI AC97 Channel Disable Register................................................................................... 43-67 SSI Clocking ....................................................................................................................... 43-68 SSI Transmit Clock Generator Block Diagram .................................................................. 43-69 SSI Transmit Frame Sync Generator Block Diagram ......................................................... 43-69 SSI Bit Clock Equation ....................................................................................................... 43-70 LCDC Block Diagram .......................................................................................................... 44-3 LCD Screen Format .............................................................................................................. 44-3 Graphic Window on Screen .................................................................................................. 44-4 Pixel Location on Display Screen ......................................................................................... 44-5 Display Data Mapping 1 bpp Through 16 bpp Mode ........................................................... 44-6 Display Data Mapping for 24 bpp Mode .............................................................................. 44-7 Display Data Mapping for 18 bpp Mode .............................................................................. 44-7 Gray-Scale Pixel Generation................................................................................................. 44-8 Active Matrix Color Pixel Generation .................................................................................. 44-8 Passive Matrix Color Pixel Generation ................................................................................. 44-9 LCDC Interface Signals ...................................................................................................... 44-10 LCDC Interface Timing for 4-Bit Data Width Gray-Scale Panels...................................... 44-12 LCDC Interface Timing for 8-Bit Data Passive Matrix Color Panels................................. 44-12 Horizontal Sync Pulse Timing in Passive Mode ................................................................. 44-13 Vertical Sync Pulse Timing in Passive Mode...................................................................... 44-13 LCDC Interface 16-Bit Timing for Active Matrix Color Panels ........................................ 44-14 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxix Figures Figure Number 43-17 43-18 43-19 43-20 43-21 43-22 43-23 43-24 43-25 43-26 43-27 43-28 43-29 43-30 43-31 43-32 43-33 43-34 43-35 43-36 43-37 43-38 43-39 43-40 43-41 43-42 43-43 43-44 43-45 43-46 43-47 43-48 43-49 44-1 44-2 44-3 44-4 44-5 Title Page Number LCDC Interface 18-Bit Timing for Active Matrix Color Panels ........................................ 44-15 LCDC Interface 24-bpp Timing For AUS Mode ................................................................ 44-16 LCDC Interface 16-bpp Timing For AUS Mode ................................................................ 44-17 Horizontal Sync Pulse Timing in TFT Mode...................................................................... 44-17 Vertical Sync Pulse Timing TFT Mode .............................................................................. 44-18 Key to Register Fields ......................................................................................................... 44-19 LCDC Screen Start Address Register (LSSAR) ................................................................. 44-23 LCDC Size Register (LSR)................................................................................................. 44-24 LCDC Virtual Page Width Register (LVPWR)................................................................... 44-25 LCDC Cursor Position Register (LCPR) ............................................................................ 44-25 LCDC Cursor Width Height and Blink Register (LCWHB) .............................................. 44-26 LCDC Color Cursor Mapping Register (LCCMR)............................................................. 44-27 LCDC Panel Configuration Register (LPCR) ..................................................................... 44-28 LCDC Horizontal Configuration Register (LHCR) ............................................................ 44-31 LCDC Vertical Configuration Register (LVCR) ................................................................. 44-32 LCDC Panning Offset Register (LPOR) ............................................................................. 44-33 LCDC Sharp Configuration Register (LSCR) .................................................................... 44-34 Horizontal Timing in Device_Number ............................................................................... 44-35 LCDC PWM Contrast Control Register (LPCCR) ............................................................. 44-36 LCDC DMA Control Register (LDCR).............................................................................. 44-37 LCDC Refresh Mode Control Register (LRMCR) ............................................................. 44-38 LCDC Interrupt Configuration Register (LICR)) ............................................................... 44-39 LCDC Interrupt Enable Register (LIER) ............................................................................ 44-40 LCDC Interrupt Status Register (LISR).............................................................................. 44-41 LCDC Graphic Window Start Address Register (LGWSAR) ............................................ 44-42 LCDC Graphic Window Start Address Register (LGWSAR) ............................................ 44-43 LCDC Graphic Window Virtual Page Width Register (LGWVPWR) ............................... 44-44 LCDC Graphic Window Panning Offset Register (LGWPOR).......................................... 44-44 LCDC Graphic Window Position Register (LGWPR)........................................................ 44-45 LCDC Graphic Window Control Register (LGWCR) ........................................................ 44-46 LCDC Graphic Window DMA Control Register (LGWDCR)........................................... 44-47 LCDC AUS Mode Control Register (LAUSCR) ................................................................ 44-48 LCDC AUS Mode Cursor Control Register (LAUSCCR).................................................. 44-49 SLCDC System Diagram ...................................................................................................... 45-2 Sample LCD Controller Memory Mapping (Monochrome) (8-Bit Command/8-Bit Data) ........................................................................................... 45-5 SLCDC LCD Controller Memory Mapping (2-Bit Color/Gray Scale) (8-Bit Command/8-Bit Data) ........................................................................................... 45-6 Automatic Display Data Transfer Memory Configuration (8-Bit Command/8-Bit Data) ........................................................................................... 45-7 Command Buffer Tag Organization (8-Bit Words)............................................................... 45-8 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxx Freescale Semiconductor Figures Figure Number 44-6 44-7 44-8 44-9 44-10 44-11 44-12 44-13 44-14 44-15 44-16 44-17 44-18 44-19 44-20 44-21 44-22 44-23 44-24 Title Page Number Sample LCD Controller Memory Map (16-Bit Color) (16-Bit Command/16-Bit Data) ....................................................................................... 45-9 Command Buffer Tag Organization (16-bit Words) ........................................................... 45-10 Automatic Display Data Transfer Memory Configuration (16-Bit Command/16-Bit Data) ..................................................................................... 45-11 SLCDC Automatic Mode Write Sequence (Monochrome Display) .................................. 45-12 SLCDC Automatic Mode Data Flow (AUTOMODE[1:0] = 10)........................................ 45-13 Key to Register Fields ......................................................................................................... 45-15 Data Buffer Base Address register ...................................................................................... 45-18 Data Buffer Size register ..................................................................................................... 45-18 Command Buffer Base Address Register............................................................................ 45-19 Command Buffer Size Register........................................................................................... 45-19 Command String Size Register ........................................................................................... 45-20 FIFO Configuration Register .............................................................................................. 45-21 LCD Controller Configuration Register.............................................................................. 45-21 LCD Transfer Configuration Register................................................................................. 45-22 SLCDC Control/Status Register ......................................................................................... 45-23 LCD Clock Configuration Register .................................................................................... 45-26 LCD Write Data Register.................................................................................................... 45-26 SLCDC Serial Transfers to LCD Device ............................................................................ 45-28 SLCDC Parallel Transfers to LCD Device ......................................................................... 45-30 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxi Figures Figure Number Title Page Number MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxii Freescale Semiconductor Tables Table Number 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 3-10 3-11 3-12 3-13 3-14 3-15 3-16 3-17 3-18 3-19 3-20 3-21 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 4-12 Title Page Number Tables 4 Gbyte Memory Map Breakdown.......................................................................................... 2-1 Primary AHB Memory Map (Lower) ..................................................................................... 2-3 Secondary AHB Port 1 Memory Map..................................................................................... 2-3 Secondary AHB Port 2 Memory Map..................................................................................... 2-5 Primary AHB Memory Map (Upper)...................................................................................... 2-5 AIPI1 Memory Map................................................................................................................ 2-6 AIPI2 Memory Map................................................................................................................ 2-7 Register Map ........................................................................................................................... 2-7 PLL Clock Controller Signal Descriptions ............................................................................. 3-3 SDRAM Operation During Power Modes .............................................................................. 3-8 Power Management in the Clock Controller........................................................................... 3-8 PLL Clock Controller Memory Map ...................................................................................... 3-9 Register Conventions .............................................................................................................. 3-9 Clock Source Control Register Field Descriptions ............................................................... 3-11 MPLL Register 0 Field Descriptions .................................................................................... 3-13 Recommend Settings for Frequency Stability....................................................................... 3-14 MCU and System PLL Control Register 1 Field Descriptions ............................................. 3-15 Serial PLL Multiplier Factor................................................................................................. 3-16 SPLL Control Register 0 Field Descriptions ........................................................................ 3-17 Serial Peripheral PLL Control Register 1 Field Descriptions............................................... 3-19 Oscillator 26M Control Register Field Descriptions ............................................................ 3-20 Peripheral Clock Divider Register 0 Field Descriptions....................................................... 3-22 Peripheral Clock Divider Register 1 Field Descriptions....................................................... 3-23 Clock Sources for i.MX27 Peripherals ................................................................................. 3-24 Peripheral Clock Control Register 0 Field Descriptions....................................................... 3-25 Peripheral Clock Control Register 1 Field Descriptions....................................................... 3-28 Clock Control Status Register Field Descriptions ................................................................ 3-31 Wakeup Guard Mode Control Register Field Descriptions .................................................. 3-33 Reset Module Pin and Signal Descriptions........................................................................... 3-36 Block Memory Map ................................................................................................................ 4-1 Register Conventions .............................................................................................................. 4-2 Chip ID Register Field Descriptions ....................................................................................... 4-3 Function Multiplexing Control Register Description ............................................................. 4-4 Global Peripheral Control Register Descriptions.................................................................... 4-7 Well Bias Control Register Field Descriptions ....................................................................... 4-9 Drive Strength Control Register 1 Field Description............................................................ 4-11 Drive Strength Control Register 2 Field Descriptions .......................................................... 4-13 Drive Strength Control Register 3 Field Descriptions .......................................................... 4-15 Drive Strength Control Register 4 Field Descriptions .......................................................... 4-18 Drive Strength Control Register 5 Field Descriptions .......................................................... 4-19 Drive Strength Control Register 6 Field Descriptions .......................................................... 4-22 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxiii Tables Table Number 4-13 4-14 4-15 4-16 4-17 4-18 4-19 4-20 4-21 4-22 4-23 4-24 4-25 4-26 4-27 4-28 5-1 5-2 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 6-13 6-14 6-15 6-16 6-17 6-18 6-19 6-20 7-1 7-2 7-3 Title Page Number Drive Strength Control Register 7 Field Descriptions .......................................................... 4-24 Drive Strength Control Register 8 Field Descriptions .......................................................... 4-26 Drive Strength Control Register 9 Field Descriptions .......................................................... 4-29 Drive Strength Control Register 10 Field Descriptions ........................................................ 4-31 Drive Strength Control Register 11 Field Descriptions ........................................................ 4-33 Drive Strength Control Register 12 Field Descriptions ........................................................ 4-36 Drive Strength Control Register 13 Field Descriptions ........................................................ 4-37 Pull Strength Control Register Field Descriptions................................................................ 4-39 Priority Control and Select Register Field Descriptions ....................................................... 4-41 Power Management Control Register Field Descriptions..................................................... 4-42 DPTC Comparator Value Register 0 Field Description ........................................................ 4-44 DPTC Comparator Value Register 1 Field Descriptions....................................................... 4-45 DPTC Comparator Value Register 2 Field Descriptions....................................................... 4-45 DPTC Comparator Value Register 3 Description ................................................................. 4-46 PMIC Pad Control Register Field Description...................................................................... 4-47 System Boot Mode Selection................................................................................................ 4-48 i.MX27 Signal Descriptions.................................................................................................... 5-1 i.MX27 Pin MUX Table........................................................................................................ 5-11 GPIO Memory Map ................................................................................................................ 6-5 Register Conventions .............................................................................................................. 6-8 Data Direction Register Field Descriptions ............................................................................ 6-9 Output Configuration Register 1 Field Descriptions ............................................................ 6-10 Output Configuration Register 2 Field Descriptions ............................................................ 6-11 Input Configuration Register A1 Field Descriptions ............................................................ 6-13 Input Configuration Register A2 Field Descriptions ............................................................ 6-13 Input Configuration Register B1 Field Descriptions ............................................................ 6-14 Input Configuration Register B2 Description ....................................................................... 6-15 Data Register Field Descriptions .......................................................................................... 6-16 GPIO In Use Register Field Descriptions ............................................................................. 6-17 Sample Status Register Field Descriptions ........................................................................... 6-21 Interrupt Configuration Register 1 Field Descriptions.......................................................... 6-22 Interrupt Configuration Register 2 Field Descriptions.......................................................... 6-23 Interrupt Mask Register Description ..................................................................................... 6-24 Interrupt Status Register Field Descriptions ......................................................................... 6-25 General Purpose Register Field Descriptions ....................................................................... 6-26 Software Reset Register Field Descriptions.......................................................................... 6-27 Pull-Up Enable Register Field Descriptions ......................................................................... 6-28 Port Interrupt Mask Register Field Descriptions .................................................................. 6-29 TMS Sequence To Check ID Code ......................................................................................... 7-6 TMS Sequence to Write to ExtraDebug Register ................................................................... 7-7 TMS Sequence to Read ExtraDebug Register ........................................................................ 7-8 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxiv Freescale Semiconductor Tables Table Number 8-1 8-2 8-3 8-4 8-5 8-6 8-7 8-8 9-1 9-2 9-3 9-4 9-5 9-6 9-7 9-8 9-1 9-2 9-3 9-4 9-5 9-6 9-7 9-8 9-9 9-10 9-11 9-12 9-13 9-14 9-15 10-1 10-2 10-3 10-4 10-5 10-6 10-7 10-8 10-9 10-10 Title Page Number Synch Command Response Definition ................................................................................... 8-3 Response A Definition ............................................................................................................ 8-3 Write Register Command Definition ...................................................................................... 8-4 Response B Definition ............................................................................................................ 8-4 Response C Definition ............................................................................................................ 8-4 Download Command Definition ............................................................................................. 8-5 Response B Silicon Type Definition ....................................................................................... 8-5 Bootstrap End Indication Operation Diagram ........................................................................ 8-6 AIPI ARM9 Platform IP Bus Support .................................................................................. 10-7 JAM IP Bus General Purpose Registers................................................................................ 10-8 ARM926EJ-S JTAG ID Register Definition ....................................................................... 10-10 Upper Address Bit Decode ................................................................................................. 10-10 ARM9 Platform Memory Map ........................................................................................... 10-10 Alternate Bus Master Interface Signal List ......................................................................... 10-18 Single External Master Connections to an Alternate Bus Master Interface........................ 10-19 hmaster Encodings .............................................................................................................. 10-21 Primary AHB Slave Device Latencies ................................................................................ 10-24 Secondary AHB Interface Signal List................................................................................. 10-24 ARM926EJ-S Endian Related Signals................................................................................ 10-25 Little Endian Byte Write Enable Decoding ........................................................................ 10-26 Big Endian Byte Write Enable Decoding ........................................................................... 10-27 ARM9 Platform Size Estimates .......................................................................................... 10-28 ARM9 Platform Power Estimates ....................................................................................... 10-29 ARM9 Platform Signal List ................................................................................................ 10-30 ARM9 Platform AHB Clock and Reset Timing Constraints .............................................. 10-39 Alternate Bus Master Constraints ....................................................................................... 10-40 Alternate Bus Master Interface AC Timing Parameters...................................................... 10-42 Secondary AHB Constraints ............................................................................................... 10-42 Secondary AHB AC Timing Parameters............................................................................. 10-43 RAM and ROM Interface Loading Constraints .................................................................. 10-44 RAM and ROM Interface AC Timing Parameters .............................................................. 10-45 AITC Memory Map .............................................................................................................. 11-3 Register Figure Conventions ................................................................................................. 11-4 AITC Register Summary....................................................................................................... 11-5 Interrupt Control Register Field Description ........................................................................ 11-9 Normal Interrupt Mask Register Field Description ............................................................ 11-10 Interrupt Enable Number Register Description................................................................... 11-11 Interrupt Disable Number Register Field Description ........................................................ 11-12 Interrupt Enable Register Low and High Field Descriptions.............................................. 11-14 Interrupt Type Register High and Low Register Description.............................................. 11-15 Normal Interrupt Priority Level Register 7 Field Description ............................................ 11-16 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxv Tables Table Number 10-11 10-12 10-13 10-14 10-15 10-16 10-17 10-18 10-19 10-21 10-20 10-22 10-23 10-24 10-25 10-26 10-27 15-1 15-2 15-3 15-4 15-5 16-1 16-2 16-3 16-4 16-5 16-6 16-7 16-8 16-9 16-10 16-11 16-12 16-13 16-14 16-15 16-16 17-1 17-2 17-3 Title Page Number Normal Interrupt Priority Level Register 6 Field Description ............................................ 11-17 Normal Interrupt Priority Level Register 5 Field Description ............................................ 11-18 Normal Interrupt Priority Level Register 4 Field Description ............................................ 11-19 Normal Interrupt Priority Level Register 3 Field Description ............................................ 11-20 Normal Interrupt Priority Level Register 2 Field Description ............................................ 11-21 Normal Interrupt Priority Level Register 1 Field Description ............................................ 11-22 Normal Interrupt Priority Level Register 0 Field Description ............................................ 11-23 Normal Interrupt Vector and Status Register Field Description ......................................... 11-24 Fast Interrupt Vector and Status Register Description ........................................................ 11-25 Interrupt Source High (INTSRCH) Assignment................................................................. 11-26 Interrupt Source Register High and Low Description......................................................... 11-26 Interrupt Source Low (INTSRCL) Assignment .................................................................. 11-27 Interrupt Force Register High and Low Field Description ................................................. 11-29 Normal Interrupt Pending Register High and Low Description ......................................... 11-30 Fast Interrupt Pending Register High and Low Field Description...................................... 11-31 Typical Hardware Accelerated Normal Interrupt Entry Sequence...................................... 11-32 Typical Fast Interrupt Entry Sequence ................................................................................ 11-33 CHOOSEN_SLAVE Encoding ............................................................................................. 16-8 External Memory Interface I/O MUX Description............................................................. 16-11 EMI Signal Properties ......................................................................................................... 16-22 EMI Registers Definition .................................................................................................... 16-29 EMI Memory Map .............................................................................................................. 16-30 M3IF Signal Properties ......................................................................................................... 17-4 M3IF Memory Map .............................................................................................................. 17-6 M3IF Memory Space Summary............................................................................................ 17-6 Register Figure Conventions ................................................................................................. 17-7 M3IF Register Summary....................................................................................................... 17-8 M3IF Control Register Field Descriptions.......................................................................... 17-11 M3IF Snooping Configuration Register 0 Field Descriptions ............................................ 17-12 SWSZ Field Descriptions.................................................................................................... 17-12 M3IF Snooping Configuration Register 1–2 Field Descriptions ........................................ 17-14 M3IF Snooping Status Register 0 Field Descriptions......................................................... 17-15 M3IF Snooping Status Register 1 Field Descriptions......................................................... 17-16 M3IF Lock General Register Field Descriptions ................................................................ 17-17 MPG Supported Burst Accesses ......................................................................................... 17-19 MPG MAX Signals ............................................................................................................. 17-20 MPG64 Supported Burst Accesses ..................................................................................... 17-29 MPG64 Additional Signals ................................................................................................. 17-30 Signal Properties ................................................................................................................... 18-3 WEIM Detailed Signal Descriptions..................................................................................... 18-4 Boot Configuration Settings.................................................................................................. 18-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxvi Freescale Semiconductor Tables Table Number 17-4 17-5 17-6 17-7 17-8 17-9 17-10 17-11 17-12 17-13 17-14 17-15 17-16 17-17 17-18 17-19 17-20 18-1 18-2 18-3 18-4 18-5 18-6 18-7 18-8 18-9 18-10 18-11 18-12 18-13 18-14 18-15 18-16 18-17 18-18 18-19 18-20 18-21 18-22 Title Page Number WEIM Out/in Data in Case AHB Out/in Data is 0xB3B2B1B0 .......................................... 18-7 WEIM Memory Map ............................................................................................................ 18-8 WEIM Chip Selection Memory Map.................................................................................... 18-8 Register Figure Conventions ................................................................................................. 18-9 WEIM Register Summary................................................................................................... 18-10 Chip Select x Upper Control Register Field Descriptions .................................................. 18-13 PSZ Bit Field Values ........................................................................................................... 18-16 WSC Bit Field Values ......................................................................................................... 18-16 Chip Select x Lower Control Register Field Descriptions.................................................. 18-18 DSZ Bit Field Values .......................................................................................................... 18-19 Chip Select x Addition Control Register Field Descriptions .............................................. 18-21 LBN Bit Field Values .......................................................................................................... 18-23 CNC/CNC2 Bit Values........................................................................................................ 18-23 WEIM Control Register Field Descriptions........................................................................ 18-24 WEIM Operation Modes Field Settings.............................................................................. 18-25 AHB Burst Cycles Supported ............................................................................................. 18-28 External Memory Bursts Start Addresses for Some AHB Burst Accesses......................... 18-28 ESDRAMC Signal Properties ............................................................................................... 19-6 ESDRAMC Detailed Signal Description.............................................................................. 19-7 ESDRAMC Memory Map .................................................................................................. 19-10 ESDRAMC Memory Map .................................................................................................. 19-10 Register Figure Conventions ............................................................................................... 19-11 ESDRAMC Register Summary........................................................................................... 19-11 Enhanced SDRAM Control Register (ESDCTL0/1) Field Descriptions............................ 19-15 COL Bit Field Encoding ..................................................................................................... 19-16 SREFR Bit Field Encoding ................................................................................................. 19-17 PWDT Bit Field Encoding.................................................................................................. 19-17 Burst Length Bit Field Encoding ........................................................................................ 19-17 PRCT Bit Field Encoding ................................................................................................... 19-17 ESDCFG0/ESDCFG1 Field Descriptions .......................................................................... 19-19 tWR Bit Field Encoding...................................................................................................... 19-21 Configurable SDRAM/LPDDR Timing Parameters........................................................... 19-22 tRC Bit Field Encoding....................................................................................................... 19-30 Enhanced SDRAM Control Register (ESDCTL0/1) Field Descriptions............................ 19-32 Enhanced MDDR Delay Line 5 Control Register (ESDCDLY5) Field Descriptions .......................................................................................................... 19-35 Enhanced MDDR Delay Line Cycle Length Debug Register (ESDCDLYL) Field Descriptions .......................................................................................................... 19-36 JEDEC Standard Single/Double Data Rate SDRAMs........................................................ 19-36 Possibilities for Latency Hiding.......................................................................................... 19-41 CPU to SDRAM/LPDDR Translation ................................................................................ 19-44 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxvii Tables Table Number 18-23 18-24 18-25 18-26 18-27 18-28 18-29 18-30 18-31 18-32 18-33 18-34 18-35 18-36 18-37 18-38 18-39 18-40 18-41 18-42 18-43 18-44 18-45 18-46 18-47 19-1 19-2 19-3 19-4 19-5 19-6 19-7 19-8 19-9 19-10 19-12 19-13 19-11 19-14 19-15 19-16 Title Page Number Address Multiplexing by Column/Row Width for 16-Bit Devices..................................... 19-45 Address Multiplexing by Column/Row Width for 32-bit Devices ..................................... 19-46 Bank Address Bit Assignment ............................................................................................ 19-47 ESDRAMC Low Power Operating Modes ......................................................................... 19-49 SDRAM (SDR and LPDDR) Command Encoding ............................................................ 19-60 SDRAM/LPDDR Burst Access Support............................................................................. 19-63 SDRAM Command Sequence for Burst Accesses ............................................................. 19-91 SDRAM Mode Register Description ................................................................................ 19-100 Example Address Calculation for Mode Register............................................................. 19-101 Single 4Mx16 Control Register Value .............................................................................. 19-102 Single 8MBx16 Control Register Value............................................................................ 19-103 Single 16MBx16 Control Register Value.......................................................................... 19-104 Single 32MBx16 Control Register Value.......................................................................... 19-105 Single 64MBx16 Control Register Value.......................................................................... 19-106 Dual 4MBx16 Control Register Value .............................................................................. 19-107 Dual 8MBx16 Control Register Value .............................................................................. 19-108 Dual 16MBx16 Control Register Value ............................................................................ 19-109 Single 2MBx32 Control Register Value............................................................................ 19-110 Single 4MBx32 Control Register Value............................................................................ 19-111 Single 8MBx32 Control Register Value............................................................................ 19-112 Single 16MBx32 Control Register Value.......................................................................... 19-113 Single 32MBx32 Control Register Value.......................................................................... 19-114 Single 64MBx32 Control Register Value.......................................................................... 19-115 Single 16MBx32 Control Register Value.......................................................................... 19-116 Single 32MBx16 Control Register Value.......................................................................... 19-117 NFC Signal Properties .......................................................................................................... 20-3 NFC Detailed Signal Descriptions........................................................................................ 20-3 Data (Buffer) Organization in Memory ................................................................................ 20-5 Spare Area Buffer (with X8 I/O bus) .................................................................................... 20-6 Spare Area Buffer (with X16 I/O bus) .................................................................................. 20-6 NFC Module Register Memory Map .................................................................................... 20-7 Register Figure Conventions ................................................................................................. 20-8 NFC Register Summary ........................................................................................................ 20-8 NFC_BUFSIZE Register Field Description........................................................................ 20-10 RAM Buffer Address Field Descriptions............................................................................ 20-10 NAND_Flash_CMD Register Field Description ................................................................ 20-11 NFC_Configuration Register Field Descriptions................................................................ 20-11 NAND Flash Address Register Field Description .............................................................. 20-11 ECC_STATUS_RESULT Register Field Description......................................................... 20-12 ECC_RSLT_MAIN_AREA Register Field Descriptions ................................................... 20-13 ECC_RSLT_MAIN_AREA Register Field Descriptions ................................................... 20-13 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxviii Freescale Semiconductor Tables Table Number 19-17 19-18 19-19 19-20 19-21 19-22 19-23 19-24 19-25 19-26 19-27 19-28 19-29 19-30 20-1 20-2 20-3 20-4 20-5 20-6 20-7 20-8 20-9 20-10 20-11 20-12 20-13 20-14 20-15 20-16 20-17 20-18 20-19 20-20 20-21 21-1 21-2 21-3 21-4 21-5 21-6 Title Page Number ECC_Rslt_Spare_Area Descriptions .................................................................................. 20-14 ECC_Rslt_Spare_Area Descriptions .................................................................................. 20-15 NAND Flash Write Protection Register Field Descriptions ............................................... 20-15 Unlock_Start_Blk_Add Register Field Description............................................................ 20-16 UNLOCK_END_BLK_ADD Register Field Description .................................................. 20-16 NAND_FLASH_WR_PR_ST Register Field Descriptions................................................ 20-16 Write Protected States ......................................................................................................... 20-17 NAND_FLASH_CONFIG1 Register Field Descriptions ................................................... 20-17 NAND_FLASH_CONFIG2 Register Field Descriptions ................................................... 20-18 NAND FLASH Controller Operating Modes ..................................................................... 20-20 NAND Flash Burst Access Support .................................................................................... 20-25 ECC Code/Result Readability............................................................................................. 20-36 Write Protection for Main/Spare RAM Buffer ................................................................... 20-37 Examples for NFC Pin Configuration for Selected Memory Devices ................................ 20-40 PCMCIA Signal Descriptions ............................................................................................... 21-3 BVD1 and BVD2 Descriptions............................................................................................. 21-6 PCMCIA Controller Memory Map...................................................................................... 21-6 Register Figure Conventions ................................................................................................. 21-7 PCMCIA Controller Register Summary ............................................................................... 21-7 PIPR Field Descriptions...................................................................................................... 21-10 PSCR Field Descriptions .................................................................................................... 21-11 PER Field Descriptions ....................................................................................................... 21-12 PBR0–PBR4 Field Descriptions ......................................................................................... 21-14 POR0–POR4 Field Descriptions......................................................................................... 21-15 BSIZE Values ...................................................................................................................... 21-16 BSIZE Mask........................................................................................................................ 21-17 POFR0–POFR4 Field Descriptions .................................................................................... 21-18 PGCR Field Descriptions.................................................................................................... 21-19 PGSR Field Descriptions .................................................................................................... 21-20 PCMCIA I/F Interrupt Sources ........................................................................................... 21-22 Write Protect ....................................................................................................................... 21-23 IOIS16 and PPS Bit Relations ............................................................................................ 21-24 Data and Control Signal Relations...................................................................................... 21-24 Data, Control and Address Relations in TrueIDE Mode .................................................... 21-25 PCMCIA Card TrueIDE Signal Names and Assignments.................................................. 21-26 1-Wire Port Definitions: DS2502.......................................................................................... 22-2 1-Wire Pin Configuration...................................................................................................... 22-2 CRM and API Register Descriptions .................................................................................... 22-3 1-Wire Memory Map ............................................................................................................ 22-5 Register Figure Conventions Key to Register Fields ............................................................ 22-5 1-Wire Register Summary..................................................................................................... 22-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxix Tables Table Number 21-7 21-8 21-9 21-10 21-11 22-1 22-2 22-3 22-4 22-5 22-6 22-7 22-8 22-9 22-10 22-11 22-13 22-12 22-14 22-15 22-16 22-17 23-1 23-1 23-2 23-3 23-4 23-5 23-6 23-7 23-8 23-9 23-10 23-11 24-3 24-4 24-5 24-6 24-7 24-8 24-9 Title Page Number Control Register Field Descriptions...................................................................................... 22-8 Time Divider Register Field Descriptions............................................................................. 22-9 System Timing Requirements ............................................................................................. 22-10 System Clock Requirements ............................................................................................... 22-10 Reset Register Field Descriptions ....................................................................................... 22-11 Signal Properties ................................................................................................................... 23-4 ATA Memory Map ................................................................................................................ 23-6 Register Figure Conventions ................................................................................................. 23-7 ATA Register Summary ........................................................................................................ 23-8 ATA TIME_CONFIG0 Register Field Descriptions ........................................................... 23-11 ATA TIME_CONFIG1 Register Field Descriptions ........................................................... 23-12 ATA TIME_CONFIG2 Register Field Descriptions ........................................................... 23-13 ATA TIME_CONFIG3 Register Field Descriptions ........................................................... 23-14 ATA TIME_CONFIG4 Register Field Descriptions ........................................................... 23-15 ATA TIME_CONFIG5 Register Field Descriptions ........................................................... 23-16 ATA FIFO_DATA_32 Register Field Descriptions............................................................. 23-17 FIFO_FILL Register Field Descriptions............................................................................. 23-18 FIFO_DATA_16 Register Field Descriptions ..................................................................... 23-18 ATA Control Register Field Descriptions ........................................................................... 23-19 INT_PENDING Register Field Description ....................................................................... 23-22 ATA FIFO_ALARM Register Field Descriptions .............................................................. 23-23 Drive Registers connected to ATA Bus ............................................................................... 23-23 CSPI Behavior In Master Mode In Various Configurations ................................................. 24-7 CSPI Memory Map ............................................................................................................. 24-12 Register Figure Conventions ............................................................................................... 24-13 CSPI Register Summary ..................................................................................................... 24-13 RXDATA Register Field Descriptions ................................................................................ 24-15 TXDATA Register Field Descriptions................................................................................. 24-16 CONREG Register Field Descriptions................................................................................ 24-17 Interrupt Control/Status Register Description..................................................................... 24-21 TESTREG Register Field Descriptions .............................................................................. 24-23 PERIODREG Register Field Descriptions.......................................................................... 24-25 DMA Register Description ................................................................................................. 24-25 Reset Register Field Description......................................................................................... 24-27 I2C Memory Map .................................................................................................................. 25-4 I2C Register Summary .......................................................................................................... 25-5 I2C Address Register Field Descriptions .............................................................................. 25-6 I2C Frequency Register Field Descriptions........................................................................... 25-7 IFDR Register Field Values .................................................................................................. 25-7 I2C Control Register Field Descriptions ............................................................................... 25-8 I2C Status Register Field Descriptions.................................................................................. 25-9 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxx Freescale Semiconductor Tables Table Number 24-10 24-11 25-1 25-2 25-3 25-4 25-5 25-6 25-7 25-8 26-1 26-2 26-3 26-4 26-5 26-6 27-1 27-2 27-3 27-4 27-5 27-6 27-7 27-8 27-9 27-10 27-11 27-12 27-13 27-14 27-15 27-16 27-17 27-18 27-19 27-20 27-21 28-1 28-2 28-3 28-4 Title Page Number I2C Data Register Field Descriptions.................................................................................. 25-11 I2C Bus Timing Parameters................................................................................................. 25-18 Keypad Port Column Modes ................................................................................................. 26-3 KPP Memory Map ................................................................................................................ 26-3 Register Figure Conventions ................................................................................................. 26-4 KPP Register Summary......................................................................................................... 26-4 Keypad Control Register Field Descriptions ........................................................................ 26-5 Keypad Status Register Field Descriptions ........................................................................... 26-6 Keypad Data Direction Register Field Descriptions ............................................................. 26-8 Keypad Data Register Field Descriptions ............................................................................. 26-9 MSHC I/O Signals ................................................................................................................ 27-3 MSHC Memory Map ............................................................................................................ 27-4 MSHC Data Endianism and Connection to IP Bus............................................................... 27-4 Timeout Register ................................................................................................................... 27-5 Interrupt Status/Clear Register.............................................................................................. 27-5 Interrupt enable register ........................................................................................................ 27-6 Signal Properties ................................................................................................................... 28-3 Signal Descriptions ............................................................................................................... 28-3 SDHC Memory Map............................................................................................................. 28-3 Register Figure Conventions ................................................................................................. 28-4 SDHC Register Summary ..................................................................................................... 28-5 SDHC Clock Control Register Field Descriptions................................................................ 28-9 SDHC Status Register Field Descriptions........................................................................... 28-10 SDHC Clock Rate Register Field Descriptions .................................................................. 28-15 SDHC Command and Data Control Register Field Description......................................... 28-16 MMC/SD Response Time Out Register Field Descriptions ............................................... 28-18 SDHC Read Time Out Register Field Descriptions............................................................ 28-19 SDHC Block Length Register Field Descriptions .............................................................. 28-21 SDHC Number of Blocks Register Field Descriptions....................................................... 28-22 SDHC Revision Number Register Field Descriptions ........................................................ 28-23 SDHC Interrupt Control Register Field Descriptions ......................................................... 28-24 Interrupt Mechanisms ......................................................................................................... 28-27 SDHC Command Number Register Field Descriptions...................................................... 28-28 SDHC Command Argument Register Field Descriptions .................................................. 28-29 SDHC Response FIFO Register Field Descriptions ........................................................... 28-30 SDHC Buffer Access Register Field Descriptions.............................................................. 28-31 Commands for MMC/SD/SDIO ......................................................................................... 28-54 Interface Signals.................................................................................................................... 29-3 UART Memory Map ............................................................................................................. 29-4 Register Conventions ............................................................................................................ 29-5 UART Register Summary ..................................................................................................... 29-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxxi Tables Table Number 28-5 28-6 28-7 28-8 28-9 28-10 28-11 28-12 28-13 28-14 28-15 28-16 28-17 28-18 28-19 28-20 28-21 28-22 28-23 28-24 28-25 28-26 28-27 29-1 29-2 29-3 29-4 29-5 29-6 29-7 29-8 29-9 29-10 29-11 29-12 29-13 29-14 29-15 29-16 29-17 29-18 Title Page Number Receiver Register Field Descriptions.................................................................................... 29-8 UART Transmitter Register Field Descriptions .................................................................... 29-9 UART Control Register 1 (UCR1) Field Descriptions ....................................................... 29-10 UART Control Register 2 Field Descriptions ..................................................................... 29-12 UART Control Register 3 (UCR3) Field Descriptions ....................................................... 29-14 UART Control Register 4 (UCR4) Field Descriptions ....................................................... 29-16 UART FIFO Control Register Description ......................................................................... 29-18 UART Status Register 1 (USR1) Field Descriptions .......................................................... 29-19 UART Status Register 2 Field Descriptions........................................................................ 29-21 UART Escape Character Register Field Descriptions......................................................... 29-23 UART Escape Timer Register (UTIM) Field Descriptions................................................. 29-23 UART BRM Incremental Register Field Descriptions ....................................................... 29-24 UART BRM Modulator Register Field Descriptions.......................................................... 29-25 UART Baud Rate Count Register Field Descriptions ......................................................... 29-25 UART One Millisecond Register Field Descriptions.......................................................... 29-26 UART Test Register Description......................................................................................... 29-27 Interrupts and DMA ............................................................................................................ 29-28 RTS Edge Triggered Interrupt Truth Table ......................................................................... 29-32 Detection Truth Table.......................................................................................................... 29-38 Majority Vote Results.......................................................................................................... 29-39 Baud Rate Automatic Detection ......................................................................................... 29-42 Escape Timer Scaling.......................................................................................................... 29-45 UART Low Power State Operation..................................................................................... 29-49 ECR[ETHER_EN] De-Assertion Effect on FEC.................................................................. 30-5 User Initialization (Before ECR[ETHER_EN]) ................................................................... 30-5 FEC User Initialization (Before ECR[ETHER_EN]) ........................................................... 30-5 Microcontroller Initialization................................................................................................ 30-6 MII Mode .............................................................................................................................. 30-6 7-Wire Mode Configuration.................................................................................................. 30-7 Destination Address to 6-Bit Hash...................................................................................... 30-12 Module Memory Map ......................................................................................................... 30-17 FEC Register Memory Map ................................................................................................ 30-18 MIB Counters Memory Map............................................................................................... 30-19 EIR Field Descriptions........................................................................................................ 30-21 EIMR Field Descriptions .................................................................................................... 30-23 RDAR Field Descriptions ................................................................................................... 30-24 TDAR Field Descriptions.................................................................................................... 30-25 ECR Field Descriptions ...................................................................................................... 30-25 MMFR Field Descriptions .................................................................................................. 30-26 MSCR Field Descriptions ................................................................................................... 30-27 Programming Examples for MSCR .................................................................................... 30-28 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxxii Freescale Semiconductor Tables Table Number 29-19 29-20 29-21 29-22 29-23 29-24 29-25 29-26 29-27 29-28 29-29 29-30 29-31 29-32 29-33 29-34 29-35 30-1 30-2 30-3 30-4 30-5 30-6 30-7 30-8 30-9 30-10 30-11 30-12 30-13 30-14 30-15 30-16 30-17 30-18 30-19 30-20 30-21 30-22 30-23 30-24 Title Page Number MIBC Field Descriptions .................................................................................................... 30-28 RCR Field Descriptions ...................................................................................................... 30-29 TCR Field Descriptions ...................................................................................................... 30-31 PALR Field Descriptions .................................................................................................... 30-31 PAUR Field Descriptions .................................................................................................... 30-32 OPD Field Descriptions ...................................................................................................... 30-32 IAUR Field Descriptions..................................................................................................... 30-33 IALR Field Descriptions ..................................................................................................... 30-33 GAUR Field Descriptions ................................................................................................... 30-34 GALR Field Descriptions ................................................................................................... 30-34 TFWR Field Descriptions ................................................................................................... 30-35 FRBR Field Descriptions .................................................................................................... 30-35 FRSR Field Descriptions .................................................................................................... 30-36 ERDSR Field Descriptions ................................................................................................. 30-36 EMRBR Field Descriptions ................................................................................................ 30-38 Receive Buffer Descriptor Field Definitions....................................................................... 30-40 Transmit Buffer Descriptor Field Definitions ..................................................................... 30-42 USB Module Memory Map .................................................................................................. 31-4 USB Control Register Field Descriptions ............................................................................. 31-8 Host Port 1 Pin Functions ................................................................................................... 31-11 Host Port 2 Signal Connections .......................................................................................... 31-12 ULPI/ Serial Muxing........................................................................................................... 31-13 Signal Connections ............................................................................................................. 31-14 OTG ULPI/Serial Muxing................................................................................................... 31-15 Port 1 TLL and PHY Mode Pin Connections ..................................................................... 31-18 Port 2 TLL and PHY Mode Pin Connections ..................................................................... 31-18 HOST1 Bypass Mode Pin Functions .................................................................................. 31-20 Interface Register Sets......................................................................................................... 31-23 Configuration, Control, and Status Register Set ................................................................. 31-23 HS-USB Register Summary................................................................................................ 31-27 HWGENERAL ................................................................................................................... 31-31 HWHOST Field Descriptions ............................................................................................. 31-32 HCSPARAMS Field Descriptions ...................................................................................... 31-35 HCCPARAMS Field Descriptions ...................................................................................... 31-37 DCCPARAMS Field Descriptions ...................................................................................... 31-38 GPTIMER0LD Field Descriptions ..................................................................................... 31-39 GPTIMER0LD Field Descriptions ..................................................................................... 31-40 USBCMD—USB Command Register Field Descriptions.................................................. 31-41 USBSTS Field Descriptions................................................................................................ 31-44 USBINTR Field Descriptions ............................................................................................. 31-47 FRINDEX Register Field Descriptions............................................................................... 31-49 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxxiii Tables Table Number 30-25 30-26 30-27 30-28 30-29 30-30 30-31 30-32 30-33 30-34 30-35 30-36 30-37 30-38 30-39 30-40 30-41 30-42 30-43 30-44 30-45 30-46 30-47 30-48 30-49 30-50 30-51 30-52 30-53 30-54 30-55 30-56 30-57 30-58 30-59 30-60 30-61 30-62 30-63 30-64 30-65 Title Page Number PERIODICLISTBASE Register Field Descriptions ........................................................... 31-50 DEVICEADDR Field Descriptions .................................................................................... 31-50 ASYNCLISTADDR Field Descriptions ............................................................................. 31-51 ENDPOINTLISTADDR Field Descriptions....................................................................... 31-52 BURSTSIZE Field Descriptions ......................................................................................... 31-52 TXFILLTUNING Field Descriptions.................................................................................. 31-54 ULPI VIEWPORT Field Descriptions ................................................................................ 31-56 PORTSCx Field Descriptions ............................................................................................. 31-58 OTGSC Field Descriptions ................................................................................................. 31-63 Typ Field Value Definitions ................................................................................................ 31-78 Isochronous Transfer Descriptor......................................................................................... 31-79 Next Schedule Element Pointer .......................................................................................... 31-80 iTD Transaction Status and Control.................................................................................... 31-81 it Buffer Pointer Page 0 (Plus) ............................................................................................ 31-82 iTD Buffer Pointer Page 1 (Plus) ........................................................................................ 31-82 iTD Buffer Pointer Page 2 (Plus) ........................................................................................ 31-82 iTD Buffer Pointer Page 3-6 ............................................................................................... 31-83 Next Link Pointer ................................................................................................................ 31-84 Endpoint and Transaction Translator Characteristics ......................................................... 31-84 Micro-frame Schedule Control ........................................................................................... 31-85 siTD Transfer Status and Control ....................................................................................... 31-85 Buffer Page Pointer List (plus)............................................................................................ 31-87 siTD Back Link Pointer ...................................................................................................... 31-87 D Next Element Transfer Pointer (DWord 0)...................................................................... 31-89 TD Alternate Next Element Transfer Pointer (DWord 1) ................................................... 31-89 qTD Token (DWord 2) ........................................................................................................ 31-90 qTD Buffer Pointer(s) (DWords 3-7) .................................................................................. 31-94 Queue Head DWord 0 ......................................................................................................... 31-95 Endpoint Characteristics: Queue Head DWord 1................................................................ 31-96 Endpoint Capabilities: Queue Head DWord 2 .................................................................... 31-97 Current qTD Link Pointer ................................................................................................... 31-98 Host-Controller Rules for Bits in Overlay (DWords 5, 6, 8 and 9)..................................... 31-99 Default Values of Operational Register Space .................................................................. 31-101 Default Port Routing Depending on EHCI HC CF Bit ..................................................... 31-104 Port Power Enable Control Rules ..................................................................................... 31-107 Behavior During Wake-up Events..................................................................................... 31-110 Example Worse-case Transaction Timing Components ................................................... 31-113 Operation of FRINDEX and SOFV (SOF Value Register)............................................... 31-116 Asynchronous Schedule SM Transition Actions .............................................................. 31-129 Typical Low-/Full-speed Transaction Times..................................................................... 31-130 NakCnt Field Adjustment Rules ....................................................................................... 31-131 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxxiv Freescale Semiconductor Tables Table Number 30-66 30-67 30-68 30-69 30-70 30-71 30-72 30-73 30-74 30-75 30-76 30-77 30-78 30-79 30-80 30-81 30-82 30-83 30-84 30-85 30-86 30-87 30-88 30-89 30-90 30-91 30-92 30-93 30-94 30-95 30-96 31-1 31-2 31-3 31-4 31-5 31-6 31-7 31-8 32-1 Title Page Number Actions for Park Mode, based on Endpoint Response and Residual Transfer State.......................................................................................... 31-140 Example Periodic Reference Patterns for Interrupt Transfers with 2ms Poll Rate........... 31-143 Ping Control State Transition Table .................................................................................. 31-144 Interrupt IN/OUT Do Complete Split State Execution Criteria........................................ 31-158 Initial Conditions for OUT siTD's TP and T-count Fields................................................ 31-167 Transaction Position (TP)/Transaction Count (T-Count) Transition Table....................... 31-167 Summary siTD Split Transaction State............................................................................. 31-170 Example Case 2a—Software Scheduling siTDs for an IN Endpoint................................ 31-172 Summary of Transaction Error.......................................................................................... 31-176 Summary Behavior of EHCI Host Controller on Host System Errors.............................. 31-179 Summary of EHCI ............................................................................................................ 31-181 Summary of the conditons of handshakes......................................................................... 31-182 Endpoint Capabilities/Characteristics ............................................................................... 31-188 Next dTD Pointer .............................................................................................................. 31-188 Multiple Mode Control (HCCPARAMS) ......................................................................... 31-189 Next dTD Pointer .............................................................................................................. 31-189 dTD Token ........................................................................................................................ 31-190 dTD Buffer Page Pointer List............................................................................................ 31-190 Device State Diagram ....................................................................................................... 31-192 Device Controller State Information Bits ......................................................................... 31-193 Device Controller Endpoint Initialization ......................................................................... 31-196 Device Controller Stall Response Matrix ......................................................................... 31-196 Variable Length Transfer Protocol Example (ZLT = 0) .................................................... 31-199 Variable Length Transfer Protocol Example (ZLT = 1) .................................................... 31-199 Interrupt/Bulk Endpoint Bus Response Matrix................................................................. 31-200 Isochronous Endpoint Bus Response Matrix .................................................................... 31-205 Device Error Matrix .......................................................................................................... 31-209 Error Descriptions ............................................................................................................. 31-209 High Frequency Interrupt Events ...................................................................................... 31-210 Low Frequency Interrupt Events....................................................................................... 31-210 Error Interrupt Events ....................................................................................................... 31-211 GPT Register Summary ........................................................................................................ 32-4 General Purpose Timer Register Summary........................................................................... 32-5 GPT Control Registers Field Descriptions............................................................................ 32-7 GPT Prescaler Register Description...................................................................................... 32-9 GPT Compare Registers Descriptions ................................................................................ 32-10 GPT Capture Registers Description .................................................................................... 32-11 GPT Counter Register Field Descriptions........................................................................... 32-12 GPT Status Register Field Descriptions.............................................................................. 32-13 i.MX27 External Signals....................................................................................................... 33-3 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxxv Tables Table Number 32-2 32-3 32-4 32-5 32-6 32-7 32-8 32-9 32-10 33-1 33-2 33-3 33-4 33-5 33-6 33-7 33-8 33-9 33-10 33-11 33-12 33-13 33-14 33-15 34-1 34-2 34-3 34-4 34-5 34-6 34-7 34-8 35-1 35-2 35-3 35-4 35-5 36-1 36-2 36-3 36-4 Title Page Number PWM Memory Map .............................................................................................................. 33-4 Register Figure Conventions ................................................................................................. 33-4 PWM Register Summary ...................................................................................................... 33-5 PWMCR Field Descriptions ................................................................................................. 33-6 PWMSR Field Descriptions.................................................................................................. 33-9 PWMIR Field Descriptions................................................................................................. 33-10 PWMSAR Field Descriptions ............................................................................................. 33-11 PWMPR Field Descriptions................................................................................................ 33-11 PWMCNR Field Descriptions ............................................................................................ 33-12 RTC Signal Names List......................................................................................................... 34-3 RTC Register Memory Map.................................................................................................. 34-3 Register Figure Conventions ................................................................................................. 34-4 RTC Register Summary ........................................................................................................ 34-4 RTC Hours and Minutes Counter Register Field Descriptions ............................................. 34-7 RTC Seconds Counter Register Field Descriptions .............................................................. 34-8 RTC Hours and Minutes Alarm Register Field Descriptions................................................ 34-8 RTC Seconds Alarm Register Field Descriptions ................................................................. 34-9 RTC Control Register Field Descriptions ........................................................................... 34-10 RTC Interrupt Status Register Field Descriptions............................................................... 34-11 RTC Interrupt Enable Register Field Descriptions ............................................................. 34-13 RTC Stopwatch Minutes Register Field Descriptions ........................................................ 34-16 RTC Days Counter Register Field Descriptions ................................................................. 34-17 RTC Day Alarm Register Field Descriptions...................................................................... 34-17 Sampling Timer Frequencies .............................................................................................. 34-19 Signal Properties ................................................................................................................... 35-2 WDOG Module Port List ...................................................................................................... 35-3 WDOG Memory Map ........................................................................................................... 35-4 Register Figure Conventions ................................................................................................. 35-4 WDOG Register Summary ................................................................................................... 35-5 WCR Register Descriptions .................................................................................................. 35-6 Watchdog Service Register Description................................................................................ 35-7 Watchdog Reset Status Register Field Descriptions ............................................................. 35-7 AHB-Lite To IP Bus V2.0 Interface Operation (Little Endian)............................................ 36-1 PSR 1–0 Data Bus Size Encoding......................................................................................... 36-3 AIPI1 PSR Setting ................................................................................................................ 36-4 AIPI2 PSR Setting ................................................................................................................ 36-4 i.MX27 AIPI Peripheral Access Sizes and IP Access Types ................................................ 36-5 MAX Memory Map .............................................................................................................. 37-4 Register Figure Conventions ................................................................................................. 37-4 MAX Detailed Register Summary ........................................................................................ 37-5 Master Priority Register (MPR0–MPR2).............................................................................. 37-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxxvi Freescale Semiconductor Tables Table Number 36-5 36-6 36-7 36-8 36-9 36-10 37-1 37-2 37-3 37-4 37-5 37-6 37-7 37-8 37-9 37-10 37-11 37-12 37-13 37-14 37-15 37-16 37-17 37-18 37-19 37-20 37-21 37-22 37-23 37-24 37-25 37-26 38-1 38-2 38-3 38-4 38-5 39-1 39-2 39-3 39-4 Title Page Number Master Priority Register Field Descriptions.......................................................................... 37-6 Alternate Priority Register (MPR0–MPR2).......................................................................... 37-8 Alternate Priority Register Field Descriptions...................................................................... 37-8 Slave General Purpose Control Register Field Descriptions .............................................. 37-10 Alternate Slave General Purpose Control Register Field Descriptions............................... 37-12 Master General Purpose Control Register Field Descriptions ............................................ 37-14 DMA Request Mapping ........................................................................................................ 38-3 DMAC Memory Map............................................................................................................ 38-5 Register Figure Conventions ................................................................................................. 38-7 DMAC Register Summary .................................................................................................... 38-7 DMA Control Register Field Descriptions ......................................................................... 38-11 DMA Interrupt Status Register Field Descriptions............................................................. 38-12 DMA Interrupt Mask Register Field Descriptions.............................................................. 38-13 DMA Burst Time-Out Status Register Description ............................................................ 38-14 DMA Request Time-Out Status Register Field Descriptions ............................................. 38-16 DMA Transfer Error Status Register Field Descriptions .................................................... 38-16 DMA Buffer Overflow Status Register Field Descriptions ................................................ 38-17 DMA Burst Time-Out Control Register Field Descriptions ............................................... 38-18 W-Size Registers Field Descriptions................................................................................... 38-20 X-Size Registers Field Descriptions ................................................................................... 38-21 Y-Size Registers Field Descriptions.................................................................................... 38-22 Channel Source Address Register Field Description .......................................................... 38-24 Channel Destination Address Registers Field Descriptions................................................ 38-24 Channel Count Registers Field Descriptions ...................................................................... 38-25 Channel Control Registers Field Descriptions.................................................................... 38-26 Channel Request Source Select Registers Field Descriptions ............................................ 38-28 Channel Burst Length Registers Field Descriptions ........................................................... 38-29 Channel Request Time-Out Registers Field Descriptions................................................... 38-30 Channel Bus Utilization Control Register Field Descriptions ............................................ 38-31 Channel Counter Register Field Descriptions..................................................................... 38-32 CNNR Value Combinations ................................................................................................ 38-35 CCNR Value Combinations ................................................................................................ 38-35 AUDMUX Memory Map.................................................................................................... 39-14 Register Figure Conventions ............................................................................................... 39-14 AUDMUX Register Summary ............................................................................................ 39-15 Host Port Configuration Register Field Descriptions ......................................................... 39-16 Peripheral Port Configuration Register Field Descriptions ................................................ 39-19 Signals Between CSI and Sensor .......................................................................................... 40-3 Integer Multiples of RxFIFO Full Levels ............................................................................. 40-3 Coding for SAV and EAV ..................................................................................................... 40-6 Coding for Protection Bits .................................................................................................... 40-6 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxxvii Tables Table Number 39-5 39-6 39-7 39-8 39-9 39-10 39-11 39-12 39-13 40-1 40-2 40-3 40-4 40-5 40-6 40-7 40-8 40-9 40-10 40-11 40-12 40-13 40-14 40-15 41-1 41-2 41-3 41-4 41-5 41-6 41-7 41-8 41-9 41-10 41-11 41-12 41-13 41-14 41-15 41-16 41-17 Title Page Number Representations by F-Bit....................................................................................................... 40-6 CSI Memory Map ............................................................................................................... 40-11 Register Figure Conventions ............................................................................................... 40-11 CSI Register Summary........................................................................................................ 40-12 CSI Control Register 1 Field Descriptions.......................................................................... 40-14 CSI Control Register 2 Description .................................................................................... 40-17 CSI Control Register 3 Field Descriptions.......................................................................... 40-19 CSI Status Register Field Descriptions ............................................................................... 40-20 CSI RX Count Register Field Descriptions ........................................................................ 40-24 Video Codec Hardware Register Memory Map.................................................................... 41-5 Register Conventions ............................................................................................................ 41-5 Video Codec Hardware Register Summary .......................................................................... 41-6 Video Codec Code Run Register Field Descriptions ............................................................ 41-8 Video Codec BIT Boot Code Download Data Register Field Descriptions ......................... 41-8 Video Codec Host Interrupt Request Register Field Descriptions........................................ 41-9 Video Codec BIT Interrupt Clear Register Field Descriptions ........................................... 41-10 Video Codec BIT Interrupt Status Register Field Descriptions .......................................... 41-10 Video Codec BIT Code Reset Register Field Descriptions ................................................ 41-11 Video Codec BIT Current PC Register Field Descriptions................................................. 41-12 Rotation and Mirroring Mode ............................................................................................. 41-13 RunCodStd Register Value for Coding Standard ................................................................ 41-18 Frame Buffer Requirement ................................................................................................. 41-23 Working Buffer Organization.............................................................................................. 41-24 Summary of Buffer Requirement........................................................................................ 41-25 Resize Coefficients for 3:5.................................................................................................... 42-6 Resize Coefficients for 5:3.................................................................................................... 42-7 Resize Coefficients for 4:1.................................................................................................... 42-7 YUV to RGB CSC Equations ............................................................................................... 42-8 RGB Color Width and Offsets ............................................................................................ 42-11 PP Register Memory Map................................................................................................... 42-13 PP Control Register Field Descriptions .............................................................................. 42-14 PP Interrupt Control Register Description .......................................................................... 42-16 PP Interrupt Status Register Field Descriptions.................................................................. 42-17 PP Source Y Address Register Field Descriptions ............................................................. 42-18 PP Source Cb Address Register Field Descriptions............................................................ 42-19 PP Source Cr Address Register Field Descriptions ............................................................ 42-19 PP Destination RGB Frame Start Address Register Description........................................ 42-20 PP Quantizer Start Address Register Description............................................................... 42-21 PP Process Parameter Register Description........................................................................ 42-21 PP Source Frame Width Register Field Descriptions ......................................................... 42-22 PP Destination Display Width Register Description........................................................... 42-23 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 lxxxviii Freescale Semiconductor Tables Table Number 41-18 41-19 41-20 41-21 41-22 41-23 41-24 41-25 41-26 41-27 41-28 41-29 41-30 41-31 41-32 41-33 41-34 41-35 41-36 41-37 41-38 41-39 41-40 41-41 41-42 41-43 41-44 41-45 41-46 41-47 41-48 41-49 41-50 41-51 41-52 41-53 41-54 41-55 41-56 41-57 41-58 Title Page Number PP Destination Image Size Register Description ................................................................ 42-24 PP Destination Frame Format Control Register Description.............................................. 42-24 YUV 4:2:2 Configuration Settings...................................................................................... 42-25 PP Resize Table Index Register Field Descriptions ............................................................ 42-26 PP Lock Bit Register Field Descriptions ............................................................................ 42-27 PP CSC COEF_4 Register Field Descriptions.................................................................... 42-28 CSC Coefficient Usage ....................................................................................................... 42-28 PP Resize Coefficient Table Register Field Descriptions ................................................... 42-29 Pre-Processing Block Diagram ........................................................................................... 42-30 Input Data Formats.............................................................................................................. 42-31 Resize Ratios....................................................................................................................... 42-31 Output Formats.................................................................................................................... 42-32 Channel-1 Output Formats and Sizes.................................................................................. 42-34 Channel-2 Output Formats and Sizes.................................................................................. 42-35 YUV to RGB CSC Equations ............................................................................................. 42-36 Loop Mode Ping Pong Registers......................................................................................... 42-37 CSI-PrP Link Internal Signals............................................................................................. 42-42 PrP Register Memory Map.................................................................................................. 42-43 PRP Control Register Field Descriptions............................................................................ 42-45 PRP Interrupt Control Register Field Descriptions............................................................. 42-48 PrP Interrupt Status Register Field Descriptions ................................................................ 42-49 PrP Source Y Address Register Field Descriptions ............................................................ 42-50 PrP Source Cb Address Register Field Descriptions .......................................................... 42-51 PrP Source Cr Address Register Field Descriptions ........................................................... 42-52 PrP Destination RGB1 Start Address Register Field Descriptions..................................... 42-52 PrP Destination RGB2 Start Address Register Field Descriptions..................................... 42-53 PrP Destination Y Address Register Field Descriptions..................................................... 42-54 PrP Destination Cb Address Register Field Descriptions ................................................... 42-54 PrP Destination Cr Address Register Description .............................................................. 42-55 PrP Source Frame Size Register Field Descriptions ........................................................... 42-56 PrP Destination Channel-1 Line Stride Register Field Descriptions .................................. 42-56 PrP Source Pixel Format Control Register Field Descriptions ........................................... 42-57 Example Source Input Pixel Formats.................................................................................. 42-58 PrP CH1 Pixel Format Control Register Field Descriptions............................................... 42-59 Example Channel-1 RGB Output Pixel Format.................................................................. 42-60 PrP Destination Channel-1 Output Image Size Register Field Descriptions ...................... 42-61 PrP Destination CH2 Output Image Size Register Field Description................................. 42-61 PrP Source Line Stride Register Field Descriptions ........................................................... 42-62 YUV to RGB....................................................................................................................... 42-63 For RGB to YUV ................................................................................................................ 42-64 For YUV to RGB ................................................................................................................ 42-64 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor lxxxix Tables Table Number 41-59 41-60 41-61 41-62 41-63 41-64 41-65 41-66 41-67 41-68 41-69 41-70 41-71 41-72 41-73 42-1 42-2 42-3 42-4 42-5 42-6 42-7 42-8 42-9 42-10 42-11 42-12 42-13 42-14 42-15 42-16 42-18 42-17 42-19 42-20 42-21 42-22 42-23 42-24 42-25 42-26 Title Page Number For RGB to YUV ................................................................................................................ 42-65 For RGB to YUV ................................................................................................................ 42-65 CSC Equations .................................................................................................................... 42-66 PrP Channel 1 Horizontal Resize Coefficient-1 Register Field Descriptions ..................... 42-67 PrP Channel1 Horizontal Resize Coefficient-2 Register Field Descriptions ...................... 42-68 PrP Channel 1 Horizontal Resize Valid Register Field Descriptions.................................. 42-69 PrP Channel1 Vertical Resize Coefficient-1 Register Field Descriptions........................... 42-70 PrP Channel 1 Vertical Resize Coefficient 2 Register Field Descriptions .......................... 42-71 PrP Channel 1 Vertical Resize Valid Register Field Descriptions ...................................... 42-72 PrP Channel-2 Horizontal Resize Coefficient-1 Register Field Descriptions..................... 42-73 PrP Channel-2 Horizontal Resize Coefficient-2 Field Descriptions ................................... 42-75 PrP Channel-2 Horizontal Resize Valid Register Field Descriptions ................................. 42-76 PrP Channel2 Vertical Resize Coefficient-1 Register Field Descriptions........................... 42-77 PrP Channel 2 Vertical Resize Coefficient 2 Register Field Descriptions .......................... 42-78 PrP Channel 2 Vertical Resize Valid Register Field Descriptions ...................................... 42-79 SSI Operating Modes ............................................................................................................ 43-4 I2S Mode Selection............................................................................................................. 43-15 Data Alignment ................................................................................................................... 43-19 Signal Properties ................................................................................................................. 43-20 Clock Pin Configuration ..................................................................................................... 43-25 Internal I/O Signal Description ........................................................................................... 43-25 SSI Memory Map................................................................................................................ 43-27 Register Figure Conventions ............................................................................................... 43-28 Register Summary ............................................................................................................... 43-29 SSI Transmit Data Register Field Descriptions .................................................................. 43-33 SSI Receive Data Register Field Descriptions.................................................................... 43-36 SSI Control Register Field Descriptions ............................................................................. 43-40 SSI Interrupt Status Register Field Descriptions ................................................................ 43-42 SSI Interrupt Enable Register Field Descriptions ............................................................... 43-46 SSI Transmit Configuration Register Field Descriptions.................................................... 43-48 SSI Receive Configuration Register Field Descriptions ..................................................... 43-49 SSI Data Length .................................................................................................................. 43-52 SSI Transmit and Receive Clock Control Register Field Descriptions............................... 43-52 SSI FIFO Control/Status Register Field Descriptions ........................................................ 43-54 Status of Transmit FIFO Empty Flag.................................................................................. 43-55 SSI Test Register Field Descriptions................................................................................... 43-56 SSI Option Register Field Descriptions .............................................................................. 43-57 SSI AC97 Control Register Field Descriptions................................................................... 43-59 SSI AC97 Command Address Register Field Descriptions ................................................ 43-60 SSI AC97 Command Data Register .................................................................................... 43-61 SSI AC97 Tag Register Field Descriptions ......................................................................... 43-62 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xc Freescale Semiconductor Tables Table Number 42-27 42-28 42-29 42-30 42-31 42-32 42-33 42-34 42-35 42-36 42-37 42-38 43-1 43-2 43-3 43-4 43-5 43-6 43-7 43-8 43-9 43-10 43-11 43-12 43-13 43-14 43-15 43-16 43-17 43-18 43-19 43-20 43-21 43-23 43-22 43-24 43-25 43-26 43-27 43-28 43-29 Title Page Number SSI Transmit Time Slot Mask Register Field Descriptions ................................................ 43-63 SSI Receive Time Slot Mask Register Field Descriptions.................................................. 43-64 SSI AC97 Channel Status Register Field Descriptions....................................................... 43-65 SSI AC97 Channel Enable Register Field Descriptions ..................................................... 43-66 SSI AC97 Channel Disable Register Field Descriptions .................................................... 43-67 SSI Bit Clock and Frame Rate as a Function of PSR, PM and DIV2................................. 43-70 SSI System Clock, Bit Clock, Frame Clock in Master Mode............................................. 43-71 SSI Receive Data 1 Interrupts ............................................................................................. 43-72 SSI Receive Data 0 Interrupts ............................................................................................. 43-72 SSI Transmit Data 1 Interrupts ........................................................................................... 43-73 SSI Transmit Data 0 Interrupts ........................................................................................... 43-73 SSI Control Bits Requiring SSI to be Disabled Before Change ......................................... 43-74 Supported Panel Characteristics............................................................................................ 44-2 Gray Palette Density ........................................................................................................... 44-10 Pin Configuration ................................................................................................................ 44-11 TFT Color Channel Assignments ....................................................................................... 44-16 LCDC Memory Map........................................................................................................... 44-18 Register Figure Conventions ............................................................................................... 44-19 LCDC Register Summary ................................................................................................... 44-20 Screen Start Address Register Field Description ................................................................ 44-23 LCDC Size Register Field Descriptions ............................................................................. 44-24 LCDC Virtual Page Width Register Field Descriptions...................................................... 44-25 LCDC Cursor Position Register Field Descriptions ........................................................... 44-26 LCDC Cursor Width Height and Blink Register Field Descriptions .................................. 44-27 LCDC Color Cursor Mapping Register Field Descriptions................................................ 44-28 LCDC Panel Configuration Register Field Descriptions .................................................... 44-29 LCDC Horizontal Configuration Register Field Description ............................................. 44-31 LCDC Vertical Configuration Register Field Descriptions ................................................ 44-32 LCDC Panning Offset Register Field Descriptions ............................................................ 44-33 LCDC Sharp Configuration Register Field Descriptions.................................................... 44-34 LCDC PWM Contrast Control Register Field Description................................................. 44-36 LCDC DMA Control Register Field Descriptions............................................................. 44-37 LCDC Refresh Mode Control Register Field Descriptions ................................................ 44-38 INTSYN/INTCON Settings................................................................................................ 44-39 LCDC Interrupt Configuration Register Field Descriptions ............................................... 44-39 LCDC Interrupt Enable Register Field Description............................................................ 44-40 LCDC Interrupt Status Register Field Descriptions............................................................ 44-41 LCDC Graphic Window Start Address Register Field Descriptions .................................. 44-42 LCDC Graphic Window Size Register Field Descriptions ................................................. 44-43 LCDC Graphic Window Virtual Page Width Register Field Descriptions ......................... 44-44 LCDC Graphic Window Panning Offset Register Field Descriptions ................................ 44-45 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xci Tables Table Number 43-30 43-31 43-32 43-33 43-34 43-35 43-36 43-37 43-38 43-39 44-1 44-2 44-3 44-4 44-5 44-6 44-7 44-8 44-10 44-9 44-11 44-12 44-13 44-14 44-15 44-16 44-17 44-18 44-19 Title Page Number LCDC Graphic Window Position Register Field Descriptions........................................... 44-45 LCDC Graphic Window Control Register Field Descriptions............................................ 44-46 LCDC DMA Control Register Field Descriptions............................................................. 44-47 LCDC AUS Mode Control Register Field Descriptions ..................................................... 44-48 LCDC AUS Mode Cursor Control Register Field Descriptions ......................................... 44-49 Four Bits Per Pixel Gray-Scale Mode ................................................................................. 44-50 Four Bits Per Pixel Passive Matrix Color Mode ................................................................. 44-50 Eight Bits Per Pixel Passive Matrix Color Mode ................................................................ 44-51 Four Bits Per Pixel Active Matrix Color Mode .................................................................. 44-51 Eight Bits Per Pixel Active Matrix Color Mode ................................................................. 44-51 SLCDC Module Pin List....................................................................................................... 45-1 Image Endianness ................................................................................................................. 45-3 SDLC Memory Map ........................................................................................................... 45-14 Register Conventions .......................................................................................................... 45-15 SLCDC Register Summary ................................................................................................. 45-16 Data Buffer Base Address Register Field Description........................................................ 45-18 Data Buffer Size Register Description ................................................................................ 45-18 Command Base Address Register Field Description .......................................................... 45-19 Command String Size Register Field Description .............................................................. 45-20 Command Buffer Size Register Field Description.............................................................. 45-20 FIFO Configuration Register Description........................................................................... 45-21 LCD Controller Configuration Register Field Description................................................. 45-21 LCD Transfer Configuration Register Field Description.................................................... 45-22 SLCDC Control/Status Register Field Description............................................................. 45-24 LCD Clock Configuration Register Field Description........................................................ 45-26 LCD Write Data Register Field Description....................................................................... 45-27 SLCDC Serial Interface Timing.......................................................................................... 45-29 SLCDC Parallel Interface Timing....................................................................................... 45-29 LCD_CLK Frequency Range.............................................................................................. 45-31 MCIMX27 Applications Processor Reference Manual, Rev. 0.4 xcii Freescale Semiconductor An addendum, entitled Addendum to Rev. 0.3 of MCIMX27 Multimedia Applications Processor Reference Manual (Rev. 0.4) has been added at the end of this document. About This Book The MCIMX27 Multimedia Applications Processor Reference Manual describes the features and operation of the i.MX27 microprocessor, the seventh generation of the DragonBall family of products. It provides the details of how to initialize, configure, and program the i.MX27 device. The manual presumes basic knowledge of ARM926EJ-S™ architecture. Audience The MCIMX27 Multimedia Applications Processor Reference Manual is intended to provide a design engineer with the necessary data to successfully integrate the i.MX27 processor into a wide variety of applications. It is assumed that the reader has a good working knowledge of the ARM926EJ-S processor. For programming information about the ARM926EJ-S processor, see the documents listed in the Suggested Reading section of this preface. Organization This reference manual is organized into two books: 1. Book I contains chapters that detail integration information, including the signals, clocks, power management, muxing tables, and JTAG/Boot operation of the IC. 2. Book II is divided into parts that consist of chapters that cover the operation and programming of the i.MX27 device. Suggested Reading The following documents are recommended for a complete description of the i.MX27 Multimedia Applications Processor, and enable proper design with the i.MX27 device. Especially for those not familiar with the ARM926EJ-S processor or previous DragonBall products, the following documents will be helpful when used in conjunction with this manual. • AMBA AHB specifications, (ARM Ltd.) • ARM926EJ-S Platform specifications (also named ARM926p Platform) • Hip7a KiloBit Single Port HP SRAM Compiler, MEMCTC (May 8, 2002) • Hip7A SAMI ROM Compiler, MEMCTC (November 16, 2001) • Hip7A KiloBit HD VIA ROM Compiler, MEMCTC (June 28, 2002) • ARM926EJ-S Platform Test Guide (ARM Ltd.) • ARM Architecture Reference Manual (ARM Ltd., order number ARM DDI 0100) • ARM9DT1 Data Sheet Manual (ARM Ltd., order number ARM DDI 0029) • ARM Technical Reference Manual (ARM Ltd., order number ARM DDI 0151C) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xciii • • MC9328MX1 i.MX Integrated Portable System Processor Reference Manual (order number MC9328MX1RM) MCIMX27 Multimedia Application Processor Data Sheet—(order number MCIMX27)) These manuals can be found at the ARM Ltd. World Wide Web site at http://www.arm.com and Freescale Semiconductors World Wide Web site at http://www.freescale.com/imx. These documents can be downloaded directly from the World Wide Web site, or printed versions may be ordered. The World Wide Web site may also have useful application notes. Conventions This reference uses the following conventions: • OVERBAR is used to indicate a signal that is active when pulled low: for example, RESET. • Logic level one is a voltage that corresponds to Boolean true (1) state. • Logic level zero is a voltage that corresponds to Boolean false (0) state. • To set a bit or bits means to establish logic level one. • To clear a bit or bits means to establish logic level zero. • A signal is an electronic construct whose state conveys or changes in state convey information. • A pin is an external physical connection. The same pin can be used to connect a number of signals. • Asserted means that a discrete signal is in active logic state. — Active low signals change from logic level one to logic level zero. — Active high signals change from logic level zero to logic level one. • Negated means that an asserted discrete signal changes logic state. — Active low signals change from logic level zero to logic level one. — Active high signals change from logic level one to logic level zero. • LSB means least significant bit or bits, and MSB means most significant bit or bits. References to low and high bytes or words are spelled out. • Numbers preceded by a percent sign (%) are binary. Numbers preceded by a 0x are hexadecimal. Definitions, Acronyms, and Abbreviations The following list defines acronyms and abbreviations used in this document. ADC analog-to-digital converter AFE analog front end API application programming interface BCD binary coded decimal BER bit error ratio CGM clock generation module CMOS complimentary metal-oxide semiconductor CRC cyclic redundancy check MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 xciv Freescale Semiconductor CSIC DAC DDR RAM DMA DRAM DSP FEC FIFO FIRI GPIO I/O ICE IrDa JTAG MAP MAPBGA MIPS MMC PLL PWM RTC SD SDRAM SPI SRAM TQFP UART USB USB OTG XTAL BE/LE CCM LV LWB MCTL complex instruction set computer digital-to-analog converter double data rate RAM direct memory access dynamic random access memory digital signal processor forward error correction first in first out fast IR interface general purpose input/output Input/Output in-circuit emulation infrared data association joint test action group mold array process mold array process ball grid array million instructions per second multimedia card phase locked loop pulse-width modulator real-time clock secure digital synchronous dynamic random access memory serial peripheral interface static random access memory thin quad flat pack universal asynchronous receiver/transmitter universal serial bus USB On-The-Go crystal big endian/little endian clock control module, also called “clkctl” module low voltage late-write buffer memory controller MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor xcv RAM ROM R-AHB bus SRAM ARM API Fabrication Path Flash Path GPCR HW iRAM iROM NFC NAND Flash ROM Bootstrap RAM Path SIDR Sync Flash TBD UART USB V-Sync Flash Word TYPE UID WTLS random access memory read only memory reduced advanced high-performance bus (AHB), related to ARM bus architecture static RAM Advanced RISC Machines processor architecture Application Programming Interface Path within ROM Bootstrap for fabrication test execution Path within ROM Bootstrap leading towards executing a Flash application. Global Peripheral Control Registry of the i.MX27. Hardware Processor-internal RAM Processor-internal ROM NAND Flash Controller A Flash ROM Technology Internal boot code encompassing main boot flow as well as exception vectors, USB/UART Bootloader blocks. Path within ROM Bootstrap leading towards downloading and executing a RAM application Silicon ID Register of the i.MX27 A Flash ROM Technology To Be Determined Universal Asynchronous Receiver/Transmitter Universal Serial Bus A Flash ROM Technology 32 bits Identifier that distinguishes a production or engineering device. Unique ID; a field in the processor and CSF identifying a device or group of devices Wireless Transport layer Security, a part of the Wireless Application Protocol MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 xcvi Freescale Semiconductor Book I: i.MX27 Applications Processor Integration and Description Introduction Book I comprises detailed descriptions and information on the integration of the i.MX27 Multimedia Applications Processor. Book I includes the following chapters. Device Introduction and Memory Map Chapter 1, “Introduction to the i.MX27 Multimedia Applications Processor,” on page 1-1 Chapter 2, “System Memory and Register Map,” on page 2-1 Clocks, Power Management and Reset Chapter 3, “Clocks, Power Management, and Reset Control,” on page 3-1 Pins Chapter 4, “System Control,” on page 4-1 Chapter 5, “Signal Descriptions and Pin Assignments,” on page 5-1 Chapter 6, “General-Purpose I/O (GPIO),” on page 6-1 Debug Chapter 7, “JTAG Controller (JTAGC),” on page 7-1 Boot Chapter 8, “Bootstrap Mode Operation,” on page 8-1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor I-1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 I-2 Freescale Semiconductor Chapter 1 Introduction to the i.MX27 Multimedia Applications Processor As part of the i.MX growing family of multimedia-focused products, the i.MX27 Multimedia Applications Processor takes the Mobile Multimedia Experience to another level. Whether you are designing mobile entertainment, a smartphone, wireless PDA, or any other portable device, the i.MX27 processor offers a high degree of integration to significantly reduce your design time while providing low-power consumption with performance to spare, and the flexibility necessary for today’s competitive marketplace. The i.MX27 processor is packaged in a 404-pin MAPBGA. Differentiating features of the i.MX27 device include: • Advanced and power-efficient implementation of the ARM926EJ-S™ core, operating at speeds up to 400 MHz • enhanced Multimedia Accelerator Lite (eMMA_lt)—MPEG-4 and H.264 hardware encode or decode up to D1 resolution at 30 fps or encode and decode up to VGA resolution at 24 fps. • High-Speed USB On-The-Go controller, host or client • Smart Speed Crossbar Switch—Multi-layer AMBA-compliant bus allows any one of the six bus masters to talk to any of the three slaves without interfering with the other bus master/slave transactions to provide system level parallelism. • PCMCIA/Compact Flash Interface—Supports hot-insertion, card insert, and removal detection • Security—Software and hardware combined security solution allows secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. • Smart Power Management—Includes Run, Doze, and Sleep modes, frequency scaling, active well biasing and clock gating • LCD panels—Supports both smart and standard LCD panels • Fast Ethernet—Supports 10/100 baseT Ethernet MAC MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-1 Introduction to the i.MX27 Multimedia Applications Processor 1.1 i.MX27 Applications Processor Block Diagram Figure 1-1 is a simplified functional block diagram of the i.MX27 processor. System Control Connectivity JTAG/ETM9 i.MX27 CSPI (3) Bootstrap SSI (2) CRM 2 I C (2) System Security SCC CPU Complex Wireline UART (6) MAX (Smart Speed Switch) ARM926EJ-S SAHARA2 RTIC I-Cache D-Cache MMU Internal Control Bus Control Memory Control IIM USB 2.0 1-WIRE FEC ATA Multimedia Accelerator External Memory Interface Std System Resource Video Codec GPT (6) eMMA Lite M3IF PWM Expansion SDRAMC WDOG SDHC (3) EIM SRTC NFC GPIO LCDC and SLCDC PCMCIA/CF SDMA Keypad Control MSHC Multimedia Interface CSI Human Interface Figure 1-1. i.MX27 Processor Functional Block Diagram 1.2 Summary of Core and Modules This section describes the ARM926EJ-S as it applies to the i.MX27 processor and the function of the modules within the i.MX27 device. 1.2.1 ARM9™ Platform The ARM9™ Platform consists of the ARM926EJ-S core, operating at speeds up to 400 MHz at 1.6 V, and 266 MHz at 1.2 V. The ARM926EJ-S core includes a 16-Kbyte level 1 (L1) cache system, a 6 × 3 multi-layer AHB crossbar switch, and a 16 channel DMA. The ARM926EJ-S is a member of the ARM9 family of general-purpose microprocessors targeted at multi-tasking applications. The ARM9 Platform provides the following features: • ARM926EJ-S microprocessor core MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-2 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor — — — — — — — • • • • • • • 16K instruction cache and 16K data cache High-performance ARM® 32-bit RISC engine Thumb® 16-bit compressed instruction set for a leading level of code density Efficient execution of Java byte codes EmbeddedICE™ JTAG software debug 100% user code binary compatibility with ARM7TDMI™ Advanced Microcontroller Bus Architecture (AMBA™) system-on-chip multi-master bus interface — Support for mixed loads of real-time and user applications via cache locking facilities — Virtual Memory Management Unit (VMMU) Support for Little Endian only CPU and System speed — ARM926EJ-S core: up to 400 MHz — System Clock: up to 133 MHz — External memory interface: same clock source as system, up to 133 MHz at 1.8 V supply — System clock is derived from the CPU clock through an integer divider ARM Interrupt Controller (AITC) — The AITC is connected to the primary AHB as a slave device and provides support for up to 64 interrupt sources. It generates normal and fast interrupts to the processor core. The AITC supports a hardware-assisted vectoring mode for automatic vectoring to reduce interrupt latency. Clock Control Module (CLKCTL)—The CLKCTL performs block level clock gating, ARM926EJ-S JTAG synchronization requirements, as well as other miscellaneous clock control for the platform. AHB to IP bus interfaces (AIPIs)—Provide a communication interface between the high-speed AHB to a lower-speed IP bus for slave peripherals The Multi-Layer 6 × 3 AHB Crossbar Switch (MAX)—The crossbar switch allows for concurrent transactions to proceed from any input port (bus master) to any output port (bus slave): That is, it is possible for all three output ports to be active at the same time as a result of three independent input or output requests. Well Bias Charge Pump (WBCP)—With the exception of the memories, the entire ARM9 Platform supports two active well biasing to reduce leakage current to minimum levels. The well bias enable inputs (wt_en and wt_en_dnw) are driven by the external Well Bias Charge Pump (WBCP) to the ARM9 Platform. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-3 Introduction to the i.MX27 Multimedia Applications Processor 1.2.2 System Control To ensure optimum power use and clock signal stability, the i.MX27 processor uses the following modules to generate, control, and distribute clock and control signals throughout the i.MX27 processor and to external devices. 1.2.2.1 Clock Controller Module (CCM) The CCM generates clock and reset signals used throughout the i.MX27 device and for external peripherals. It also enables system software to control, customize, or read the status of the following functions: • Chip ID • Multiplexing of I/O signals • I/O driving strength • I/O pull enable control • Well bias control • System boot mode selection • DPTC control 1.2.2.2 JTAG Controller (JTAGC) The JTAGC provides debug access to the ARM926EJ-S core and boundary scan test control. The i.MX27 processor offers designers and programers with full-debug capabilities through industry-standard JTAG interface and the ability to bootload using either a serial or USB interface. • UART Bootstrap mode function: — Allows system initialization and program or data download to system memory via USB or UART1 — Accepts execution command to run program stored in system memory — Supports memory/register read/write operation of selectable data size of byte, half-word, or word — Provides a 16-byte instruction buffer for ARM instruction storage and execution • USB Bootstrap mode function — Supports bootstrapping through USB OTG port • JTAG port to support generic ARM debug tools 1.2.3 Standard System Resources The i.MX27 processor contains various timers and resource features to optimize the control and security of both the internal modules and external devices. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-4 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor 1.2.3.1 General Purpose Timer (GPT) The six General-Purpose Timer (GPT) modules contain identical general-purpose 32-bit timers with programmable prescalers and compare and capture registers with the following features: • Automatic interrupt generation • Programmable timer input/output pins • Input capture channels capability with programmable trigger edge for each GPT • Output compare channels with programmable mode for each GPT 1.2.3.2 Pulse-Width Modulator (PWM) The Pulse-Width Modulator (PWM) has a 16-bit counter and is optimized to generate sound from stored sample audio images. It also generate tones. The following features characterize the PWM module: • • • 4 × 16 FIFO to minimize interrupt overhead 16-bit resolution Sound and melody generation 1.2.3.3 Real Time Clock (RTC) The Real-Time Clock (RTC) module maintains the system clock, provides stopwatch, alarm, and interrupt functions, and supports the following features: • 32.768 kHz and 32 kHz input operation • Full clock features: seconds, minutes, hours, days • Capable of counting up to 512 days • Minute countdown timer with interrupt • Programmable daily alarm with interrupt • Sampling timer with interrupt • Once-per-second, once-per-minute, once-per-hour, and once-per-day interrupts • Interrupt generation for digitizer sampling or keyboard debouncing • Independent power supply 1.2.3.4 Watchdog Timer Module (WDOG) The Watchdog Timer module (WDOG Timer) module protects against system failures by providing a method for the system to recover from unexpected events or programming errors. The WDOG timer module also generates a system reset using a software write to the Watchdog Control Register (WCR), a detection of a clock monitor event, an external reset, an external JTAG reset signal, or an occurrence of a power-on reset. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-5 Introduction to the i.MX27 Multimedia Applications Processor The WDOG Timer provides the following: • Programmable time out of 0.5 s to 64 s • Resolution of 0.5 s 1.2.3.5 General-Purpose I/O Ports (GPIO) The GPIO module provides six general purpose I/O ports. Each single GPIO port is a 32-bit port that may be multiplexed with one or more dedicated functions. The GPIO features are: • Supports level or edge trigger interrupt and is system wake-up capable • Most I/O signals are multiplexed with dedicated functions for pin efficiency. 1.2.3.6 Direct Memory Access Controller (DMAC) The Direct Memory Access Controller (DMAC) provides 16 channels to support linear memory, 2D memory, FIFO, and end-of-burst enable FIFO transfers to support a wide variety of DMA operations. Features include the following: • Supports 16 channels linear memory, 2D memory, and FIFO for both source and destination • Supports 8-bit, 16-bit, or 32-bit FIFO port size and memory port size data transfer • DMA burst length is configurable up to maximum of 16 words, 32 half-words, or 64 bytes for each channel • Bus utilization control for a channel that is not triggered by DMA request • Interrupts that are provided to interrupt handler on bulk data transfer complete or transfer error • DMA burst time-out error to terminate DMA cycle when the burst cannot be completed in a programmed timing period • Dedicated external DMA request and grant signal • Supports increment, decrement, and no increment for source and destination addressing • Supports DMA chaining 1.2.4 Power Management and Backup Modes The i.MX27 processor’s power management features are as follows: • SupportS 3 power modes of operation: Run, Doze, and Stop • Aggressive clock gating within modules to minimize CMOS switching power • Active well biasing technique to reduce standby mode current consumption • Voltage/frequency scalable capability • Dynamic process temperature compensation 1.2.4.1 SCC, RTC, and Oscillator Power Supply The i.MX27 processor has a separate power domain from the main power domain for the SCC, RTC, and the 32 kHz oscillator (OSC32K) power supply, so that when the main power domain shuts down, the SCC MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-6 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor internal memory data and status is maintained. Also, the RTC and OSC32K works as normal using the backup power supply that is provided by power management. 1.2.4.2 Enter/Exit Mode Power management provides the power_cut to indicate the main power cut: 1—main power_cut; 0—main power_on. • Mode Enter—When power_cut is set to 1 by the power management chip, then the main power can shut down. • Mode Exit—power_cut must be set to 1 when the main power is not on; after main power_on is restored (after the main power reset ends), power_cut should be set to 0. • Power On Initial—In the initial process, power_cut must be set to 0, and POR must give a valid 0 slot for the SCC, RTC power_on reset. 1.2.4.3 Reset Strategy The POR is active to the RTC and SCC. When power_cut is set to 1 (in the backed power mode), then the reset from the chip system will be gated, preventing any chip reset sources from resetting SCC and RTC. When power_cut is set to 0 (not in the backed power mode), then the reset from the chip system will be active to SCC and RTC, which means all chip reset sources can reset the SCC and RTC. 1.2.5 System Security To address the need for secure wireless communication, the i.MX27 processor provides confidentiality, authentication, integrity, and legitimacy within its architecture. This section describes the modules that provide these types of security—the Security Controller, SAHARA2, Run-Time Integrity Checker, and the IC Identification Module—whose built-in features support a broad range of security-enabled products. 1.2.5.1 Security Controller Module (SCC) The SCC is a hardware component composed of two blocks—the Secure RAM module and the Security Monitor. The Secure RAM securely stores sensitive information. The Security Monitor implements the security policy, checking algorithm sequencing, and controlling the Secure State. There is also a unique encryption key accessible only to secure RAM. 1.2.5.2 Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) SAHARA2 is a security co-processor within the i.MX27 processor used to implement block encryption algorithms, hashing algorithms, stream cipher algorithms, and hardware random number generation. SAHARA2 accelerates the following security protocols and their features: • AES encryption/decryption — ECB, CBC, CTR, and CCM modes — 128 bit key • DES/3DES MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-7 Introduction to the i.MX27 Multimedia Applications Processor • • • — EBC, CBC, and CTR modes — 56 key with parity (DES) — 112 bit or 168 bit key parity (3DES) AR4 (RC4 compatible cipher) — 5–16 byte key — Host accessible S-box MD5, SHA-1, SHA-224 and SHA-256 hashing algorithms — Message lengths are multiples of bytes — Auto padding supported — HMAC (support for IPAD and OPAD via descriptors) — Up to 4-Gbyte message length Random number generator (NIST approved PRNG – FIPS 186-2) — Entropy is generated via an independent free running ring oscillator 1.2.5.3 Run-Time Integrity Checkers (RTIC) The RTIC ensures the integrity of the contents of the peripheral memory and assists with boot authentication. The RTIC offers the following features: • SHA-1 message authentication • Input DMA (AMBA-AHB Lite1 bus master) interface • Segmented data gathering to support non-contiguous data blocks in memory (up to two segments per block) • Works with High Assurance Boot (HAB) process • Secure-scan DFT security • Support for up to four independent memory blocks • Programmable DMA bus duty cycle timer and watchdog timer • Power-saving clock gating logic • Hardware configurable Big/Little-Endian data format • Full word memory reads (word-aligned addresses, multiple of 32-bit lengths) 1.2.5.4 IC Identification Module (IIM) The IC Identification Module (IIM) provides an interface for reading, and in some cases, programming, and for overriding identification and control information stored in on-chip fuse elements. 1. AHB-Lite interface provides support for request/grant bus arbitration MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-8 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor 1.2.6 Connectivity This section describes how the modules within the i.MX27 processor interface with each other, and provides a high-level overview on how the architecture of the buses are configured and multiplexed. GPS UART3 Bluetooth UART4 IrDA UART5 IrDA UART6 USB OTG USB Host 1 USB Host 2 Serial EEPROM EtherNet 1-Wire FEC INTERNAL CONNECTIVITY i.MX27 ATA CPU ROMPATCH ETM CRM MAX RTIC External Memory Interface (EMI) SD Secure Digital MSHC Memory Stick Pro ESDRAM EIM NFC ETB PCMCIA/CF JTAGC DMAC MULTIMEDIA Video Codec ATAPI IDE Hard Drive SCC SECURITY SSI2 M3IF UART2 CSPI2 SAHARA2 MEMORY EXPANSION IrDA SSI1 CSPI1 MEMORY UART1 AUDMUX EXTERNAL CONNECTIVITY RS-232 IrDA I2C IIM I2C Audio SSI Voice SSI Bluetooth MPEG-4 H.264 eMMA_lt HUMAN INTERFACE CSI SLCDC LCDC KPP CCIR656 Camera Smart Displays Dumb Display KeyPad Linear FIFO 2D Figure 1-2. i.MX27 Connectivity Example 1.2.6.1 Configurable Serial Peripheral Interfaces (CSPI) The i.MX27 processor has three Configurable Serial Peripheral Interface (CSPI) modules that allow rapid data communication with fewer software interrupts than conventional serial communications. Each CSPI is equipped with data FIFO and is a master/slave configurable serial peripheral interface module, enabling the i.MX27 processor to interface with external SPI master or slave devices. • Master/slave configurable • Two chip-selects each for master mode operation MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-9 Introduction to the i.MX27 Multimedia Applications Processor • • Up to 16-bit programmable data transfer 8 × 16 FIFO for both transmit and receive data 1.2.6.2 Inter-IC Connectivity (I2C) Bus Module The two I2C modules are two-wire, bidirectional serial buses that provide a simple, efficient method of data exchange, minimizing the interconnection between devices. These buses are suitable for applications requiring occasional communications over a short distance between several devices. The flexible I2C allows additional devices to be connected to the bus for expansion and system development. The I2C features include: • Multiple-master operation • Software-programmable for 1 of 64 different serial clock frequencies • Interrupt-driven, byte-by-byte data transfer • Arbitration-lost interrupt with automatic mode switching from master to slave • Calling address identification interrupt • Start and stop signal generation and detection • Repeated START signal generation • Acknowledge bit generation and detection • Bus-busy detection 1.2.6.3 Synchronous Serial Interface (SSI) The two synchronous serial interfaces are full-duplex, serial ports that enable the i.MX27 device to communicate with a variety of serial devices, such as standard codecs, digital signal processors (DSPs), microprocessors, peripherals, and popular industry audio codecs that implement the inter-IC sound bus standard (I2S) and Intel AC97 standard. Features include the following: • Supports generic SSI interface for timeslot based communication with synchronous voice codecs • Timeslot mode supports up to four channels for communication among devices, Bluetooth™ voice port, voice codecs, and baseband audio ports. • Supports Philips standard Inter-IC Sound (I2S) bus for external digital audio chip interface at 44.1 kHz and 48 kHz • AC97 Host Controller mode with support for two audio channels supporting fixed and variable rate transfers • Used together with the Digital Audio Mux (AUDMUX) module to provide flexible audio and voice routing options 1.2.6.4 Bus Control The six modules that control the bus in the MX27 are listed here. This section provides a brief description for each. • AHB-Lite IP Interface Module (AIPI) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-10 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor • • • ARM926EJ-S Interrupt Controller (AITC) Intellectual Property Bus Multiplexer (IPMUX) Multi-layer AHB Crossbar Switch (MAX) 1.2.6.4.1 AHB-Lite IP Interface Module (AIPI) The AIPI acts as an interface between the ARM Advanced High-performance Bus Lite. (AHB-Lite) and lower bandwidth peripherals that conform to the IP Bus Specification, Rev 2.0. 1.2.6.4.2 ARM926EJ-S Interrupt Controller (AITC) AITC is connected to the primary AHB as a slave device. It generates the normal and fast interrupts to the ARM926EJ-S processor. 1.2.6.4.3 Intellectual Property Bus Multiplexer (IPMUX) The Intellectual Property Bus Multiplexer (IPMUX) is used to select the read data, transfer wait, and transfer error signals from the various modules and pass it to the AIPI in the ARM9 Platform. 1.2.6.4.4 Multi-Layer AHB Crossbar Switch (MAX) The ARM926EJ-S core’s instruction and data buses and all alternate bus master interfaces arbitrate for resources via a 6 × 3 Multi-Layer AHB Crossbar Switch (MAX)—also known as a Smart Speed Switch. There are six fully functional master ports (M0–M5) and three fully functional slave ports (S0–S2). The MAX is uni-directional. All master and slave ports are AHB-Lite compliant. 1.2.7 Wireline Connectivity The i.MX27 device provides a variety of external wireline connectivity. This section describes the modules for this support. 1.2.7.1 Universal Asynchronous Receiver/Transmitter (UART) The i.MX27 processor includes six Universal Asynchronous Receiver/Transmitter (UART) modules that provide serial communication with external devices through either an RS-232 cable or by using IrDA-compatible infrared. Each of the six UARTs features the following: • Supports serial data transmit/receive operation: 7 or 8 data bits, 1 or 2 stop bits, programmable parity (even, odd, or none) • Programmable baud rates up to 4.125 Mbps. • Automatic baud rate detection • 32-bytes FIFO for transmit and 32 half-words FIFO for receive data • IrDA Serial Infra-Red (SIR) mode support MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-11 Introduction to the i.MX27 Multimedia Applications Processor 1.2.7.2 High Speed USB 2.0 Interface (USB) The i.MX27 processor supports three independent USB 2.0 ports, two of which support high speed (HS) operation: • OTG—High speed (480 Mbps) • Host 1—Full speed (12 Mbps) • Host 2—High speed (480 Mbps) The USB connectivity of the i.MX27 processor provides extremely fast synchronization with a PC or between two devices. Any of the USB ports may be used for transceiver-free connection or for external transceiver-based connection. The USB OTG port can connect to a PC as either a device or as a host to any of the following peripherals: keyboard, printer, mouse, speakers, storage device, digital camera, and so on. It supports 16 endpoints for each host and device. USB Host 1 is typically connected to dedicated ICs that support WLAN, Bluetooth™ wireless technology, and GPS. Host 1 supports 16 endpoints. USB Host 2 is typically used to connect to ICs for baseband or WLAN, Bluetooth wireless technology, or GPS. Host 2 supports four endpoints. 1.2.7.3 1-Wire Interface (1-Wire) The 1-Wire® module provides bi-directional communication between the ARM926EJ-S and the Add-Only-Memory EPROM (DS2502). The 1-Kbit EPROM is used to hold information about the battery and to communicate with the ARM9 Platform using the IP interface. 1.2.7.4 Advanced Technology Attachment (ATA) The Advanced Technology Attachment (ATA) block of the i.MX27 processor is an AT attachment host interface and is used to interface with IDE hard disk drives and ATAPI optical disk drives. This feature allows designers to attach storage devices at low costs per unit, which is a critical selling point in the portable digital player market. The ATA controller interfaces with ATA devices using the industry-standard ATA-6 specification. The ATA interface is compliant to the ATA-6 standard, and supports following protocols: • PIO mode 0, 1, 2, 3, and 4 • Multiword DMA mode 0, 1, and 2 • Ultra DMA modes 0, 1, 2, 3, and 4 with bus clock of 50 MHz or higher • Ultra DMA modes 5 with bus clock of 80 MHz or higher 1.2.7.5 Fast Ethernet Controller (FEC) The Fast Ethernet Controller (FEC) performs the full set of IEEE 802.3/Ethernet CSMA/CD media access control and channel interface functions. The FEC supports connection and functionality for the 10/100 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-12 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor Mbps 802.3 Media Independent Interface (MII). It requires an external transceiver (PHY) to complete the interface to the media. The FEC provides the following features: • Supports three different Ethernet physical interfaces: — 100 Mbps IEEE 802.3 MII — 10 Mbps IEEE 802.3 MII — 10 Mbps 7-wire interface (industry standard) • IEEE 802.3 full-duplex flow control • Programmable maximum frame length supports IEEE 802.1 VLAN tags and priority • Supports full-duplex operation (200 Mbps throughput) with a minimum system clock rate of 50 MHz • Supports half-duplex operation (100 Mbps throughput) with a minimum system clock rate of 25 MHz • Retransmission from transmit FIFO following a collision (no processor bus utilization) • Automatic internal flushing of the receive FIFO for runts (collision fragments) and address recognition rejects (no processor bus utilization) • Address recognition — Frames with broadcast address may be always accepted or always rejected — Exact match for single 48-bit individual (unicast) address — Hash (64-bit hash) check of individual (unicast) addresses — Hash (64-bit hash) check of group (multicast) addresses — Promiscuous mode 1.2.8 External Memory Interface The External Memory Interface (EMI) of the i.MX27 processor consists of the SDRAM controller (SDRAMC), the PCMCIA controller, the NAND Flash controller (NFC), and the External Interface module (EIM), using the Multi-Master Memory Interface (M3IF) as the controller through the external memory ports. The individual features of these controllers are provided in this section. To allow the maximum number of potential designs, the EMI supports the following memory types: • SDRAM—133 MHz, 32/16-bit • DDR—266 MHz, 32/16-bit • NAND Flash—dedicated 8-bit, shared 16-bit • PSRAM 1.2.8.1 Multi-Master Memory Interface (M3IF) The Multi-Master Memory Interface (M3IF) controls memory accesses from one or more masters through different port interfaces to the external memory controllers SDRAM, PCMCIA, NAND Flash, and EIM. The M3IF includes these distinctive features: • Supports multiple requests from masters through input port interfaces MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-13 Introduction to the i.MX27 Multimedia Applications Processor • • • • • • Arbitrates requests to the different memory controllers Multiple requests capabilities to SDRAMC through a dedicated arbitration mechanism Flexible round robin access arbitration, with a programmable priority scheme to selective masters Programmable master that controls (locks) accesses to SDRAM/DDR, and a programmable master that controls (locks) accesses to other memories (NFC, EIM) Multi-endianness support for all memory controllers Supports memory “snooping”—that is, monitors a region in external memory for write accesses 1.2.8.2 SDRAM Controller (SDRAMC) The SDRAM Controller (SDRAMC) provides an interface and control for synchronous DRAM memories for the system. The SDRAMC supports the following: • Optimization of consecutive memory accesses using memory command anticipation (latency hiding) — Hiding latency (or “command anticipation”) by optimizing the commands to both connected chip-selects — Monitoring open memory pages — Bank-wise memory address mapping — SDRAM burst length configuration of 41 or 8 bursts or full-page mode — MDDR burst length configuration of 8 bursts — Support of different internal burst length (1/4/8 words) by using burst truncate commands — ARM/AMBA/AHB-Lite compliant — Shared address and command bus to SDRAM/MDDR • Supports 64, 128, 256, 512 Mbit, 1 Gbit, and 2 Gbit, 4 bank, single data rate, synchronous SDRAM, and MDDR — Two independent chip-selects — Up to 128 Mbytes per chip-select — Up to four banks active simultaneously per chip-select — JEDEC standard pinout/operation • Supports mobile DDR266 devices (both 16-bit and 32-bit) • PC133 compliant interface — 133-MHz system clock achievable with “–7” option PC133 compliant memories — Single fixed-length (4/8-word) burst or full page access — Access time of 9-1-1-1-1-1-1-1 at 133 MHz (for read access when the memory bus is available, the row is open and CAS latency configured to three cycles). The access time includes the M3IF delay (assuming there is no arbitration penalty). • Software configurable for different system and memory devices requirements — 16-bit or 32-bit memory data bus width 1. For 16-bit memory burst length 4 is not supported. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-14 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor • • — Many row and column addresses — Row cycle delay (tRC) — Row precharge delay (tRP) — Row-to-column delay (tRCD) — Column-to-data delay (CAS latency) — Load mode register to active command (tMRD) — Write to precharge (tWR) — Write to read (tWTR) for MDDR memories only — MDDR exit power down to next valid command delay (tXS) — Active to precharge (tRAS) — Active to active (tRRD) Built-in auto-refresh timer and state machine Hardware and software supported self-refresh entry and exit — Keeps data valid during system reset and low-power modes — Auto Power Down timer (one per chip-select) — Auto Precharge timer (one per bank in each chip-select) 1.2.8.3 NAND Flash Controller (NFC) The NAND Flash controller (NFC) interfaces standard NAND Flash memory devices to the i.MX27 processor and hides the complexities of accessing NAND Flash. The NFC features include: • Contains hardware boot loader for automatic boot up from NAND Flash devices • Supports all 8-bit/16-bit NAND Flash devices regardless of density and organization • Supports 512-byte and 2-Kbyte page sizes • Internal 2 Kbytes of buffer RAM used as boot RAM during cold startup and as read/write page buffers to relieve CPU intervention • Automatic ECC detection and selectable correction • Data protection for RAM buffer and NAND Flash pages 1.2.8.4 Personal Computer Memory Card International Association (PCMCIA) The PCMCIA host adapter module provides the control logic for PCMCIA socket interfaces, and requires some additional external analog power switching logic and buffering. The PCMCIA controller provides the following features: • A host adapter interface fully compliant with the PCMCIA standard release 2.1 (PC Card -16) — Supports one PCMCIA socket — Supports hot-insertion — Supports card detection MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-15 Introduction to the i.MX27 Multimedia Applications Processor • • — Mappings to common memory space, attribute memory space, and I/O space. Each space is up to 64 Mbytes in size. — Supports five memory windows — Generates a single interrupt to the CPU — PC card access timing is fully programmable — Handles interrupts from the card The pcmcia_if signal is part of the EMI complex and shares pins with the EIM, SDRAMC, and NFC controller. Supports ATA disk emulation 1.2.8.5 External Interface Module (EIM) The External Interface Module (EIM) interfaces to devices external to the chip, including generation of chip-selects, clock and control for external peripherals, and memory. The EIM provides asynchronous and synchronous access to devices with an SRAM-like interface. The EIM includes the following features: • • • • • • • • • • • • Six chip-selects for external devices, with CS [0] and CS [1] each covering a range of 128 Mbytes, and CS [2] – CS [5], each covering a range of 32 Mbytes CS [0] range can be increased to 256 Mbytes when collapsed with CS [1] Selectable protection for each chip-select Programmable data port size for each chip-select Asynchronous accesses with programmable setup and hold times for control signals Synchronous Memory Burst Read Mode support for AMD, Intel, and Micron burst flash memory Synchronous Memory Burst Write Mode support for PSRAM (CellularRAMTM from Micron, Infineon, and Cypress) Support for multiplexed address/data bus operation External cycle termination/postpone with DTACK signal Programmable wait-state generator for each chip-select Support for Big Endian and Little Endian modes of operation per access ARM AHB slave interface 1.2.9 Memory Expansion The i.MX27 processor offers memory expansion options for SD, Memory Stick Pro®, and ATA-6. Each expansion port reflects the latest version of the respective specification for that interface. Brief descriptions of each expansion port follow. 1.2.9.1 Memory Stick Host Controller (MSHC) The i.MX27 processor’s Memory Stick Host Controller supports one Memory Stick Pro slot. The MSHC conforms to Memory Stick Standard Format Specifications, ver.1.4-00 and Memory Stick Standard MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-16 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor Memory Stick PRO Format Specification, ver.1.00-01. The MSHC communication is based on an advanced 7-pin serial bus designed to operate in a low-voltage range. In addition to multimedia cards, the module can be used to communicate to high-bit rate communication devices, such as WLAN 802.11 a/b, and Bluetooth wireless technology, among others. The MSHC is placed between the AIPI and the customer memory stick to support data transfer from the i.MX27 device to the customer memory stick. 1.2.9.2 Secured Digital Host Controller (SDHC) The three Secured Digital Host Controllers (SDHC) in the i.MX27 device control the Secure Digital memory cards and I/O functions by sending commands to the cards and performing data accesses to and from the cards. SDHC features include: • Fully compatible with the SD Memory Card Specification 1.0 and SD I/O Specification 1.0 with 1 and 4 channel(s) • Supports hot swappable operation • Data rates from 25 Mbps to 100 Mbps • Dedicated power pin 1.2.10 Video Codec and enhanced Multimedia Accelerator Lite (eMMA_lt) The i.MX27 processor uses a Video Codec and an enhanced Multimedia Accelerator Lite (eMMA_lt) to provide H.264, MPEG-4 and H.263 hardware acceleration with pre- and post-processing. 1.2.10.1 Video Codec The Video Codec module supports full-duplex video codec with MPEG-4 and H.264 hardware encode or decode up to D1 resolution at 30 fps or encode and decode up to VGA resolution at 24 fps, and integrates multiple video processing standards, such as H.264 BP, MPEG-4 SP, and H.263 P3. The Video Codec architecture is shown in the Figure 1-3. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-17 Introduction to the i.MX27 Multimedia Applications Processor CRM ahb64_sel Clock and Reset 32bit AXI Video Processing IP AXI to AHB bus Read Channel 1 and 2 Logic Memories Block 64bit 32to64 Gasket 64bit EMI Write Channel Logic Memory Bist Engine 64bit APB to IP Bus 32 bit Test Signal Internal SRAM AIPI Interrupt Signal Figure 1-3. Video Codec Architecture Diagram The Video Codec provides the following capabilities: • Multi-standard video codec — MPEG-4 part-II Simple Profile (SP) encoding/decoding — H.264/AVC Baseline Profile (BP) encoding/decoding — H.263 P3 encoding/decoding — Multi-party call: One stream encoding and two streams decoding simultaneously — Multi-format: Encodes MPEG-4 bitstream, and decodes H.264 bitstream simultaneously • Coding tools — High-performance motion estimation (single reference frame for both MPEG-4 and H.264 encoding) – Quarter-pel and half-pel accuracy motion estimation – [±16, ±16] search range — All variable block sizes are supported. (In case of encoding, 8 × 4, 4 × 8, and 4 × 4 block sizes are not supported.) — Unrestricted motion vector — MPEG-4 AC/DC prediction and intra-prediction (H.264) — H.264/AVC intra-prediction MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-18 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor • • • — H.263 Annex I, J, K, and T are supported — Error resilience tools – MPEG-4 resync. marker and data-partitioning with RVLC (fixed number of bits/macroblocks between macroblocks) – H.264/AVC FMO and ASO – H.263 slice structured mode – Bit-rate control (CBR and VBR) Pre/post rotation/mirroring — 8 rotation/mirroring modes for image to be encoded — 8 rotation/mirroring modes for image to be displayed Programmability — Embeds C and M proprietary 16-bit DSP processor that is dedicated to processing bitstream and driving the codec hardware — General purpose registers and interrupt for communication between internal host processor and Video Codec IP Performance — Up to full-duplex VGA 24 fps encoding/decoding — Up to half-duplex SD 30 fps encoding/decoding 1.2.10.2 enhanced Multimedia Accelerator Lite (eMMA_lt) The i.MX27 processor comes with an enhanced Multimedia Accelerator Lite (eMMA_lt), which comprises independent pre-processing and post-processing stages that provide exceptional image and video quality. The eMMA_lt represents a major breakthrough to solve the problem of high MIPS required for video encode and decode operations in mobile and wireless applications. Tight integration and memory pipelining coupled with AHB master mode operation ensure minimal system loading. To further offload the CPU, live video stream data enters the eMMA_lt module directly through an internal private data interface. The i.MX27 processor’s eMMA_lt features the following: • Enables simultaneous MPEG-4 Simple Profile (SP) video encoding and decoding • Supports real-time video decode in any of the following advanced formats: — MPEG-4 Simple Profile (SP) — H.264 • Provides video and image data pre/post-processing (resizing, color conversion, filtering) that is fully hardware accelerated The eMMA_lt architecture is shown in Figure 1-4. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-19 Introduction to the i.MX27 Multimedia Applications Processor IP bus IP bus Interface Post Pre- Processing Processing Sensor data From CSI Bus Arbitration AHB bus Figure 1-4. eMMA_lt Architecture 1.2.10.2.1 Image Pre-Processor (PrP) The image Pre-Processor block performs color space conversion and image resizing for the viewfinder display, and data formatting for the video encoder. It also performs color space conversions of the still image for input to either a hardware- or software-based video encoder or image compressor. The Pre-Processor has two media input and output paths and can accept input from system memory or from a private data bus connected to the CMOS Sensor Interface (CSI) module. The Pre-Processor can apply frame rate control on the live video stream from the CSI module to adjust for different processing load conditions. The Pre-Processor’s two output channels are used to output RGB data for display of the local camera view and to output image data for compression by the hardware encoder or a software encoder (still image or video encode). Figure 1-5 shows the image Pre-Processor. System Memory CMOS Sensor Interface Main Color Space Resize Conversion Second Resize Frame Compression 4:2:2,4:2:0, 4:4:4 or video encode RGB Display Viewfinder Buffer Buffer (RGB/YUV) YUV Pre-Processor Optional data paths using dumb CMOS sensors Figure 1-5. Pre-Processor Data Flow Pre-Processor features: • Data input: — System memory — Private DMA between CMOS Sensor Interface module and Pre-Processor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-20 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor • • • • • Data input formats: — Arbitrarily unpacked RGB input — YUV 4:2:2 (Interleaved) — YUV 4:2:0 (Planar) Input image size: 2044 × 2044 Image scaling: — Main resize ratio: 8:1–1:1 in integral steps, Horizontal 9:8/vertical 6:5 and Horizontal 9:8/Vertical 1:1 — Secondary resize ratio for viewfinder: 8:1–1:1 in integral steps Output data format: — RGB565 — YUV 4:2:2 (Interleaved) — YUV 4:2:0 (Planar) RGB data and one YUV data format can be generated concurrently 1.2.10.2.2 Post-Processor (PP) The Post-Processor performs Deblock, Dering, Image Resize, and Color Space Conversion (CSC) functions on the input image data. These functions provide flexibility to meet various RGB formats and YUV formats for display. In addition to working in tandem with the decoder sub-block in the eMMA_lt, the Post-Processor can also be used by software decoders (other than MPEG-4) to touch up the final output before display. The sub-blocks that perform Deblock, Dering, Resize, and CSC operations can be selectively bypassed through software configuration. Figure 1-6 shows the flow for video postprocessing. MPEG-4 Decoder Current/ Ref Post-Processor Frame Deblock Dering Image Color Resize Conversion RGB Display Buffer Current/ Ref Frame Figure 1-6. Post-Processor Post-Processor features: • Input data: — From system memory • Input format: — YUV 4:2:0 (Planar) • Output format: — YUV422 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-21 Introduction to the i.MX27 Multimedia Applications Processor • • — RGB444 — RGB565 — RGB666 — RGB888 (unpacked) Input Size: Maximum size of 2044 × 2044 Image Resize: — Upscaling ratios ranging from 1:1 to 1:4 in fractional steps — Downscaling ratios ranging from 1:1 to 2:1 in fractional steps and a fixed 4:1 — Ratios provide scaling between QCIF, CIF, QVGA (320 × 240) and QVGA (240 × 320) 1.2.10.3 Digital Audio Multiplexer (AUDMUX) The Digital Audio Multiplexer (AUDMUX) provides a programmable interconnect fabric for voice, audio, and synchronous data routing between the i.MX27 processor’s SSI modules and external SSI, audio, and voice codecs. The AUDMUX is designed so that resource configurations do not need to be hard-wired, but instead, can be shared in many different configurations. The AUDMUX interconnections allow multiple simultaneous separate audio/voice/data flows between the ports in a point-to-point or point-to-multipoint configuration(s). In a typical scenario, the AUDMUX and two SSI/I2S modules provide interfaces to the Serial Audio Port of the cellular baseband (BB), narrowband (NB), and wideband (WB) audio ports of the external audio AD/DA, and to the audio port of the Bluetooth wireless technology on-board peripheral. See Figure 1-7. Power Management IC Alert Tone i.MX27 i.MX31/i.MX31L Voice Notes NB Voice Notes Baseband IC Voice BB SSI2 SAP Port 2 Port44 Port Port 4 (External) (External) (External) Voice Codec BluetoothTM IC Voice Port55 Port Port 5 (External) (External) (External) Stereo DAC ADC/DAC Audio Blue tooth ADC/DAC Voice Port66 Port Port 6 (External) (External) (External) IO MUX Port 1 AUDMUX i.MX27 i.MX31/i.MX31L WB SSI1 MP3 MP3 Port77 Port Port 7 (External) (External) (External) Port 3 Option Voice Call Figure 1-7. Typical AUDMUX Application MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-22 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor 1.2.11 MultiMedia Interface The CMOS Sensor Interface (CSI) provides multimedia interfacing. 1.2.11.1 CMOS Sensor Interface (CSI) The CMOS Sensor Interface (CSI) is a logic interface that enables the i.MX27 device to connect directly to external CMOS sensors and a CCIR656 video source. The sensor port provides a connection to either one or two image sensors, of which only one sensor can be active at any given time. The sensor port supports a direct parallel interface to either CMOS or CCD sensor controllers using a parallel interface with widths of 12 bits, 10 bits, 8 bits, or 4 bits at data bus rates up to 60 MHz. The sensor port may be configured to perform outputs of a still image to a non-contiguous memory buffer, enabling efficient memory use under an open OS. The capabilities of the CSI include: • Configurable interface logic to support common available CMOS sensors in the market • Support traditional sensor timing interface • Support CCIR656 video interface, progressive mode for smart sensor, interlace mode for PAL and NTSC input • 8-bit input port for YCC, YUV, Bayer, or RGB data • 32 × 32 FIFO storing image data supporting core data read and DMA data burst transfer to system memory • Full control of 8-bit and 16-bit data to 32-bit FIFO packing • Direct interface to the eMMA_lt Pre-Processing block (PrP) • Single interrupt source to the interrupt controller from maskable sensor interrupt sources: Start of Frame, End of Frame, Change of Field, FIFO full • Configurable master clock frequency output to sensor • Asynchronous input logic design. Sensor master clock can be driven by either the i.MX27 processor or by an external clock source. • Statistic data generation for Auto Exposure (AE) and Auto White Balance (AWB) control of the camera (for Bayer data only) 1.2.12 Human Interface The i.MX27 processor can connect to a wide variety of popular display devices, such as: • RAM-less LCD panels—up to 40 Mpix/s (for example, SVGA @ 80 fps), 262k colors. Results are dependent on end application. • LCD panels with integrated frame buffer—up to 1024 × 1024, 14M colors. Results are dependent on end application. • Graphics accelerators • TV encoders MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-23 Introduction to the i.MX27 Multimedia Applications Processor The i.MX27 processor’s display ports enable simultaneous connectivity of up to two displays—an LCD without memory and a TV encoder—as well as provides connectivity to three interface types: • Synchronous parallel (18-bit) • Asynchronous parallel (18-bit) • Asynchronous Serial (SPI-like) at a bus rate of up to 100 MHz 1.2.12.1 Liquid Crystal Display Controller (LCDC) The Liquid Crystal Display Controller (LCDC) provides display data for external gray-scale or color LCD panels. The LCDC features include the following: • Software programmable screen size (up to 800 × 600) to support single (non-split) monochrome, color STN panels, and color TFT panels • Support for color depth for CSTN panels: 4- or 8-bit mapping from 256 × 18 table, 12-bit true color • Support for color depth for TFT panels: 4- or 8-bit mapping from 256 × 18 table, 16-bit/18-bit/24-bit true color • Up to 16 grey levels out of 16 palettes • Capable of directly driving popular LCD drivers from manufacturers including Motorola, Sharp, Hitachi, and Toshiba • Support for data bus width of 16-bit or 18-bit TFT panels • Support for the AUO panel in 16 bpp and 24 bpp pixel modes • Support for data bus widths of 8-bit, 4-bit, 2-bit, and 1-bit monochrome LCD panels • Direct interface to Sharp® 320 × 240 and 240 × 320 HR-TFT panels and other generic panels • Support for logical operation between color hardware cursor and background • LCD contrast control using 8-bit PWM • Support for self-refresh LCD modules • Hardware panning (soft horizontal scrolling) • Windowing support for one graphic or text overlay 1.2.12.2 Smart Liquid Crystal Display Controller (SLCDC) The Smart Liquid Crystal Display Controller (SLCDC) transparently and efficiently transfers image data from system memory to an external LCD controller. The SLCDC module contains a DMA controller that transfers image and control data from system memory to the SLCDC FIFO, where it is formatted and sent out to the external LCD controller. The SLCDC can be configured to write image data to an external LCD controller via a 4-line serial, 3-line serial, or 8- or 16-bit parallel interface. The SLCDC has two FIFOs where command and display data are loaded via DMA. The display data is tagged with commands that are used by the SLCDC to communicate display information and data to the Smart LCD panel. The command tagged data format of the SLCDC provides flexibility and ease of connection to existing and new smart LCD panels. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-24 Freescale Semiconductor Introduction to the i.MX27 Multimedia Applications Processor 1.2.12.3 Keypad Port (KPP) The Keypad Port (KPP) is used for key pad matrix scanning or as a general purpose I/O. This peripheral simplifies the software task of scanning a keypad matrix. Features include: • Up to 8 × 8 external key pad matrix support • Open drain design • Glitch suppression circuit prevents erroneous key detection • Multiple keys detection • Standby key press detection 1.2.13 Packaging Information The i.MX27 processor is offered in the 404 MAPBGA package option. This package brings out all the new interfaces, and supplies more flexible multiplexing. • • • Type: 0.65 mm pitch Dimensions: 17 mm × 17 mm Balls: 404 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 1-25 Introduction to the i.MX27 Multimedia Applications Processor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1-26 Freescale Semiconductor Chapter 2 System Memory and Register Map 2.1 Introduction This chapter provides the i.MX27 Multimedia Applications Processor’s memory maps and chip configuration registers. 2.2 Memory Space The i.MX27 Multimedia Applications Processor, with a 32-bit address bus, is capable of addressing a 4-Gbyte physical address space. This space is divided into sections of 512-Mbyte regions within which various memories and peripherals are mapped. Table 2-1 shows a simplified breakdown of the eight 512-Mbyte regions decoded within the 4-Gbyte address space. Table 2-1. 4 Gbyte Memory Map Breakdown Address 2.2.1 Size Usage 0x00000000 512 Mbyte ROM, Primary AHB Slaves, and Peripherals 0x20000000 512 Mbyte Reserved 0x40000000 512 Mbyte Reserved 0x60000000 512 Mbyte Reserved 0x80000000 512 Mbyte Secondary AHB Slave Port 1 0xA0000000 1 Gbyte Secondary AHB Slave Port 2 0xE0000000 512 Mbyte Primary AHB (RAM) Detailed Memory Map Figure 2-2 shows the memory space breakout view for the i.MX27 processor. The left-most column shows the eight 512-Mbyte regions. The middle column shows the breakout of primary and secondary AHB slaves, and the right-most column shows the breakout of the AIPI1 and AIPI2 address spaces. Table 2-2 through Table 2-5 show the detailed breakdown of the complete memory map according to the 512-Mbyte regions. Table 2-6 and Table 2-7 show the detailed breakdown of the AIPI1 and AIPI2 modules and the different IP peripherals accessed over the AIPI1 and AIPI2. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-1 System Memory and Register Map WB Audio Voice BT CE SSI 2 SSI 1 [16] IIM SLID RAM [12,13] SCC MU MU MU OWIRE CSPI 1 CSPI 2 CSPI 3 [14] [15] [23] [17] [9] IP Bus 2 [22] WDOG Interrupt [2] WDOG [21] GPIO GPIO KPP 8x8 Keypad MU MPLL MU IPMUX IP Bus 1 MU OSC32K MU IPMUX AUDMUX 2 1 0 Battery Ctl Pulse Width Mod. In/Out [8] OSC26M SPLL ARM926 PLATFORM AITC CLKCTL CRM Primary AHB ETM9 RTC IP bus ETM ARM926EJ-S D-$ D-AHB I-$ I-AHB LCDC SROUTER [1] FEC TMAX 10/100baseT PHY MSHC To CRM [19] [11] TCU [20] [30] JTAGC 64-bit TMAX [3] 0 1 2 3 4 5 6 7 UART1 [4] [10] SCC, CRM, SAHARA2 [11] IrDA SDHC1 MMC/SD Card SDHC2 MMC/SD Card SDHC3 MMC/SD Card PCMCIA PCMCIA/CF NFC NAND Flash WEIM NOR-Flash SDRAM ESDCTL (SDR and DDR) UART2 IIM [29] [8] UART3 I2C2 MU i.MX27 [12] IrDA M3IF IrDA/WLAN BB + RF Memory Stick MS/Pro EMI Video Codec USB2.0 Hard Drive MU TMAX LCD Display 2 ATA [24] MU TMAX [2] CSI MCU M2 Internal 45 Kbyte 24 Kbyte Memory RAM ROM [10] RTIC SLCDC 6x3 MAX m0 S0 m1 S1 m2 S2 m3 m4 m5 ARM926EJ-S Platform DMA Camera IP bus I-AHB Patch D-AHB Patch [6] I2C1 PAHBMUX ROMPATCH SAHARA2 LCD Display 1 JAM ABCD [5] [1] PWM [18] IP bus ETB [7] eMMA_lt [6] MCTL AIPI 1 AIPI 2 JTAG SYNC [7] USB ctl [13] MU IrDA UART4 [27] [28] [3] [4] [5] [25] [26] [31] UART 5 UART 6 GPT 1 GPT 2 GPT 3 GPT 4 GPT 5 GPT 6 MU MU IrDA IPC MU MU COLOR LEGEND MCU MemoryMapped Module Other Modules like test, PLLs or memories (all sizes in KByte) DMA LEGEND Module without DMA Module with internal DMA MU PAD-MUX LEGEND MU MUX MU MU Functional pad muxing with other peripherals in some modes Module with DMA-req to DMA Module with internal DMA and DMA-req to DMA Figure 2-1. Detailed Block Diagram for the i.MX27 Processor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-2 Freescale Semiconductor System Memory and Register Map NOTE Accesses to locations defined as Reserved (other than aliased RAM space) result in an AHB error response. Accesses to unimplemented locations within the AITC register spaces will be terminated, write accesses will have no effect, and read accesses will return all zeros. Table 2-2 shows the memory map of the Primary AHB address space in the first 512-Mbyte region. Table 2-2. Primary AHB Memory Map (Lower) Address Secondary AHB Slave Port 1 Size 0x0000 0000–0x0000 3FFF BROM 16 Kbyte 0x0000 4000–0x0040 3FFF Reserved 4 Mbyte 0x0040 4000–0x0040 5FFF BROM 8 Kbyte 0x0040 6000– 0x007F FFFF BROM (Hole) 3 Mbyte + 1000 Kbyte 0x0080 0000–0x0FFF FFFF Reserved 248 Mbyte 0x1000 0000–0x1001 FFFF AIPI1 128 Kbyte 0x1002 0000–0x1003 FFFF AIPI2 128 Kbyte 0x1004 0000–0x1004 0FFF AITC 4 Kbyte 0x1004 1000– 0x1004 1FFF ROM Patch 4 Kbyte 0x1004 2000–0x7FFF FFFF Reserved 255 Mbyte + 752 Kbyte Table 2-3 shows the memory map of the CSI and ATA modules when connected to the Secondary AHB Ports 1 via the ABCD. The BROM (hole) is split into two sections of 16 Kbytes and 8 Kbytes. The BROM (Hole) indicates that there is no BROM code present in this region. The AIPI1 and AIPI2 address space contains AIPI control registers and the IP slave registers. The AIPI1 and AIPI2 maps are shown in Table 2-6 and Table 2-7, respectively. Table 2-3. Secondary AHB Port 1 Memory Map Address Secondary AHB Port 1 Size 0x8000 0000–0x8000 0FFF CSI 4 Kbyte 0x8000 1000–0x8000 1FFF ATA 4 Kbyte 0x8000 2000–0x9FFF FFFF Reserved 512 Mbyte–8 Kbyte MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-3 System Memory and Register Map Figure 2-2 shows the i.MX27 processor’s physical memory map (4 Gbytes). Base Address 0x1002 0000 0x1002 0FFF 16 Kbyte 0x0000 0000 0x1000 0000 BROM 0x0000 3FFF 128 Kbyte 0x1000 0000 0x1000 1000 AIPI1 4 Mbyte 0x1000 0FFF 0x1000 1FFF 0x0000 4000 0x1000 2000 Reserved 0x0040 3FFF 0x1001 FFFF 0x1002 0000 4 Mbyte 16 Kbyte 0x0040 4000 0x1003 1FFF 0x1004 0000 BROM 0x007F FFFF 248 Mbyte 0x0080 0000 Reserved 0x1004 0FFF 0x1004 1000 0x1004 1FFF 128 Kbyte 72 K byte AIPI2 Reserved 36 K 20 K byte AITC 0x1000 2FFF 0x1000 3000 0x1000 3FFF 0x1000 4000 4 Kbyte 0x1000 4FFF 0x1000 5000 4 Kbyte 0x1000 5FFF 0x1000 6000 ROM Patch 0x1000 6FFF 0x1000 7000 0x0FFF FFFF 0x1000 7FFF 264 Kbyte 0x1000 0000 0x1000 8000 Internal Registers 0x1000 8FFF 0x1000 9000 0x1004 1FFF 0x1000 9FFF 0x1004 2000 0x1000 A000 256 Mbyte - Reserved 280 Kbyte 256 Mbyte 0xA000 0000 0x1000 B000 CSD0 (SDRAM) active low 0x1FFF FFFF 0xAFFF FFFF 0xB000 0000 0x2000 0000 0x1000 BFFF 0x1000 C000 256 Mbyte 0x1000 DFFF 0x1000 E000 128 Mbyte Reserved 0xC7FF FFFF 0xC800 0000 0x1000 FFFF 0x1001 0000 128 Mbyte CS1 (Flash) active low 0x1001 1FFF 0x1001 2000 32 Mbyte 0xD1FF FFFF 0xD200 0000 0x8000 0000 0x9FFF FFFF 0xA000 0000 CSI (4KB) ATA(4KB) Reserved External Memory (960 Mbyte) 0xDFFF FFFF 0x1001 4000 32 Mbyte 0x1001 5FFF 0x1001 6000 32 Mbyte CS4 (Spare) active low 0x1001 7FFF 0x1001 8000 32 Mbyte 511 Mbyte 0xE000 0000 0x1001 9FFF 0x1001 A000 64 Mbyte 979 Kbyte 0xFFFF 4BFF 0xFFFF 4C00 0xFFFF FFFF Reserved VRAM (45 Kbyte) 0xDBFF FFFF 0xDC00 0000 0x1001 BFFF 0x1001 C000 Reserved 64 Mbyte 0x1001 CFFF 0x1001 D000 45 Kbyte PCMCIA/CF 0xDFFF FFFF 0x1001 AFFF 0x1001 B000 EMI Modules 5X4 KByte Reserved 0xFFEF FFFF 0xFFF0 0000 0x1001 8FFF 0x1001 9000 CS5 (Spare) active low 0xD7FF FFFF 0xD800 0000 0x1001 6FFF 0x1001 7000 0xD5FF FFFF 0xD600 0000 Reserved 0x1001 4FFF 0x1001 5000 0xD3FF FFFF 0xD400 0000 Reserved EMI (20 Kbyte) 0x1001 3FFF CS3 (Spare) active low 1 Gbyte 0x1001 2FFF 0x1001 3000 CS2 (Ext SRAM) active low 512 Mbyte 0x1001 0FFF 0x1001 1000 0xCFFF FFFF 0xD000 0000 0x7FFF FFFF 0x1000 EFFF 0x1000 F000 CS0 (Flash) active low 1536MB 0x1000 CFFF 0x1000 D000 CSD1 (SDRAM) active low 0xBFFF FFFF 0xC000 0000 0x1000 AFFF 0x1001 DFFF 0x1001 E000 0x1001 EFFF 0x1001 F000 0x1001 FFFF 0x1002 1000 AIPI1 AIPI2 DMA LCDC WDOG SLCDC GPT1 H.264 GPT2 USB2.0 GPT3 SAHARA2 PWM eMMA_lt RTC CRM KPP IIM OWIRE Reserved UART1 RTIC UART2 FEC UART3 SCC UART4 SCC CSPI1 Reserved CSPI2 Reserved SSI1 Reserved SSI2 Reserved I2C1 Reserved SDHC1 Reserved SDHC2 Reserved GPIO Reserved 0x1002 1FFF 0x1002 2000 0x1002 2FFF 0x1002 3000 0x1002 3FFF 0x1002 4000 0x1002 4FFF 0x1002 5000 0x1002 5FFF 0x1002 6000 0x1002 6FFF 0x1002 7000 0x1002 7FFF 0x1002 8000 0x1002 8FFF 0x1002 9000 0x1002 9FFF 0x1002 A000 0x1002 AFFF 0x1002 B000 0x1002 BFFF 0x1002 C000 0x1002 CFFF 0x1002 D000 0x1002 DFFF 0x1002 E000 0x1002 EFFF 0x1002 F000 0x1002 FFFF 0x1003 0000 0x1003 0FFF 0x1003 1000 0x1003 1FFF 0x1003 2000 0x1003 2FFF 0x1003 3000 0x1003 3FFF 0x1003 4000 0x1003 4FFF 0x1003 5000 0x1003 5FFF 0x1003 6000 0x1003 6FFF 0x1003 7000 AUDMUX Reserved 0x1003 7FFF 0x1003 8000 CSPI3 Reserved MSHC Reserved GPT4 Reserved GPT5 Reserved UART5 ETB Regs UART6 ETB RAM 0x1003 8FFF 0x1003 9000 0x1003 9FFF 0x1003 A000 0x1003 AFFF 0x1003 B000 0x1003 BFFF 0x1003 C000 0x1003 CFFF 0x1003 D000 0x1003 DFFF 0x1003 E000 I2C2 CS5 ETB RAM (Spare) active SDHC3 low JAM GPT6 0x1003 EFFF 0x1003 F000 0x1003 FFFF MAX MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-4 Freescale Semiconductor System Memory and Register Map Figure 2-2. i.MX27 Processor’s Physical Memory Map (4 Gbytes) Table 2-4 shows the memory map breakdown for the Secondary AHB Port 3. The SDRAMC, WEIM, PCMCIA, and NFC module control registers and external memory are addressed via this region. The external memory regions (memory or external peripherals) are accessed via the respective chip selects. CSD1 and CSD0 are SDRAMC chip selects, and CS5 to CS0 are WEIM chip selects. CSD1 and CS0 chip select spaces are available for external boot. 0xBC000 0000 to 0xDFFF_FFFF is allocated for PCMCIA IO and memory space. Table 2-4. Secondary AHB Port 2 Memory Map Address Secondary AHB Port 3 Size 0xA000 0000–0xAFFF FFFF External SDRAM/MDDR (CSD0) 256 Mbyte 0xB000 0000–0xBFFF FFFF External SDRAM/MDDR (CSD1) 256 Mbyte 0xC000 0000–0xC7FF FFFF WEIM External Memory (CS0) 128 Mbyte 0xC800 0000–0xCFFF FFFF WEIM External Memory (CS1) 128 Mbyte 0xD000 0000–0xD1FF FFFF WEIM External Memory (CS2) 32 Mbyte 0xD200 0000–0xD3FF FFFF WEIM External Memory (CS3) 32 Mbyte 0xD400 0000–0xD5FF FFFF WEIM External Memory (CS4) 32 Mbyte 0xD600 0000–0xD7FF FFFF WEIM External Memory (CS5) 32 Mbyte 0xD800 0000–0xD800 0FFF NFC registers and internal RAM 4 Kbyte 0xD800 1000–0xD800 1FFF SDRAMC registers 4 Kbyte 0xD800 2000–0xD800 2FFF WEIM registers 4 Kbyte 0xD800 3000–0xD800 3FFF M3IF registers 4 Kbyte 0xD800 4000–0xD800 4FFF PCMCIA registers 4 Kbyte 0xD800 5000–0xDBFF FFFF Reserved 64 Mbyte–20 Kbyte 0xDC00 0000–0xDFFF FFFF PCMCIA Memory Space 64 Mbyte Table 2-5 shows the last region of address space that is part of the Primary AHB Memory Map. The Vector-RAM is mapped into this region and the i.MX27 device uses the high memory (0xFFFF FF00–0xFFFF FFFF) to store the interrupt vector table (64 words). This region is aliased on a 128-Kbyte boundary. Table 2-5. Primary AHB Memory Map (Upper) Address Primary AHB Size 0xE000 0000–0xFFEF FFFF Reserved (aliased) 511 Mbyte 0xFFF0 0000–0xFFFF 4BFF VRAM Space Not Use 979 Kbyte 0xFFFF 4C00–0xFFFF FFFF 45 Kbyte VRAM 45 Kbyte MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-5 System Memory and Register Map Table 2-6 and Table 2-7 show the detailed breakdown of the address space controlled by AIPI1 and AIPI2. More details on the AIPI can be found in Chapter 35, “AHB-Lite IP Interface (AIPI) Module.” Table 2-6. AIPI1 Memory Map Address AIPI1 Memory Map Size 0 0x1000 0000–0x1000 0FFF AIPI1 (slot 0) 4 Kbytes 1 0x1000 1000–0x1000 1FFF DMA 4 Kbytes 2 0x1000 2000–0x1000 2FFF WDOG 4 Kbytes 3 0x1000 3000–0x1000 3FFF GPT1 4 Kbytes 4 0x1000 4000–0x1000 4FFF GPT2 4 Kbytes 5 0x1000 5000–0x1000 5FFF GPT3 4 Kbytes 6 0x1000 6000–0x1000 6FFF PWM 4 Kbytes 7 0x1000 7000–0x1000 7FFF RTC 4 Kbytes 8 0x1000 8000–0x1000 8FFF KPP 4 Kbytes 9 0x1000 9000–0x1000 9FFF OWIRE 4 Kbytes 10 0x1000 A000–0x1000 AFFF UART1 4 Kbytes 11 0x1000 B000–0x1000 BFFF UART2 4 Kbytes 12 0x1000 C000–0x1000 CFFF UART3 4 Kbytes 13 0x1000 D000–0x1000 DFFF UART4 4 Kbytes 14 0x1000 E000–0x1000 EFFF CSPI1 4 Kbytes 15 0x1000 F000–0x1000 FFFF CSPI2 4 Kbytes 16 0x1001 0000–0x1001 0FFF SSI1 4 Kbytes 17 0x1001 1000–0x1001 1FFF SSI2 4 Kbytes 18 0x1001 2000–0x1001 2FFF I2C1 4 Kbytes 19 0x1001 3000–0x1001 3FFF SDHC1 4 Kbytes 20 0x1001 4000–0x1001 4FFF SDHC2 4 Kbytes 21 0x1001 5000–0x1001 5FFF GPIO 4 Kbytes 22 0x1001 6000–0x1001 6FFF AUDMUX 4 Kbytes 23 0x1001 7000–0x1001 7FFF CSPI3 4 Kbytes 24 0x1001 8000–0x1001 8FFF MSHC 4 Kbytes 25 0x1001 9000–0x1001 9FFF GPT4 4 Kbytes 26 0x1001 A000–0x1001 AFFF GPT5 4 Kbytes 27 0x1001 B000–0x1001 BFFF UART5 4 Kbytes 28 0x1001 C000–0x1001 CFFF UART6 4 Kbytes 29 0x1001 D000–0x1001 DFFF I2C2 4 Kbytes MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-6 Freescale Semiconductor System Memory and Register Map Table 2-6. AIPI1 Memory Map (continued) Address AIPI1 Memory Map Size 30 0x1001 E000–0x1001 EFFF SDHC3 4 Kbytes 31 0x1001 F000–0x1001 FFFF GPT6 4 Kbytes Table 2-7. AIPI2 Memory Map 2.3 Address AIPI2 Memory Map Size 0 0x1002 0000–0x1002 0FFF AIPI2 (Slot 0) 4 Kbytes 1 0x1002 1000–0x1002 1FFF LCDC 4 Kbytes 2 0x1002 2000–0x1002 2FFF SLCDC 4 Kbytes 3 0x1002 3000–0x1002 3FFF Reserved 4 Kbytes 4 0x1002 4000–0x1002 4FFF USB2.0 4 Kbytes 5 0x1002 5000–0x1002 5FFF SAHARA2 4 Kbytes 6 0x1002 6000–0x1002 6FFF eMMA_lt 4 Kbytes 7 0x1002 7000–0x1002 7FFF CRM 4 Kbytes 8 0x1002 8000–0x1002 8FFF IIM 4 Kbytes 9 0x1002 9000–0x1002 9FFF Reserved 4 Kbytes 10 0x1002 A000–0x1002 AFFF RTIC 4 Kbyte 11 0x1002 B000–0x1002 BFFF FEC 4 Kbyte 12 0x1002 C000–0x1002 CFFF SCC 4 Kbyte 13 0x1002 D000–0x1002 DFFF SCC 4 Kbyte 14–26 0x1002 E000–0x1003 AFFF Reserved (slots 14–26) 52 Kbytes 27 0x1003 B000–0x1003 BFFF ETB Regs 4 Kbytes 28 0x1003 C000–0x1003 CFFF ETB RAM 4 Kbytes 29 0x1003 D000–0x1003 DFFF ETB RAM 4 Kbytes 30 0x1003 E000–0x1003 EFFF JAM 4 Kbytes 31 0x1003 F000–0x1003 FFFF MAX 4 Kbytes Register Map The internal registers in the i.MX27 processor are listed in Table 2-8. Table 2-8. Register Map Module Name Address Register Name Description AIPI1 0x1000 0000 PSR0 Peripheral Size Register 0 AIPI1 0x1000 0004 PSR1 Peripheral Size Register 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-7 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description AIPI1 0x1000 0008 PAR AIPI1 0x1000 000C AAOR DMAC 0x1000 1000 DCR DMA Control Register DMAC 0x1000 1004 DISR DMA Interrupt Status Register DMAC 0x1000 1008 DIMR DMA Interrupt Mask Register DMAC 0x1000 100C DBTOSR DMA Burst Time-Out Status Register DMAC 0x1000 1010 DRTOSR DMA Request Time-Out Status Register DMAC 0x1000 1014 DSESR DMA Transfer Error Status Register DMAC 0x1000 1018 DBOSR DMA Buffer Overflow Status Register DMAC 0x1000 101C DBTOCR DMA Burst Time-Out Control Register DMAC 0x1000 1040 WSRA W-Size Register A DMAC 0x1000 1044 XSRA X-Size Register A DMAC 0x1000 1048 YSRA Y-Size Register A DMAC 0x1000 104C WSRB W-Size Register B DMAC 0x1000 1050 XSRB X-Size Register B DMAC 0x1000 1054 YSRB Y-Size Register B DMAC 0x1000 1080 SAR0 Channel 0 Source Address Register DMAC 0x1000 1084 DAR0 Channel 0 Destination Address Register DMAC 0x1000 1088 CNTR0 Channel 0 Count Register DMAC 0x1000 108C CCR0 Channel 0 Control Register DMAC 0x1000 1090 RSSR0 DMAC 0x1000 1094 BLR0 DMAC 0x1000 1098 RTOR0 BUCR0 Channel 0 Request Time-Out Register Channel 0 Bus Utilization Control Register DMAC 0x1000 109C CCNR0 Channel 0 Channel Counter Register DMAC 0x1000 10C0 SAR1 Channel 1 Source Address Register DMAC 0x1000 10C4 DAR1 Channel 1 Destination Address Register DMAC 0x1000 10C8 CNTR1 Channel 1 Count Register DMAC 0x1000 10CC CCR1 Channel 1 Control Register DMAC 0x1000 10D0 RSSR1 DMAC 0x1000 10D4 BLR1 DMAC 0x1000 10D8 RTOR1 BUCR1 Peripheral Access Register Atomic Access Only Register Channel 0 Request Source Select Register Channel 0 Burst Length Register Channel 1 Request Source Select Register Channel 1 Burst Length Register Channel 1 Request Time-Out Register Channel 1 Bus Utilization Control Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-8 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description DMAC 0x1000 10DC CCNR1 Channel 1 Channel Counter Register DMAC 0x1000 1100 SAR2 Channel 2 Source Address Register DMAC 0x1000 1104 DAR2 Channel 2 Destination Address Register DMAC 0x1000 1108 CNTR2 Channel 2 Count Register DMAC 0x1000 110C CCR2 Channel 2 Control Register DMAC 0x1000 1110 RSSR2 DMAC 0x1000 1114 BLR2 DMAC 0x1000 1118 RTOR2 BUCR2 Channel 2 Request Time-Out Register Channel 2 Bus Utilization Control Register DMAC 0x1000 111C CCNR2 Channel 2 Channel Counter Register DMAC 0x1000 1140 SAR3 Channel 3 Source Address Register DMAC 0x1000 1144 DAR3 Channel 3 Destination Address Register DMAC 0x1000 1148 CNTR3 Channel 3 Count Register DMAC 0x1000 114C CCR3 Channel 3 Control Register DMAC 0x1000 1150 RSSR3 DMAC 0x1000 1154 BLR3 DMAC 0x1000 1158 RTOR3 BUCR3 Channel 3 Request Time-Out Register Channel 3 Bus Utilization Control Register DMAC 0x1000 115C CCNR3 Channel 3 Channel Counter Register DMAC 0x1000 1180 SAR4 Channel 4 Source Address Register DMAC 0x1000 1184 DAR4 Channel 4 Destination Address Register DMAC 0x1000 1188 CNTR4 Channel 4 Count Register DMAC 0x1000 118C CCR4 Channel 4 Control Register DMAC 0x1000 1190 RSSR4 DMAC 0x1000 1194 BLR4 DMAC 0x1000 1198 RTOR4 BUCR4 Channel 4 Request Time-Out Register Channel 4 Bus Utilization Control Register DMAC 0x1000 119C CCNR 4 Channel 4 Channel Counter Register DMAC 0x1000 11C0 SAR5 Channel 5 Source Address Register DMAC 0x1000 11C4 DAR5 Channel 5 Destination Address Register DMAC 0x1000 11C8 CNTR5 Channel 5 Count Register DMAC 0x1000 11CC CCR5 Channel 5 Control Register DMAC 0x1000 11D0 RSSR5 DMAC 0x1000 11D4 BLR5 Channel 2 Request Source Select Register Channel 2 Burst Length Register Channel 3 Request Source Select Register Channel 3 Burst Length Register Channel 4 Request Source Select Register Channel 4 Burst Length Register Channel 5 Request Source Select Register Channel 5 Burst Length Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-9 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description DMAC 0x1000 11D8 RTOR5 BUCR5 Channel 5 Request Time-Out Register Channel 5 Bus Utilization Control Register DMAC 0x1000 11DC CCNR5 Channel 5 Channel Counter Register DMAC 0x1000 1200 SAR6 Channel 6 Source Address Register DMAC 0x1000 1204 DAR6 Channel 6 Destination Address Register DMAC 0x1000 1208 CNTR6 Channel 6 Count Register DMAC 0x1000 120C CCR6 Channel 6 Control Register DMAC 0x1000 1210 RSSR6 DMAC 0x1000 1214 BLR6 DMAC 0x1000 1218 RTOR6 BUCR6 Channel 6 Request Time-Out Register Channel 6 Bus Utilization Control Register DMAC 0x1000 121C CCNR6 Channel 6 Channel Counter Register DMAC 0x1000 1240 SAR7 Channel 7 Source Address Register DMAC 0x1000 1244 DAR7 Channel 7 Destination Address Register DMAC 0x1000 1248 CNTR7 Channel 7 Count Register DMAC 0x1000 124C CCR7 Channel 7 Control Register DMAC 0x1000 1250 RSSR7 DMAC 0x1000 1254 BLR7 DMAC 0x1000 1258 RTOR7 BUCR7 Channel 7 Request Time-Out Register Channel 7 Bus Utilization Control Register DMAC 0x1000 125C CCNR7 Channel 7 Channel Counter Register DMAC 0x1000 1280 SAR8 Channel 8 Source Address Register DMAC 0x1000 1284 DAR8 Channel 8 Destination Address Register DMAC 0x1000 1288 CNTR8 Channel 8 Count Register DMAC 0x1000 128C CCR8 Channel 8 Control Register DMAC 0x1000 1290 RSSR8 DMAC 0x1000 1294 BLR8 DMAC 0x1000 1298 RTOR8 BUCR8 Channel 8 Request Time-Out Register Channel 8 Bus Utilization Control Register DMAC 0x1000 129C CCNR8 Channel 8 Channel Counter Register DMAC 0x1000 12C0 SAR9 Channel 9 Source Address Register DMAC 0x1000 12C4 DAR9 Channel 9 Destination Address Register DMAC 0x1000 12C8 CNTR9 Channel 9 Count Register DMAC 0x1000 12CC CCR9 Channel 9 Control Register Channel 6 Request Source Select Register Channel 6 Burst Length Register Channel 7 Request Source Select Register Channel 7 Burst Length Register Channel 8 Request Source Select Register Channel 8 Burst Length Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-10 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description DMAC 0x1000 12D0 RSSR9 DMAC 0x1000 12D4 BLR9 DMAC 0x1000 12D8 RTOR9 BUCR9 Channel 9 Request Time-Out Register Channel 9 Bus Utilization Control Register DMAC 0x1000 12DC CCNR9 Channel 9 Channel Counter Register DMAC 0x1000 1300 SAR10 Channel 10 Source Address Register DMAC 0x1000 1304 DAR10 Channel 10 Destination Address Register DMAC 0x1000 1308 CNTR10 Channel 10 Count Register DMAC 0x1000 130C CCR10 Channel 10 Control Register DMAC 0x1000 1310 RSSR10 DMAC 0x1000 1314 BLR10 DMAC 0x1000 1318 RTOR10 BUCR10 Channel 10 Request Time-Out Register Channel 10 Bus Utilization Control Register DMAC 0x1000 131C CCNR10 Channel 10 Channel Counter Register DMAC 0x1000 1340 SAR11 Channel 11 Source Address Register DMAC 0x1000 1344 DAR11 Channel 11 Destination Address Register DMAC 0x1000 1348 CNTR11 Channel 11 Count Register DMAC 0x1000 134C CCR11 Channel 11 Control Register DMAC 0x1000 1350 RSSR11 Channel 11 Request Source Select Register DMAC 0x1000 1354 BLR11 DMAC 0x1000 1358 RTOR11 BUCR11 Channel 11 Request Time-Out Register Channel 11 Bus Utilization Control Register DMAC 0x1000 135C CCNR11 Channel 11 Channel Counter Register DMAC 0x1000 1380 SAR12 Channel 12 Source Address Register DMAC 0x1000 1384 DAR12 Channel 12 Destination Address Register DMAC 0x1000 1388 CNTR12 Channel 12 Count Register DMAC 0x1000 138C CCR12 Channel 12 Control Register DMAC 0x1000 1390 RSSR12 Channel 12 Request Source Select Register DMAC 0x1000 1394 BLR12 DMAC 0x1000 1398 RTOR12 BUCR12 Channel 12 Request Time-Out Register Channel 12 Bus Utilization Control Register DMAC 0x1000 139C CCNR12 Channel 14 Channel Counter Register DMAC 0x1000 13C0 SAR13 Channel 13 Source Address Register DMAC 0x1000 13C4 DAR13 Channel 13 Destination Address Register Channel 9 Request Source Select Register Channel 9 Burst Length Register Channel 10 Request Source Select Register Channel 10 Burst Length Register Channel 11 Burst Length Register Channel 12 Burst Length Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-11 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description DMAC 0x1000 13C8 CNTR13 Channel 13 Count Register DMAC 0x1000 13CC CCR13 Channel 13 Control Register DMAC 0x1000 13D0 RSSR13 Channel 13 Request Source Select Register DMAC 0x1000 13D4 BLR13 DMAC 0x1000 13D8 RTOR13 BUCR13 Channel 13 Request Time-Out Register Channel 13 Bus Utilization Control Register DMAC 0x1000 13DC CCNR13 Channel 13 Channel Counter Register DMAC 0x1000 1400 SAR14 Channel 14 Source Address Register DMAC 0x1000 1404 DAR14 Channel 14 Destination Address Register DMAC 0x1000 1408 CNTR14 Channel 14 Count Register DMAC 0x1000 140C CCR14 Channel 14 Control Register DMAC 0x1000 1410 RSSR14 Channel 14 Request Source Select Register DMAC 0x1000 1414 BLR14 DMAC 0x1000 1418 RTOR14 BUCR14 Channel 14 Request Time-Out Register Channel 14 Bus Utilization Control Register DMAC 0x1000 141C CCNR14 Channel 14 Channel Counter Register DMAC 0x1000 1440 SAR15 Channel 15 Source Address Register DMAC 0x1000 1444 DAR15 Channel 15 Destination Address Register DMAC 0x1000 1448 CNTR15 Channel 15 Count Register DMAC 0x1000 144C CCR15 Channel 15 Control Register DMAC 0x1000 1450 RSSR15 Channel 15 Request Source Select Register DMAC 0x1000 1454 BLR15 DMAC 0x1000 1458 RTOR15 BUCR15 Channel 15 Request Time-Out Register Channel 15 Bus Utilization Control Register DMAC 0x1000 145C CCNR15 Channel 15 Channel Counter Register DMAC 0x1000 1480 TCR Test Control Register DMAC 0x1000 1484 TFIFOAR Test FIFO A Register DMAC 0x1000 148C TDIPR DMAC 0x1000 1490 TFIFOBR Test FIFO B Register DMAC 0x1000 1498 TDRR_L Low 32 DMA Request Register DMAC 0x1000 149C TDRR_H High 32 DMA Request Register WDOG 0x1000 2000 WCR Watchdog Control Register WDOG 0x1000 2002 WSR Watchdog Service Register WDOG 0x1000 2004 WRSR Channel 13 Burst Length Register Channel 14 Burst Length Register Channel 15 Burst Length Register Test DMA In Progress Register Watchdog Reset Status Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-12 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description GPT1 0x1000 3000 TCTL1 GPT1 0x1000 3004 TPRER1 GPT Prescaler Register 1 GPT1 0x1000 3008 TCMP1 GPT Compare Register 1 GPT1 0x1000 300C TCR1 GPT Capture Register 1 GPT1 0x1000 3010 TCN1 GPT Counter Register 1 GPT1 0x1000 3014 TSTAT1 GPT Status Register 1 GPT2 0x1000 4000 TCTL2 GPT Control Register 2 GPT2 0x1000 4004 TPRER2 GPT Prescaler Register 2 GPT2 0x1000 4008 TCMP2 GPT Compare Register 2 GPT2 0x1000 400C TCR2 GPT Capture Register 2 GPT2 0x1000 4010 TCN2 GPT Counter Register 2 GPT2 0x1000 4014 TSTAT2 GPT Status Register 2 GPT3 0x1000 5000 TCTL3 GPT Control Register 3 GPT3 0x1000 5004 TPRER3 GPT Prescaler Register 3 GPT3 0x1000 5008 TCMP3 GPT Compare Register 3 GPT3 0x1000 500C TCR3 GPT Capture Register 3 GPT3 0x1000 5010 TCN3 GPT Counter Register 3 GPT3 0x1000 5014 TSTAT3 GPT Status Register 3 PWM 0x1000 6000 PWMCR PWM Control Register PWM 0x1000 6004 PWMSR PWM Status Register PWM 0x1000 6008 PWMIR PWM Interrupt Register PWM 0x1000 600C PWMSAR PWM Sample Register PWM 0x1000 6010 PWMPR PWM Period Register PWM 0x1000 6014 PWMCNR PWM Counter Register RTC 0x1000 7000 HOURMIN RTC Hours and Minutes Counter Register RTC 0x1000 7004 SECONDS RTC Seconds Counter Register RTC 0x1000 7008 ALRM_HM RTC Hours and Minutes Alarm Register RTC 0x1000 700C ALRM_SEC RTC Seconds Alarm Register RTC 0x1000 7010 RCCTL RTC Control Register RTC 0x1000 7014 RTCISR RTC Interrupt Status Register RTC 0x1000 7018 RTCIENR RTC Interrupt Enable Register RTC 0x1000 701C STPWCH Stopwatch Minutes Register RTC 0x1000 7020 DAYR RTC Days Counter Register GPT Control Register 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-13 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description RTC 0x1000 7024 DAYALARM RTC Day Alarm Register KPP 0x1000_8000 KPCR Keypad Control Register KPP 0x1000_8002 KPSR Keypad Status Register KPP 0x1000_8004 KDDR Keypad Data Direction Register KPP 0x1000_8006 KPDR Keypad Data Register O-Wire 0x1000 9000 CONTROL O-Wire 0x1000 9002 TIME_DIVIDER O-Wire 0x1000 9004 RESET 1-Wire Reset Register UART1 0x1000_A000 UXRD_1 UART1 Receiver Register UART1 0x1000_A040 UTXD_1 UART1 Transmitter Register UART1 0x1000_A080 UCR1_1 UART1 Control Register UART1 0x1000_A084 UCR2_1 UART1 Control Register 2 UART1 0x1000_A088 UCR3_1 UART1 Control Register 3 UART1 0x1000_A08C UCR4_1 UART1 Control Register 4 UART1 0x1000_A090 UFCR_1 UART1 FIFO Control Register UART1 0x1000_A094 USR1_1 UART1 Status Register 1 UART1 0x1000_A098 USR2_1 UART1 Status Register 2 UART1 0x1000_A09C UESC_1 UART1 Escape Character Register UART1 0x1000_A0A0 UTIM_1 UART1 Escape Timer Register UART1 0x1000_A0A4 UBIR_1 UART1 BRM Incremental Register UART1 0x1000_A0A8 UBMR_1 UART1 BRM Modulator Register UART1 0x1000_A0AC UBRC_1 UART1 Baud Rate Count Register UART1 0x1000_A0B0 ONEMS_1 UART1 One Millisecond Register UART1 0x1000_A0B4 UTS_1 UART2 0x1000_B000 UXRD_2 UART2 Receiver Register UART2 0x1000_B040 UTXD_2 UART2 Transmitter Register UART2 0x1000_B080 UCR1_2 UART2 Control Register UART2 0x1000_B084 UCR2_2 UART2 Control Register 2 UART2 0x1000_B088 UCR3_2 UART2 Control Register 3 UART2 0x1000_B08C UCR4_2 UART2 Control Register 4 UART2 0x1000_B090 UFCR_2 UART2 FIFO Control Register UART2 0x1000_B094 USR1_2 UART2 Status Register 1 UART2 0x1000_B098 USR2_2 UART2 Status Register 2 1-Wire Control Register 1-Wire Time Divider Register UART1 Test Register 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-14 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description UART2 0x1000_B09C UESC_2 UART2 Escape Character Register UART2 0x1000_B0A0 UTIM_2 UART2 Escape Timer Register UART2 0x1000_B0A4 UBIR_2 UART2 BRM Incremental Register UART2 0x1000_B0A8 UBMR_2 UART2 BRM Modulator Register UART2 0x1000_B0AC UBRC_2 UART2 Baud Rate Count Register UART2 0x1000_B0B0 ONEMS_2 UART2 One Millisecond Register UART2 0x1000_B0B4 UTS_2 UART3 0x1000_C000 UXRD_3 UART3 Receiver Register UART3 0x1000_C040 UTXD_3 UART3 Transmitter Register UART3 0x1000_C080 UCR1_3 UART3 Control Register UART3 0x1000_C084 UCR2_3 UART3 Control Register 2 UART3 0x1000_C088 UCR3_3 UART3 Control Register 3 UART3 0x1000_C08C UCR4_3 UART3 Control Register 4 UART3 0x1000_C090 UFCR_3 UART3 FIFO Control Register UART3 0x1000_C094 USR1_3 UART3 Status Register 1 UART3 0x1000_C098 USR2_3 UART3 Status Register 2 UART3 0x1000_C09C UESC_3 UART3 Escape Character Register UART3 0x1000_C0A0 UTIM_3 UART3 Escape Timer Register UART3 0x1000_C0A4 UBIR_3 UART3 BRM Incremental Register UART3 0x1000_C0A8 UBMR_3 UART3 BRM Modulator Register UART3 0x1000_C0AC UBRC_3 UART3 Baud Rate Count Register UART3 0x1000_C0B0 ONEMS_3 UART3 One Millisecond Register UART3 0x1000_C0B4 UTS_3 UART4 0x1000_D000 UXRD_4 UART4 Receiver Register UART4 0x1000_D040 UTXD_4 UART4 Transmitter Register UART4 0x1000_D080 UCR1_4 UART4 Control Register UART4 0x1000_D084 UCR2_4 UART4 Control Register 2 UART4 0x1000_D088 UCR3_4 UART4 Control Register 3 UART4 0x1000_D08C UCR4_4 UART4 Control Register 4 UART4 0x1000_D090 UFCR_4 UART4 FIFO Control Register UART4 0x1000_D094 USR1_4 UART4 Status Register 1 UART4 0x1000_D098 USR2_4 UART4 Status Register 2 UART4 0x1000_D09C UESC_4 UART4 Escape Character Register UART2 Test Register 1 UART3 Test Register 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-15 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description UART4 0x1000_D0A0 UTIM_4 UART4 Escape Timer Register UART4 0x1000_D0A4 UBIR_4 UART4 BRM Incremental Register UART4 0x1000_D0A8 UBMR_4 UART4 BRM Modulator Register UART4 0x1000_D0AC UBRC_4 UART4 Baud Rate Count Register UART4 0x1000_D0B0 ONEMS_4 UART4 One Millisecond Register UART4 0x1000_D0B4 UTS_4 CSPI1 0x1000 E000 RXDATA1 Receive Data Register 1 CSPI1 0x1000 E004 TXDATA1 Transmit Data Register 1 CSPI1 0x1000 E008 CONTROL_REG1 CSPI Control Register 1 CSPI1 0x1000 E00C INT_REG1 Interrupt Control/Status Register 1 CSPI1 0x1000 E010 TEST_REG CSPI Test Register 1 CSPI1 0x1000 E014 PERIOD1 CSPI1 0x1000 E018 CSPI_DMA1 CSPI1 0x1000 E01C CSPI_RESET1 CSPI2 0x1000 F000 RXDATA2 Receive Data Register 2 CSPI2 0x1000 F004 TXDATA2 Transmit Data Register 2 CSPI2 0x1000 F008 CONTROL_REG2 CSPI Control Register 2 CSPI2 0x1000 F00C INT_REG2 CSPI2 0x1000 F010 TEST_REG 2 CSPI2 0x1000 F014 PERIOD2 CSPI2 0x1000 F018 CSPI_DMA2 CSPI2 0x1000 F01C CSPI_RESET2 SSI 1 0x1001 0000 STX0 SSI Transmit Data Register 0 SSI 1 0x1001 0004 STX1 SSI Transmit Data Register 1 SSI 1 0x1001 0008 SRX0 SSI Receive Data Register 0 SSI 1 0x1001 000C SRX1 SSI Receive Data Register 1 SSI 1 0x1001 0010 SCR SSI Control Register SSI 1 0x1001 0014 SISR SSI Interrupt Status Register SSI 1 0x1001 0018 SIER SSI Interrupt Enable Register SSI 1 0x1001 001C STCR SSI Transmit Configuration Register SSI 1 0x1001 0020 SRCR SSI Receive Configuration Register SSI 1 0x1001 0024 STCCR SSI Transmit Clock Control Register SSI 1 0x1001 0028 SRCCR SSI Receive Clock Control Register UART4 Test Register 1 CSPI Sample Period Control Register 1 CSPI DMA Register 1 CSPI 1 Soft Reset Register Interrupt Control/Status Register 2 CSPI Test Register 2 CSPI Sample Period Control Register 2 CSPI DMA Register 2 CSPI 2 Soft Reset Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-16 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SSI 1 0x1001 002C SFCSR SSI 1 0x1001 0030 STR SSI Test Register SSI 1 0x1001 0034 SOR SSI Option Register SSI 1 0x1001 0038 SACNT SSI 1 0x1001 003C SACADD SSI AC97 Command Address Register SSI 1 0x1001 0040 SACDAT SSI AC97 Command Data Register SSI 1 0x1001 0044 SATAG SSI AC97 Tag Register SSI 1 0x1001 0048 STMSK SSI Transmit Time Slot Mask Register SSI 1 0x1001 004C SRMSK SSI Receive Time Slot Mask Register SSI 1 0x1001 0050 SACCST SSI AC97 Channel Status Register SSI 1 0x1001 0054 SACCEN SSI AC97 Channel Enable Register SSI 1 0x1001 0058 SACCDIS SSI AC97 Channel Disable Register SSI 2 0x1001 1000 STX0 SSI Transmit Data Register 0 SSI 2 0x1001 1004 STX1 SSI Transmit Data Register 1 SSI 2 0x1001 1008 SRX0 SSI Receive Data Register 0 SSI 2 0x1001 100C SRX1 SSI Receive Data Register 1 SSI 2 0x1001 1010 SCR SSI Control Register SSI 2 0x1001 1014 SISR SSI Interrupt Status Register SSI 2 0x1001 1018 SIER SSI Interrupt Enable Register SSI 2 0x1001 101C STCR SSI Transmit Configuration Register SSI 2 0x1001 1020 SRCR SSI Receive Configuration Register SSI 2 0x1001 1024 STCCR SSI Transmit Clock Control Register SSI 2 0x1001 1028 SRCCR SSI Receive Clock Control Register SSI 2 0x1001 102C SFCSR SSI FIFO Control/Status Register SSI 2 0x1001 1030 STR SSI Test Register SSI 2 0x1001 1034 SOR SSI Option Register SSI 2 0x1001 1038 SACNT SSI 2 0x1001 103C SACADD SSI AC97 Command Address Register SSI 2 0x1001 1040 SACDAT SSI AC97 Command Data Register SSI 2 0x1001 1044 SATAG SSI AC97 Tag Register SSI 2 0x1001 1048 STMSK SSI Transmit Time Slot Mask Register SSI 2 0x1001 104C SRMSK SSI Receive Time Slot Mask Register SSI 2 0x1001 1050 SACCST SSI AC97 Channel Status Register SSI FIFO Control/Status Register SSI AC97 Control Register SSI AC97 Control Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-17 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SSI 2 0x1001 1054 SACCEN SSI AC97 Channel Enable Register SSI 2 0x1001 1058 SACCDIS SSI AC97 Channel Disable Register I2C 1 0x1001 2000 IADR I2C Address Register I2C 1 0x1001 2004 IFDR I2C Frequency Divider Register I2C 1 0x1001 2008 I2CR I2C Control Register I2C 1 0x1001 200C I2SR I2C Status Register I2C 1 0x1001 2010 I2DR I2C Data I/O Register SDHC1 0x1001 3000 STR_STP_CLK SDHC1 0x1001 3004 STATUS (Read Only) SDHC1 0x1001 3008 CLK_RATE SDHC1 0x1001 300C CMD_DAT_CONT MMC/SD1 Command and Data Control Register SDHC1 0x1001 3010 RESPONSE_TO MMC/SD1 Response Time Out Register SDHC1 0x1001 3014 READ_TO MMC/SD1 Read Time Out Register SDHC1 0x1001 3018 BLK_LEN MMC/SD1 Block Length Register SDHC1 0x1001 301C NOB MMC/SD1 Number of Block Register SDHC1 0x1001 3020 REV_NO MMC/SD1 Revision Number Register SDHC1 0x1001 3024 INT_CNTL MMC/SD1 Interrupt Control Register SDHC1 0x1001 3028 CMD MMC/SD1 Command Number Register SDHC1 0x1001 302C ARGH MMC/SD1 Higher Argument Register SDHC1 0x1001 3030 ARGL MMC/SD1 Lower Argument Register SDHC1 0x1001 3034 RES_FIFO (Read Only) MMC/SD1 Response FIFO Register SDHC1 0x1001 3038 BUFFER_ACCESS MMC/SD1 Buffer Access Register SDHC2 0x1001 4000 STR_STP_CLK MMC/SD2 Clock Control Register SDHC2 0x1001 4004 STATUS (Read Only) SDHC2 0x1001 4008 CLK_RATE SDHC2 0x1001 400C CMD_DAT_CONT MMC/SD2 Command and Data Control Register SDHC2 0x1001 4010 RESPONSE_TO MMC/SD2 Response Time Out Register SDHC2 0x1001 4014 READ_TO MMC/SD2 Read Time Out Register SDHC2 0x1001 4018 BLK_LEN MMC/SD2 Block Length Register SDHC2 0x1001 401C NOB MMC/SD2 Number of Block Register SDHC2 0x1001 4020 REV_NO MMC/SD2 Revision Number Register SDHC2 0x1001 4024 INT_CNTL MMC/SD2 Interrupt Control Register SDHC2 0x1001 4028 CMD MMC/SD1 Clock Control Register MMC/SD1 Status Register MMC/SD1 Clock Rate Register MMC/SD2 Status Register MMC/SD2 Clock Rate Register MMC/SD2 Command Number Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-18 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SDHC2 0x1001 402C ARGH MMC/SD2 Higher Argument Register SDHC2 0x1001 4030 ARGL MMC/SD2 Lower Argument Register SDHC2 0x1001 4034 RES_FIFO (Read Only) MMC/SD2 Response FIFO Register SDHC2 0x1001 4038 BUFFER_ACCESS GPIO 0x1001 5000 PTA_DDIR Data Direction Register, Port A GPIO 0x1001 5004 PTA_OCR1 Output Configuration Register 1 (OCR1), Port A GPIO 0x1001 5008 PTA_OCR2 Output Configuration Register 2 (OCR2), Port A GPIO 0x1001 500C PTA_ICONFA1 Input Configuration Register A1 (ICONFA1), Port A GPIO 0x1001 5010 PTA_ICONFA2 Input Configuration Register A1 (ICONFA2), Port A GPIO 0x1001 5014 PTA_ICONFB1 Input Configuration Register B1 (ICONFB1), Port A GPIO 0x1001 5018 PTA_ICONFB2 Input Configuration Register B2 (ICONFB2), Port A GPIO 0x1001 501c PTA_DR GPIO 0x1001 5020 PTA_GIUS GPIO In Use Register, Port A GPIO 0x1001 5024 PTA_SSR Sample Status Register, Port A GPIO 0x1001 5028 PTA_ICR1 Interrupt Configuration Register 1, Port A GPIO 0x1001 502C PTA_ICR2 Interrupt Configuration Register 2, Port A GPIO 0x1001 5030 PTA_IMR Interrupt Mask Register, Port A GPIO 0x1001 5034 PTA_ISR Interrupt Status Register, Port A GPIO 0x1001 5038 PTA_GPR General Purpose Register, Port A GPIO 0x1001 503c PTA_SWR Software Reset Register, Port A GPIO 0x1001 5040 PTA_PUEN Pull_up Enable Register, Port A GPIO 0x1001_5100 PTB_DDIR Data Direction Register, Port B GPIO 0x1001 5104 PTB_OCR1 Output Configuration Register 1 (OCR1), Port B GPIO 0x1001 5108 PTB_OCR2 Output Configuration Register 2 (OCR2), Port B GPIO 0x1001 510c PTB_ICONFA1 Input Configuration Register A1 (ICONFA1), Port B GPIO 0x1001 5110 PTB_ICONFA2 Input Configuration Register A1 (ICONFA2), Port B GPIO 0x1001 5114 PTB_ICONFB1 Input Configuration Register B1 (ICONFB1), Port B GPIO 0x1001 5118 PTB_ICONFB2 Input Configuration Register B2 (ICONFB2), Port B GPIO 0x1001 511c PTB_DR GPIO 0x1001 5120 PTB_GIUS GPIO In Use Register, Port B GPIO 0x1001 5124 PTB_SSR Sample Status Register, Port B GPIO 0x1001 5128 PTB_ICR1 Interrupt Configuration Register 1, Port B GPIO 0x1001 512C PTB_ICR2 Interrupt Configuration Register 2, Port B MMC/SD2 Buffer Access Register Data Register, Port A Data Register, Port B MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-19 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description GPIO 0x1001 5130 PTB_IMR Interrupt Mask Register, Port B GPIO 0x1001 5134 PTB_ISR Interrupt Status Register, Port B GPIO 0x1001 5138 PTB_GPR General Purpose Register, Port B GPIO 0x1001 513c PTB_SWR Software Reset Register, Port B GPIO 0x1001 5140 PTB_PUEN Pull_up Enable Register, Port B GPIO 0x1001_5200 PTC_DDIR Data Direction Register, Port C GPIO 0x1001 5204 PTC_OCR1 Output Configuration Register 1 (OCR1), Port C GPIO 0x1001 5208 PTC_OCR2 Output Configuration Register 2 (OCR2), Port C GPIO 0x1001 520c PTC_ICONFA1 Input Configuration Register A1 (ICONFA1), Port C GPIO 0x1001 5210 PTC_ICONFA2 Input Configuration Register A1 (ICONFA2), Port C GPIO 0x1001 5214 PTC_ICONFB1 Input Configuration Register B1 (ICONFB1), Port C GPIO 0x1001 5218 PTC_ICONFB2 Input Configuration Register B2 (ICONFB2), Port C GPIO 0x1001 521C PTC_DR GPIO 0x1001 5220 PTC_GIUS GPIO In Use Register, Port C GPIO 0x1001 5224 PTC_SSR Sample Status Register, Port C GPIO 0x1001 5228 PTC_ICR1 Interrupt Configuration Register 1, Port C GPIO 0x1001 522C PTC_ICR2 Interrupt Configuration Register 2, Port C GPIO 0x1001 5230 PTC_IMR Interrupt Mask Register, Port C GPIO 0x1001 5234 PTC_ISR Interrupt Status Register, Port C GPIO 0x1001 5238 PTC_GPR General Purpose Register, Port C GPIO 0x1001 523c PTC_SWR Software Reset Register, Port C GPIO 0x1001 5240 PTC_PUEN Pull_up Enable Register, Port C GPIO 0x1001 5300 PTD_DDIR Data Direction Register, Port D GPIO 0x1001 5304 PTD_OCR1 Output Configuration Register 1 (OCR1), Port D GPIO 0x1001 5308 PTD_OCR2 Output Configuration Register 2 (OCR2), Port D GPIO 0x1001 530c PTD_ICONFA1 Input Configuration Register A1 (ICONFA1), Port D GPIO 0x1001 5310 PTD_ICONFA2 Input Configuration Register A1 (ICONFA2), Port D GPIO 0x1001 5314 PTD_ICONFB1 Input Configuration Register B1 (ICONFB1), Port D GPIO 0x1001 5318 PTD_ICONFB2 Input Configuration Register B2 (ICONFB2), Port D GPIO 0x1001 531c PTD_DR GPIO 0x1001 5320 PTD_GIUS GPIO In Use Register, Port D GPIO 0x1001 5324 PTD_SSR Sample Status Register, Port D GPIO 0x1001 5328 PTD_ICR1 Interrupt Configuration Register 1, Port D Data Register, Port C Data Register, Port D MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-20 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description GPIO 0x1001 532C PTD_ICR2 Interrupt Configuration Register 2, Port D GPIO 0x1001 5330 PTD_IMR Interrupt Mask Register, Port D GPIO 0x1001 5334 PTD_ISR Interrupt Status Register, Port D GPIO 0x1001 5338 PTD_GPR General Purpose Register, Port D GPIO 0x1001 533c PTD_SWR Software Reset Register, Port D GPIO 0x1001 5340 PTD_PUEN Pull_up Enable Register, Port D GPIO 0x1001 5400 PTE_DDIR Data Direction Register, Port E GPIO 0x1001 5404 PTE_OCR1 Output Configuration Register 1 (OCR1), Port E GPIO 0x1001 5408 PTE_OCR2 Output Configuration Register 2 (OCR2), Port E GPIO 0x1001 540c PTE_ICONFA1 Input Configuration Register A1 (ICONFA1), Port E GPIO 0x1001 5410 PTE_ICONFA2 Input Configuration Register A1 (ICONFA2), Port E GPIO 0x1001 5414 PTE_ICONFB1 Input Configuration Register B1 (ICONFB1), Port E GPIO 0x1001 5418 PTE_ICONFB2 Input Configuration Register B2 (ICONFB2), Port E GPIO 0x1001 541c PTE_DR GPIO 0x1001 5420 PTE_GIUS GPIO In Use Register, Port E GPIO 0x1001 5424 PTE_SSR Sample Status Register, Port E GPIO 0x1001 5428 PTE_ICR1 Interrupt Configuration Register 1, Port E GPIO 0x1001 542C PTE_ICR2 Interrupt Configuration Register 2, Port E GPIO 0x1001 5430 PTE_IMR Interrupt Mask Register, Port E GPIO 0x1001 5434 PTE_ISR Interrupt Status Register, Port E GPIO 0x1001 5438 PTE_GPR General Purpose Register, Port E GPIO 0x1001 543c PTE_SWR Software Reset Register, Port E GPIO 0x1001 5440 PTE_PUEN Pull_up Enable Register, Port E GPIO 0x1001 5500 PTF_DDIR Data Direction Register, Port F GPIO 0x1001 5504 PTF_OCR1 Output Configuration Register 1 (OCR1), Port F GPIO 0x1001 5508 PTF_OCR2 Output Configuration Register 2 (OCR2), Port F GPIO 0x1001 550C PTF_ICONFA1 Input Configuration Register A1 (ICONFA1), Port F GPIO 0x1001 5510 PTF_ICONFA2 Input Configuration Register A1 (ICONFA2), Port F GPIO 0x1001 5514 PTF_ICONFB1 Input Configuration Register B1 (ICONFB1), Port F GPIO 0x1001 5518 PTF_ICONFB2 Input Configuration Register B2 (ICONFB2), Port F GPIO 0x1001 551c PTF_DR GPIO 0x1001 5520 PTF_GIUS GPIO In Use Register, Port F GPIO 0x1001 5524 PTF_SSR Sample Status Register, Port F Data Register, Port E Data Register, Port F MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-21 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description GPIO 0x1001 5528 PTF_ICR1 Interrupt Configuration Register 1, Port F GPIO 0x1001 552C PTF_ICR2 Interrupt Configuration Register 2, Port F GPIO 0x1001 5530 PTF_IMR Interrupt Mask Register, Port F GPIO 0x1001 5534 PTF_ISR Interrupt Status Register, Port F GPIO 0x1001 5538 PTF_GPR General Purpose Register, Port F GPIO 0x1001 553c PTF_SWR Software Reset Register, Port F GPIO 0x1001 5540 PTF_PUEN Pull_up Enable Register, Port F GPIO 0x1001 5600 PMASK GPIO Port Interrupt Mask AUDMUX 0x1001 6000 HPCR1 Host Port Configuration Register 1 AUDMUX 0x1001 6004 HPCR2 Host Port Configuration Register 2 AUDMUX 0x1001 6008 HPCR3 Host Port Configuration Register 3 AUDMUX 0x1001 6010 PPCR1 Peripheral Port Configuration Register 1 AUDMUX 0x1001 6014 PPCR2 Peripheral Port Configuration Register 2 AUDMUX 0x1001 601C PPCR3 Peripheral Port Configuration Register 3 CSPI3 0x1001 7000 RXDATA3 Receive Data Register 3 CSPI3 0x1001 7004 TXDATA3 Transmit Data Register 3 CSPI3 0x1001 7008 CONTROL_REG3 CSPI Control Register 3 CSPI3 0x1001 700C INT_REG3 CSPI3 0x1001 7010 TEST_REG3 CSPI3 0x1001 7014 PERIOD3 CSPI3 0x1001 7018 CSPI_DMA3 CSPI3 0x1001 701C CSPI_RESET3 CSPI Soft Reset Register 3 MSHC 0x1001 8000 COMMAND_REG MSHC Command Register MSHC 0x1001 8008 DATA_REG MSHC 0x1001 8010 STATUS_REG MSHC Status Register MSHC 0x1001 8018 SYSTEM_REG MSHC System Register GPT4 0x1001 9000 TCTL4 GPT Control Register 4 GPT4 0x1001 9004 TPRER4 GPT Prescaler Register 4 GPT4 0x1001 9008 TCMP4 GPT Compare Register 4 GPT4 0x1001 900C TCR4 GPT Capture Register 4 GPT4 0x1001 9010 TCN4 GPT Counter Register 4 GPT4 0x1001 9014 TSTAT4 GPT Status Register 4 GPT5 0x1001 A000 TCTL5 GPT Control Register 5 Interrupt Control/Status Register 3 CSPI Test Register 3 CSPI Sample Period Control Register 3 CSPI DMA Register 3 MSHC Data Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-22 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description GPT5 0x1001 A004 TPRER5 GPT Prescaler Register 5 GPT5 0x1001 A008 TCMP5 GPT Compare Register 5 GPT5 0x1001 A00C TCR5 GPT Capture Register 5 GPT5 0x1001 A010 TCN5 GPT Counter Register 5 GPT5 0x1001 A014 TSTAT5 GPT Status Register 5 UART5 0x1001_B000 UXRD_5 UART5 Receiver Register UART5 0x1001_B040 UTXD_5 UART5 Transmitter Register UART5 0x1001_B080 UCR1_5 UART5 Control Register UART5 0x1001_B084 UCR2_5 UART5 Control Register 2 UART5 0x1001_B088 UCR3_5 UART5 Control Register 3 UART5 0x1001_B08C UCR4_5 UART5 Control Register 4 UART5 0x1001_B090 UFCR_5 UART5 FIFO Control Register UART5 0x1001_B094 USR1_5 UART5 Status Register 1 UART5 0x1001_B098 USR2_5 UART5 Status Register 2 UART5 0x1001_B09C UESC_5 UART5 Escape Character Register UART5 0x1001_B0A0 UTIM_5 UART5 Escape Timer Register UART5 0x1001_B0A4 UBIR_5 UART5 BRM Incremental Register UART5 0x1001_B0A8 UBMR_5 UART5 BRM Modulator Register UART5 0x1001_B0AC UBRC_5 UART5 Baud Rate Count Register UART5 0x1001_B0B0 ONEMS_5 UART5 One Millisecond Register UART5 0x1001_B0B4 UTS_5 UART6 0x1001_C000 UXRD_6 UART6 Receiver Register UART6 0x1001_C040 UTXD_6 UART6 Transmitter Register UART6 0x1001_C080 UCR1_6 UART6 Control Register UART6 0x1001_C084 UCR2_6 UART6 Control Register 2 UART6 0x1001_C088 UCR3_6 UART6 Control Register 3 UART6 0x1001_C08C UCR4_6 UART6 Control Register 4 UART6 0x1001_C090 UFCR_6 UART6 FIFO Control Register UART6 0x1001_C094 USR1_6 UART6 Status Register 1 UART6 0x1001_C098 USR2_6 UART6 Status Register 2 UART6 0x1001_C09C UESC_6 UART6 Escape Character Register UART6 0x1001_C0A0 UTIM_6 UART6 Escape Timer Register UART6 0x1001_C0A4 UBIR_6 UART6 BRM Incremental Register UART5 Test Register 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-23 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description UART6 0x1001_C0A8 UBMR_6 UART6 BRM Modulator Register UART6 0x1001_C0AC UBRC_6 UART6 Baud Rate Count Register UART6 0x1001_C0B0 ONEMS_6 UART6 One Millisecond Register UART6 0x1001_C0B4 UTS_6 I2C 2 0x1001 D000 IADR I2C Address Register I2C 2 0x1001 D004 IFDR I2C Frequency Divider Register I2C 2 0x1001 D008 I2CR I2C Control Register I2C 2 0x1001 D00C I2SR I2C Status Register I2C 2 0x1001 D010 I2DR I2C Data I/O Register SDHC3 0x1001 E000 STR_STP_CLK SDHC3 0x1001 E004 STATUS (Read Only) SDHC3 0x1001 E008 CLK_RATE SDHC3 0x1001 E00C CMD_DAT_CONT MMC/SD2 Command and Data Control Register SDHC3 0x1001 E010 RESPONSE_TO MMC/SD2 Response Time Out Register SDHC3 0x1001 E014 READ_TO MMC/SD2 Read Time Out Register SDHC3 0x1001 E018 BLK_LEN MMC/SD2 Block Length Register SDHC3 0x1001 E01C NOB MMC/SD2 Number of Block Register SDHC3 0x1001 E020 REV_NO MMC/SD2 Revision Number Register SDHC3 0x1001 E024 INT_CNTL MMC/SD2 Interrupt Control Register SDHC3 0x1001 E028 CMD MMC/SD2 Command Number Register SDHC3 0x1001 E02C ARGH MMC/SD2 Higher Argument Register SDHC3 0x1001 E030 ARGL MMC/SD2 Lower Argument Register SDHC3 0x1001 E034 RES_FIFO (Read Only) MMC/SD2 Response FIFO Register SDHC3 0x1001 E038 BUFFER_ACCESS GPT6 0x1001 F000 TCTL6 GPT6 0x1001 F004 TPRER6 GPT Prescaler Register 6 GPT6 0x1001 F008 TCMP6 GPT Compare Register 6 GPT6 0x1001 F00C TCR6 GPT Capture Register 6 GPT6 0x1001 F010 TCN6 GPT Counter Register 6 GPT6 0x1001 F014 TSTAT6 AIPI2 0x1002 0000 PSR0 Peripheral Size Register0 AIPI2 0x1002 0004 PSR1 Peripheral Size Register1 AIPI2 0x1002 0008 PAR UART6 Test Register 1 MMC/SD2 Clock Control Register MMC/SD2 Status Register MMC/SD2 Clock Rate Register MMC/SD2 Buffer Access Register GPT Control Register 6 GPT Status Register 6 Peripheral Access Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-24 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description AIPI2 0x1002 000C AAOR Atomic Access Only Register LCDC 0x1002 1000 LSSAR LCDC Screen Start Address Register LCDC 0x1002 1004 LSR LCDC 0x1002 1008 LVPWR LCDC 0x1002 100C LCPR LCDC 0x1002 1010 LCWHBR LCDC 0x1002 1014 LCCMR LCDC 0x1002 1018 LPCR LCDC Panel Configuration Register LCDC 0x1002 101C LHCR LCDC Horizontal Configuration Register LCDC 0x1002 1020 LVCR LCDC Vertical Configuration Register LCDC 0x1002 1024 LPOR LCDC Panning Offset Register LCDC 0x1002 1028 LSCR LCDC Sharp Configuration Register LCDC 0x1002 102C LPCCR LCDC 0x1002 1030 LDCR LCDC 0x1002 1034 LRMCR LCDC Refresh Mode Control Register LCDC 0x1002 1038 LICR LCDC Interrupt Configuration Register LCDC 0x1002 103C LIER LCDC Interrupt Enable Register LCDC 0x1002 1040 LISR LCDC Interrupt Status Register LCDC 0x1002 1050 LGWSAR LCDC 0x1002 1054 LGWSR LCDC 0x1002 1058 LGWVPWR LCDC 0x1002 105C LGWPOR LCDC 0x1002 1060 LGWPR LCDC Graphic Window Position Register LCDC 0x1002 1064 LGWCR LCDC Graphic Window Control Register LCDC 0x1002 1068 LGWDCR LCDC Graphic Window DMA Control Register LCDC 0x1002 1080 LAUSCR LCDC Aus mode Control Register LCDC 0x1002 1084 LAUSCCR SLCDC 0x1002 2000 DATA_BASE_ADDR SLCDC 0x1002 2004 DATA_BUFF_SIZE SLCD Data Buffer Size Register SLCDC 0x1002 2008 CMD_BASE_ADDR SLCD Command Buffer Base Address Register SLCDC 0x1002 200C CMD_BUFF_SIZE SLCD Command Buffer Size Register SLCDC 0x1002 2010 CMD_STR_SIZE SLCD Command String Size Register SLCDC 0x1002 2014 FIFO_CONFIG LCDC Size Register LCDC Virtual Page Width Register LCDC Cursor Position Register LCDC Cursor Width Height and Blink Register LCDC Color Cursor Mapping Register LCDC PWM Contrast Control Register LCDC DMA Control Register LCDC Graphic Window Start Address Register LCDC Graphic Window Size Register LCDC Graphic Window Virtual Page Width Register LCDC Graphic Window Panning Offset Register LCDC Aus mode Cursor Control Register SLCD Data Base Address Register SLCD FIFO Configuration Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-25 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SLCDC 0x1002 2018 LCD_CONFIG SLCDC 0x1002 201C LCD_XFER_CONFIG SLCDC 0x1002 2020 DMA_CTRL_STAT SLCD DMA Control/Status Register SLCDC 0x1002 2024 LCD_CLK_CONFIG SLCD Clock Configuration Register SLCDC 0x1002 2028 LCD_WRITE_DATA SLCD Write Data Register Video Codec 0x1002 3000 CodeRun Video Codec 0x1002 3004 CodeDownLoad Video Codec 0x1002 3008 HostIntReq Host Interrupt Request to BI Video Codec 0x1002 300C BitIntClear BIT Interrupt Clear Video Codec 0x1002 3010 BitIntSts BIT Interrupt Status Video Codec 0x1002 3100 WorkBufAddr Working Buffer Address in External Memory Video Codec 0x1002 3104 CodeBufAddr Code Table Size in External Memory Video Codec 0x1002 3108 BitStreamCtrl Bit Stream Control Video Codec 0x1002 310C FrameMemCtrl Video Codec 0x1002 3110 SramAddr Internal SRAM Base Address Video Codec 0x1002 3114 SramSize Internal SRAM Size Video Codec 0x1002 3140 BitStreamRdPtr Bit Stream Buffer Read Address Video Codec 0x1002 3144 BitStreamWrPtr Bit Stream Buffer Write Address Video Codec 0x1002 3148 FrameNum Video Codec 0x1002 3160 BusyFlag Video Codec 0x1002 3164 RunCommand Video Codec 0x1002 3168 RunIndex Video Codec 0x1002 316C RunCodStd Run Codec Standard Video Codec 0x1002 3180 BitBufAddr Parameter Registers in sequence initialization. Bitstream Buffer Address Video Codec 0x1002 3184 BitBufSize Parameter Registers in sequence initialization. Bitstream Buffer Size Video Codec 0x1002 3188 FrameIntAddrY Parameter Registers in sequence initialization. Temporal Frame Y Address Video Codec 0x1002 318C FrameIntAddrCb Parameter Registers in sequence initialization. Temporal Frame Cb Address Video Codec 0x1002 3190 FrameIntAddrCr Parameter Registers in sequence initialization. Temporal Frame Cr Address Video Codec 0x1002 3194 EncCodStd SLCD Configuration Register SLCD Transfer Configuration Register BIT run start Code Download Data Register Frame Memory Control Encoded/Decoded Frame Number Processing Busy Flag Start/Stop Codec Run Command Run Process Index Parameter Registers in sequence initialization. Encode Coding Standard MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-26 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description Video Codec 0x1002 3198 EncSrcFormat Parameter Registers in sequence initialization. Encode Source Frame Format Video Codec 0x1002 319C EncMp4Para Parameter Registers in sequence initialization. Encode MPEG4 Parameter Video Codec 0x1002 31A0 Enc263Para Parameter Registers in sequence initialization. Encode H.263 Parameter Video Codec 0x1002 31A4 Enc264Para Parameter Registers in sequence initialization. Encode H.264 Parameter Video Codec 0x1002 31A8 EncSliceMode Parameter Registers in sequence initialization. Encode Slice Mode Video Codec 0x1002 31AC EncGopNum Parameter Registers in sequence initialization. Encode GOP Number Video Codec 0x1002 31B0 EncPictureQs Parameter Registers in sequence initialization. Encode Picture Quantize Step Video Codec 0x1002 31C0 RetStatus Parameter Registers in sequence initialization. Command Executing Result Status Video Codec 0x1002 31C4 RetSrcFormat Parameter Registers in sequence initialization. Decoded Source Format Video Codec 0x1002 31C8 RetMp4Info Parameter Registers in sequence initialization. Decoded MPEG4 Sequence Information Video Codec 0x1002 31CC Ret263Info Parameter Registers in sequence initialization. Decoded H.263 Sequence Information Video Codec 0x1002 31D0 Ret264Info Parameter Registers in sequence initialization. Decoded H.264 Sequence Information Video Codec 0x1002 3180 FrameSrcAddrY Parameter Register in Processing Running. Source Frame Y Address Video Codec 0x1002 3184 FrameSrcAddrCb Parameter Register in Processing Running. Source Frame Cb Address Video Codec 0x1002 3188 FrameSrcAddrCr Parameter Register in Processing Running. Source Frame Cr Address Video Codec 0x1002 318C FrameDecAddrY Parameter Register in Processing Running. Decode Frame Y Address Video Codec 0x1002 3190 FrameDecAddrCb Parameter Register in Processing Running. Decode Frame Cb Address Video Codec 0x1002 3194 FrameDecAddrCr Parameter Register in Processing Running. Decode Frame Cr Address Video Codec 0x1002 31C0 RetStatus Parameter Register in Processing Running. Command Executing Result Status USBOTG 0x1002 4000 UOG_ID ID (UOG_ID) USBOTG 0x1002 4004 UOG_HWGENERAL Hardware General (UOG_HWGENERAL) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-27 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description USBOTG 0x1002 4008 UOG_HWHOST USBOTG 0x1002 400C UOG_HWDEVICE Device Hardware Parameters (UOG_HWDEVICE) USBOTG 0x1002 4010 UOG_HWTXBUF TX Buffer Hardware Parameters (UOG_HWTXBUF) USBOTG 0x1002 4014 UOG_HWRXBUF RX Buffer Hardware Parameters (UOG_HWRXBUF) USBOTG 0x1002 4080 GPTIMER0LD USBOTG 0x1002 4084 GPTIMER0CTRL USBOTG 0x1002 4088 GPTIMER0LD USBOTG 0x1002 408C GPTIMER0CTRL USBOTG 0x1002 4100 UOG_CAPLENGTH Capability Register Length (UOG_CAPLENGTH) USBOTG 0x1002 4102 UOG_HCIVERSION Host Interface Version (UOG_HCIVERSION) USBOTG 0x1002 4104 UOG_HCSPARAMS Host Control Structural Parameters (UOG_HCSPARAMS) USBOTG 0x1002 4108 UOG_HCCPARAMS Control Capability Parameters (UOG_HCCPARAMS) USBOTG 0x1002 4120 UOG_DCIVERSION Device Interface Version (UOG_DCIVERSION) USBOTG 0x1002 4124 UOG_DCCPARAMS Device Controller Capability Parameters (UOG_DCCPARAMS) USBOTG 0x1002 4140 UOG_USBCMD USB Command Register (UOG_USBCMD) USBOTG 0x1002 4144 UOG_USBSTS USB Status Register (UOG_USBSTS) USBOTG 0x1002 4148 UOG_USBINTR Interrupt Enable Register (UOG_USBINTR) USBOTG 0x1002 414C UOG_FRINDEX USB Frame Index (UOG_FRINDEX) USBOTG 0x1002 4154 UOG_PERIODICLISTBASE USBOTG 0x1002 4158 UOG_ASYNCLISTADDR USBOTG 0x1002 4160 UOG_BURSTSIZE USBOTG 0x1002 4164 UOG_TXFILLTUNING USBOTG 0x1002 4170 ULPIVIEW USBOTG 0x1002 4180 UOG_CFGFLAG Config Flag (UOG_CFGFLAG) USBOTG 0x1002 4184 UOG_PORTSC1 Port Status and Control (UOG_PORTSC1) USBOTG 0x1002 41A4 UOG_OTGSC USBOTG 0x1002 41A8 UOG_USBMODE USBOTG 0x1002 41AC UOG_ENDPTSETUPSTAT USBOTG 0x1002 41B0 UOG_ENDPTPRIME Endpoint Initialization (UOG_ENDPTPRIME) USBOTG 0x1002 41B4 UOG_ENDPTFLUSH Endpoint De-Initialize (UOG_ENDPTFLUSH) Host Hardware Parameters (UOG_HWHOST) General Purpose Timer #0 Load (GPTIMER0LD) General Purpose Timer #0 Controller (GPTIMER0CTRL) General Purpose Timer #1 Load (GPTIMER0LD) General Purpose Timer #1 Controller (GPTIMER0CTRL) Host Controller Frame List Base Address (UOG_PERIODICLISTBASE) Host Controller Next Asynch. Address (UOG_ASYNCLISTADDR) Host Controller Embedded TT Asynch. Buffer Status (UOG_BURSTSIZE) TX FIFO Fill Tuning (UOG_TXFILLTUNING) ULPI Viewport (ULPIVIEW) On-The-Go Status and control (UOG_OTGSC) USB Device Mode (UOG_USBMODE) Endpoint Setup Status (UOG_ENDPTSETUPSTAT) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-28 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description USBOTG 0x1002 41B8 UOG_ENDPTSTAT USBOTG 0x1002 41BC UOG_ENDPTCOMPLETE USBOTG 0x1002 41C0 ENDPTCTRL0 Endpoint Control 0 (ENDPTCTRL0) USBOTG 0x1002 41C4 ENDPTCTRL1 Endpoint Control 1 (ENDPTCTRL1) USBOTG 0x1002 41C8 ENDPTCTRL2 Endpoint Control 2 (ENDPTCTRL2) USBOTG 0x1002 41CC ENDPTCTRL3 Endpoint Control 3 (ENDPTCTRL3) USBOTG 0x1002 41D0 ENDPTCTRL4 Endpoint Control 4 (ENDPTCTRL4) USB OTG 0x1002 41D4 ENDPTCTRL5 Endpoint Control 5 (ENDPTCTRL5) USB OTG 0x1002 41D8 ENDPTCTRL6 Endpoint Control 6 (ENDPTCTRL6) USBOTG 0x1002 41DC ENDPTCTRL7 Endpoint Control 7 (ENDPTCTRL7) USBOTG 0x1002 4200 UH1_ID USBOTG 0x1002 4204 UH1_HWGENERAL USBOTG 0x1002 4208 UH1_HWHOST Host Hardware Parameters (UH1_HWHOST) USBOTG 0x1002 4210 UH1_HWTXBUF TX Buffer Hardware Parameters (UH1_HWTXBUF) USBOTG 0x1002 4214 UH1_HWRXBUF RX Buffer Hardware Parameters (UH1_HWRXBUF) USBOTG 0x1002 4280 GPTIMER0LD USBOTG 0x1002 4284 GPTIMER0CTRL USBOTG 0x1002 4288 GPTIMER0LD USBOTG 0x1002 428C GPTIMER0CTRL USBOTG 0x1002 4300 UH1_CAPLENGTH Capability Register Length (UH1_CAPLENGTH) USBOTG 0x1002 4302 UH1_HCIVERSION Host Interface Version (UH1_HCIVERSION) USBOTG 0x1002 4304 UH1_HCSPARAMS Host Control Structural Parameters (UH1_HCSPARAMS) USBOTG 0x1002 4308 UH1_HCCPARAMS Control Capability Parameters (UH1_HCCPARAMS) USBOTG 0x1002 4340 UH1_USBCMD USB Command Register (UH1_USBCMD) USBOTG 0x1002 4344 UH1_USBSTS USB Status Register (UH1_USBSTS) USBOTG 0x1002 4348 UH1_USBINTR Interrupt Enable Register (UH1_USBINTR) USBOTG 0x1002 434C UH1_FRINDEX USB Frame Index (UH1_FRINDEX) USBOTG 0x1002 4354 UH1_PERIODICLISTBASE USBOTG 0x1002 4358 UH1_ASYNCLISTADDR USBOTG 0x1002 4360 UH1_BURSTSIZE USBOTG 0x1002 4364 UH1_TXFILLTUNING Endpoint Status (UOG_ENDPTSTAT) Endpoint Complete (UOG_ENDPTCOMPLETE) Host 1 ID (UH1_ID) Hardware General (UH1_HWGENERAL) General Purpose Timer #0 Load (GPTIMER0LD) General Purpose Timer #0 Controller (GPTIMER0CTRL) General Purpose Timer #1 Load (GPTIMER0LD) General Purpose Timer #1 Controller (GPTIMER0CTRL) Host Controller Frame List Base Address (UH1_PERIODICLISTBASE) Host Controller Next Asynch. Address (UH1_ASYNCLISTADDR) Host Controller Embedded TT Asynch. Buffer Status (UH1_BURSTSIZE) TX FIFO Fill Tuning (UH1_TXFILLTUNING) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-29 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description USBOTG 0x1002 4380 — USBOTG 0x1002 4838 Reserved Port Status and Control (UH1_PORTSC1) USBOTG 0x1002 4384 UH1_PORTSC1 Port Status and Control (UH1_PORTSC1) USBOTG 0x1002 483C Reserved USBOTG 0x1002 43A8 UH1_USBMODE USBOTG 0x1002 4400 UH2_ID USBOTG 0x1002 4404 UH2_HWGENERAL USBOTG 0x1002 4408 UH2_HWHOST Host Hardware Parameters (UH2_HWHOST) USBOTG 0x1002 4410 UH2_HWTXBUF TX Buffer Hardware Parameters (UH2_HWTXBUF) USBOTG 0x1002 4414 UH2_HWRXBUF RX Buffer Hardware Parameters (UH2_HWRXBUF) USBOTG 0x1002 4480 GPTIMER0LD USBOTG 0x1002 4484 GPTIMER0CTRL USBOTG 0x1002 4488 GPTIMER0LD USBOTG 0x1002 448C GPTIMER0CTRL USBOTG 0x1002 4500 UH2_CAPLENGTH Capability Register Length (UH2_CAPLENGTH) USBOTG 0x1002 4502 UH2_HCIVERSION Host Interface Version (UH2_HCIVERSION) USBOTG 0x1002 4504 UH2_HCSPARAMS Host Control Structural Parameters (UH2_HCSPARAMS) USBOTG 0x1002 4508 UH2_HCCPARAMS Control Capability Parameters (UH2_HCCPARAMS) USBOTG 0x1002 4540 UH2_USBCMD USB Command Register (UH2_USBCMD) USBOTG 0x1002 4544 UH2_USBSTS USB Status Register (UH2_USBSTS) USBOTG 0x1002 4548 UH2_USBINTR Interrupt Enable Register (UH2_USBINTR) USBOTG 0x1002 454C UH2_FRINDEX USB Frame Index (UH2_FRINDEX) USBOTG 0x1002 4554 UH2_PERIODICLISTBASE USBOTG 0x1002 4558 UH2_ASYNCLISTADDR USBOTG 0x1002 4560 UH2_BURSTSIZE USBOTG 0x1002 4564 UH2_TXFILLTUNING USBOTG 0x1002 4570 ULPIVIEW USBOTG 0x1002 4580 — USBOTG 0x1002 4584 UH2_PORTSC1 Port Status and Control (UH2_PORTSC1) USBOTG 0x1002 45A8 UH2_USBMODE USB Device Mode (UH2_USBMODE) USBOTG 0x1002 4600 USB_CTRL Reserved Reserved USB Device Mode (UH1_USBMODE) ID (UH2_ID) Hardware General (UH2_HWGENERAL) General Purpose Timer #0 Load (GPTIMER0LD) General Purpose Timer #0 Controller (GPTIMER0CTRL) General Purpose Timer #1 Load (GPTIMER0LD) General Purpose Timer #1 Controller (GPTIMER0CTRL) Host Controller Frame List Base Address (UH2_PERIODICLISTBASE) Host Controller Next Asynch. Address (UH2_ASYNCLISTADDR) Host Controller Embedded TT Asynch. Buffer Status (UH2_BURSTSIZE) TX FIFO Fill Tuning (UH2_TXFILLTUNING) ULPI Viewport (ULPIVIEW) Reserved USB Control Register (USB_CTRL) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-30 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description USBOTG 0x1002 4604 USB_OTG_MIRROR SAHARA2 0x1002 5000 VER_ID SAHARA2 0x1002 5004 DSC_ADR SAHARA2 Descriptor Address Register SAHARA2 0x1002 5008 CONTROL SAHARA2 Control Register SAHARA2 0x1002 500C COMMAND SAHARA2 Command Register SAHARA2 0x1002 5010 STAT SAHARA2 0x1002 5014 ERR_STAT SAHARA2 Error Status Register SAHARA2 0x1002 5018 FAULT_ADR SAHARA2 Fault Address Register SAHARA2 0x1002 501C C_DSC_ADR SAHARA2 Current Descriptor Address Register SAHARA2 0x1002 5020 I_DSC_ADR SAHARA2 Initial Descriptor Address Register SAHARA2 0x1002 5024 BUFF_LVL SAHARA2 0x1002 5080 DSC_A Location to Store Descriptor SAHARA2 0x1002 5084 DSC_B Location to Store Descriptor SAHARA2 0x1002 5088 DSC_C Location to Store Descriptor SAHARA2 0x1002 508C DSC_D Location to Store Descriptor SAHARA2 0x1002 5090 DSC_E Location to Store Descriptor SAHARA2 0x1002 5094 DSC_F Location to Store Descriptor SAHARA2 0x1002 50A0 LNK_1_A Location to Store Link Data SAHARA2 0x1002 50A4 LNK_1_B Location to Store Link Data SAHARA2 0x1002 50A8 LNK_1_C Location to Store Link Data SAHARA2 0x1002 50B0 LNK_2_A Location to Store Link Data SAHARA2 0x1002 50B4 LNK_2_B Location to Store Link Data SAHARA2 0x1002 50B8 LNK_2_C Location to Store Link Data SAHARA2 0x1002 50C0 FLOW_CTRL SAHARA2 Internal Buffer and Data-Paths Control Register SAHARA2 0x1002 5100 SKHA_MODE SKHA Mode Register SAHARA2 0x1002 5104 SKHA_KEY_SIZE SKHA Key Size Register SAHARA2 0x1002 5108 SKHA_DATA_SIZE SKHA Data Size Register SAHARA2 0x1002 510C SKHA_STAT SAHARA2 0x1002 5110 SKHA_ERR_STAT SAHARA2 0x1002 5114 SKHA_End-of-Message SAHARA2 0x1002 5140– 0x1002 517F SKHA_CXT USB OTG Mirror Register (USB_OTG_MIRROR) SAHARA2 Version ID Register SAHARA2 Status Register SAHARA2 Buffer Level Register SKHA Status Register SKHA Error Status Register SKHA End-of-Message Register SKHA Context Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-31 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SAHARA2 0x1002 5180– 0x1002 51FF SKHA Key SAHARA2 0x1002 5200 MDHA_MODE SAHARA2 0x1002 5204 MDHA_KEY_SIZE MDHA Key Size Register SAHARA2 0x1002 5208 MDHA_DATA_SIZE MDHA Data Size Register SAHARA2 0x1002 520C MDHA_STAT SAHARA2 0x1002 5210 MDHA_ERR_STAT SAHARA2 0x1002 5214 MDHA_End-of-Message SAHARA2 0x1002 5240– 0x1002 5254 MDHA_Digest and Length SAHARA2 0x1002 5280– 0x1002 52FF MDHA_Key MDHA Keys SAHARA2 0x1002 5300 RNG_Mode RNG Mode Register SAHARA2 0x1002 5308 RNG_Data_SIZE SAHARA2 0x1002 530C RNG_STAT SAHARA2 0x1002 5310 RNG_ERROR_STAT SAHARA2 0x1002 5314 RNG_End-of-Message RNG End-of-Message Register SAHARA2 0x1002 5340– 0x1002 537F RNG_VERIFICATION RNG Verification Register SAHARA2 0x1002 5380 RNG_ENTROPY RNG Entropy Register SAHARA2 0x1002 5400– 0x1002 54FF Data Input Buffer Data Input Buffers SAHARA2 0x1002 5500– 0x1002 55FF Data Output Buffer Data Output Buffers SAHARA2 0x1002 5600– 0x1002 57FF SBOX CONTEXT SBOX Context eMMA_lt 0x1002 6000 PP_CNTL eMMA_lt 0x1002 6004 PP_INTRCNTL PP Interrupt Control Register eMMA_lt 0x1002 6008 PP_INTRSTATUS PP interrupt Status Register eMMA_lt 0x1002 600C PP_SOURCE_Y_PTR eMMA_lt 0x1002 6010 PP_SOURCE_CB_PTR PP Source “CB” Frame Data Pointer Register eMMA_lt 0x1002 6014 PP_SOURCE_CR_PTR PP Source “CR” Frame Data Pointer Register eMMA_lt 0x1002 6018 PP_DEST_RGB_PTR PP Destination “RGB” Frame Start Address Register eMMA_lt 0x1002 601C PP_QUANTIZER_PTR PP Quantizer Start Address Register eMMA_lt 0x1002 6020 PP_PROCESS_FRAME_PARA SKHA Key Register MDHA Mode Register MDHA Status Register MDHA Error Status Register MDHA End-of-Message Register MDHA Message Digest and Length Register RNG Data Size Register RNG Status Register RNG Error Status Register PP Control Register PP Source “Y” FramE Data Pointer Register PP Process Frame Parameter, Width And Height Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-32 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description eMMA_lt 0x1002 6024 eMMA_lt 0x1002 6028 PP_DEST_DISPLAY_WIDTH eMMA_lt 0x1002 602C PP_DEST_IMAGE_SIZE eMMA_lt 0x1002 6030 eMMA_lt 0x1002 6034 PP Resize Table index Reg eMMA_lt 0x1002 6038 PP_CSC_COEFF_012 PP CSC Coefficient 0, 1, and 2 Register eMMA_lt 0x1002 603C PP_CSC_COEFF_34 PP CSC Coefficient 3 and 4 Register eMMA_lt 0x1002 6100– 0x1002 617C PP_RESIZE_COEF_TBL PP Resize Coefficient Table Register eMMA_lt 0x1002 6400 PrP_CNTL eMMA_lt 0x1002 6404 PrP_INTRCNTL PrP Interrupt Control Register eMMA_lt 0x1002 6408 PrP_INTRSTATUS PrP interrupt Status Register eMMA_lt 0x1002 640C PrP_SOURCE_Y_PTR eMMA_lt 0x1002 6410 PrP_SOURCE_CB_PTR PrP Source “CB” Frame Start Address Register eMMA_lt 0x1002 6414 PrP_SOURCE_CR_PTR PrP Source “CR” Frame Start Address Register eMMA_lt 0x1002 6418 PrP_DEST_RGB1_PTR PrP Destination “RGB” Frame-1 Start Address Register eMMA_lt 0x1002 641C PrP_DEST_RGB2_PTR PrP Destination “RGB” Frame-2 Start Address Register eMMA_lt 0x1002 6420 PrP_DEST_Y_PTR eMMA_lt 0x1002 6424 PrP_DEST_CB_PTR PrP Destination “CB” Frame Start Address Register eMMA_lt 0x1002 6428 PrP_DEST_CR_PTR PrP Destination “CR” Frame Start Address Register eMMA_lt 0x1002 642C PrP_SOURCE_FRAME_SIZE eMMA_lt 0x1002 6430 PrP_CH1_LINE_STRIDE eMMA_lt 0x1002 6434 PrP_SRC_PIXEL_FORMAT_CN PrP Source Pixel Format Control Register TL eMMA_lt 0x1002 6438 PrP_CH1_PIXEL_FORMAT_CN PrP CH1 Pixel Format Control Register TL eMMA_lt 0x1002 643C PrP_CH1_OUT_IMAGE_SIZE PrP CH1 Output Image Size Register eMMA_lt 0x1002 6440 PrP_CH2_OUT_IMAGE_SIZE PrP CH2 Output Image Size Register eMMA_lt 0x1002 6444 PrP_SOURCE_LINE_STRIDE PrP Source Line Stride Register eMMA_lt 0x1002 6448 PrP_CSC_COEFF_012 PrP CSC Coefficients 0, 1, and 2 Register eMMA_lt 0x1002 644C PrP_CSC_COEFF_345 PrP CSC Coefficients 3, 4, and 5 Register eMMA_lt 0x1002 6450 PrP_CSC_COEFF_678 PrP CSC Coefficients 6, 7, and 8 Register eMMA_lt 0x1002 6454 PrP_CH1_HRESIZE_COEFF1 PrP CH1 Horizontal Resize Coefficients Register eMMA_lt 0x1002 6458 PrP_CH1_HRESIZE_COEFF2 PrP CH1 Horizontal Resize Coefficients Register PP_SOURCE_FRAME_WIDTH PP Source Frame Width Register PP Destination Display Width Register PP Destination Image Size Register PP_DEST_FRAME_FMT_CNTL PP Destination Frame Format Control Register PP Resize Table Index Register PrP Control Register PrP Source “Y” Frame Start Address Register PrP Destination “Y” Frame Start Address Register PrP Source Frame Size Register PrP Channel-1 Line stride Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-33 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description eMMA_lt 0x1002 645C PrP_CH1_HRESIZE_VALID eMMA_lt 0x1002 6460 PrP_CH1_VRESIZE_COEFF1 PrP CH1 Vertical Resize Coefficients Register eMMA_lt 0x1002 6464 PrP_CH1_VRESIZE_COEFF2 PrP CH1 Vertical Resize Coefficients Register eMMA_lt 0x1002 6468 PrP_CH1_VRESIZE_VALID eMMA_lt 0x1002 646C PrP_CH2_HRESIZE_COEFF1 PrP CH2 Horizontal Resize Coefficients Register eMMA_lt 0x1002 6470 PrP_CH2_HRESIZE_COEFF2 PrP CH2 Horizontal Resize Coefficients Register eMMA_lt 0x1002 6474 PrP_CH2_HRESIZE_VALID eMMA_lt 0x1002 6478 PrP_CH2_VRESIZE_COEFF1 PrP CH2 Vertical Resize Coefficients Register eMMA_lt 0x1002 647C PrP_CH2_VRESIZE_COEFF2 PrP CH2 Vertical Resize Coefficients Register eMMA_lt 0x1002 6480 PrP_CH2_VRESIZE_VALID PLLCLK 0x1002 7000 CSCR PLLCLK 0x1002 7004 MPCTL0 MPLL Control Register 0 PLLCLK 0x10027008 MPCTL1 MPLL Control Register 1 PLLCLK 0x1002700C SPCTL0 SPLL Control Register 0 PLLCLK 0x10027010 SPCTL1 SPLL Control Register 1 PLLCLK 0x10027014 OSC26MCTL Oscillator 26M Register PLLCLK 0x10027018 PCDR0 Peripheral Clock Divider Register 0 PLLCLK 0x1002701C PCDR1 Peripheral Clock Divider Register 1 PLLCLK 0x10027020 PCCR0 Peripheral Clock Control Register 0 PLLCLK 0x10027024 PCCR1 Peripheral Clock Control Register 1 PLLCLK 0x10027028 CCSR Clock Control Status Register PLLCLK 0x1002702C PMCTL PMOS Switch Control Register PLLCLK 0x10027030 PMCOUNT PMOS Switch Counter Register PLLCLK 0x10027034 WKGDCTL Wakeup Guard Mode Control Register SYSCTRL 0x10027800 CID SYSCTRL 0x10027814 FMCR Function Multiplexing Control Register SYSCTRL 0x10027818 GPCR Global Peripheral Control Register SYSCTRL 0x1002781C WBCR Well Bias Control Register SYSCTRL 0x10027820 DSCR1 Driving Strength Control Register 1 SYSCTRL 0x10027824 DSCR2 Driving Strength Control Register 2 SYSCTRL 0x10027828 DSCR3 Driving Strength Control Register 3 SYSCTRL 0x1002782C DSCR4 Driving Strength Control Register 4 SYSCTRL 0x10027830 DSCR5 Driving Strength Control Register 5 PrP CH1 Horizontal Resize Valid Register PrP CH1 Vertical Resize Valid Register PrP CH2 Horizontal Resize Valid Register PrP CH2 Vertical Resize Valid Register Clock Source Control Register Chip ID Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-34 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SYSCTRL 0x10027834 DSCR6 Driving Strength Control Register 6 SYSCTRL 0x10027838 DSCR7 Driving Strength Control Register 7 SYSCTRL 0x1002783C DSCR8 Driving Strength Control Register 8 SYSCTRL 0x10027840 DSCR9 Driving Strength Control Register 9 SYSCTRL 0x1002 7844 DSCR10 Driving Strength Control Register 10 SYSCTRL 0x1002 7848 DSCR11 Driving Strength Control Register 11 SYSCTRL 0x1002 784C DSCR12 Driving Strength Control Register 12 SYSCTRL 0x1002 7850 DSCR13 Driving Strength Control Register 13 SYSCTRL 0x1002 7854 PSCR Pull Strength Control Register SYSCTRL 0x1002 7858 PCSR Priority Control and Select Register SYSCTRL 0x1002 7860 PMCR Power Management Control Register SYSCTRL 0x1002 7864 DCVR0 DPTC Comparator Value Register 0 SYSCTRL 0x1002 7868 DCVR‘ DPTC Comparator Value Register 1 SYSCTRL 0x1002 786C DCVR2 DPTC Comparator Value Register 2 SYSCTRL 0x1002 7870 DCVR3 DPTC Comparator Value Register 3 IIM 0x1002_8000 STAT IIM 0x1002_8004 STATM IIM 0x1002_8008 ERR IIM 0x1002_800C EMASK IIM 0x1002_8010 FCTL IIM 0x1002_8014 UA Upper Address Register IIM 0x1002_8018 LA Lower Address Register IIM 0x1002_801C SDAT Explicit Sense Data Register IIM 0x1002_8020 PREV Product Revision Register IIM 0x1002_8024 SREV Silicon Revision Register IIM 0x1002_8028 PROG_P IIM 0x1002_802C SCS0 Software_Controllable Signals Register 0 IIM 0x1002_8030 SCS1 IIM 0x1002_8034 SCS2 Software_Controllable Volatile Hardware—Visible Signals Register (1–3) IIM 0x1002_8038 SCS3 IIM 0x1002_803C FBAC0 IIM 0x1002_8804 WORD1_BANK0 Word 1 of Fusebank 0 IIM 0x1002_8808 WORD2_BANK0 Word 2 of Fusebank 0 Status Register Status IRQ Mask Register Module Errors Register Error IRQ Mask Register Fuse Control Register Program Protection Register Fuse Bank 0 Access Protection Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-35 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description IIM 0x1002_880C WORD3_BANK0 Word 3 of Fusebank 0 IIM 0x1002_8810 WORD4_BANK0 Word 4 of Fusebank 0 IIM 0x1002_8814– 0x1002_8828 MAC_ADDR IIM 0x1002_882C– 0x1002_887C SCC_KEY IIM 0x1002_8C00 FBAC1 IIM 0x1002_8C04– 0x1002_8C18 SUID IIM 0x1002_8C1C– 0x1002_8C7C RESERVED RTIC 0x1002 A000 RTICSR RTIC 0x1002 A004 RTICCMDR RTIC Command Register RTIC 0x1002 A008 RTICCNTLR RTIC Control Register RTIC 0x1002 A00C RTICTR RTIC Throttle Register RTIC 0x1002 A010 RTICAMSAR1 RTIC 0x1002 A014 RTICAMLR1 RTIC 0x1002 A0018 RTICAMSAR2 RTIC 0x1002 A01C RTICAMLR2 RTIC 0x1002 A030 RTICBMSAR1 RTIC 0x1002 A034 RTICBMLR1 RTIC 0x1002 A038 RTICBMSAR2 RTIC 0x1002 A003C RTICBMLR2 RTIC 0x1002 A050 RTICCMSAR1 RTIC 0x1002 A054 RTICCMLR1 RTIC 0x1002 A058 RTICCMSAR2 RTIC 0x1002 A05C RTICCMLR2 RTIC 0x1002 A070 RTICDMSAR1 RTIC 0x1002 A074 RTICDMLR1 RTIC 0x1002 A078 RTICDMSAR2 RTIC 0x1002 A07C RTICDMLR2 RTIC 0x1002 A090 RTICFAR RTIC Fault Address Register RTIC 0x1002 A094 RTICWR RTIC Watchdog Register RTIC 0x1002 A0A0 RTICAMHR1 MAC Address of Ethernet SCC_KEY[167:0] Fuse Bank 0 Access Protection register Silicon_Unique_ID[47:0] Reserved for future use RTIC Status Register RTIC Memory A Start Address Register 1 RTIC Memory A Len Register 1 RTIC Memory A Start Address Register 2 RTIC Memory A Len Register 2 RTIC Memory B Start Address Register 1 RTIC Memory B Len Register 1 RTIC Memory B Start Address Register 2 RTIC Memory B Len Register 2 RTIC Memory C Start Address Register 1 RTIC Memory C Len Register 1 RTIC Memory C Start Address Register 2 RTIC Memory C Len Register 2 RTIC Memory D Start Address Register 1 RTIC Memory D Len Register 1 RTIC Memory D Start Address Register 2 RTIC Memory D Len Register 2 RTIC Memory A Hash Result [159:128] MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-36 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description RTIC 0x1002 A0A4 RTICAMHR2 RTIC Memory A Hash Result [127:96] RTIC 0x1002 A0A8 RTICAMHR3 RTIC Memory A Hash Result [95:64] RTIC 0x1002 A0AC RTICAMHR4 RTIC Memory A Hash Result [63:32] RTIC 0x1002 A0B0 RTICAMHR5 RTIC Memory A Hash Result [31:0] RTIC 0x1002 A0C0 RTICBMHR1 RTIC Memory B Hash Result [159:128] RTIC 0x1002 A0C4 RTICBMHR2 RTIC Memory B Hash Result [127:96] RTIC 0x1002 A0C8 RTICBMHR3 RTIC Memory B Hash Result [95:64] RTIC 0x1002 A0CC RTICBMHR4 RTIC Memory B Hash Result [63:32 RTIC 0x1002 A0D0 RTICBMHR5 RTIC Memory B Hash Result [31:0] RTIC 0x1002 A0E0 RTICCMHR1 RTIC Memory C Hash Result [159:128] RTIC 0x1002 A0E4 RTICCMHR2 RTIC Memory C Hash Result [127:96] RTIC 0x1002 A0E8 RTICCMHR3 RTIC Memory C Hash Result [95:64] RTIC 0x1002 A0EC RTICCMHR4 RTIC Memory C Hash Result [63:32] RTIC 0x1002 A0F0 RTICCMHR5 RTIC Memory C Hash Result [31:0] RTIC 0x1002 A100 RTICDMHR1 RTIC Memory D Hash Result [159:128] RTIC 0x1002 A104 RTICDMHR2 RTIC Memory D Hash Result [127:96] RTIC 0x1002 A108 RTICDMHR3 RTIC Memory D Hash Result [95:64] RTIC 0x1002 A10C RTICDMHR4 RTIC Memory D Hash Result [63:32] RTIC 0x1002 A110 RTICDMHR5 RTIC Memory D Hash Result [31:0] FEC 0x1002 B004 EIR Interrupt Event Register FEC 0x1002 B008 EIMR Interrupt Mask Register FEC 0x1002 B010 RDAR Receive Descriptor Active Register FEC 0x1002 B014 TDAR Transmit Descriptor Active Register FEC 0x1002 B024 ECR Ethernet Control Register FEC 0x1002 B040 MMFR MII Management Frame Register FEC 0x1002 B044 MSCR MII Speed Control Register FEC 0x1002 B064 MIBC MIB Control/Status Register FEC 0x1002 B084 RCR Receive Control Register FEC 0x1002 B0C4 TCR Transmit Control Register FEC 0x1002 B0E4 PALR Physical Address Low Register FEC 0x1002 B0E8 PAUR Physical Address High+ Type Field FEC 0x1002 B0EC OPD Opcode + Pause Duration FEC 0x1002 B118 IAUR Upper 32 bits of Individual Hash Table MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-37 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description FEC 0x1002 B11C IALR Lower 32 Bits of Individual Hash Table FEC 0x1002 B120 GAUR Upper 32 bits of Group Hash Table FEC 0x1002 B124 GALR Lower 32 bits of Group Hash Table FEC 0x1002 B144 TFWR Transmit FIFO Watermark FEC 0x1002 B14C FRBR FIFO Receive Bound Register FEC 0x1002 B150 FRSR FIFO Receive FIFO Start Registers FEC 0x1002 B180 ERDSR Pointer to Receive Descriptor Ring FEC 0x1002 B184 ETDSR Pointer to Transmit Descriptor Ring FEC 0x1002 B188 EMRBR Maximum Receive Buffer Size FEC 0x1002 B200 RMON_T_DROP FEC 0x1002 B204 RMON_T_PACKETS RMON Tx packet count FEC 0x1002 B208 RMON_T_BC_PKT RMON Tx Broadcast Packets FEC 0x1002 B20C RMON_T_MC_PKT RMON Tx Multicast Packets FEC 0x1002 B210 RMON_T_CRC_ALIGN RMON Tx Packets w CRC/Align error FEC 0x1002 B214 RMON_T_UNDERSIZE RMON Tx Packets < 64 bytes, good crc FEC 0x1002 B218 RMON_T_OVERSIZE FEC 0x1002 B21C RMON_T_FRAG FEC 0x1002 B220 RMON_T_JAB RMON Tx Packets > MAX_FL bytes, bad crc FEC 0x1002 B224 RMON_T_COL RMON Tx collision count FEC 0x1002 B228 RMON_T_P64 RMON Tx 64 byte packets FEC 0x1002 B22C RMON_T_P65TO127 RMON Tx 65 to 127 byte packets FEC 0x1002 B230 RMON_T_P128TO255 RMON Tx 128 to 255 byte packets FEC 0x1002 B234 RMON_T_P256TO511 RMON Tx 256 to 511 byte packets FEC 0x1002 B238 RMON_T_P512TO1023 RMON Tx 512 to 1023 byte packets FEC 0x1002 B23C RMON_T_P1024TO2047 RMON Tx 1024 to 2047 byte packets FEC 0x1002 B240 RMON_T_P_GTE2048 FEC 0x1002 B244 RMON_T_OCTETS FEC 0x1002 B248 IEEE_T_DROP FEC 0x1002 B24C IEEE_T_FRAME_OK FEC 0x1002 B250 IEEE_T_1COL Frames Transmitted with Single Collision FEC 0x1002 B254 IEEE_T_MCOL Frames Transmitted with Multiple Collisions FEC 0x1002 B258 IEEE_T_DEF Frames Transmitted after Deferral Delay FEC 0x1002 B25C IEEE_T_LCOL Frames Transmitted with Late Collision Count of frames not counted correctly RMON Tx Packets > MAX_FL bytes, good crc RMON Tx Packets < 64 bytes, bad crc RMON Tx packets w > 2048 bytes RMON Tx Octets Count of frames not counted correctly Frames Transmitted OK MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-38 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description FEC 0x1002 B260 IEEE_T_EXCOL FEC 0x1002 B264 IEEE_T_MACERR Frames Transmitted with Tx FIFO Underrun FEC 0x1002 B268 IEEE_T_CSERR Frames Transmitted with Carrier Sense Error FEC 0x1002 B26C IEEE_T_SQE FEC 0x1002 B270 IEEE_T_FDXFC FEC 0x1002 B274 IEEE_T_OCTETS_OK FEC 0x1002 B284 RMON_R_PACKETS RMON Rx packet count FEC 0x1002 B288 RMON_R_BC_PKT RMON Rx Broadcast Packets FEC 0x1002 B28C RMON_R_MC_PKT RMON Rx Multicast Packets FEC 0x1002 B290 RMON_R_CRC_ALIGN RMON Rx Packets w CRC/Align error FEC 0x1002 B294 RMON_R_UNDERSIZE RMON Rx Packets < 64 bytes, good crc FEC 0x1002 B298 RMON_R_OVERSIZE FEC 0x1002 B29C RMON_R_FRAG FEC 0x1002 B2A0 RMON_R_JAB FEC 0x1002 B2A4 RMON_R_RESVD_0 FEC 0x1002 B2A8 RMON_R_P64 FEC 0x1002 B2AC RMON_R_P65TO127 RMON Rx 65 to 127 byte packets FEC 0x1002 B2B0 RMON_R_P128TO255 RMON Rx 128 to 255 byte packets FEC 0x1002 B2B4 RMON_R_P256TO511 RMON Rx 256 to 511 byte packets FEC 0x1002 B2B8 RMON_R_P512TO1023 RMON Rx 512 to 1023 byte packets FEC 0x1002 B2BC RMON_R_P1024TO2047 RMON Rx 1024 to 2047 byte packets FEC 0x1002 B2C0 RMON_R_P_GTE2048 FEC 0x1002 B2C4 RMON_R_OCTETS FEC 0x1002 B2C8 IEEE_R_DROP FEC 0x1002 B2CC IEEE_R_FRAME_OK FEC 0x1002 B2D0 IEEE_R_CRC FEC 0x1002 B2D4 IEEE_R_ALIGN FEC 0x1002 B2D8 IEEE_R_MACERR FEC 0x1002 B2DC IEEE_R_FDXFC FEC 0x1002 B2E0 IEEE_R_OCTETS_OK Octet count for Frames Rcvd w/o Error SCC 0x1002 C000 RED_START SCM Red Memory Start Addr Register SCC 0x1002 C004 BLACK_START SCM Black Memory Start Addr Register SCC 0x1002 C008 LENGTH Frames Transmitted with Excessive Collisions Frames Transmitted with SQE Error Flow Control Pause frames transmitted Octet count for Frames Transmitted w/o Error RMON Rx Packets > MAX_FL bytes, good crc RMON Rx Packets < 64 bytes, bad crc RMON Rx Packets > MAX_FL bytes, bad crc Reserved RMON Rx 64 byte packets RMON Rx packets w > 2048 bytes RMON Rx Octets Count of frames not counted correctly Frames Received OK Frames Received with CRC Error Frames Received with Alignment Error Receive Fifo Overflow count Flow Control Pause frames received SCM Encrypt/Decrypt Data Length Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-39 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description SCC 0x1002 C010 SCM_STAT SCC 0x1002 C014 SCM_ERROR SCC 0x1002 C018 INTERRUPT_CONTROL SCC 0x1002 C01C CONFIGURATION SCC 0x1002 C020 INIT_VECTOR 0 Initial Vector 0 Register SCC 0x1002 C024 INIT_VECTOR1 Initial Vector 1 Register SCC 0x1002 C400 – 0x1002 C7FF SCM_RED_MEM SCC 0x1002 C800 – 0x1002 CBFF SCM_BLACK_MEM SCM Black Memory SCC 0x1002 D000 SMN_STAT SMN Status Register SCC 0x1002 D004 SMN_COMMAND SCC 0x1002 D008 SEQ_START Sequence Start Value Register SCC 0x1002 D00C SEQ_END Sequence End Value Register SCC 0x1002 D010 SEQ_CHECK Sequence Check Register SCC 0x1002 D014 BIT_COUNT Bit Count Register SCC 0x1002 D018 BIT_BANK_INC_SIZE SCC 0x1002 D01C BIT_BANK_DEC SCC 0x1002 D020 CMP_SIZE Compare Size Register SCC 0x1002 D024 PLAINTEXT_CHECK Plaintext Check Register SCC 0x1002 D028 CIPHER CHECK SCC 0x1002 D02C TIMER IV SCC 0x1002 D030 TIMER CONTROL SCC 0x1002 D034 DEBUG DETECTOR STATUS SCC 0x1002 D038 TIMER Timer Register ETB REG 0x1003 B000 ETB_ID ETB Identify Register ETB REG 0x1003 B004 ETB_RAM_DEPTH ETB RAM depth Register ETB REG 0x1003 B008 ETB_RAM_WIDTH ETB RAM width Register ETB REG 0x1003 B00C ETB_STATUS ETB REG 0x1003 B010 ETB_DATA ETB REG 0x1003 B014 ETB_READ_POINTER ETB Read Pointer Register ETB REG 0x1003 B018 ETB_WRITE_POINTER ETB Write Pointer Register SCM Status Register SCC Error Status Register SCC Interrupt Control Register SCC Configuration Register SCM Red Memory SMN Command Register Bit Bank Increment Size Register Bit Bank Decrement Ciphertext Check Register Timer Initial Vector Register Timer Control Register Debug Port Detection Status Register ETB Status Register ETB Data Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-40 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description ETB REG 0x1003 B01C ETB_TRIGGER_COUNTER ETB REG 0x1003 B020 ETB_CONTROL JAM 0x1003 E000 JAM_ARM9P_GPR0 JAM ARM9P General Purpose Register 0 JAM 0x1003 E010 JAM_ARM9P_GPR4 JAM ARM9P General Purpose Register 4 MAX 0x1003 F000 MPR0 Master Priority Register for Slave Port 0 MAX 0x1003 F100 MPR1 Master Priority Register for Slave Port 1 MAX 0x1003 F200 MPR2 Master Priority Register for Slave Port 2 MAX 0x1003 F004 AMPR0 Alternate Master Priority Register for Slave Port 0 MAX 0x1003 F104 AMPR1 Alternate Master Priority Register for Slave Port 1 MAX 0x1003 F204 AMPR2 Alternate Master Priority Register for Slave Port 2 MAX 0x1003 F010 SGPCR0 General Purpose Control Register for Slave Port 0 MAX 0x1003 F110 SGPCR1 General Purpose Control Register for Slave Port 1 MAX 0x1003 F210 SGPCR2 General Purpose Control Register for Slave Port 2 MAX 0x1003 F014 ASGPCR0 Alternate SGPCR for Slave Port 0 MAX 0x1003 F114 ASGPCR1 Alternate SGPCR for Slave Port 1 MAX 0x1003 F214 ASGPCR2 Alternate SGPCR for Slave Port 2 MAX 0x1003 F800 MGPCR0 General Purpose Control Register for Master Port 0 MAX 0x1003 F900 MGPCR1 General Purpose Control Register for Master Port 1 MAX 0x1003 FA00 MGPCR2 General Purpose Control Register for Master Port 2 MAX 0x1003 FB00 MGPCR3 General Purpose Control Register for Master Port 3 MAX 0x1003 FC00 MGPCR4 General Purpose Control Register for Master Port 4 MAX 0x1003 FD00 MGPCR5 General Purpose Control Register for Master Port 5 AITC 0x1004 0000 INTCNTL Interrupt Control Register AITC 0x1004 0004 NIMASK Normal Interrupt Mask Register AITC 0x1004 0008 INTENNUM Interrupt Enable Number Register AITC 0x1004 000C INTDISNUM Interrupt Disable Number Register AITC 0x1004 0010 INTENABLEH Interrupt Enable Register High AITC 0x1004 0014 INTENABLEL Interrupt Enable Register Low AITC 0x1004 0018 INTTYPEH Interrupt Type Register High AITC 0x1004 001C INTTYPEL Interrupt Type Register Low AITC 0x1004 0020 NIPRIORITY7 Normal Interrupt Priority Level Register 7 AITC 0x1004 0024 NIPRIORITY6 Normal Interrupt Priority Level Register 6 AITC 0x1004 0028 NIPRIORITY5 Normal Interrupt Priority Level Register 5 ETB Trigger Counter Register ETB Control Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-41 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description AITC 0x1004 002C NIPRIORITY4 Normal Interrupt Priority Level Register 4 AITC 0x1004 0030 NIPRIORITY3 Normal Interrupt Priority Level Register 3 AITC 0x1004 0034 NIPRIORITY2 Normal Interrupt Priority Level Register 2 AITC 0x1004 0038 NIPRIORITY1 Normal Interrupt Priority Level Register 1 AITC 0x1004 003C NIPRIORITY0 Normal Interrupt Priority Level Register 0 AITC 0x1004 0040 NIVECSR Normal Interrupt Vector and Status Register AITC 0x1004 0044 FIVECSR Fast Interrupt Vector and Status Register AITC 0x1004 0048 INTSRCH Interrupt Source Register High AITC 0x1004 004C INTSRCL Interrupt Source Register Low AITC 0x1004 0050 INTFRCH Interrupt Force Register High AITC 0x1004 0054 INTFRCL Interrupt Force Register Low AITC 0x1004 0058 NIPNDH Normal Interrupt Pending Register High AITC 0x1004 005C NIPNDL Normal Interrupt Pending Register Low AITC 0x1004 0060 FIPNDH Fast Interrupt Pending Register High AITC 0x1004 0064 FIPNDL Fast Interrupt Pending Register Low CSI 0x8000 0000 CSICR1 CSI Control Register 1 CSI 0x8000 0004 CSICR2 CSI Control Register 2 CSI 0x8000 0008 CSISR CSI 0x8000 000C CSISTATR CSI 0x8000 0010 CSIRXR CSI 0x8000 0014 CSIRXCNT CSI RX Count Register CSI 0x8000 0018 CSIDEBUG CSI Debug Register CSI 0x8000 001C CSICR3 CSI Control Register 3 CSI Status Register CSI Statistic FIFO Register CSI RxFIFO Register ATA 0x8000_1000 TIME_CONFIG0 ATA timing parameter 0. ATA 0x8000_1004 TIME_CONFIG1 ATA timing parameter 1. ATA 0x8000_1008 TIME_CONFIG2 ATA timing parameter 2. ATA 0x8000_100C TIME_CONFIG3 ATA timing parameter 3. ATA 0x8000_1010 TIME_CONFIG4 ATA timing parameter 4. ATA 0x8000_1014 TIME_CONFIG5 ATA timing parameter 5. ATA 0x8000_1018 FIFO_DATA_32 32-bit wide data port to/from FIFO ATA 0x8000_101C FIFO_DATA_16 16-bit wide data port to/from FIFO ATA 0x8000_1020 FIFO_FILL ATA 0x8000_1024 ATA_CONTROL FIFO Filling in Halfwords ATA Interface Control Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-42 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description ATA 0x8000_1028 INT_PENDING Interrupt Pending Register ATA 0x8000_102c INT_ENABLE Interrupt Enable Register ATA 0x8000_1030 INT_CLEAR Interrupt Clear Register ATA 0x8000_1034 FIFO_ALARM FIFO Alarm Threshold ATA 0x8000_10A0 DCTR Drive Data Register ATA 0x8000_10A4 DDTR Drive Features Register ATA 0x8000_10A8 DFTR Drive Sector Count Register ATA 0x8000_10AC DSCR Drive Sector Number Register ATA 0x8000_10B0 DSNR Drive Cylinder Low Register ATA 0x8000_10B4 DCLR Drive Cylinder High Register ATA 0x8000_10B8 DCHR Drive Device Head Register ATA 0x8000_10BC DDHR Drive Command Register (W)/ Drive Status Register (R) ATA 0x8000_10D8 DCDR Drive Alternate Status Register (W)/ Drive Control Register (R) NFC 0xD800 0E00 NFC_BUFSIZE Internal SRAM Size NFC 0xD800 0E02 BLOCK_ADD_LOCK NFC 0xD800 0E04 RAM_BUFFER_ADDRESS NFC 0xD800 0E06 NAND_FLASH_ADD NAND Flash Address NFC 0xD800 0E08 NAND_FLASH_CMD NAND Flash Command NFC 0xD800 0E0A NFC_CONFIGURATION NFC Internal Buffer Lock Control NFC 0xD800 0E0C ECC_STATUS_RESULT Controller Status/Result of Flash Operation NFC 0xD800 0E0E ECC_RSLT_MAIN_AREA ECC Error Position of Main Area Data Error NFC 0xD800 0E10 ECC_RSLT_SPARE_AREA ECC Error Position of Spare Area Data Error NFC 0xD800 0E12 NF_WR_PROT NFC 0xD800 0E14 UNLOCK_START_BLK_ADD Start Address for Write Protection Unlock NFC 0xD800 0E16 UNLOCK_END_BLK_ADD End Address for Write Protection Unlock NFC 0xD800 0E18 NAND_FLASH_WR_PR_ST NFC 0xD800 0E1A NAND_FLASH_CONFIG1 Nand Flash Operation Configuration 1 NFC 0xD800 0E1C NAND_FLASH_CONFIG2 Nand Flash Operation Configuration 2 ESDCTL 0xD8001000 ESD_ESDCTL0 SDRAM/MDDR 0 Control Register ESDCTL 0xD8001004 ESD_ESDCFG0 SDRAM/MDDR 0 Timing Config Register ESDCTL 0xD8001008 ESD_ESDCTL1 SDRAM/MDDR 1 Control Register NAND Flash Block Address for Lock Check Buffer Number for Page Data Transfer To/ From Flash Memory Nand Flash Write Protection Current Nand Flash Write Protection Status MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-43 System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description ESDCTL 0xD800100C ESD_ESDCFG1 SDRAM/MDDR 1 Timing Config Register ESDCTL 0xD8001010 ESD_ESDMISC SDRAM/MDDR Miscellaneous Register WEIM 0xD800 2000 CS0U Chip Select 0 Upper Control Register WEIM 0xD800 2004 CS0L Chip Select 0 Lower Control Register WEIM 0xD800 2008 CS0A Chip Select 0 Addition Control Register WEIM 0xD800 2010 CS1U Chip Select 1 Upper Control Register WEIM 0xD800 2014 CS1L Chip Select 1 Lower Control Register WEIM 0xD800 2018 CS1A Chip Select 1 Addition Control Register WEIM 0xD800 2020 CS2U Chip Select 2 Upper Control Register WEIM 0xD800 2024 CS2L Chip Select 2 Lower Control Register WEIM 0xD800 2028 CS2A Chip Select 2 Addition Control Register WEIM 0xD800 2030 CS3U Chip Select 3 Upper Control Register WEIM 0xD800 2034 CS3L Chip Select 3 Lower Control Register WEIM 0xD800 2038 CS3A Chip Select 3 Addition Control Register WEIM 0xD800 2040 CS4U Chip Select 4 Upper Control Register WEIM 0xD800 2044 CS4L Chip Select 4 Lower Control Register WEIM 0xD800 2048 CS4A Chip Select 4 Addition Control Register WEIM 0xD800 2050 CS5U Chip Select 5 Upper Control Register WEIM 0xD800 2054 CS5L Chip Select 5 Lower Control Register WEIM 0xD800 2058 CS5A Chip Select 5 Addition Control Register WEIM 0xD800 2060 EIM M3IF 0xD8003000 M3IF_CTL M3IF 0xD8003028 M3IF_SCFG0 M3IF Snooping Configuration Register 0 M3IF 0xD800302C M3IF_SCFG1 M3IF Snooping Configuration Register 1 M3IF 0xD8003030 M3IF_SCFG2 M3IF Snooping Configuration Register 2 M3IF 0xD8003034 M3IF_SSR0 M3IF Snooping Status Register 0 M3IF 0xD8003038 M3IF_SSR1 M3IF Snooping Status Register 1 M3IF 0xD8003040 M3IFMLWE0 M3IF Master Lock WEIM CS0 Register M3IF 0xD8003044 M3IFMLWE1 M3IF Master Lock WEIM CS1 Register M3IF 0xD8003048 M3IFMLWE2 M3IF Master Lock WEIM CS2 Register M3IF 0xD800304C M3IFMLWE3 M3IF Master Lock WEIM CS3 Register M3IF 0xD8003050 M3IFMLWE4 M3IF Master Lock WEIM CS4 Register M3IF 0xD8003054 M3IFMLWE5 M3IF Master Lock WEIM CS5 Register EIM Configuration Register M3IF control register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-44 Freescale Semiconductor System Memory and Register Map Table 2-8. Register Map (continued) Module Name Address Register Name Description PCMCIA 0xD8004000 PCMCIA_PIPR PCMCIA Input Pins Register PCMCIA 0xD8004004 PCMCIA_PSCR PCMCIA Status Changed Register PCMCIA 0xD8004008 PCMCIA_PER PCMCIA Enable Register PCMCIA 0xD800400C PCMCIA_PBR0 PCMCIA Base Register 0 PCMCIA 0xD8004010 PCMCIA_PBR1 PCMCIA Base Register 1 PCMCIA 0xD8004014 PCMCIA_PBR2 PCMCIA Base Register 2 PCMCIA 0xD8004018 PCMCIA_PBR3 PCMCIA Base Register 3 PCMCIA 0xD800401C PCMCIA_PBR4 PCMCIA Base Register 4 PCMCIA 0xD8004020 PCMCIA_PBR5 PCMCIA Base Register 5 PCMCIA 0xD8004024 PCMCIA_PBR6 PCMCIA Base Register 6 PCMCIA 0xD8004028 PCMCIA_POR0 PCMCIA Option Register 0 PCMCIA 0xD800402C PCMCIA_POR1 PCMCIA Option Register 1 PCMCIA 0xD8004030 PCMCIA_POR2 PCMCIA Option Register 2 PCMCIA 0xD8004034 PCMCIA_POR3 PCMCIA Option Register 3 PCMCIA 0xD8004038 PCMCIA_POR4 PCMCIA Option Register 4 PCMCIA 0xD800403C PCMCIA_POR5 PCMCIA Option Register 5 PCMCIA 0xD8004040 PCMCIA_POR6 PCMCIA Option Register 6 PCMCIA 0xD8004044 PCMCIA_POFR0 PCMCIA Offset Register 0 PCMCIA 0xD8004048 PCMCIA_POFR1 PCMCIA Offset Register 1 PCMCIA 0xD800404C PCMCIA_POFR2 PCMCIA Offset Register 2 PCMCIA 0xD8004050 PCMCIA_POFR3 PCMCIA Offset Register 3 PCMCIA 0xD8004054 PCMCIA_POFR4 PCMCIA Offset Register 4 PCMCIA 0xD8004058 PCMCIA_POFR5 PCMCIA Offset Register 5 PCMCIA 0xD800405C PCMCIA_POFR6 PCMCIA Offset Register 6 PCMCIA 0xD8004060 PCMCIA_PGCR PCMCIA General Control Register PCMCIA 0xD8004064 PCMCIA_PGSR PCMCIA General Status Register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 2-45 System Memory and Register Map MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 2-46 Freescale Semiconductor Chapter 3 Clocks, Power Management, and Reset Control 3.1 Introduction There are two clock controller modules in the i.MX27 Multimedia Applications Processor: The ARM9 Platform Clock Controller and the PLL Clock Controller module (CCM), which produces the clock signals used and distributed by the ARM9 Platform Clock Controller. • ARM9 Platform Clock Controller—The primary function of the ARM9 Platform Clock Controller is to take the clock signals from the PLL Clock Controller and distribute them to various peripherals on the ARM9 Platform. The clock control module contains the logic to turn clocks on or off and to determine when the ARM9 Platform’s clock can be turned off. This module also synchronizes the JTAG interface to the CLK domain. • PLL Clock Controller—This module generates clock signals used throughout the i.MX27 chip and external peripherals. The PLL Clock Controller also serves as the interface between the ARM9 Platform and the peripherals on the i.MX27 device. The ARM9 Platform Clock Controller is not a user-programmable or accessible module, whereas the PLL Clock Controller is accessible—therefore, only the PLL Clock Controller is described in this chapter. 3.2 Clock Controller Architecture Block Diagram There are two DPLLs in the PLL Clock Controller—the MCU/System PLL (MPLL) and the Serial Peripheral PLL (SPLL), which uses digital and mixed analog/digital circuits to provide clock frequencies for wireless communication and other applications. The MPLL primarily generates the CLK signal to the ARM9 and HCLK (also called System clock) for the system bus and for most of the on-chip peripherals, including the LCDC pixel clock and the NAND Flash Controller clock. The SPLL produces the primary clock to the clock dividers for USB OTG, SSI1, and SSI2. Both MPLL and SPLL accept either the output of the FPM or the OSC26M as a source from which to generate the required frequencies for the ARM9 Platform and/or peripherals using a fractional frequency multiplication method. Detailed information about the calculation of the DPLL settings is shown in Section 3.2.2, “Output Frequency Calculations.” To produce the wide range of on-chip clock frequencies required by the i.MX27 processor, the core clock generator uses a two-stage phase locked loop. The first stage is a Frequency Pre-Multiplier PLL (FPM), which multiplies the input frequency by a factor of 1024. If the input crystal frequency is 32.768 kHz, the premultiplier multiplies it by a factor of 1024 to 33.554 MHz (32.768 MHz for a 32.0 KHz crystal). The output of the FPM is one of the clock sources for the MPLL and SPLL. Power management in the i.MX27 device is accomplished by controlling the clock output of the MPLL and SPLL units. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-1 Clocks, Power Management, and Reset Control The distribution of clocks in the i.MX27 processor is shown in the general block diagram, Figure 3-1. There are two external clock sources to the PLL Clock Controller: • 32 kHz external crystal • 26 MHz external source/crystal Settings in the Clock Source Control Register (CSCR) are used to independently configure the external clock sources applied to the MPLL and SPLL. OSC 32K CLK 32K FPM 0 MPLL CLK MPLL 1 FPM EN BYPASS[1] MPLLCLK SEL BYPASS[1] OSC26M DIS BYPASS[0] DIV 1P5 OSC 26M 1 0 UPLLCLK SEL BYPASS[1] 0 EXT 60M 1 BYPASS[0] OSC26M DIV1p5 0 UPLL SPLL 0 SPLLCLK CLK UPLL 1 1 BYPASS[2] Figure 3-1. i.MX27 Clock Distribution Block Diagram (1 of 2) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-2 Freescale Semiconductor Clocks, Power Management, and Reset Control B Y PA SS [2] A RM SRC 1 1 D IV 2 A R M D IV : E XT 26 6M A RM C LK A R M D IV 0 0 2X Cloc k Por t MMPLL CU DPLL A HB D IV : D IV 3 0 A H B CL K A H B DIV 1 IP G CL K IP G D IV E XT 26 6M N F C D IV : B Y PA S S[2] NF C D IV NFC PER 1 D IV : U A R T/G P T/P W M P E R 1D IV P E R 2 D IV : S D HC / C S P I P E R 2D IV P E R 3 D IV : LC D C P E R 3D IV PER 4 D IV : P E R 4D IV CSI SSI1 D IV : 1 S S I1D IV Ref Clo c k USSPLL B DP L L S S I1 0 S S I 2 D IV : 1 S S I2 S S I2D IV 0 M S HC D IV : 1 M S HC D IV M S HC 0 H2 6 4 D IV : 1 H 26 4D IV H 26 4 0 U S B D IV : U S B D IV US B Figure 3-2. i.MX27 Clock Distribution Block Diagram (2 of 2) Table 3-1. PLL Clock Controller Signal Descriptions Signal Names Description CLK Fast clock used only by ARM9 Platform for internal operations, such as executing instructions from the cache. Can be gated during Doze and Sleep mode when all the criteria are met to enter a low power. HCLK System clock. Appears as the BCLK input to the CPU and the HCLK to the system. This is a continuous clock (when the system is not in Sleep mode). It can be gated during Doze and Sleep mode when all the criteria are met to enter a low power. HCLKEN Used to signify the rising edge of CLK that corresponds to the rising edge of HCLK. It is used by the ARM9 Platform only. CLK60M 60 MHz clock for the USB OTG module SSI1CLK Divided clock output for the SSI1 module SSI2CLK Divided clock output for the SSI2 module NFCCLK Divided clock output for the NAND Flash Controller module H264CCLK Divided clock output for the H264 module MSHCCLK Divided clock output for the MSHC module MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-3 Clocks, Power Management, and Reset Control Table 3-1. PLL Clock Controller Signal Descriptions (continued) Signal Names Description PERCLK1 Divided clock output for peripheral set 1 (UART, Timer, PWM) PERCLK2 Divided clock output for peripheral set 2 (SDHC, CSPI) PERCLK3 Divided clock output for the LCDC PERCLK4 Divided clock output for the CSI CLKO Selected internal clock output to the CLKO pin A9P_CLK_OFF Control signal from the ARM9 Platform Clock Controller 3.2.1 High Frequency Clock Source and Distribution Two DPLLs—MPLL and SPLL—on the i.MX27 device are used to generate two separate clock frequencies from either the Frequency Pre-Multiplier (FPM) or an external high frequency source (CLK26M). The clock source for each DPLL is individually selected using bits in the Clock Source Control Register (CSCR). The MCU/System PLL (MPLL) is configured by the MPCTL registers (MPCTL0, MPCTL1) to produce system clock signals that are divided down to output the FCLK (for example 266 MHz) and the HCLK (for example, 133 MHz) clock signals. MPLL serves as the clock source for the PERCLK4, PERDIV3, PERDIV2, and PERDIV1. FCLK serves as the clock source for the NFCDIV divider. These dividers produce the clock signals for the following: • NAND Flash Controller (NFC) • Peripheral set 1 (PERCLK1): UART, Timer, and PWM • Peripheral set 2 (PERCLK2): SDHC and CSPI • LCDC Pixel Clock (PERCLK3) • CSI (PERCLK4) Serial Peripheral PLL (SPLL) is configured by SPCTL registers (SPCTL0, SPCTL1) and produces input signals for the USBDIV, SSI1DIV, SSI2DIV, H264DIV, and MSHCDIV dividers, which generate clock signals for serial peripherals that require special clock frequencies: • CLK60M—for the USB OTG • SSI1CLK—Clock signal for SSI1 • SSI2CLK—Clock signal for SSI2 • H264CCLK—Clock signal for H264 • MSHCCLK—Clock signal for MSHC The clock source for the SSI1DIV and SSI2DIV dividers can be the MPLL or SPLL. Source selection is controlled by the respective bits in the Clock Source Control register (CSCR). MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-4 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.2.2 Output Frequency Calculations Both DPLLs produce a high frequency clock that exhibits a low frequency jitter and a low phase jitter. The DPLL output clock frequency (fdpll) is determined by the Equation 3-1: fdpll = 2fref • MFI + MFN / (MFD+1) PD+1 Eqn. 3-1 where: • fref is the reference frequency (1024 × 32.768 kHz, 1024 × 32.0 kHz, or 26 MHz). • MFI is an integer part of a multiplication factor (MF). • MFN is the numerator and MFD is the denominator of the MF. • PD is the predivider factor. NOTE In bootstrap mode, the PLL registers assume a source clock of 32.768 KHz. If using bootstrap mode, use a 32.768 KHz crystal. 3.3 Power Management The PLL Clock Controller module is designed with clock control at various stages of clock supply to achieve optimum power savings. The operation of the PLL and clock controller at different stages of power management is described in the following sections. 3.3.1 PLL Operation at Power-Up The crystal oscillator begins oscillating within several hundred milliseconds of initial power-up. While system reset remains asserted the PLL begins the lockup sequence and locks 1 ms after the crystal oscillator becomes stable. Both DPLLs are enabled on power-up. The system reset is held asserted by the PLL Clock Controller for 300 ms + 14 cycles of the 32 kHz, as shown in Figure 3-17. 3.3.2 PLL Operation at Wake-Up When the device is awakened from Sleep mode by a wake-up event, the DPLL locks within 350 μs. The crystal oscillator is always on after initial power-up, so crystal startup time is not a factor. The PLL output clock starts operating as soon as it achieves lock. 3.3.3 i.MX27 Processor Low-Power Modes The i.MX27 processor provides two power saving modes—Doze mode and Sleep mode: • In Doze mode, the ARM9 executes a wait for interrupt (WFI) instruction. System clocks are still active. • In Sleep mode, the ARM9 executes a wait for interrupt (WFI) instruction. The output of the MPLL and SPLL are shut down and only the 32 kHz clock is running. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-5 Clocks, Power Management, and Reset Control These modes are controlled by the clock control logic and a sequence of CPU instructions. Most of the peripheral modules can enable or disable the incoming clock signal through clock gating circuitry from the peripheral bus. Each module has a module enable bit which, when disabled, disables the operational clock to the module. The i.MX27 PLL Clock Controller provides the Low-Power mode information to the Watchdog (WDOG) module. 3.3.3.1 Doze Mode Doze mode is defined as when the ARM9 executes a wait for an interrupt instruction, after which the buffered clock supply to the MCU is turned off. The sequence of operation to set the system to Doze mode is as follows: 1. Enable desired interrupts for wake-up from Doze mode. 2. Disable watchdog timer interrupt. 3. Execute wait-for-interrupt instruction. The ARM9 executes a wait for interrupt instruction if all required conditions are met (no irq, fiq, or debug requests pending), the ARM9 Platform generates an A9P_CLK_OFF signal to the PLL Clock Controller module. The CLK signal to the MCU is immediately turned off when the A9P_CLK_OFF signal goes active. CLK_ALWAYS and system bus (HCLK) remain running. HCLK is required by the Cross Bar Switch within the ARM9 Platform for continuous operation of peripheral modules. When an unmasked interrupt event occurs, the CLK signal to the ARM9 is re-enabled. 3.3.3.2 Sleep Mode Sleep mode is defined as when all the DPLLs clock outputs are disabled. A sequence of operations and criteria must be satisfied before the system turns off the MPLL and SPLL. The Sleep mode sequence is initiated when the MPEN bit in the CSCR register is cleared disabling the MPLL. This action also automatically turns off the SPLL. The sequence to put the system into Sleep mode is as follows: 1. Disable AHB peripherals from bus accesses. 2. Enable desired interrupts to be used for system wake-up. 3. Disable watchdog timer interrupt. 4. Set the required value to the SD_CNT (CSCR register) for shutdown countdown. 5. Disable the MPLL by clearing the MPEN bit (CSCR register). 6. Execute wait-for-interrupt instruction. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-6 Freescale Semiconductor Clocks, Power Management, and Reset Control The example of programming setup to enter Sleep mode is as follows: Code Example 3-1. Programming Setup for Entering Sleep Mode MRS AND MSR LDR LDRH ORR STRH LDR LDR ORR STR BIC STR LDR MCR r0, CPSR ; Enable interrupts r1, r0, #(ENABLE_IRQ+ENABLE_FIQ+MODE_BITS) CPSR_c, r1 r3, =WDG_BASEADDR ; Disable WDG Timer r4, [r3, #0x0] r4, r4, #0x00000001 r4, [r3, #0x0] r1, =CRM_BASEADDR ; Set SDCNT to ‘01’ r2, [r1, #0x0] r2, r2, #0x0100_0000 r2, [r1, #0x0] r2, r2, #0x00000001 ; Disable MPEN r2, [r1, #0x0] r1, 0x00000000 p15, 0, r1, c7, c0, 4 ; WFI The MPLL and SPLL are turned off when the countdown value in SD_CNT is satisfied. For the MPLL, there are a number of conditions that must be satisfied before the Clock Controller module turns off the DPLL. The conditions to be satisfied before the PLL Clock Controller actually turns off the MPLL are as follows: 1. Clock Controller module has successfully mastered the system bus. 2. The A9P_CLK_OFF signal from the ARM9 Platform is active. 3. SDRAM controller has successfully placed the external SDRAM into Self-Refresh mode. 4. After the above conditions are satisfied, the countdown based on the value in the SD_CNT field will be initiated. 5. SD_CNT countdown completes. When the conditions listed above are satisfied the MPLL and the SPLL will be turned off. The Frequency Premultiplier (FPM) is also disabled in the Sleep mode. The FPM_EN bit (CSCR register) must not be cleared if the FPM is providing the clock source to the DPLL. When an unmasked interrupt event occurs, the FPM and then the MPLL are re-enabled and the MPLL enable bit (MPEN) automatically restored to its enable setting. The SPLL is restored to its original state based on the setting of the SPEN bit before Sleep mode. If the SPLL was not enabled before entering Sleep mode the SPLL will not be enabled. The total start-up time from Sleep mode is the sum of the FPM lock time and the DPLL lock time. In Sleep mode, the i.MX27 device retains all RAM data and register configuration values. Data to output terminals is also maintained and thus will continue to sink/source static current. NOTE System software must ensure that if there are any clocks being sourced by the i.MX27 processor to external peripherals (for example, SSI MCLK), then the corresponding PLL must not be turned off. In such cases, the i.MX27 processor must remain in Doze mode. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-7 Clocks, Power Management, and Reset Control 3.3.4 SDRAM Power Modes When the SDRAM controller (SDRAMC) is enabled, the external SDRAM operates in Distributed-Refresh mode or in Self-Refresh mode (as shown in Table 3-2). The SDRAM wake-up latency is approximately 20 system clock cycles (HCLK). The SDRAMC can wake up from Self-Refresh mode when it is in a SDRAM cycle. In Doze and Run mode, the Power Down timers within the SDRAMC can be enabled to cause the SDRAM to enter Power Down mode on detecting no activity. The SDRAMC still controls the refresh and it takes the SDRAM out of the Power Down mode to perform refresh when needed and then put it back into the Power Down mode. In Power Down mode the clock to the SDRAM is gated off and the CKE pin goes low. In addition since the SDRAM will be in self refresh just when the system get into Sleep mode, no bus cycle can access the SDRAM to cause it to exit the Self-Refresh mode. Exit from Self-Refresh mode will happen when the chip will exit the Sleep mode and re-enable the MPEN. Table 3-2. SDRAM Operation During Power Modes SDRAM Run Doze Stop SDRAM Distributed-refresh, Note 1 Distributed-refresh, Note 1 Self-refresh 3.3.5 Power Management in the PLL Clock Controller The i.MX27 device has a very efficient clock control scheme that enables clocking control of the modules and devices at various stages. Power management in the i.MX27 device is achieved by controlling the duty cycles of the clock system efficiently. The clocking control scheme is shown in Table 3-3. Table 3-3. Power Management in the Clock Controller Device/Signal Shut-Down Conditions Wake-Up Conditions MPLL When 0 is written to the MPEN bit and the PLL shut-down count times out (for details see the SD_CNT settings in Table 3-6). When IRQ or FIQ is asserted SPLL When 0 is written to the SPEN bit. When the SPEN bit is set to 1 FPM When 0 is written to the FPMEN bit. When the FPMEN bit is set to 1 CLK32 Continuously running. Continuously running Most modules in the i.MX27 processor have a module enable bit assigned which must be enabled before the module is active. Enabling the module enables the clock source for the module to be provided for its main operations. The clock input to the dividers from the SPLL is also controlled separately in the same manner. 3.3.6 Power Management Using Frequency Control The i.MX27 processor has DPTC, but does not support the DVFS feature. The i.MX27 device provides a way for software to save power under different operating conditions. • Software determines whether to change the operation frequency or not. • Software uses DPTC to determine whether to reduce or increase the power supply. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-8 Freescale Semiconductor Clocks, Power Management, and Reset Control • • After the power supply has been changed, software can update MPLL configuration. It restarts the MPLL and operates with new frequency. 3.4 Memory Map and Register Definition The PLL Clock Controller module includes six user-accessible 32-bit registers. Table 3-4 provides the memory map for the PLL Clock Controller. Table 3-4. PLL Clock Controller Memory Map Address Register Access Reset Value Section/Page General Registers 0x1002_7000 (CSCR) Clock Source Control Register R/W 0x33F0_1307 3.4.2/3-10 0x1002_7004 (MPCTL0) MPLL Control Register 0 R/W 0x0021_1803 3.4.3/3-13 0x1002_7008 (MPCTL1) MPLL Control Register 1 R/W 0x0000_8000 3.4.4/3-15 0x1002_700C (SPCTL0) SPLL Control Register 0 R/W 0x8403_1C53 3.4.6/3-17 0x1002_7010 (SPCTL1) SPLL Control Register 1 R/W 0x0000_8000 3.4.7/3-19 0x1002_7014 (OSC26MCTL) Oscillator 26M Register R/W 0x0000_3F00 3.4.8/3-20 0x1002_7018 (PCDR0) Peripheral Clock Divider Register 0 R/W 0x2008_3403 3.4.9/3-21 0x1002_701C (PCDR1) Peripheral Clock Divider Register 1 R/W 0x1204_1303 3.4.10/3-23 0x1002_7020 (PCCR0) Peripheral Clock Control Register 0 R/W 0x0401_01C0 3.4.11/3-25 0x1002_7024 (PCCR1) Peripheral Clock Control Register 1 R/W 0xFF4B_6848 3.4.12/3-28 0x1002_7028 (CCSR) Clock Control Status Register R/W 0x0000_0300 3.4.13/3-31 0x1002_7034 (WKGDCTL) Wakeup Guard Mode Control Register R/W 0x0000_0000 3.4.14/3-33 3.4.1 Register Summary The conventions in Figure 3-3 and Table 3-5 serve as a key for the register summary and individual register diagrams. Always reads 1 1 Always reads 0 0 R/W BIT Read- BIT WriteWrite 1 BIT Self-clear 0 bit only bit only bit BIT to clear w1c bit BIT N/A Figure 3-3. Key to Register Fields Table 3-5 provides a key for register figures and tables and the register summary. Table 3-5. Register Conventions Convention Description Depending on its placement in the read or write row, indicates that the bit is not readable or not writable. FIELDNAME Identifies the field. Its presence in the read or write row indicates that it can be read or written. Register Field Types MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-9 Clocks, Power Management, and Reset Control Table 3-5. Register Conventions (continued) Convention Description R Read only. Writing this bit has no effect. W Write only. R/W Standard read/write bit. Only software can change the bit’s value (other than a hardware reset). rwm A read/write bit that may be modified by a hardware in some fashion other than by a reset. w1c Write one to clear. A status bit that can be read, and is cleared by writing a one. Self-clearing bit Writing a one has some effect on the module, but it always reads as zero. (Previously designated slfclr) Reset Values 0 Resets to zero. 1 Resets to one. — Undefined at reset. u Unaffected by reset. [signal_name] 3.4.2 Reset value is determined by polarity of indicated signal. Clock Source Control Register (CSCR) The Clock Source Control Register controls the various clock sources to the internal modules of the i.MX27 processor. Figure 3-4 shows the register and Table 3-6 provides the field descriptions. 0x1002_7000 (CSCR) 31 R 30 27 26 0 0 USB_DIV 25 24 SD_CNT 23 22 21 20 19 18 17 16 SPLL MPLL SSi2_ SSI1_ H264 MSHC SP_S MCU _RES _RES SEL SEL _SEL _SEL EL _SEL TART TART 0 0 1 1 0 0 1 1 1 1 1 1 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R ARM W SRC Reset 28 0 W Reset 29 Access: User R/W 0 0 ARMDIV 0 0 1 AHBDIV 0 0 1 1 OSC2 OSC2 FPM_ SPE MPE 6M_DI 6M_D EN N N IS V1P5 0 0 1 1 1 Figure 3-4. Clock Source Control Register (CSCR) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-10 Freescale Semiconductor Clocks, Power Management, and Reset Control Table 3-6. Clock Source Control Register Field Descriptions Field 31 UPDATE_DIS 30–28 USB_DIV 27–26 25–24 SD_CNT Description Disable source selection and divider update until next MPLL lock. This bit is cleared automatically. When reprogramming the PLL and corresponding CSCR settings, this bit must first be set before the CSCR is updated and DPLL is reprogrammed to ensure that erratic clock behavior does not occur. USB Clock Divider. Contains the 3-bit integer divider value for generation of CLK60M. 000 SPLL_CLK divided by 1 001 SPLL_CLK divided by 2 ... 111 SPLL_CLK divided by 8 Reserved. These bits are reserved and should read 0. Shut-Down Control. Contains the value that determines duration of DPLL clock output before it goes off after a 0 is written to the MPEN or SPEN bit. Note: Power controller requests the bus before SPLL shutdown. Any unmasked interrupt event will enable MPLL. 00 DPLL shuts down after the next rising edge of CLK32 is detected and the current bus cycle is completed. A minimum of 16 HCLK cycles is occurs after writing 0 to MPEN bit. 01 DPLL shuts down after second rising edge of CLK32 is detected and the current bus cycle is completed. 10 DPLL shuts down after third rising edge of CLK32 is detected and the current bus cycle is completed. 11 DPLL shuts down after forth rising edge of CLK32 is detected and the current bus cycle is completed. 23 SSI2_SEL SSI2 Baud Source Select. Selects the clock source to SSI2 fractional divider (SSI2_DIV). 0 Source clock to SSI2 fractional divider from SPLL 1 Source clock to SSI2 fractional divider from MPLL 22 SSI1_SEL SSI1 Baud Source Select. Selects the clock source to SSI1 fractional divider (SSI1_DIV). 0 Source clock to SSI1 fractional divider from SPLL 1 Source clock to SSI1 fractional divider from MPLL 21 H264_SEL H264 CCLK Source Select. Selects the clock source to H264 divider (H264_DIV). 0 Source clock to H264 divider is from SPLL 1 Source clock to H264 divider is from MPLL 20 MSHC_SEL MSHC CCLK Source Select. Selects the clock source to MSHC divider (MSHC_DIV). 0 Source clock to MSHC divider is from SPLL 1 Source clock to MSHC divider is from MPLL 19 SPLL_RESTART SPLL Restart. Restarts SPLL at the new assigned frequency. SPLL_RESTART self-clears after 1 (min) or 2 (max) cycles of CLK32. 0 No Effect 1 Restarts SPLL at new frequency 18 MPLL Restart. Restarts MPLL at the new assigned frequency. MPLL_RESTART self-clears after 1 (min) MPLL_RESTART or 2 (max) cycles of CLK32. 0 No Effect 1 Restarts MPLL at new frequency 17 SP_SEL SPLL Select. Selects clock source of SPLL input. When set, the external high frequency clock input is selected. 0 Clock source is the internal premultiplier. Register map shows this bit as reserved also conflicts with 1 Clock source is the external high frequency clock MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-11 Clocks, Power Management, and Reset Control Table 3-6. Clock Source Control Register Field Descriptions (continued) Field Description 16 MCU_SEL MPLL Select. Selects clock source of MPLL input. When set, the external high frequency clock input is selected. 0 Clock source is the internal premultiplier. 1 Clock source is the external high frequency clock. 15 ARM SRC ARMSRC. It selects the ARM clock source. 0 MPLL CLK * 2 / 3 1 MPLL CLK 13–12 ARM_DIV ARM_DIV. Divider value for arm clk. 00 divide by 1 01 divide by 2 10 divide by 3 11 divide by 4 11–10 Reserved AHB_DIV. Divider value for AHB clk. 00 divide by 1 01 divide by 2 10 divide by 3 11 divide by 4 9-8 AHB_DIV 7–5 Reserved 4 Oscillator 26M Divide Enable. Divides osc26m output by 1 or 1.5. OSC26M_DIV1P5 0 osc26m output divide by 1 (default) 1 osc26m output divide by 1.5 3 OSC26M_DIS Oscillator Disable. Disables the internal (on-chip) 26 MHz oscillator circuit when this bit is set to 1. 0 Enable the internal 26 MHz oscillator circuit 1 Disable the internal 26 MHz oscillator circuit 2 FPM_EN Frequency Premultiplier Enable. Enables/disables FPM when set/cleared. This bit is set automatically on system reset. When the software writes a 0 to this bit, FPM is shut down immediately. This bit must remain at 1 prior and during Sleep mode if FPM is providing the source to the DPLL. 0 Disable the frequency premultiplier circuit 1 Enable the frequency premultiplier circuit 1 SPEN Serial Peripheral PLL Enable. Enables/disables the SPLL. When software writes 0 to SPEN, SPLL shuts down after timeout determined by SD_CNT. SPEN sets automatically when SPLLEN asserts, and on system reset. 0 Serial Peripheral PLL disabled 1 Serial Peripheral PLL enabled 0 MPEN MPLL Enable. Enables/disables the MPLL. When software writes 0 to MPEN, MPLL shuts down after SDCNT timeout. MPEN sets automatically when MPLLEN asserts, and on system reset. 0 MCU and Serial PLL disabled 1 MCU and Serial PLL enabled NOTE When PRESC and BCLKDIV are modified at the same time, it must be performed in two programming steps: The first step is to change BCLKDIV, and then to change PRESC. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-12 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.3 MPLL Control Register 0 (MPCTL0) The MCU and System PLL Control Register 0 (MPCTL0) is a 32-bit register that controls the operation of the MPLL. The MPCTL0 control bits are described in the following sections. Figure 3-5 shows the register and Table 3-7 provides the field descriptions. The following is the recommended procedure for changing the MPLL settings: 1. Program the desired values of PD, MFD, MFI, and MFN into the MPCTL0. 2. Set the MPLL_RESTART bit in the CSCR (it will self-clear). 3. New MPLL settings will take effect. 4. The new PLL clock output is valid upon the assertion of the DPLL lock flag. 0x1002_7004 (MPCTL0) 31 R 30 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 0 CPLM PD MFD W Reset R 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 1 1 MFI MFN W Reset 0 0 0 1 1 0 0 0 0 0 0 Figure 3-5. MPLL Control Register 0 (MPCTL0) Table 3-7. MPLL Register 0 Field Descriptions Field Description 31 CPLM Phase Lock Mode. DPLL operates in the Frequency Only Lock mode (FOL) when CPLM bit is cleared, and in Frequency and Phase Lock mode (FPL) when the bit is set. FPL mode can be used for both integer and fractional multiplication factor, but phase skew elimination is accomplished only for integer MF. 0 FOL 1 FPL 30 29–26 PD Reserved. This bit is reserved and should read 0. Predivider Factor. Defines the predivider factor (PD) applied to MPLL input frequency. PD is an integer between 0 and 15 (inclusive). PD is chosen to ensure that the resulting output frequency remains within the specified range. When a new value is written into PD, MPLL loses its lock; and after a time delay, MPLL re-locks. MPLL output is determined by Equation 3-1. 0000 0 0001 1 … 1111 15 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-13 Clocks, Power Management, and Reset Control Table 3-7. MPLL Register 0 Field Descriptions (continued) Field Description 25–16 MFD Multiplication Factor (Denominator Part). Defines the denominator part of BRM value for MF. When a new value is written into the MFD bits, MPLL loses its lock; and after a time delay, MPLL re-locks. 000 Reserved 001 1 … 3FF 1023 15–14 Reserved. These bits are reserved and should read 0. 13–10 MFI Multiplication Factor (Integer). Defines the integer part of BRM value for MF. MFI is encoded so that MFI < 5 results in MFI = 5. When a new value is written into the MFI bits, PLL loses its lock: and after a time delay, PLL re-locks. VCO oscillates at a frequency determined by Equation 3-1. Where PD is the division factor of the predivider, MFI is the integer part of total MF, MFN is the numerator of the fractional part of MF, and MFD is its denominator part. MF is chosen to ensure that the resulting VCO output frequency remains within the specified range. 0000–01015 0110 6 ... 1111 15 9–0 MFN Multiplication Factor (Numerator). Defines the numerator of BRM value for MF. The MFN is the only part in the DPLL Configuration that can be changed after the DPLL was locked without resetting the DPLL (on the fly).The bit 9 is the sign bit. When MFN is zero, the circuitry for fractional division is disabled to save power. 000 0 001 1 ... 1FE 510 1FF reserved ... 3FE –510 3FF Reservoir The recommended settings for MPLL and SPLL that produce the least amount of signal jitter are shown in Table 3-8. Table 3-8. Recommend Settings for Frequency Stability Ref Frequency Target Frequency MFI MFN MFD PD MPCTL0 Setting Actual Calculated Frequency 32.768 kHz 399 MHz 5 469 495 0 0x01EF15D5 399.000 32.000 kHz 399 MHz 6 3 21 0 0x00211803 398.998 26 MHz 399 MHz 7 35 51 0 0x00331C23 399 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-14 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.4 MCU and System PLL Control Register 1 (MPCTL1) The MCU and System PLL Control Register 1 (MPCTL1) is a 32-bit register that directs the operation of the on-chip MCU PLL. Figure 3-6 shows the register and Table 3-9 provides the field descriptions. 0x1002_7008 (MPCTL1) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R LF BRMO W Reset 1 0 0 0 0 0 0 0 0 0 0 Figure 3-6. MCU and System PLL Control Register 1 (MPCTL1) Table 3-9. MCU and System PLL Control Register 1 Field Descriptions Field 31–16 15 LF 14–7 6 BRMO 5–0 Description Reserved. These bits are reserved and should read 0. Lock Flag. Indicates whether MPLL is locked or not. When set, MPLL clock output is valid. When cleared, MPLL clock output remains at logic high. 0 MPLL is not locked. 1 MPLL is locked. Reserved. These bits are reserved and should read 0. BRM Order. Controls the BRM order which affects jitter performance of MPLL. The first order BRM is used if a MF fractional part is more than 1/10 and less than 9/10. In other cases, second order BRM is used. BRMO bit is cleared by a hardware reset. A delay of reference cycles is required between two write accesses to BRMO. 0 BRM contains first order. 1 BRM contains second order. Reserved. These bits are reserved and should read 0. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-15 Clocks, Power Management, and Reset Control 3.4.5 Programming the Serial Peripheral PLL (SPLL) One of the clock frequencies that the SPLL generates is for the USB OTG module (CLK60M). Its frequency is set to 60 MHz using the SPLL control registers assuming a default input clock frequency 32.768 MHz. This input clock frequency assumes a 32 kHz crystal input. The predivider/multiplier output depends on the input clock frequency. Recommended settings are provided for the Serial Peripheral PLL as shown in Table 3-10. Table 3-10. Serial PLL Multiplier Factor Ref Frequency Target Frequency MFI MFN MFD PD SPCTL0 Setting Actual Calculated Frequency 32.768 kHz 300 MHz 8 111 117 1 0x0475206F 299.99937 MHz 32.768 kHz 240 MHz 7 9 58 1 0x043A1C09 239.99950 MHz 32 kHz 300 MHz 9 25 160 1 0x04A02419 300.00020 MHz 32 kHz 240 MHz 7 83 255 1 0x04FF1C53 240 MHz 26 MHz 300 MHz 11 7 12 1 0x040C2C07 300 MHz 26 MHz 240 MHz 9 3 12 1 0x040C2403 240 MHz MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-16 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.6 SPLL Control Register 0 (SPCTL0) The Serial Peripheral PLL Control Register 0 (SPCTL0) is a 32-bit register that controls the operation of the SPLL. The SPCTL0 control bits are described in the following sections. Figure 3-7 shows the register and Table 3-11 provides the field descriptions. The following is a procedure for changing the Serial Peripheral PLL settings: 1. Program the desired values of PD, MFD, MFI, and MFN into the SPCTL0. 2. Set the SPLL_RESTART bit in the CSCR (it will self-clear). 3. New PLL settings will take effect. 4. The new PLL clock output is valid upon the assertion of the DPLL lock flag. 0x1002_700C (SPCTL0) 31 R 30 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 0 CPLM PD MFD W Reset R 1 0 0 0 0 1 0 0 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 1 0 0 1 1 MFI MFN W Reset 0 0 0 1 1 1 0 0 0 1 0 Figure 3-7. SPLL Control Register 0 (SPCTL0) Table 3-11. SPLL Control Register 0 Field Descriptions Field Description 31 CPLM Phase Lock Mode. DPLL operates in the Frequency Only Lock mode (FOL) when CPLM bit is cleared, and in Frequency and Phase Lock mode (FPL) when the bit is set. FPL mode can be used for both integer and fractional multiplication factor, but phase skew elimination is accomplished only for integer MF. 0 FOL 1 FPL 30 29–26 PD Reserved. These bit is reserved and should read 0. Predivider Factor. Defines the predivider factor (PD) that is applied to the PLL input frequency. PD is an integer between 0 and 15 (inclusive). SPLL oscillates at a frequency determined by Equation 3-1. PD is chosen to ensure that the resulting VCO output frequency remains within the specified range. When a new value is written into the PD bits, SPLL loses its lock: and after a time delay, SPLL re-locks. 0000 0 0001 1 … 111115 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-17 Clocks, Power Management, and Reset Control Table 3-11. SPLL Control Register 0 Field Descriptions (continued) Field Description 25–16 MFD Multiplication Factor (Denominator Part). Defines the denominator part of BRM value for the MF. When a new value is written into the MFD9 to MFD0 bits, PLL loses its lock: and after a time delay, PLL re-locks. 000 Reserved 001 1 … 3FF 1023 15–14 Reserved. These bits are reserved and should read 0. 13–10 MFI Multiplication Factor (Integer Part). Defines the integer part of BRM value for MF. MFI is decoded so that MFI < 5 results in MFI = 5. SPLL oscillates at a frequency determined by Equation 3-1. Where PD is the division factor of the predivider, MFI is the integer part of total MF, MFN is the numerator of fractional part of MF, and MFD is the denominator part of MF. MF is chosen to ensure that the resulting VCO output frequency remains within the specified range. When a new value is written into the MFI bits, SPLL loses its lock; and after a time delay, SPLL re-locks. 0000–01015 0110 6 ... 1111 15 9–0 MFN Multiplication Factor (Numerator). Defines the numerator of BRM value for MF. The MFN is the only part in the DPLL Configuration that can be changed after the DPLL was locked without resetting the DPLL (on the fly).The bit 9 is the sign bit. When MFN is zero, the circuitry for fractional division is disabled to save power. 0x0000 0x0011 ... 0x1FE 510 0x1FF Reserved ... 0x3FE-510 0x3FF Reserved MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-18 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.7 SPLL Control Register 1 (SPCTL1) The Serial PLL Control Register 1 (SPCTL1) is a 32-bit read/write register that directs the operation of the SPLL. The SPCTL1 control bits are described in this section. Figure 3-8 shows the register and Table 3-12 provides the field descriptions. 0x1002_7010 (SPCTL1) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R LF BRMO W Reset 1 0 0 0 0 0 0 0 0 0 Figure 3-8. SPLL Control Register 1 (SPCTL1) Table 3-12. Serial Peripheral PLL Control Register 1 Field Descriptions Field 31–16 15 LF 14–7 6 BRMO 5–0 Description Reserved. These bits are reserved and should read 0. Lock Flag. Indicates whether SPLL is locked or not. When set, SPLL clock output is valid. When cleared, SPLL clock output remains at logic high. 0 SPLL is not locked. 1 SPLL is locked. Reserved. These bits are reserved and should read 0. BRM Order. Controls the BRM order which affect SPLL jitter performance. The first order BRM is used if a MF fractional part is more than 1/10 and less than 9/10. In other cases, second order BRM is used. BRMO bit is cleared by a hardware reset. A delay of reference cycles is required between two write accesses to BRMO. 0 BRM contains first order. 1 BRM contains second order. Reserved. These bits are reserved and should read 0. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-19 Clocks, Power Management, and Reset Control 3.4.8 Oscillator 26M Register This register is use to program the 26 MHz oscillator test modes as well as the gain control. Trimming of the oscillator is necessary only on initial power up; the trim may be stored in Flash for future reference. Figure 3-9 shows the register and Table 3-13 provides the field descriptions. 0x1002_7014 (OSC26MCTL) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 19 18 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R 17 16 OSC26M_ PEAK AGC W Reset 0 0 1 1 1 1 1 1 Figure 3-9. Oscillator 26M Control Register (OSC26MCTL) Table 3-13. Oscillator 26M Control Register Field Descriptions Field 31–18 Description Reserved. These bits are reserved and should read 0. 17–16 OSC26M_PEAK. These bits indicates the current amplitude status from the oscillator. OSC26M_PEAK 00 Amplitude in desired operating range 01 Amplitude too low; trim higher 10 Amplitude too high; trim lower 11 Invalid state 13–8 AGC Automatic Gain Control. These bits sets the magnitude of crystal oscillations based on OSC26M_PEAK status. Optimum settings for these bits is determined using the algorithm in Section 3.4.8.1, “Adjusting the 26 MHz Oscillator Trim.” 7–0 Reserved. These bits are reserved and should read 0. Reserved Bits 7–0 3.4.8.1 Reserved—These bits are reserved and should read 0. Adjusting the 26 MHz Oscillator Trim To ensure a proper startup of the 26 MHz oscillator on power-up or system reset use the following steps to determine the optimum trim of the oscillator AGC. To ensure proper startup of 26 MHz oscillator on power-up or system reset, use Example 3-2 to determine optimum trim. This algorithm must be run to determine optimum AGC setting. Once done, software must read the trim value from external memory and write it to OSC26M_AGC[5:0]. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-20 Freescale Semiconductor Clocks, Power Management, and Reset Control Example 3-2. 26 MHz Oscillator Trim Programming Algorithm 1. At power up or system reset, OSC26M_AGC[5:0] bits in the OSC26MCTL register are reset to logic 1 (done in hardware, no software interaction required). 2. Read the peak amplitude value in bits OSC26M_PEAK[1:0] in the OSC26MCTL register. 3. If the amplitude is not in the desired range, adjust by decrementing the OSC26M_AGC[5:0] by 1 count. 4. Wait at least 30.5 us (1 cycle of 32 kHz clock) for system to update OSC26M_PEAK bits. 5. Repeat steps 2 to 4 until trimmed in desired range. 6. Decrement 4 additional counts to provide a margin of error for temperature drift. 7. Store trim value in an external memory—that is, Flash, for future use. It is suggested that the proceeding algorithm be run to determine the optimum AGC setting. Once this is done on power-up or system reset the software must read the trim value from the external memory and write it to the OSC26M_AGC[5:0]. 3.4.9 Peripheral Clock Divider Register 0 (PCDR0) The Peripheral Clock Divider Register 0 (PCDR0) contains the divider values for the peripheral clock dividers in the PLL Clock Controller. Peripherals in the i.MX27 device require special clock frequency which is divided down from the MPLL and the SPLL clock output. Each of these peripheral modules receive their clock input from the respective clock divider. These modules will still have the clock gating scheme as with other modules for power saving advantages. Figure 3-10 shows the register and Table 3-14 provides the field descriptions. Table 3-16 lists the clock sources associated with the i.MX27 peripherals given in the PCDR0. 0x1002_7018 (PCDR0) 31 30 29 Access: User R/W 28 27 26 R 24 CLKO _EN SSI2DIV W Reset 25 23 22 21 20 CLKO_DIV 19 18 17 16 SSI1DIV 0 0 0 1 0 0 1 0 0 0 0 0 0 1 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 R H264DIV NFCDIV MSHCDIV W Reset 0 0 0 1 0 1 0 0 1 1 0 0 0 0 Figure 3-10. Peripheral Clock Divider Register 0 (PCDR0) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-21 Clocks, Power Management, and Reset Control Table 3-14. Peripheral Clock Divider Register 0 Field Descriptions Field Description 31–26 SSI2DIV SSI2 Baud Clock Divider. Contains 6-bit fractional divider that produces the clock for SSI2CLK clock signal for the peripherals. The value of the divider starts from 0. 0 2 1 2.5 2 3 .... 63 33.5 Note: Formula for all others: clkin / (2 + 0.5 * SSI2DIV) 25 Clock Out Enable. Enable bit for CLKO pin. CLKO_EN 0 disable CLKO output 1 enable CLKO output 24–22 Clock Out Divider. Contains the 3-bit divider that divides output clocks to CLKO pin. CLKO_DIV 000 Divide by 1 001 Divide by 2 … 111 Divide by 8 21–16 SSI1DIV SSI1 Baud Clock Divider. Contains 6-bit fractional divider that produces the clock for SSI1CLK clock signal for the peripherals. The value of the divider starts from 0. 0 2 1 2.5 2 3 .... 63 33.5 Note: Formula for all others: clkin / (2 + 0.5 * SSI1DIV) 15–10 H264DIV H264 Baud Clock Divider. Contains 6-bit fractional divider that produces the clock for H264CLK clock signal for the peripherals. The value of the divider starts from 0. 0 2 1 2.5 2 3 .... 63 33.5 Note: Formula for all others: clkin / (2 + 0.5 * H264DIV) 9–6 NFCDIV NAND Flash Controller Clock Divider. Contains 4-bit divider that produces the clock for NFCCLK clock signal of the NAND Flash Controller. 0000 Divide by 1 0001 Divide by 2 … 1111 Divide by 16 5–0 MSHC Clock Divider. Contains 6-bit divider that produces the clock for MSHCCLK clock signal of MSHC. MSHCDIV 000000 Divide by 1 000001 Divide by 2 … 111111 Divide by 64 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-22 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.10 Peripheral Clock Divider Register 1 (PCDR1) The Peripheral Clock Divider Register 1 (PCDR1) contains the divider values for the peripheral clock dividers in the PLL Clock Controller. Peripherals in i.MX27 requires special clock frequency which is divided down from the MPLL and the SPLL clock output. Each of these peripheral modules receive their clock input from the respective clock divider. These modules will still have the clock gating scheme as with other modules for power saving advantages. Figure 3-11 shows the register and Table 3-15 provides the field descriptions. Table 3-16 lists the clock sources associated with the i.MX27 peripherals given in the PCDR1. 0x1002_701C (PCDR1) R 31 30 0 0 29 Access: User R/W 28 27 26 25 24 23 22 0 0 21 20 PERDIV4 19 18 17 16 PERDIV3 W Reset R 0 0 0 0 0 0 1 1 0 0 0 0 0 0 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 1 1 PERDIV2 PERDIV1 W Reset 0 0 0 0 0 0 1 1 0 0 0 0 0 0 Figure 3-11. Peripheral Clock Divider Register 1(PCDR1) Table 3-15. Peripheral Clock Divider Register 1 Field Descriptions Field 31–30 29–24 PERDIV4 23–22 21–16 PERDIV3 15–14 Description These are reserved bits and should read 0. Peripheral Clock Divider 4. Contains 6-bit integer divider that produces PERCLK4 clock signal for CSI MCLK Clock. 000000 Divide by 1 000001 Divide by 2 … 111111 Divide by 64 These are reserved bits and should read 0. Peripheral Clock Divider 3. Contains 6-bit integer divider that produces PERCLK3 clock signal for LCDC Pixel Clock. 000000 Divide by 1 000001 Divide by 2 … 111111 Divide by 64 These are reserved bits and should read 0. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-23 Clocks, Power Management, and Reset Control Table 3-15. Peripheral Clock Divider Register 1 Field Descriptions (continued) Field Description 13–8 PERDIV2 Peripheral Clock Divider 2. Contains 6-bit integer divider that produces PERCLK2 clock signal for the peripheral 2set (CSPI and SDHC). 000000 Divide by 1 000001 Divide by 2 … 111111 Divide by 64 7–6 5–0 PERDIV1 These are reserved bits and should read 0. Peripheral Clock Divider 1. Contains 6-bit integer divider that produces PERCLK1 clock signal for the peripheral 1 set (UART, GPT, PWM). 000000 Divide by 1 000001 Divide by 2 … 111111 Divide by 64 Table 3-16. Clock Sources for i.MX27 Peripherals Clock Source Peripherals Clock Source Peripherals SSI1CLK SSI1 NFCCLK NFC SSI2CLK SSI2 MSHCCLK MSHC H264CCLC H264 — — MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-24 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.11 Peripheral Clock Control Register 0 (PCCR0) The Peripheral Clock Control Register 0 (PCCR0) provides additional power saving capabilities by controlling the clocks in the i.MX27 modules. It also controls the clock source for Bootstrap mode. The PCCR0 allows for gating of HCLK to modules or peripherals that access the AHB bus and perform AHB bus transfers and also allows for gating of the ipg clk (PERCLK) to specific peripherals. Figure 3-12 shows the register and Table 3-17 provides the field descriptions. 27 26 25 24 23 22 21 20 19 18 17 16 W CSPI3_EN DMA_EN EMMA_EN FEC_EN GPIO_EN GPT1_EN GPT2_EN GPT3_EN GPT4_EN GPT5_EN GPT6_EN I2C1_EN I2C2_EN IIM_EN Reset 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 RTC_EN RTIC_EN SAHARA_EN SCC_EN SDHC1_EN SDHC2_EN SDHC3_EN SLCDC_EN SSI1_EN SSI2_EN 0 1 1 1 0 0 0 0 0 0 R W KPP_EN R Reset 0 0 PWM_EN 28 OWIRE_EN 29 MSHC_EN 30 LCDC_EN 31 CSPI2_EN Access: User R/W CSPI1_EN 0x1002_7020 (PCCR0) 0 0 0 0 0 Figure 3-12. Peripheral Clock Control Register 0 (PCCR0) Table 3-17. Peripheral Clock Control Register 0 Field Descriptions Field Description 31 CSPI1_EN CSPI1 IPG Clock Enable. Enables/Disables IPG clock input to CSPI1 module. 0 CSPI1 IPG clock input is disabled. 1 CSPI1 IPG clock input is enabled. 30 CSPI2_EN CSPI2 IPG Clock Enable. Enables/Disables IPG clock input to CSPI2 module. 0 CSPI2 IPG clock input is disabled. 1 CSPI2 IPG clock input is enabled. 29 CSPI3_EN CSPI3 IPG Clock Enable. Enables/Disables IPG clock input to CSPI3 module. 0 CSPI3 IPG clock input is disabled. 1 CSPI3 IPG clock input is enabled. 28 DMA_EN 27 EMMA_EN 26 FEC_EN DMA IPG Clock Enable. Enables/Disables IPG clock input to DMA module. 0 DMA IPG clock input is disabled. 1 DMA IPG clock input is enabled. EMMA IPG Clock Enable. Enables/Disables IPG clock input to EMMA module. 0 EMMA IPG clock input is disabled. 1 EMMA IPG clock input is enabled. FEC IPG Clock Enable. Enables/Disables IPG clock input to FEC module. 0 FEC IPG clock input is disabled. 1 FEC IPG clock input is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-25 Clocks, Power Management, and Reset Control Table 3-17. Peripheral Clock Control Register 0 Field Descriptions (continued) Field Description 25 GPIO_EN GPIO IPG Clock Enable. Enables/Disables IPG clock input to GPIO module. 0 GPIO IPG clock input is disabled. 1 GPIO IPG clock input is enabled. 24 GPT1_EN GPT1 IPG Clock Enable. Enables/Disables IPG clock input to GPT1 module. 0 GPT1 IPG clock input is disabled. 1 GPT1 IPG clock input is enabled. 23 GPT2_EN GPT2 IPG Clock Enable. Enables/Disables IPG clock input to GPT2 module. 0 GPT2 IPG clock input is disabled. 1 GPT2 IPG clock input is enabled. 22 GPT3_EN GPT3 IPG Clock Enable. Enables/Disables IPG clock input to GPT3 module. 0 GPT3 IPG clock input is disabled. 1 GPT3 IPG clock input is enabled. 21 GPT4_EN GPT4 IPG Clock Enable. Enables/Disables IPG clock input to GPT4 module. 0 GPT4 IPG clock input is disabled. 1 GPT4 IPG clock input is enabled. 20 GPT5_EN GPT5 IPG Clock Enable. Enables/Disables IPG clock input to GPT5 module. 0 GPT5 IPG clock input is disabled. 1 GPT5 IPG clock input is enabled. 19 GPT6_EN GPT6 IPG Clock Enable. Enables/Disables IPG clock input to GPT6 module. 0 GPT6 IPG clock input is disabled. 1 GPT6 IPG clock input is enabled. 18 I2C1_EN I2C1 IPG Clock Enable. Enables/Disables IPG clock input to I2C1 module. 0 I2C1 IPG clock input is disabled. 1 I2C1 IPG clock input is enabled. 17 I2C2_EN I2C2 IPG Clock Enable. Enables/Disables IPG clock input to I2C2 module. 0 I2C2 IPG clock input is disabled. 1 I2C2 IPG clock input is enabled. 16 IIM_EN 15 KPP_EN IIM IPG Clock Enable. Enables/Disables IPG clock input to IIM module. 0 IIM IPG clock input is disabled. 1 IIM IPG clock input is enabled. KPP IPG Clock Enable. Enables/Disables IPG clock input to KPP module. 0 KPP IPG clock input is disabled. 1 KPP IPG clock input is enabled. 14 LCDC_EN LCDC IPG Clock Enable. Enables/Disables IPG clock input to LCDC module. 0 LCDC IPG clock input is disabled. 1 LCDC IPG clock input is enabled. 13 MSHC_EN MSHC IPG Clock Enable. Enables/Disables IPG clock input to MSHC module. 0 MSHC IPG clock input is disabled. 1 MSHC IPG clock input is enabled. 12 OWIRE_EN OWIRE IPG Clock Enable. Enables/Disables IPG clock input to OWIRE module. 0 OWIRE IPG clock input is disabled. 1 OWIRE IPG clock input is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-26 Freescale Semiconductor Clocks, Power Management, and Reset Control Table 3-17. Peripheral Clock Control Register 0 Field Descriptions (continued) Field 11 PWM_EN 10 Description PWM IPG Clock Enable. Enables/Disables IPG clock input to PWM module. 0 PWM IPG clock input is disabled. 1 PWM IPG clock input is enabled. Reserved. This bit is reserved. 9 RTC_EN RTC IPG Clock Enable. Enables/Disables IPG clock input to RTC module. 0 RTC IPG clock input is disabled. 1 RTC IPG clock input is enabled. 8 RTIC_EN RTIC IPG Clock Enable. Enables/Disables IPG clock input to RTIC module. 0 RTIC IPG clock input is disabled. 1 RTIC IPG clock input is enabled. 7 SAHARA_EN 6 SCC_EN SAHARA IPG Clock Enable. Enables/Disables IPG clock input to SAHARA module. 0 SAHARA IPG clock input is disabled. 1 SAHARA IPG clock input is enabled. SCC IPG Clock Enable. Enables/Disables IPG clock input to SCC_EN module. 0 SCC_EN IPG clock input is disabled. 1 SCC_EN IPG clock input is enabled. 5 SDHC1_EN SDHC1 IPG Clock Enable. Enables/Disables IPG clock input to SDHC1 module. 0 SDHC1 IPG clock input is disabled. 1 SDHC1 IPG clock input is enabled. 4 SDHC2_EN SDHC2 IPG Clock Enable. Enables/Disables IPG clock input to SDHC2 module. 0 SDHC2 IPG clock input is disabled. 1 SDHC2 IPG clock input is enabled. 3 SDHC3_EN SDHC3 IPG Clock Enable. Enables/Disables IPG clock input to SDHC3 module. 0 SDHC3 IPG clock input is disabled. 1 SDHC3 IPG clock input is enabled. 2 SLCDC_EN SLCDC IPG Clock Enable. Enables/Disables IPG clock input to SLCDC module. 0 SLCDC IPG clock input is disabled. 1 SLCDC IPG clock input is enabled. 1 SSI1_EN SSI1 IPG Clock Enable. Enables/Disables IPG clock input to SSI1 module. 0 SSI1 IPG clock input is disabled. 1 SSI1 IPG clock input is enabled. 0 SSI2_EN SSI2 IPG Clock Enable. Enables/Disables IPG clock input to SSI2 module. 0 SSI2 IPG clock input is disabled. 1 SSI2 IPG clock input is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-27 Clocks, Power Management, and Reset Control 3.4.12 Peripheral Clock Control Register 1 (PCCR1) The Peripheral Clock Control Register 1 (PCCR1) provides additional power saving capabilities by controlling the clocks in the i.MX27 modules. It also controls the clock source for Bootstrap mode. The PCCR1 allows for gating of the ipg clk (PERCLK) to specific peripherals. Figure 3-13 shows the register and Table 3-18 provides the field descriptions. 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 W UART1_EN UART2_EN UART3_EN UART4_EN UART5_EN UART6_EN USB_EN WDT_EN HCLK_ATA HCLK_BROM HCLK_CSI HCLK_DMA HCLK_EMI HCLK_EMMA HCLK_FEC HCLK_H264 Reset 1 1 1 1 1 1 1 1 0 1 0 0 1 0 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 HCLK_RTIC HCLK_SAHARA HCLK_SLCDC HCLK_USB PERCLK1_EN PERCLK2_EN PERCLK3_EN PERCLK4_EN H264_BAUDEN SSI1_BAUDEN SSI2+BAUDEN NFC_BAUDEN MSHC_BAUDEN Access: User R/W HCLK_LCDC 0x1002_7024 (PCCR1) 0 0 0 1 1 0 1 0 0 0 0 1 0 0 1 0 0 0 R R W Reset Figure 3-13. Peripheral Clock Control Register 1(PCCR1) Table 3-18. Peripheral Clock Control Register 1 Field Descriptions Field Description 31 UART1_EN UART1 IPG Clock Enable. Enables/Disables IPG clock input to UART1 module. 0 UART1 IPG clock input is disabled. 1 UART1 IPG clock input is enabled. 30 UART2_EN UART2 IPG Clock Enable. Enables/Disables IPG clock input to UART2 module. 0 UART2 IPG clock input is disabled. 1 UART2 IPG clock input is enabled. 29 UART3_EN UART3 IPG Clock Enable. Enables/Disables IPG clock input to UART3 module. 0 UART3 IPG clock input is disabled. 1 UART3 IPG clock input is enabled. 28 UART4_EN UART4 IPG Clock Enable. Enables/Disables IPG clock input to UART4 module. 0 UART4 IPG clock input is disabled. 1 UART4 IPG clock input is enabled. 27 UART5_EN UART5 IPG Clock Enable. Enables/Disables IPG clock input to UART5 module. 0 UART5 IPG clock input is disabled. 1 UART5 IPG clock input is enabled. 26 UART6_EN UART6 IPG Clock Enable. Enables/Disables IPG clock input to UART6 module. 0 UART6 IPG clock input is disabled. 1 UART6 IPG clock input is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-28 Freescale Semiconductor Clocks, Power Management, and Reset Control Table 3-18. Peripheral Clock Control Register 1 Field Descriptions (continued) Field Description 25 USB_EN USB IPG Clock Enable. Enables/Disables IPG clock input to USB module. 0 USB IPG clock input is disabled. 1 USB IPG clock input is enabled. 24 WDT_EN WDT IPG Clock Enable. Enables/Disables IPG clock input to WDT module. 0 WDT IPG clock input is disabled. 1 WDT IPG clock input is enabled. 23 HCLK_ATA ATA AHB Clock Enable. Enables/Disables AHB clock input to ATA module. 0 ATA AHB clock input is disabled. 1 ATA AHB clock input is enabled. 22 HCLK_BROM BROM AHB Clock Enable. Enables/Disables AHB clock input to BROM module. 0 BROM AHB clock input is disabled. 1 BROM AHB clock input is enabled. 21 HCLK_CSI CSI AHB Clock Enable. Enables/Disables AHB clock input to CSI module. 0 CSI AHB clock input is disabled. 1 CSI AHB clock input is enabled. 20 HCLK_DMA DMA AHB Clock Enable. Enables/Disables AHB clock input to DMA module. 0 DMA AHB clock input is disabled. 1 DMA AHB clock input is enabled. 19 HCLK_EMI EMI AHB Clock Enable. Enables/Disables AHB clock input to EMI module. 0 EMI AHB clock input is disabled. 1 EMI AHB clock input is enabled. 18 HCLK_EMMA EMMA AHB Clock Enable. Enables/Disables AHB clock input to EMMA module. 0 EMMA AHB clock input is disabled. 1 EMMA AHB clock input is enabled. 17 HCLK_FEC FEC AHB Clock Enable. Enables/Disables AHB clock input to FEC module. 0 FEC AHB clock input is disabled. 1 FEC AHB clock input is enabled. 16 HCLK_H264 H264 AHB Clock Enable. Enables/Disables AHB clock input to H264 module. 0 H264 AHB clock input is disabled. 1 H264 AHB clock input is enabled. 15 HCLK_LCDC LCDC AHB Clock Enable. Enables/Disables AHB clock input to LCDC module. 0 LCDC AHB clock input is disabled. 1 LCDC AHB clock input is enabled. 14 HCLK_RTIC RTIC AHB Clock Enable. Enables/Disables AHB clock input to RTIC module. 0 RTIC AHB clock input is disabled. 1 RTIC AHB clock input is enabled. 13 HCLK_SAHARA 12 HCLK_SLCDC SAHARA AHB Clock Enable. Enables/Disables AHB clock input to SAHARA module. 0 SAHARA AHB clock input is disabled. 1 SAHARA AHB clock input is enabled. SLCDC AHB Clock Enable. Enables/Disables AHB clock input to SLCDC module. 0 SLCDC AHB clock input is disabled. 1 SLCDC AHB clock input is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-29 Clocks, Power Management, and Reset Control Table 3-18. Peripheral Clock Control Register 1 Field Descriptions (continued) Field 11 HCLK_USB Description USB AHB Clock Enable. Enables/Disables AHB clock input to USB module. 0 USB AHB clock input is disabled. 1 USB AHB clock input is enabled. 10 PERCLK1_EN PERCLK1 Clock Enable. Enables/Disables Peripheral clock1. 0 Peripheral clock1 is disabled. 1 Peripheral clock1 is enabled. 9 PERCLK2_EN PERCLK2 Clock Enable. Enables/Disables Peripheral clock2. 0 Peripheral clock2 is disabled. 1 Peripheral clock2 is enabled. 8 PERCLK3_EN PERCLK3 Clock Enable. Enables/Disables Peripheral clock3. 0 Peripheral clock3 is disabled. 1 Peripheral clock3 is enabled. 7 PERCLK4_EN PERCLK4 Clock Enable. Enables/Disables Peripheral clock4. 0 Peripheral clock4 is disabled. 1 Peripheral clock4 is enabled. 6 H264_BAUDEN H264 BAUD Clock Enable. Enables/Disables BAUD clock input to H264 module. 0 H264 BAUD clock input is disabled. 1 H264 BAUD clock input is enabled. 5 SSI1_BAUDEN SSI1 BAUD Clock Enable. Enables/Disables BAUD clock input to SSI1 module. 0 SSI1 BAUD clock input is disabled. 1 SSI1 BAUD clock input is enabled. 4 SSI2_BAUDEN SSI2 BAUD Clock Enable. Enables/Disables BAUD clock input to SSI2 module. 0 SSI2 BAUD clock input is disabled. 1 SSI2 BAUD clock input is enabled. 3 NFC_BAUDEN NFC BAUD Clock Enable. Enables/Disables BAUD clock input to NFC module. 0 NFC BAUD clock input is disabled. 1 NFC BAUD clock input is enabled. 2 MSHC_BAUDEN 1–0 MSHC BAUD Clock Enable. Enables/Disables BAUD clock input to MSHC module. 0 MSHC BAUD clock input is disabled. 1 MSHC BAUD clock input is enabled. Reserved. These bits are reserved and should read 0. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-30 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.13 Clock Control Status Register (CCSR) The Clock Control Status Register (CCSR) provides information on the configuration of the Analog and Digital block. The clocks within the chip can also be monitored by the CLKO_SEL programming. Figure 3-14 shows the register and Table 3-19 provides the field descriptions. 0x1002_7028 (CCSR) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 W Reset R 32K W _SR Reset 0 CLKMODE 0 0 0 0 0 1 1 CLKO_SEL 0 0 0 0 0 0 Figure 3-14. Clock Control Status Register (CCSR) Table 3-19. Clock Control Status Register Field Descriptions Field Description 31–16 Reserved. These bit are reserved and should read 0. 15 32K_SR 32K Status Register. It contains status information of 32 KHz clock. It is cleared to zero during the assertion of HARD_ASYNC_RESET signal. The sampled 32KHz clock phase is continuously registered into the bit upon the de-assertion of HARD_ASYNC_RESET signal. 0 CLK32 in low phase 1 CLK32 in high phase 14–12 Reserved. These bits are reserved and should read 0. 9–8 CLKMODE CLKMODE. Determines the configuration of FPM, OSC26M and DPLL on the chip. Its reset value depends on CLKMODE input signals. 00 DPLL, FPM, OSC26M bypassed 01 FPM bypassed. 10 FPM and OSC26M bypassed 11 FPM and DPLL in use (Default) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-31 Clocks, Power Management, and Reset Control Table 3-19. Clock Control Status Register Field Descriptions (continued) Field 7–5 4–0 CLKO_SEL Description Reserved. These bits are reserved and should read 0. CLKO Select. Selects which clock signal source is the output of CLKO pin. 00000 CLK32 00001 PREMCLK 00010 CLK26M 00011 MPLL Reference CLK 00100 SPLL Reference CLK 00101 HCLK Source (MPLL 2x clock output / 3) 00110 SPLL CLK 00111 FCLK 01000 HCLK 01001 IPG_CLK 01010 PERCLK1 01011 PERCLK2 01100 PERCLK3 01101 PERCLK4 01110 SSI 1 Baud 01111 SSI 2 Baud 10000 NFC Baud 10001 MSHC_Baud 10010 H264 Baud 10011 CLK60M Always 10100 CLK32K Always 10101 CLK60M 10110 DPTC Reference Clock MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-32 Freescale Semiconductor Clocks, Power Management, and Reset Control 3.4.14 Wakeup Guard Mode Control Register (WKGDCTL) The Wakeup Guard mode Control Register (WKGDCTL) provides the configuration of the Wakeup Guard mode. This is a write once only bit in order to be compatible with the watchdog behavior. After enable/disable, it will not be modifiable. When enabled, the battery detector external to the chip provides a glitch free signal through the TIN pin. Battery must be intact for the chip to wakeup from sleep. Figure 3-15 shows the register and Table 3-20 provides the field descriptions. 0x1002_7034 (WKGDCTL) R Access: User write-once 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R WKGD_EN W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 3-15. Wakeup Guard Mode Control Register (WKGDCTL) Table 3-20. Wakeup Guard Mode Control Register Field Descriptions Field 31–1 0 WKDG_EN Description Reserved. These bits are reserved and should read 0. Wakeup Guard Mode Enable. Enables /disables the wakeup guard logic. Write- once-only bit and can only be cleared through system reset. Once enabled, battery indicator through TIN will be used to qualify the wakeup process. When battery is intact, that is, TIN=1, wakeup from sleep proceed as per normal. When WKGD_EN=1 and battery is removed, 32 kHz clock to watchdog module is gated off. Clock resumes when battery is back in place. 0 Wakeup Guard mode is disabled. 1 Wakeup Guard mode is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-33 Clocks, Power Management, and Reset Control 3.5 Functional Description of the Reset Module The reset module controls or distributes all of the system reset signals used by the i.MX27 processor. A simplified block diagram of the reset module is shown in Figure 3-16. The reset module generates two distinct events—a global reset and an ARM9 Platform reset. RESET_POR POR RESET_POR 300 ms Counter RESET_DRAM 7-cycle stretcher CLK32 POR_TIMEOUT (programmed values) fuse_latch CLK32 14-cycle HRESET syn logic stretcher CLK32 3-cycle Rising edge detector 4-cycle qualifier WDOG_RESET syn logic stretcher CLK32 RESET HARD_ASYNC_RESET hclk RSR GLOBAL_RESET IP bus EXT_RESET Figure 3-16. Reset Module Clock Diagram 3.5.1 Global Reset A global reset is produced by the simultaneous assertion of the following resets: • RESET_DRAM • HRESET • HARD_ASYNC_RESET • RESET_POR There is one source capable of generating a global reset: A low condition on the POR pin when the 32 kHz crystal oscillator is running. The HRESET and HARD_ASYNC_RESET are armed simultaneously; they remain in that state for 14 CLK32 cycles. RESET_DRAM is deasserted seven CLK32 cycles before HRESET and HARD_ASYNC_RESET are deasserted. The SDRAM executes the necessary self refresh operations during this time. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-34 Freescale Semiconductor Clocks, Power Management, and Reset Control The timing diagram in Figure 3-16 shows the relationship of the reset signal timings. See Table 3-21 for reset module signal and pin definitions. The following signal conditions are not capable of generating a global reset, however their assertion will reset the ARM9 Platform: • An external qualified low condition on the RESET_IN pin • A low condition on WDOG_RESET Furthermore, these reset conditions will not reset the SDRAMC, Real Time Clock, WatchDog module, or allow a change in Boot mode—that is, changes made to BOOT[3:0] during these resets conditions will not take effect. Only the global reset is capable of this. The source of the last hardware reset can be determined in the watchdog status register. NOTE Due to the asynchronous nature of the RESET_IN signal, the time period required to qualify the signal may vary, and the HRESET timing relative to the rising edge of the RESET_IN is also affected. A RESET_IN signal shorter than three CLK32 cycles will not be qualified, a RESET_IN signal equal to or longer than four CLK32 cycles will always be qualified, and any period length that is more than three and less than four CLK32 cycles is undefined. POR is the reset signal for all the reset module flip-flops. For this reason, an external reset signal is qualified if it lasts more than four CLK32 cycles when POR is deasserted. During power on the user must ensure that POR stay asserted (low) long enough for the 32kHz crystal to stabilize. The time it takes for the crystal to stabilize depends upon on the crystal used. Consult the crystal’s specification for details about its stabilization timing. NOTE Refer to the i.MX27 Multimedia Applications Processor Data Sheet for power-up and power-down sequence requirements. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-35 Clocks, Power Management, and Reset Control POR RESET_POR 7 cycles @ clk32 300 ms RESET_DRAM u RESET_CPU RESET_SYS 14 cycles @ clk32 n d e CLK32 f i HCLK n e d Figure 3-17. DRAM and Internal Reset Timing Diagram 3.5.2 ARM9 Platform Reset Any qualified global reset signal resets the ARM9 Platform and all related peripherals to their default state. After the internal reset is deasserted, the ARM9 processor begins fetching code from the internal bootstrap ROM or CS0 space. The memory location of the fetch depends on the configuration of the BOOT pins and the value of the TEST pin on the rising edge of the HRESET. Table 3-21. Reset Module Pin and Signal Descriptions Signal Name Direction Signal Description CLK32 IN 32 kHz Clock—A 32 kHz clock signal derived from the 32.768 KHz or 32.0 KHz crystal oscillator circuit in the PLL Clock Controller. POR IN Power-On Reset—An internal active Schmitt trigger signal from the POR pin. The POR signal is normally generated by an external RC circuit designed to detect a power-up event. RESET_IN IN Reset—An external active low Schmitt trigger signal from the RESET_IN pin. When this signal goes active, all modules (except the SDRAMC, Real Time Clock, WatchDog, and the BOOT[3:0] signals) are reset. WDOG_RESET IN Watchdog Timer Reset—An active low signal generated by the watchdog timer when a time-out period has expired. Resets the same modules as RESET_IN. HARD_ASYN_RESET OUT Hard Asynchronous Reset—An active low signal that resets all peripheral modules except the watchdog module’s status register. The rising edge of this signal is synchronous with IPG_CLK. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-36 Freescale Semiconductor Clocks, Power Management, and Reset Control Table 3-21. Reset Module Pin and Signal Descriptions (continued) Signal Name Direction Signal Description HRESET OUT Hard Reset—An active low signal that resets the ARM9 Platform. This signal is deasserted during the low phase of HCLK. This signal also appears on the RESET_OUT pin of the i.MX27. RESET_DRAM OUT DRAM Reset—An active low signal that resets the SDRAM controller. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 3-37 Clocks, Power Management, and Reset Control MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 3-38 Freescale Semiconductor Chapter 4 System Control 4.1 Introduction This chapter describes the system control module of the i.MX27 microprocessor. The system control module enables system software to control, customize, or read the status of the following functions: • Chip ID • Multiplexing of I/O signals • I/O Drive Strength • I/O Pull Enable Control • Well Bias Control • System boot mode selection • DPTC Control 4.2 Memory Map and Register Definition The system control module includes one 32-bit Silicon ID and twenty-four user-accessible 32-bit registers. Table 4-1 summarizes these registers and their addresses. Table 4-1. Block Memory Map Address Register Access Reset Value Section/Page General Registers 0x1002_7800 (CID) Chip ID Register R/W 0x1882_181D 4.2.1/4-3 0x1002_7814 (FMCR) Function Multiplexing Control Register R/W 0xFFFF_FFCB 4.2.2/4-4 0x1002_7818 (GPCR) Global Peripheral Control Register R/W 0x0000_0808 4.2.3/4-7 0x1002_781C (WBCR) Well Bias Control Register R/W 0x0000_0000 4.2.5/4-9 0x1002_7820 (DSCR1) Drive Strength Control Register 1 R/W 0x0000_0000 4.2.6/4-11 0x1002_7824 (DSCR2) Drive Strength Control Register 2 R/W 0x0000_0000 4.2.7/4-13 0x1002_7828 (DSCR3) Drive Strength Control Register 3 R/W 0x0000_0000 4.2.8/4-15 0x1002_782C (DSCR4) Drive Strength Control Register 4 R/W 0x0000_0000 4.2.9/4-17 0x1002_7830 (DSCR5) Drive Strength Control Register 5 R/W 0x0000_0000 4.2.10/4-19 0x1002_7834 (DSCR6) Drive Strength Control Register 6 R/W 0x0000_0000 4.2.11/4-21 0x1002_7838 (DSCR7) Drive Strength Control Register 7 R/W 0x0000_0000 4.2.12/4-24 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-1 System Control Table 4-1. Block Memory Map (continued) Address Register Access Reset Value Section/Page 0x1002_783C (DSCR8) Drive Strength Control Register 8 R/W 0x0000_0000 4.2.13/4-26 0x1002_7840 (DSCR9) Drive Strength Control Register 9 R/W 0x0000_0000 4.2.14/4-28 0x1002_7844 (DSCR10) Drive Strength Control Register 10 R/W 0x0000_0000 4.2.15/4-31 0x1002_7848 (DSCR11) Drive Strength Control Register 11 R/W 0x0000_0000 4.2.16/4-33 0x1002_784C (DSCR12) Drive Strength Control Register 12 R/W 0x0000_0000 4.2.17/4-35 0x1002_7850 (DSCR13) Drive Strength Control Register 13 R/W 0x0000_0000 4.2.18/4-37 0x1002_7854 (PSCR) Pull Strength Control Register R/W 0x0000_0000 4.2.19/4-39 0x1002_7858 (PCSR) Priority Control and Select Register R/W 0x0000_0003 4.2.20/4-41 0x1002_7860 (PMCR) Power Management Control Register R/W 0x0000_0000 4.2.21/4-42 0x1002_7864 (DCVR0) DPTC Comparator Value Register 0 R/W 0x0000_0000 4.2.22/4-44 0x1002_7868 (DCVR1) DPTC Comparator Value Register 1 R/W 0x0000_0000 4.2.23/4-44 0x1002_786C (DCVR2) DPTC Comparator Value Register 2 R/W 0x0000_0000 4.2.24/4-45 0x1002_7870 (DCVR3) DPTC Comparator Value Register 3 R/W 0x0000_0000 4.2.25/4-46 The conventions in Figure 4-1 and Table 4-2 serve as a key for the register summary and individual register diagrams. Always reads 1 1 Always reads 0 0 R/W BIT Read- BIT WriteWrite 1 BIT Self-clear 0 bit only bit only bit BIT to clear w1c bit BIT N/A Figure 4-1. Key to Register Fields Table 4-2 provides a key for register figures and tables and the register summary. Table 4-2. Register Conventions Convention Description Depending on its placement in the read or write row, indicates that the bit is not readable or not writable. FIELDNAME Identifies the field. Its presence in the read or write row indicates that it can be read or written. Register Field Types R Read only. Writing this bit has no effect. W Write only. R/W Standard read/write bit. Only software can change the bit’s value (other than a hardware reset). rwm A read/write bit that may be modified by a hardware in some fashion other than by a reset. w1c Write one to clear. A status bit that can be read, and is cleared by writing a one. Self-clearing bit Writing a one has some effect on the module, but it always reads as zero. (Previously designated slfclr) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-2 Freescale Semiconductor System Control Table 4-2. Register Conventions (continued) Convention Description Reset Values 0 Resets to zero. 1 Resets to one. — Undefined at reset. u Unaffected by reset. [signal_name] 4.2.1 Reset value is determined by polarity of indicated signal. Chip ID Register (CID) The Chip ID register contains the chip identification number. Figure 4-2 shows the register and Table 4-3 provides its field descriptions. 0x1002_7800 (CID) 31 R 28 27 26 25 24 23 22 21 20 19 18 17 16 PART NUMBER 0 0 0 1 1 0 0 0 1 0 0 0 0 0 1 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 0 1 R PART NUMBER W Reset 29 VERSION ID W Reset 30 Access: User R/W 0 0 0 MANUFACTURER ID 1 0 0 0 0 0 0 0 1 Figure 4-2. Chip ID Register (CID) Table 4-3. Chip ID Register Field Descriptions Field 31–28 VERSION ID 27–12 PART NUMBER Description VERSION ID. This field contains the 4-bit version ID number. PART NUMBER. This field contains the 16-bit part number of the chip. 11–0 MANUFACTURER ID. This field contains the 12-bit manufacturer ID MANUFACTURER ID number of the chip. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-3 System Control 4.2.2 Function Multiplexing Control Register (FMCR) The FMCR controls the multiplexing of the signal lines shared by the SLCDC module, UART module, and Keypad module as well as the SDRAM chip select lines. The FMCR also allows control or indicates the boot status of the NAND Flash page size and data port size. Figure 4-3 shows the register and Table 4-4 provides its field descriptions. 26 25 24 23 22 21 20 19 1 1 UART4_RXD_CTL UART4_RTS_CTL 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 5 4 3 2 1 0 1 PC_VS2_CTL PC_BVD1_CTL PC_BVD2_CTL IOIS16_CTL SLCDC_SEL SDCS1_SEL SDCS0_SEL R 1 1 1 1 1 1 1 1 0 1 1 W Reset 7 6 1 1 1 1 1 0 0 1 16 KP_ROW6_CTL 27 1 PC_VS1_CTL Reset 17 KP_ROW7_CTL 28 1 W 18 KP_COL6_CTL 29 1 NF_16BIT_SEL 30 1 NF_FMS 31 PC_READY_CTL R Access: User R/W PC_WAIT_B_CTL 0x1002_7814 (FMCR) 1 1 1 Figure 4-3. Function Multiplexing Control Register (FMCR) Table 4-4. Function Multiplexing Control Register Description Field Description 31–26 Reserved. These bits are reserved and should read 1. 25 UART4_RXD_CTL UART4 RXD Control. When set, the alternate signal of USBH1_RXDP (PB31) is input to RXD of UART4. When 0, the USBH1_TXDP (PB29) GPIO’s AOUT is input to RXD of UART4. With either setting, the user must also ensure that the proper GPIO registers have been programmed to select the desired multiplexing. 0 The USBH1_TXDP (PB29) GPIO’s AOUT is input to RXD of UART4. 1 The alternate signal of USBH1_RXDP (PB31) is input to RXD of UART4. 24 UART4_RTS_CTL UART4 RTS Control. When set, the alternate signal of USBH1_FS (PB26) is input to RTS of UART4. When 0, the USBH1_RXDP (PB31) GPIO’s AOUT is input to RTS of UART4. With either setting, the user must also ensure that the proper GPIO registers have been programmed to select the desired multiplexing. 0 The USBH1_RXDP (PB31) GPIO’s AOUT is input to RTS of UART4. 1 The alternate signal of USBH1_FS (PB26) is input to RTS of UART4. 23–19 Reserved. These bits are reserved and should read 1. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-4 Freescale Semiconductor System Control Table 4-4. Function Multiplexing Control Register Description (continued) Field Description 18 KP_COL6_CTL Keypad Column 6 Control. When set, the alternate signal of UART2_TXD (PE6) is input to column 6 of keypad. When 0, the alternate signal of TEST_WB2 (PE0) is input to column 6 of keypad. With either setting, the user must also ensure that the proper GPIO registers have been programmed to select the desired multiplexing. 0 The alternate signal of TEST_WB2 (PE0) is input to column 6 of keypad. 1 The alternate signal of UART2_TXD (PE6) is input to column 6 of keypad. 17 KP_ROW7_CTL Keypad Row 7 Control. When set, the alternate signal of UART2_RTS (PE4) is input to row 7of keypad. When 0, the alternate signal of TEST_WB0 (PE2) is input to row 7 of keypad. With either setting, the user must also ensure that the proper GPIO registers have been programmed to select the desired multiplexing. 0 The alternate signal of TEST_WB0 (PE2) is input to row 7 of keypad. 1 The alternate signal of UART2_RTS (PE4) is input to row 7of keypad. 16 KP_ROW6_CTL Keypad Row 6 Control. When set, the alternate signal of UART2_RXD (PE7) is input to row 6 of keypad. When 0, the alternate signal of TEST_WB1 (PE1) is input to row 6 of keypad. With either setting, the user must also ensure that the proper GPIO registers have been programmed to select the desired multiplexing. 0 The alternate signal of TEST_WB1 (PE1) is input to row 6 of keypad. 1 The alternate signal of UART2_RXD (PE7) is input to row 6 of keypad. 15 Reserved. These bits are reserved and should read 1. 14 PC_WAIT_B_CTL PC_WAIT_B Control. When set, signal pc_wait_b of PCMCIA is input from PC_WAIT_B. When 0, it is input from BOUT of GPIO PORT C[31]. 0 The signal pc_wait_b of PCMCIA is input from BOUT of GPIO PORT C[31]. 1 The signal pc_wait_b of PCMCIA is input from PC_WAIT_B. 13 PC_READY_CTL PC_READY Control. When set, signal pc_ready of PCMCIA is input from PC_READY. When 0, it is input from BOUT of GPIO PORT C[30]. 0 The signal pc_ready of PCMCIA is input from BOUT of GPIO PORT C[30]. 1 The signal pc_ready of PCMCIA is input from PC_READY. 12 PC_VS1_CTL PC_VS1 Control. When set, signal pc_vs1 of PCMCIA is input from PC_VS1. When 0, it is input from BOUT of GPIO PORT C[29]. 0 The signal pc_vs1 of PCMCIA is input from BOUT of GPIO PORT C[29]. 1 The signal pc_vs1 of PCMCIA is input from PC_VS1. 11 PC_VS2_CTL PC_VS2 Control. When set, signal pc_vs2 of PCMCIA is input from PC_VS2. When 0, it is input from BOUT of GPIO PORT C[28]. 0 The signal pc_vs2 of PCMCIA is input from BOUT of GPIO PORT C[28]. 1 The signal pc_vs2 of PCMCIA is input from PC_VS2. 10 PC_BVD1_CTL PC_BVD1 Control. When set, signal pc_bvd1 of PCMCIA is input from PC_BVD1. When 0, it is input from BOUT of GPIO PORT C[19]. 0 The signal pc_bvd1 of PCMCIA is input from BOUT of GPIO PORT C[19]. 1 The signal pc_bvd1 of PCMCIA is input from PC_BVD1. 9 PC_BVD2_CTL PC_BVD2 Control. When set, signal PC_BVD2 of PCMCIA is input from PC_BVD2. When 0, it is input from BOUT of GPIO PORT C[18]. 0 The signal pc_bvd2 of PCMCIA is input from BOUT of GPIO PORT C[18]. 1 The signal pc_bvd2 of PCMCIA is input from PC_BVD2. 8 IOIS16_CTL IOIS16 Control. When set, signal iois16 of PCMCIA is input from IOIS16. When 0, it is input from BOUT of GPIO PORT C[17]. 0 The signal iois16 of PCMCIA is input from BOUT of GPIO PORT C[17]. 1 The signal iois16 of PCMCIA is input from IOIS16. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-5 System Control Table 4-4. Function Multiplexing Control Register Description (continued) Field Description 7–6 Reserved. These bits are reserved and should read 1. 5 NF_FMS Flash Memory Select. When Boot[3:0] = 0010 or 0011, the NF_FMS will be set, otherwise it will be 0. After boot up, this bit is user programmable. 0 NAND Flash with 512B page size (64Mb/128Mb/256Mb/512Mbyte/ 1Gbyte DDP) 1 NAND Flash with 2 Kbyte page size (1Gbyte/2Gbyte DDP/2Gbyte) Note: DDP means Double Density Package. 4 NF_16BIT_SEL 3 NAND Flash 16-bit Select. Selects 16-bit NF operation. Setting this bit forces the NAND Flash into 16-bit operation and the NAND Flash upper data is available to the pins. Clearing this bit forces the NF to 8-bit operation and the A[25:21]signals become the function pins. The muxing is done in the EMI module, not I/O MUX module. During system boot up, if the BOOT[3:0] input pins are configured to select 16-bit mode, this NF_16BIT_SEL bit is set. 0 NAND Flash 8-bit operation 1 NAND Flash 16-bit operation Reserved. This bit is reserved and should read 0. 2 SLCDC_SEL SLCDC Select. Selects whether a BaseBand chip (BB) or the i.MX27 processor drives the SLCDC display port in serial mode. 0 On Chip SLCDC drives the SLCDC port. 1 BB can write directly to the SLCDC port. 1 SDCS1_SEL SDRAM Chip Select. Selects the function of the CS3/CSD1 pin. 0 CS3 is selected. 1 CSD1 is selected. 0 SDCS0_SEL SDRAM Chip Select. Selects the function of the CS2/CSD0 pin. 0 CS2 is selected. 1 CSD0 is selected. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-6 Freescale Semiconductor System Control 4.2.3 Global Peripheral Control Register (GPCR) The Global Peripheral Control Register (GPCR) displays the current boot mode of the i.MX27 device. The clock gating to the processor’s modules is also controlled by this register. Figure 4-4 shows the register and Table 4-5 provides its field descriptions. 0x1002_7818 (GPCR) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 0 0 0 0 0 0 0 0 19 18 R W Reset USB_ PP_ DMA_ ETM9 Burst Burst Burst _PAD _Over _Over _Over _EN ride ride ride 1 0 0 0 7 6 5 4 0 0 0 0 0 0 0 0 16 BOOT W Reset 17 0 0 0 0 3 2 1 0 CLOC CLK_ DDR_ K_GA DDR_ DDR_ INPUT TING_ MODE MODE EN 1 0 0 0 Figure 4-4. Global Peripheral Control Register (GPCR) Table 4-5. Global Peripheral Control Register Descriptions Field Description 31–20 Reserved. These bits are reserved and should read 0. 19–16 BOOT Boot Mode. These are 4-bit system boot mode for the i.MX27 device. 0000 Bootstrap from UART/USB 0001 Reserved 0010 8-bit NAND Flash (2 Kbyte per page) 0011 16-bit Nand Flash (2 Kbyte per page) 0100 16-bit Nand Flash (512 bytes per page) 0101 16-bit CS0 0110 32-bit CS0 0111 8 bit Nand Flash (512 bytes per page) 1xxx Reserved 15–12 Reserved. These bits are reserved and should read 0. 11 ETM9_PAD_EN ETM9 Pad Enable. When this bit is set, pads for ETM9 are enabled. 0 Disable ETM9 pads 1 Enable ETM9 pads 10 USB Burst Override Control. When this bit is set, the burst type of USB will be forced to INCR8. USB_Burst_Override 0 Bypass. The burst type will not be forced. 1 Burst type of USB is INCR8 9 PP_Burst_Override EMMA PP Burst Override Control. When this bit is set, the burst type of EMMA PP will be forced to INCR4 or INCR8. 0 Bypass. The burst type will not be forced. 1 Burst type of EMMA PP is INCR4 or INCR8. 8 DMA Burst Override Control. When this bit is set, the burst type of DMA will be forced to INCR4 DMA_Burst_Override or INCR8. 0 Bypass. The burst type will not be forced. 1 Burst type of DMA is INCR4 or INCR8. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-7 System Control Table 4-5. Global Peripheral Control Register Descriptions (continued) Field Description 7–4 Reserved. These bits are reserved and should read 0. 3 Clock Gating Enable. When set to 1, the peripheral register access clocks are gated by the AIPI CLOCK_GATING_EN modules. For example, when there is a register read or write access to the peripherals of AIPI1, the ipg_clk_s1 clock will be running, otherwise if no access is taking place the clock will shut off and when there is a register read or write access to the peripherals of AIPI2. The clock is running, otherwise if no access is taking place the clock shuts off. When this bit is cleared to 0 then the AIPI clocks become a continuous clock, regardless of peripheral accesses. It is recommended for maximum power savings to ensure this bit is set to 1. 2 DDR_MODE 1 CLK_DDR_MODE 0 DDR_INPUT 4.2.4 DDR Drive Strength Control. used to select DDR drive strength of all DDR pads except the SDCLK pad. 0 Drive strength is selected by associated fields in the DSCRx registers. 1 Drive strength of about 20 mA, as defined in SSTL_18 CLK DDR MODE. used to select DDR drive strength of SDCLK pad. 0 Drive strength is selected by associated fields in the DSCR8 registers. 1 Drive strength of about 20 mA, as defined in SSTL_18 DDR_INPUT. Used to force input mode of DDR pads to CMOS input mode. 0 No force on input mode of DDR pads 1 DDR pads will be forced to CMOS input mode. Well Bias System The i.MX27 processor employs an innovative system feature to help reduce leakage current called Well Biasing. The Well Bias System reduces the leakage current of the QVDDx sub-system during low-power mode by increasing the threshold voltage of the QVDDx sub-system transistors. The i.MX27 contains two Well Biasing System, one for ARM core logic and one for EMI module. The following section describes how to enable and take advantage of this power saving feature. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-8 Freescale Semiconductor System Control 4.2.5 Well Bias Control Register (WBCR) The Well Bias Control Register (WBCR) allows the user to enable the A926P Well Biasing System and EMI Well Biasing System. The default setting is both Well Biasing Systems are disabled. A926P Well Biasing System can operate under both Doze mode and Sleep mode, while EMI Well Biasing System can operate under Sleep mode only. To enable Well Biasing Systems and take advantage of this power saving feature, CRM_WBFA or CRM_WBFA_EMI bit must be set to 1. Figure 4-5 shows the register and Table 4-6 provides its field descriptions. 0x1002_781C (WBCR) R Access: User R/W 31 30 29 28 0 0 0 0 27 R 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 0 0 0 0 24 0 0 0 0 CRM_SPA W Reset 25 CRM_SPA_EMI W Reset 26 0 0 0 0 23 22 21 20 0 0 0 0 0 0 0 0 0 0 0 0 3 2 1 0 7 6 5 4 0 0 0 0 0 0 0 0 19 18 17 16 CRM_WBFA CRM_WBM_ _EMI EMI CRM_WBFA 0 0 CRM_WBM 0 0 Figure 4-5. Well Bias Control Register (WBCR) Table 4-6. Well Bias Control Register Field Descriptions Field 31–28 Description Reserved. These bits are reserved and should read 0. 27–26 CRM_SPA_EMI EMI PWELL Set Point Adjust. Describe the configuration of the EMI PWELL bias circuit’s set point or regulation level. 00 Minimum Back Bias applied to the Pwells. 01 Decreased Back Bias applied to the Pwells. 10 Moderate Back Bias applied to the Pwells. 11 Increased Back Bias applied to the Pwells. 25–24 CRM_SPA_EMI EMI NWELL Set Point Adjust. Describe the configuration of the EMI NWELL bias circuit’s set point or regulation level. 00 Minimum Back Bias applied to the Nwells. 01 Decreased Back Bias applied to the Nwells. 10 Moderate Back Bias applied to the Nwells. 11 Increased Back Bias applied to the Nwells. 23–20 19 CRM_WBFA_EMI Reserved. These bits are reserved and should read 0. Well Bias Frequency Adjust. For optimal power savings, the user should set this bit to 1 when EMI Well Bias is enabled. 0 Standard 1 Adjusted Suggested setting for optimal power savings when Well Bias is enabled. Note: This bit has no effect when Well Bias is disabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-9 System Control Table 4-6. Well Bias Control Register Field Descriptions (continued) Field Description 18–16 CRM_WBM_EMI CRM_WBM. Enables or disables EMI Well Bias System during Sleep mode. To enable Well Bias during Sleep mode, these bits must be set to 001. To disable Well Bias, these bits must be set to 000. All other bit settings are reserved. 000 Well Bias not applied 001 Well Bias @ Sleep 010–111Well Bias not applied 15–12 Reserved. These bits are reserved and should read 0. 11–10 CRM_SPA A926P PWELL Set Point Adjust. Describes the configuration of the A926P PWELL bias circuit’s set point or regulation level. 00 Minimum Back Bias applied to the Pwells. 01 Decreased Back Bias applied to the Pwells. 10 Moderate Back Bias applied to the Pwells. 11 Increased Back Bias applied to the Pwells. 9–8 CRM_SPA A926P NWELL Set Point Adjust. Describe the configuration of the A926P Nwell bias circuit’s set point or regulation level. 00 Minimum Back Bias applied to the Nwells. 01 Decreased Back Bias applied to the Nwells. 10 Moderate Back Bias applied to the Nwells. 11 Increased Back Bias applied to the Nwells. 7–4 Reserved. These bits are reserved and should read 0. 3 CRM_WBFA Well Bias Frequency Adjust. For optimal power savings, the user should set this bit to 1 when A926P Well Bias is enabled. 0 Standard. 1 Adjusted Suggested setting for optimal power savings when Well Bias is enabled This bit has no effect when Well Bias is disabled. 2–0 CRM_WBM CRM_WBM. Controls when the A926P well bias will be applied.Enables or disables Well Bias System during Sleep mode. To enable Well Bias during Sleep mode, these bits must be set to 001. To disable Well Bias, these bits must be set to 000. All other bit settings are reserved. 000 Well Bias not applied 001 Well Bias @ Sleep 010 Well Bias @ Sleep and DOZE 100–111Well Bias not applied MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-10 Freescale Semiconductor System Control 4.2.6 Drive Strength Control Register 1 (DSCR1) The Drive Strength Control Register 1 (DSCR1) controls the driving force parameters of all slow I/O signals in the i.MX27 device. Figure 4-6 shows the register and Table 4-7 provides its field descriptions. 0x1002_7820 (DSCR1) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset DS_SLOW8 0 DS_SLOW7 0 0 0 DS_SLOW6 0 0 DS_SLOW5 0 0 DS_SLOW4 0 0 21 20 DS_SLOW11 DS_SLOW3 0 19 18 DS_SLOW10 DS_SLOW2 0 0 0 17 16 DS_SLOW9 DS_SLOW1 0 0 Figure 4-6. Drive Strength Control Register (DSCR1) Table 4-7. Drive Strength Control Register 1 Field Description Field Description 31–22 Reserved. These bits are reserved and should read 0. 21–20 DS_SLOW11 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 11. (DVS_PMIC) 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_SLOW10 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 10. (SDHC1 and CSPI3) 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_SLOW9 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 9. (JTAG) 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_SLOW8 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 8. (PWM, KPP, UART1, UART2, UART3, and RESET_OUT_B) 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_SLOW7 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 7. (CSPI1 and CSPI2) 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-11 System Control Table 4-7. Drive Strength Control Register 1 Field Description (continued) Field Description 11–10 DS_SLOW6 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 6. (SSI1, SSI2, SAP, SSI3, GPT4, and GPT5) 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_SLOW5 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 5. (GPT1, I2C1, and I2C2) 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_SLOW4 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 4. (USBH1, UART4, and USBG) 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_SLOW3 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 3. (CSI, UART5, and UART6) 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_SLOW2 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 2.(SDHC2 and MSHC) 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_SLOW1 Drive Strength Slow I/O. Controls the driving strength of slow I/O group 1. (LCDC) 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-12 Freescale Semiconductor System Control 4.2.7 Drive Strength Control Register 2 (DSCR2) The Drive Strength Control Register 2 (DSCR2) controls the driving force parameters of the fast I/O signals in the i.MX27 processor. Figure 4-7 shows the register and Table 4-8 provides its field descriptions. 0x1002_7824 (DSCR2) 31 R W Reset R W Reset 30 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 DS_FAST16 DS_FAST15 DS_FAST14 DS_FAST13 DS_FAST12 DS_FAST11 DS_FAST10 17 16 DS_FAST9 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DS_FAST8 0 DS_FAST7 0 0 0 DS_FAST6 0 0 DS_FAST5 0 0 DS_FAST4 0 0 DS_FAST3 0 DS_FAST2 0 0 0 DS_FAST1 0 0 Figure 4-7. Drive Strength Control Register 2 (DSCR2) Table 4-8. Drive Strength Control Register 2 Field Descriptions Field Description 31–30 DS_FAST16 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 16 (D15). 00 Normal 01 High 10 Max high 11 Max high 29–28 DS_FAST15 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 15 (D14). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST14 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 14 (D13). 00 Normal 01 High 10 Max high 11 Max high 25–24 DS_FAST13 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 13 (D12). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST12 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 12 (D11). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-13 System Control Table 4-8. Drive Strength Control Register 2 Field Descriptions (continued) Field Description 21–20 DS_FAST11 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 11(D10). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST10 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 10 (D9). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST9 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 9 (D8). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST8 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 8 (D7). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST7 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 7 (D6). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST6 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 6 (D5). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST5 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 5 (D4). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST4 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 4 (D3). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST3 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 3 (D2). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-14 Freescale Semiconductor System Control Table 4-8. Drive Strength Control Register 2 Field Descriptions (continued) Field 4.2.8 Description 3–2 DS_FAST2 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 2 (D1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST1 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 1 (D0). 00 Normal 01 High 10 Max high 11 Max high Drive Strength Control Register 3 The Drive Strength Control Register 3 (DSCR3) controls the driving force parameters of the fast I/O signals in the i.MX27. Figure 4-8 shows the register and Table 4-9 provides its field descriptions. 0x1002_7828 (DSCR3) 31 R W W 29 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST32 DS_FAST31 DS_FAST30 DS_FAST29 DS_FAST28 DS_FAST27 DS_FAST26 DS_FAST25 Reset R 30 Access: User R/W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DS_FAST24 DS_FAST23 DS_FAST22 DS_FAST21 DS_FAST20 DS_FAST19 DS_FAST18 DS_FAST17 Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-8. Drive Strength Control Register 3 (DSCR3) Table 4-9. Drive Strength Control Register 3 Field Descriptions Field Description 31–30 DS_FAST32 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 32 (A15). 00 Normal 01 High 10 Max high 11 Max high 29–28 DS_FAST31 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 31 (A14). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST30 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 30 (A13). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-15 System Control Table 4-9. Drive Strength Control Register 3 Field Descriptions (continued) Field Description 25–24 DS_FAST29 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 29 (A12). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST28 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 28 (A11). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST27 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 27 (A10). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST26 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 26 (A9). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST25 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 25 (A8). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST24 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 24 (A7). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST23 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 23 (A6). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST22 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 22 (A5). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST21 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 21 (A4). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-16 Freescale Semiconductor System Control Table 4-9. Drive Strength Control Register 3 Field Descriptions (continued) Field Description 7–6 DS_FAST20 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 20 (A3). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST19 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 19 (A2). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST18 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 18 (A1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST17 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 17 (A0). 00 Normal 01 High 10 Max high 11 Max high 4.2.9 Drive Strength Control Register 4 The Drive Strength Control Register 4 (DSCR4) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-9 shows the register and Table 4-10 provides its field descriptions. 0x1002_782C (DSCR4) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset 19 18 17 16 DS_FAST42 DS_FAST41 DS_FAST40 DS_FAST39 DS_FAST38 DS_FAST37 DS_FAST36 DS_FAST35 DS_FAST34 DS_FAST33 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-9. Drive Strength Control Register 4 (DSCR4) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-17 System Control Table 4-10. Drive Strength Control Register 4 Field Descriptions Field Description 31–20 Reserved. These bits are reserved and should read 0. 19–18 DS_FAST42 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 42 (A25). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST41 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 41 (A24). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST40 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 40 (A23). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST39 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 39 (A22). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST38 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 38 (A21). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST37 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 37 (A20). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST36 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 36 (A19). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST35 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 35 (A18). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-18 Freescale Semiconductor System Control Table 4-10. Drive Strength Control Register 4 Field Descriptions (continued) Field Description 3–2 DS_FAST34 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 34 (A17). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST33 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 33 (A16). 00 Normal 01 High 10 Max high 11 Max high 4.2.10 Drive Strength Control Register 5 The Drive Strength Control Register 5 (DSCR5) controls the driving force parameters of the fast I/O signals in the i.MX27 processor. Figure 4-10 shows the register and Table 4-11 provides its field descriptions. 0x1002_7830 (DSCR5) 31 R W Reset R W Reset 30 29 Access: User read/write 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST64 DS_FAST63 DS_FAST62 DS_FAST61 DS_FAST60 DS_FAST59 DS_FAST58 DS_FAST57 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DS_FAST56 DS_FAST55 DS_FAST54 DS_FAST53 DS_FAST52 DS_FAST51 DS_FAST50 DS_FAST49 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-10. Drive Strength Control Register 5 (DSCR5) Table 4-11. Drive Strength Control Register 5 Field Descriptions Field Description 31–30 DS_FAST64 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 64 (SD15). 00 Normal 01 High 10 Max high 11 Max high 29–28 DS_FAST63 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 63 (SD14). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-19 System Control Table 4-11. Drive Strength Control Register 5 Field Descriptions (continued) Field Description 27–26 DS_FAST62 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 62 (SD13). 00 Normal 01 High 10 Max high 11 Max high 25–24 DS_FAST61 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 61 (SD12). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST60 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 60 (SD11). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST59 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 59 (SD10). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST58 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 58 (SD9). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST57 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 57 (SD8). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST56 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 56 (SD7). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST55 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 55 (SD6). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST54 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 54 (SD5). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-20 Freescale Semiconductor System Control Table 4-11. Drive Strength Control Register 5 Field Descriptions (continued) Field Description 9–8 DS_FAST53 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 53 (SD4). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST52 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 52 (SD3). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST51 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 51 (SD2). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST50 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 50 (SD1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST49 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 49 (SD0). 00 Normal 01 High 10 Max high 11 Max high 4.2.11 Drive Strength Control Register 6 The Drive Strength Control Register 6 (DSCR6) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-11 shows the register and Table 4-12 provides its field descriptions. 0x1002_7834 (DSCR6) 31 R W Reset R W Reset 30 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST80 DS_FAST79 DS_FAST78 DS_FAST77 DS_FAST76 DS_FAST75 DS_FAST74 DS_FAST73 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DS_FAST72 DS_FAST71 DS_FAST70 DS_FAST69 DS_FAST68 DS_FAST67 DS_FAST66 DS_FAST65 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-11. Drive Strength Control Register 6 (DSCR6) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-21 System Control Table 4-12. Drive Strength Control Register 6 Field Descriptions Field Description 31–30 DS_FAST80 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 80 (SD31). 00 Normal 01 High 10 Max high 11 Max high 29–28 DS_FAST79 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 79 (SD30). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST78 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 78 (SD29). 00 Normal 01 High 10 Max high 11 Max high 25–24 DS_FAST77 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 77 (SD28). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST7 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 76 (SD27). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST75 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 75 (SD26). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST74 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 74 (SD25). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST73 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 73 (SD24). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST72 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 72 (SD23). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-22 Freescale Semiconductor System Control Table 4-12. Drive Strength Control Register 6 Field Descriptions (continued) Field Description 13–12 DS_FAST71 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 71 (SD22). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST70 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 70 (SD21). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST69 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 69 (SD20). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST68 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 68 (SD19). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST67 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 67 (SD18). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST66 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 66 (SD17). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST65 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 65 (SD16). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-23 System Control 4.2.12 Drive Strength Control Register 7 The Drive Strength Control Register 7 (DSCR7) controls the driving force parameters of the fast I/O signals in the i.MX27 processor. Figure 4-12 shows the register and Table 4-13 provides its field descriptions. 0x1002_7838 (DSCR7) R 31 30 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST95 DS_FAST94 DS_FAST93 DS_FAST92 DS_FAST91 DS_FAST90 DS_FAST89 DS_FAST88 DS_FAST87 DS_FAST86 DS_FAST85 DS_FAST84 DS_FAST83 DS_FAST82 DS_FAST81 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-12. Drive Strength Control Register 7 (DSCR7) Table 4-13. Drive Strength Control Register 7 Field Descriptions Field Description 31–30 Reserved. These bits are reserved and should read 0. 29–28 DS_FAST95 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 95 (RW_B). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST94 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 94 (BCLK). 00 Normal 01 High 10 Max high 11 Max high 25–24 DS_FAST93 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 93 (LBA_B). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST92 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 92 (OE_B). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST91 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 91 (ECB_B). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-24 Freescale Semiconductor System Control Table 4-13. Drive Strength Control Register 7 Field Descriptions (continued) Field Description 19–18 DS_FAST90 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 90 (CS5_B). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST89 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 89 (CS4_B). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST88 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 88 (CS3_B). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST87 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 87 (CS2_B). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST86 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 86 (CS1_B). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST85 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 85 (CS0_B). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST84 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 84 (EB1_B). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST83 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 83 (EB0_B). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-25 System Control Table 4-13. Drive Strength Control Register 7 Field Descriptions (continued) 4.2.13 Field Description 3–2 DS_FAST82 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 82 (SDBA1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST81 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 81 (SDBA0). 00 Normal 01 High 10 Max high 11 Max high Drive Strength Control Register 8 The Drive Strength Control Register 8 (DSCR8) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-13 shows the register and Table 4-14 provides its field descriptions. 0x1002_783C (DSCR8) R 31 30 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset 29 Access: User R/W 28 27 26 25 24 23 22 21 20 0 18 17 16 DS_FAST111 DS_FAST110 DS_FAST109 DS_FAST108 DS_FAST107 DS_FAST106 DS_FAST105 R DS_FAST10 DS_FAST103 DS_FAST102 DS_FAST101 DS_FAST100 DS_FAST99 4 W Reset 19 0 0 0 0 0 0 0 0 0 0 DS_FAST98 0 0 DS_FAST97 0 0 0 Figure 4-13. Drive Strength Control Register 8 (DSCR8) Table 4-14. Drive Strength Control Register 8 Field Descriptions Field Description 31–30 Reserved. These bits are reserved and should read 0. 29–28 DS_FAST111 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 111 (SDQS3). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST110 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 110 (SDQS2). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-26 Freescale Semiconductor System Control Table 4-14. Drive Strength Control Register 8 Field Descriptions (continued) Field Description 25–24 DS_FAST109 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 109 (SDQS1). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST108 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 108 (SDQS0). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST107 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 107 (SDCLK). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST106 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 106 (SDCKE1). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST105 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 105 (SDCKE0). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST104 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 104 (SDWE_B). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST103 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 103 (CAS_B). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST102 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 102 (RAS_B). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST101 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 101 (MA10). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-27 System Control Table 4-14. Drive Strength Control Register 8 Field Descriptions (continued) Field 4.2.14 Description 7–6 DS_FAST100 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 100 (DQM3). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST99 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 99 (DQM2). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST98 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 98 (DQM1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST97 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 97 (DQM0). 00 Normal 01 High 10 Max high 11 Max high Drive Strength Control Register 9 The Drive Strength Control Register 9 (DSCR9) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-14 shows the register and Table 4-15 provides its field descriptions. 0x1002_7840 (DSCR9) R 31 30 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST127 DS_FAST126 DS_FAST125 DS_FAST124 DS_FAST123 DS_FAST122 DS_FAST121 DS_FAST120 DS_FAST119 DS_FAST118 DS_FAST117 DS_FAST116 DS_FAST115 DS_FAST114 DS_FAST113 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-14. Drive Strength Control Register 9 (DSCR9) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-28 Freescale Semiconductor System Control Table 4-15. Drive Strength Control Register 9 Field Descriptions Field 31–30 Description Reserved. These bits are reserved and should read 0. 29–28 DS_FAST127 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 127 (M_REQUEST). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST126 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 126 (M_GRANT). 00 Normal 01 High 10 Max high 11 Max high 25–24 DS_FAST125 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 125 (IOIS16). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST124 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 124 (PC_POE). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST123 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 123 (PC_RW_B). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST122 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 122 (PC_RST). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST121 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 121 (PC_BVD2). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST120 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 120 (PC_BVD1). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST119 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 119 (PC_VS2). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-29 System Control Table 4-15. Drive Strength Control Register 9 Field Descriptions (continued) Field Description 11–10 DS_FAST118 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 118 (PC_VS1). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST117 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 117 (PC_PWRON). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST116 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 116 (PC_READY). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST115 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 115 (PC_WAIT_B). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST114 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 114 (PC_CD2_B). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST113 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 113 (PC_CD1_B). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-30 Freescale Semiconductor System Control 4.2.15 Drive Strength Control Register 10 The Drive Strength Control Register 10 (DSCR10) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-15 shows the register and Table 4-16 provides its field descriptions. 0x1002_7844 (DSCR10) R 31 30 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST143 DS_FAST142 DS_FAST141 DS_FAST140 DS_FAST139 DS_FAST138 DS_FAST137 DS_FAST136 DS_FAST135 DS_FAST134 DS_FAST133 DS_FAST132 DS_FAST131 DS_FAST130 DS_FAST129 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-15. Drive Strength Control Register 10 (DSCR10) Table 4-16. Drive Strength Control Register 10 Field Descriptions Field Description 31–30 Reserved. These bits are reserved and should read 0. 29–28 DS_FAST143 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 143 (SD3_CMD). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST142 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 142 (SD3_CLK). 00 Normal 01 High 10 Max high 11 Max high 25–24 DS_FAST141 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 141 (SD2_CLK). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST140 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 140 (LSCLK). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST139 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 139 (CSI_MCLK). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-31 System Control Table 4-16. Drive Strength Control Register 10 Field Descriptions (continued) Field Description 19–18 DS_FAST138 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 138 (CSI_PIXCLK). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST137 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 137 (CLKO). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST136 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 136. 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST135 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 135 (NFWE_B). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST134 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 134 (NFRE_B). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST133 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 133 (NFALE). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST132 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 132 (NFCLE). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST131 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 131 (NFWP_B). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-32 Freescale Semiconductor System Control Table 4-16. Drive Strength Control Register 10 Field Descriptions (continued) Field 4.2.16 Description 3–2 DS_FAST130 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 130 (NFCE_B). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST129 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 129 (NFRB). 00 Normal 01 High 10 Max high 11 Max high Drive Strength Control Register 11 The Drive Strength Control Register 11 (DSCR11) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-16 shows the register and Table 4-17 provides its field descriptions. 0x1002_7848 (DSCR11) 31 R W Reset R W Reset 30 29 Access: User R/W 28 27 26 25 24 23 22 21 20 19 18 17 16 DS_FAST160 DS_FAST159 DS_FAST158 DS_FAST157 DS_FAST156 DS_FAST155 DS_FAST154 DS_FAST153 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 DS_FAST152 DS_FAST151 DS_FAST150 DS_FAST149 DS_FAST148 DS_FAST147 DS_FAST146 DS_FAST145 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-16. Drive Strength Control Register 11 (DSCR11) Table 4-17. Drive Strength Control Register 11 Field Descriptions Field Description 31–30 DS_FAST160 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 160 (ATA_DATA15). 00 Normal 01 High 10 Max high 11 Max high 29–28 DS_FAST159 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 159 (ATA_DATA14). 00 Normal 01 High 10 Max high 11 Max high 27–26 DS_FAST158 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 158 (ATA_DATA13). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-33 System Control Table 4-17. Drive Strength Control Register 11 Field Descriptions (continued) Field Description 25–24 DS_FAST157 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 157 (ATA_DATA12). 00 Normal 01 High 10 Max high 11 Max high 23–22 DS_FAST156 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 156 (ATA_DATA11). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST155 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 155 (ATA_DATA10). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST154 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 154 (ATA_DATA9). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST153 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 153 (ATA_DATA8). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST152 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 152 (ATA_DATA7). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST151 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 151 (ATA_DATA6). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST150 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 150 (ATA_DATA5). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST149 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 149 (ATA_DATA4). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-34 Freescale Semiconductor System Control Table 4-17. Drive Strength Control Register 11 Field Descriptions (continued) Field Description 7–6 DS_FAST148 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 148 (ATA_DATA3). 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST147 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 147 (ATA_DATA2). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST146 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 146 (ATA_DATA1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST145 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 145 (ATA_DATA0). 00 Normal 01 High 10 Max high 11 Max high 4.2.17 Drive Strength Control Register 12 The Drive Strength Control Register 12 (DSCR12) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-17 shows the register and Table 4-18 provides its field descriptions. 0x1002_784C (DSCR12) R Access: User R/W 31 30 29 28 27 26 25 24 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset 23 22 21 20 19 18 17 16 DS_FAST172 DS_FAST171 DS_FAST170 DS_FAST169 R DS_FAST DS_FAST DS_FAST DS_FAST DS_FAST164 DS_FAST163 DS_FAST162 DS_FAST161 168 167 166 165 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-17. Drive Strength Control Register 12 (DSCR12) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-35 System Control Table 4-18. Drive Strength Control Register 12 Field Descriptions Field 31–24 Description Reserved. These bits are reserved and should read 0. 23–22 DS_FAST172 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 172 (USBOTG_CLK). 00 Normal 01 High 10 Max high 11 Max high 21–20 DS_FAST171 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 171 (USBOTG_NXT). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST170 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 170 (USBOTG_STP). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST169 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 169 (USBOTG_DIR). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST168 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 168 (USBOTG_DATA7). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST167 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 167 (USBOTG_DATA6). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST166 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 166 (USBOTG_DATA5). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST165 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 165 (USBOTG_DATA4). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST164 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 164 (USBOTG_DATA3). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-36 Freescale Semiconductor System Control Table 4-18. Drive Strength Control Register 12 Field Descriptions (continued) Field Description 5–4 DS_FAST163 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 163 (USBOTG_DATA2). 00 Normal 01 High 10 Max high 11 Max high 3–2 DS_FAST162 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 162 (USBOTG_DATA1). 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST161 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 161 (USBOTG_DATA0). 00 Normal 01 High 10 Max high 11 Max high 4.2.18 Drive Strength Control Register 13 The Drive Strength Control Register 13 (DSCR13) controls the driving force parameters of the fast I/O signals in the i.MX27 device. Figure 4-18 shows the register and Table 4-19 provides its field descriptions. 0x1002_7850 (DSCR13) R Access: User R/W 31 30 29 28 27 26 25 24 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset 23 22 21 20 19 18 17 16 DS_FAST188 DS_FAST187 DS_FAST186 DS_FAST185 DS_FAST184 DS_FAST183 DS_FAST182 DS_FAST181 DS_FAST180 DS_FAST179 DS_FAST178 DS_FAST177 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 4-18. Drive Strength Control Register 13 (DSCR13) Table 4-19. Drive Strength Control Register 13 Field Descriptions Field Description 31–24 Reserved. These bits are reserved and should read 0. 23–22 DS_FAST188 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 188 (USBH2_CLK). 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-37 System Control Table 4-19. Drive Strength Control Register 13 Field Descriptions (continued) Field Description 21–20 DS_FAST187 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 187 (USBH2_DIR). 00 Normal 01 High 10 Max high 11 Max high 19–18 DS_FAST186 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 186 (USBH2_NXT). 00 Normal 01 High 10 Max high 11 Max high 17–16 DS_FAST185 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 185 (USBH2_STP). 00 Normal 01 High 10 Max high 11 Max high 15–14 DS_FAST184 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 184 (USBH2_DATA7). 00 Normal 01 High 10 Max high 11 Max high 13–12 DS_FAST183 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 183 (USBH2_DATA6). 00 Normal 01 High 10 Max high 11 Max high 11–10 DS_FAST182 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 182 (USBH2_DATA5). 00 Normal 01 High 10 Max high 11 Max high 9–8 DS_FAST181 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 181 (USBH2_DATA4). 00 Normal 01 High 10 Max high 11 Max high 7–6 DS_FAST180 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 180.(USBH2_DATA3) 00 Normal 01 High 10 Max high 11 Max high 5–4 DS_FAST179 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 179 (USBH2_DATA2) 00 Normal 01 High 10 Max high 11 Max high MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-38 Freescale Semiconductor System Control Table 4-19. Drive Strength Control Register 13 Field Descriptions (continued) Field Description 3–2 DS_FAST178 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 178 (USBH2_DATA1) 00 Normal 01 High 10 Max high 11 Max high 1–0 DS_FAST177 Drive Strength Fast I/O. Controls the driving strength of fast I/O group 177 (USBH2_DATA0) 00 Normal 01 High 10 Max high 11 Max high 4.2.19 Pull Strength Control Register (PSCR) The Pull Strength Control Register (PSCR) controls the pull strength value and direction for the chip. Figure 4-19 shows the register and Table 4-20 provides its field descriptions. 0x1002_7854 (PSCR) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W Reset R W Reset PUENCR7 0 PUENCR6 0 0 0 PUENCR5 0 0 PUENCR4 0 0 PUENCR3 0 0 PUENCR2 0 0 PUENCR1 0 0 PUENCR0 0 0 Figure 4-19. Pull Strength Control Register (PSCR) Table 4-20. Pull Strength Control Register Field Descriptions Field 31–16 Description Reserved. These bits are reserved and should read 0. 15–14 PUENCR PUEN Strength Control 7. Bit selects direction (up or down) and strength. (SD2_D0_MSHC_DATA0) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up 13–12 PUENCR6 PUEN Strength Control 6. Bit selects direction (up or down) and strength. (SD2_D1_MSHC_DATA1) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-39 System Control Table 4-20. Pull Strength Control Register Field Descriptions (continued) Field Description 11–10 PUENCR5 PUEN Strength Control 5. Bit selects direction (up or down) and strength. (SD2_D2_MSHC_DATA2) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up 9–8 PUENCR4 PUEN Strength Control 4. Bit selects direction (up or down) and strength. (SD2_D3_MSHC_DATA3) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up 7–6 PUENCR3 PUEN Strength Control 3. Bit selects direction (up or down) and strength. (SD2_CMD_MSHC_BS) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up 5–4 PUENCR2 PUEN Strength Control 2. Bit selects direction (up or down) and strength. (SD2_CLK_MSHC_SCLK) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up 3–2 PUENCR1 PUEN Strength Control 1. Bit selects direction (up or down) and strength. (SD1_D3_CSPI3_SS) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up 1–0 PUENCR0 PUEN Strength Control 0. Bit selects direction (up or down) and strength. (ATA_DATA3_SD3_D3S) 00 100k pull-down 01 100k pull-up 10 47k pull-up 11 22k pull-up MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-40 Freescale Semiconductor System Control 4.2.20 Priority Control and Select Register (PCSR) The Priority Control and Select Register (PCSR) consist of the master high priority and slave alternate context priority select to the ARM9 Platform. Figure 4-20 shows the register and Table 4-21 provides its field descriptions. 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 S3_AMPR_SEL S2_AMPR_SEL S1_AMPR_SEL S0_AMPR_SEL 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 M4_HIGH_PRIORITY M3_HIGH_PRIORITY M2_HIGH_PRIORITY M1_HIGH_PRIORITY M0_HIGH_PRIORITY R Access: User R/W M5_HIGH_PRIORITY Address 0x1002_7858 (PCSR) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 W Reset R W Reset Figure 4-20. Priority Control and Select Register (PCSR) Table 4-21. Priority Control and Select Register Field Descriptions Field 31–20 19–16 S3_AMPR_SEL S2_AMPR_SEL S1_AMPR_SEL S0_AMPR_SEL 15–6 5–0 M5_HIGH_PRIORITY M4_HIGH_PRIORITY M3_HIGH_PRIORITY M2_HIGH_PRIORITY M1_HIGH_PRIORITY M0_HIGH_PRIORITY Description Reserved. These bits are reserved and should read 0. Slave Alternate Context Priority Select. Inputs to the ARM9 Platform to select the priority determination and control source for the appropriate slave port. (Note s0 is the primary AHB and does not come out of the ARM9 Platform. 0 Priority determination and control is made by regular registers. 1 Priority determination and control is made by alternate registers set in the Crossbar switch. Reserved. These bits are reserved and should read 0. Master High Priority. Inputs to the ARM9 Platform to elevate to highest appropriate master ports priority level to each slave above all other master ports priority levels which do not have this input asserted. If more than one master has its high priority input asserted, priority level is determined by the software programmed priority assignments inside the Crossbar switch. 0 Master port low priority 1 Master port high priority MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-41 System Control 4.2.21 Power Management Control Register (PMCR) The Power Management Control Register (PMCR) controls the DPTC function of the chip. Figure 4-21 shows the register and Table 4-22 provides its field descriptions. 0x1002_7860 (PMCR) 31 R W Reset R W Reset 30 29 Access: User R/W 28 27 26 25 24 23 22 0 21 20 19 18 17 16 MC EM UP LO 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 DIE DPTE N 0 0 0 0 RVEN 0 0 0 VSTBY 0 0 REFCOUNTER DCR RCLK DRCE DRCE DRCE DRCE ON 3 1 2 0 0 0 0 0 0 0 DIM 0 0 Figure 4-21. Power Management Control Register (PMCR) Table 4-22. Power Management Control Register Field Descriptions Field Description 31 MC MC. Measure complete status bit 0 On progress or idle 1 Measure completed 30 EM EM. Emergency interrupt state bit 0 No Emergency interrupt 1 Emergency interrupt is detected. 29 UP UP. Upper_limit interrupt state bit 0 No Upper_limit interrupt is detected. 1 Upper_limit interrupt is detected. 28 LO LO. Lower_limit interrupt state bit. 0 No lower_limit interrupt. 1 Lower_limit interrupt is detected. 27 Reserved. These bits are reserved and should read 0. 26–16 REFCOUNTER 15 RVEN 14 Reference Counter Value. These bits contains the value of reference counter in comparison stage. Reduced Voltage Mode Enable. This bit controls whether enable RV mode when chip is in sleep mode. 0 Disable RV mode is in sleep mode. 1 Enable RV mode is in sleep mode. Reserved. These bits are reserved and should read 0. 13–12 VSTBY Voltage Standby Control. These two bits will be put on Boot1 and Boot0 when chip is in sleep mode. And used to inform PMIC to change the voltage to the chip. 11–10 Reserved. These bits are reserved and should read 0. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-42 Freescale Semiconductor System Control Table 4-22. Power Management Control Register Field Descriptions (continued) Field Description 9 DCR DPTC counting range. This bit sets how many times the system clock may increment and the reference circuits remain active (and their output signals will be counted). Value of ‘1’ causes a 256 system clock count. Value of ‘0’ causes a 128 system clock count. 0 128 system clock count 1 256 system clock count 8 RCLKON DPTC Reference Clock Monitor On. Enable Reference clock for debug. 0 Normal operation 1 Reference clock always on 7 DRCE3 DPTC reference circuit3 enable. This bit defines if reference circuit3 is enabled during DPTC operation. 0 DPTC reference circuit3 is disabled. 1 DPTC reference circuit3 is enabled. 6 DRCE2 DPTC reference circuit2 enable. This bit defines if reference circuit2 is enabled during DPTC operation. 0 DPTC reference circuit2 is disabled. 1 DPTC reference circuit2 is enabled. 5 DRCE1 DPTC reference circuit1 enable. This bit defines if reference circuit1 is enabled during DPTC operation. 0 DPTC reference circuit1 is disabled. 1 DPTC reference circuit1 is enabled. 4 DRCE0 DPTC reference circuit0 enable. This bit defines if reference circuit0 is enabled during DPTC operation. 0 DPTC reference circuit0 is disabled. 1 DPTC reference circuit0 is enabled. 3–2 DIM DPTC interrupt mask. these bits control how DPTC generate its interrupt. 00 DPTC will generate an interrupt in all cases. 01 DPTC will generate an interrupt only in lower_limit case. 10 DPTC will generate an interrupt only in upper_limit case. 11 DPTC will generate an interrupt only in emergency case. 1 DIE DPTC Interrupt enable. This bit enables DPTC interrupt generation. 0 No interrupt will be generated. 1 Enable interrupt generation 0 DPTEN DPTC enable. This bit enables the DPTC block and starts the reference circuit clock counting and compares this to look-up table values. 0 DPTC is disabled. 1 DPTC is enabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-43 System Control 4.2.22 DPTC Comparator Value Register 0 (DCVR0) The DPTC Comparator Value Register 0 (DCVR0) contains the DPTC comparator value for the DPTC in the i.MX27 processor. Figure 4-22 shows the register and Table 4-23 provides its field descriptions. 0x1002_7864 (DCVR0) 31 30 29 Access: User R/W 28 27 R 26 25 24 23 22 21 20 19 ULV W Reset 17 16 LLV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 R LLV W Reset 18 0 0 0 ELV 0 0 0 0 0 0 0 0 Figure 4-22. DPTC Comparator Value Register 0 (DCVR0) Table 4-23. DPTC Comparator Value Register 0 Field Description Field Description 31–21 ULV Upper Limit. Value for the upper performance limit of the reference circuit 0 clock counter. 20–10 LLV Lower Limit. Value for the lower performance limit of the reference circuit 0 clock counter. 9–0 ELV 4.2.23 Emergency Limit. Value for the lower performance limit of the reference circuit 0 clock counter. This serves as an “emergency” lower limit, which indicates a critical value. DPTC Comparator Value Register 1 (DCVR1) The DPTC Comparator Value Register 1 (DCVR1) contains the DPTC comparator value for the DPTC in the i.MX27 processor. Figure 4-23 shows the register and Table 4-24 provides its field descriptions. 0x1002_7868 (DCVR1) 31 30 29 Access: User R/W 28 27 R 24 23 22 21 20 19 18 17 16 LLV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 R LLV W Reset 25 ULV W Reset 26 0 0 0 ELV 0 0 0 0 0 0 0 0 Figure 4-23. DPTC Comparator Value Register 1 (DCVR1) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-44 Freescale Semiconductor System Control Table 4-24. DPTC Comparator Value Register 1 Field Descriptions Field Description 31–21 ULV Upper Limit. Value for the upper performance limit of the reference circuit 1 clock counter. 20–10 LLV Lower Limit. Value for the lower performance limit of the reference circuit 1 clock counter. 9–0 ELV 4.2.24 Emergency Limit. Value for the lower performance limit of the reference circuit 1 clock counter. This serves as an “emergency” lower limit, which indicates a critical value DPTC Comparator Value Register 2 The DPTC Comparator Value Register 2 (DCVR2) contains the DPTC comparator value for the DPTC in the i.MX27 processor. Figure 4-24 shows the register and Table 4-25 provides its field descriptions. 0x1002_786C (DCVR2) 31 30 29 Access: User R/W 28 27 R 26 25 24 23 22 21 20 19 ULV W Reset 17 16 LLV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 R LLV W Reset 18 0 0 0 ELV 0 0 0 0 0 0 0 0 Figure 4-24. DPTC Comparator Value Register 2 (DCVR2) Table 4-25. DPTC Comparator Value Register 2 Field Descriptions Field Description 31–21 ULV Upper Limit. Value for the upper performance limit of the reference circuit 2 clock counter. 20–10 LLV Lower Limit. Value for the lower performance limit of the reference circuit 2 clock counter. 9–0 ELV Emergency Limit. Value for the lower performance limit of the reference circuit 2 clock counter. This serves as an “emergency” lower limit, which indicates a critical value. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-45 System Control 4.2.25 DPTC Comparator Value Register 3 The DPTC Comparator Value Register 3 (DCVR3) contains the DPTC comparator value for the DPTC in the i.MX27 processor. Figure 4-25 shows the register and Table 4-26 provides its field descriptions. 0x1002_7870 (DCVR3) 31 30 29 Access: User R/W 28 27 R 26 25 24 23 22 21 20 19 18 ULV W Reset 16 LLV 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 R LLV W Reset 17 0 0 0 ELV 0 0 0 0 0 0 0 0 Figure 4-25. DPTC Comparator Value Register 3 (DCVR3) Table 4-26. DPTC Comparator Value Register 3 Description Field Description 31–21 ULV Upper Limit. Value for the upper performance limit of the reference circuit 3 clock counter. 20–10 LLV Lower Limit. Value for the lower performance limit of the reference circuit 3 clock counter. 9–0 ELV 4.2.26 Emergency Limit. Value for the lower performance limit of the reference circuit 3 clock counter. This serves as an “emergency” lower limit, which indicates a critical value. PMIC Pad Control Register (PPCR) The PMIC Pad Control Register (PPCR) contains control bits of Boot0 and Boot1 pads which used for RV function in low power mode. Figure 4-26 shows the register and Table 4-27 provides its field descriptions. 0x1002_7874 (PPCR) R Access: User read/write 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 5 4 3 2 1 0 0 0 0 0 W Reset R PUS1 W Reset 0 PUE1 1 0 DSE1 0 OE1 0 0 7 6 0 0 0 0 PUS0 0 PUE0 1 0 DSE0 0 OE0 1 1 Figure 4-26. PMIC Pad Control Register (PPCR) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-46 Freescale Semiconductor System Control Table 4-27. PMIC Pad Control Register Field Description Field 4.3 Description 31–14 Reserved. These bits are reserved and should read 0. 13–12 PUS1 PUS1. PUS control of BOOT1 pad. Only used when RVEN bit is set. 11 PUE1 PUE1. PUE control of BOOT1 pad. Only used when RVEN bit is set. 10–9 DSE1 DSE1. DSE control of BOOT1 pad. Only used when RVEN bit is set. 8 OE1 OE1. OE control of BOOT1 pad. Only used when RVEN bit is set. 7–16 Reserved. These bits are reserved and should read 0. 5–4 PUS0 PUS0. PUS control of BOOT0 pad. Only used when RVEN bit is set. 3 PUE0 PUE0. PUE control of BOOT0 pad. Only used when RVEN bit is set. 2–1 DSE0 DSE0. DSE control of BOOT0 pad. Only used when RVEN bit is set. 0 OE0 OE0. OE control of BOOT0 pad. Only used when RVEN bit is set. System Boot Mode Selection The operational system boot mode of the i.MX27 processor upon system reset is determined by the configuration of the four external input pins, BOOT[3:0]. The settings of these pins control where the system is boot from and the memory port size. The i.MX27 processor always begins fetching instruction from the address 0x00000000 after reset. The BOOT[3:0] pins control the memory region that is mapped to the address 0x0. Upon power up, if the BOOT_INT is 1, the Boot Address will always be 0x00000000. If the fuse of the BOOT_INT is blown, the BOOT Address will be generated based on the BOOT[3:0] information. The boot modes are defined in Table 4-28. These boot modes information are registered during the system reset. When an external chip select is enabled by the BOOT[3:0] pins, the reset vector 0x0 will jump to the corresponding boot address space. NOTE The BOOT pins must not change once the i.MX27 device is out of reset. For proper operation, BOOT[3] must always be tied to VSS. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 4-47 System Control Table 4-28. System Boot Mode Selection Inputs BOOT[3:0] Output Signals Active Device (Boot Internal) Output Signals Active Device (Boot External) Boot Address 0000 iROM (Bootstrap USB/UART) iROM Bootstrap USB/UART 0x00000030 0010 iROM (8-bit 2 Kbyte NAND Flash) 8-bit 2 Kbyte NAND Flash 0xD8000000 0011 iROM (16-bit 2 Kbyte NAND Flash) 16-bit 2 Kbyte NAND Flash 0xD8000000 0100 iROM (16-bit 512 byte NAND Flash) 16-bit 512 Kbyte NAND Flash 0xD8000000 0101 iROM (16-bit CS0 at D[15:0] (NOR Flash)) 16-bit CS0 at D[15:0] (NOR Flash) 0xC0000000 0110 Reserved Reserved 0xC0000000 0111 iROM (8-bit 512 byte NAND Flash) 8-bit 512B NAND Flash 0xD8000000 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 4-48 Freescale Semiconductor Signal Descriptions and Pin Assignments Chapter 5 Signal Descriptions and Pin Assignments 5.1 Introduction This chapter identifies and describes the i.MX27 signals and their pin assignments. 5.2 Signal Descriptions The i.MX27 signals are described in Table 5-1. Most of the signals shown in Table 5-1 are multiplexed with other signals. For simplicity, only the primary signal names are shown. See Table 5-2 for complete information on the signal multiplexing schemes of these signals. Table 5-1. i.MX27 Signal Descriptions Pad Name Function/Notes External Bus/Chip Select (EMI) A [13:0] Address bus signals, shared with SDRAM/MDDR, WEIM and PCMCIA, A[10] for SDRAM/MDDR is not the address but the pre-charge bank select signal. MA10 Address bus signals for SDRAM/MDDR A [25:14] Address bus signals, shared with WEIM and PCMCIA SDBA[1:0] SDRAM/MDDR bank address signals SD[31:0] Data bus signals for SDRAM, MDDR SDQS[3:0] MDDR data sample strobe signals DQM0–DQM3 SDRAM data mask strobe signals EB0 Active low external enable byte signal that controls D [15:8], shared with PCMCIA PC_REG. EB1 Active low external enable byte signal that controls D [7:0], shared with PCMCIA PC_IORD. OE Memory Output Enable—Active low output enables external data bus, shared with PCMCIA PC_IOWR. CS [5:0] Chip Select—The chip select signals CS [3:2] are multiplexed with CSD [1:0] and are selected by the Function Multiplexing Control Register (FMCR) in the System Control chapter. By default CSD [1:0] is selected. DTACK is multiplexed with CS4. CS[5:4] are multiplexed with ETMTRACECLK and ETMTRACESYNC; PF22, 21. ECB Active low input signal sent by flash device to the EIM whenever the flash device must terminate an on-going burst sequence and initiate a new (long first access) burst sequence. LBA Active low signal sent by flash device causing external burst device to latch the starting burst address. BCLK Clock signal sent to external synchronous memories (such as burst flash) during burst mode. RW RW signal—Indicates whether external access is a read (high) or write (low) cycle. This signal is also shared with the PCMCIA PC_WE. RAS SDRAM/MDDR Row Address Select signal MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 5-1 Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes CAS SDRAM/MDDR Column Address Select signal SDWE SDRAM Write Enable signal SDCKE0 SDRAM Clock Enable 0 SDCKE1 SDRAM Clock Enable 1 SDCLK SDRAM Clock SDCLK_B SDRAM Clock_B NFWE_B NFC Write enable signal, multiplexed with ETMPIPESTAT2; PF6 NFRE_B NFC Read enable signal, multiplexed with ETMPIPESTAT1; PF5 NFALE NFC Address latch signal, multiplexed with ETMPIPESTAT0; PF4 NFCLE NFC Command latch signal, multiplexed with ETMTRACEPKT0; PF1 NFWP_B NFC Write Permit signal, multiplexed with ETMTRACEPKT1; PF2 NFCE_B NFC Chip enable signal, multiplexed with ETMTRACEPKT2; PF3 NFRB NFC read Busy signal, multiplexed with ETMTRACEPKT3; PF0 D[15:0] Data Bus signal, shared with EMI, PCMCIA, and NFC PC_CD1_B PCMCIA card detect signal, multiplexed with ATA ATA_DIOR signal; PF20 PC_CD2_B PCMCIA card detect signal, multiplexed with ATA ATA_DIOW signal; PF19 PC_WAIT_B PCMCIA WAIT signal, multiplexed with ATA ATA_CS1 signal; PF18 PC_READY PCMCIA READY/IRQ signal, multiplexed with ATA ATA_CS0 signal; PF17 PC_PWRON PCMCIA signal, multiplexed with ATA ATA_DA2 signal; PF16 PC_VS1 PCMCIA voltage sense signal, multiplexed with ATA ATA_DA1 signal; PF14 PC_VS2 PCMCIA voltage sense signal, multiplexed with ATA ATA_DA0 signal; PF13 PC_BVD1 PCMCIA Battery voltage detect signal, multiplexed with ATA ATA_DMARQ signal; PF12 PC_BVD2 PCMCIA Battery voltage detect signal, multiplexed with ATA ATA_DMACK signalPF11 PC_RST PCMCIA card reset signal, multiplexed with ATA ATA_RESET_B signal; PF10 IOIS16 PCMCIA mode signal, multiplexed with ATA ATA_INTRQ signal; PF9 PC_RW_B PCMCIA read write signal, multiplexed with ATA ATA_IORDY signal; PF8 PC_POE PCMCIA output enable signal, multiplexed with ATA ATA_BUFFER_EN signal; PF7 Clocks and Resets CLKO Clock Out signal selected from internal clock signals. Refer to the clock controller for internal clock selection; PF15. EXT_60M This is a special factory test signal. To ensure proper operation, connect this signal to ground. EXT_266M This is a special factory test signal. To ensure proper operation, connect this signal to ground. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 5-2 Freescale Semiconductor Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes OSC26M_TEST This is a special factory test signal. To ensure proper operation, leave this signal as a no connect. RESET_IN Master Reset—External active low Schmitt trigger input signal. When this signal goes active, all modules (except the reset module, SDRAMC module, and the clock control module) are reset. RESET_OUT Reset_Out—Output from the internal Hreset_b; and the Hreset can be caused by all reset source: power on reset, system reset (RESET_IN), and watchdog reset. POR Power On Reset—Active low Schmitt trigger input signal. The POR signal is normally generated by an external RC circuit designed to detect a power-up event. XTAL26M Oscillator output to external crystal EXTAL26M Crystal input (26 MHz), or a 16 MHz to 32 MHz oscillator (or square-wave) input when internal oscillator circuit is shut down. CLKMODE[1:0] These are special factory test signals. To ensure proper operation, do not connect to these signals. EXTAL32K 32 kHz crystal input (Note: in the RTC power domain) XTAL32K Oscillator output to 32 kHz crystal (Note: in the RTC power domain) Power_cut (Note: in the RTC power domain) Power_on_reset (Note: in the RTC power domain) osc32K_bypass The signal for osc32k input bypass (Note: in the RTC power domain) Bootstrap BOOT [3:0] System Boot Mode Select—The operational system boot mode of the i.MX27 processor upon system reset is determined by the settings of these pins. BOOT[1:0] are also used as handshake signals to PMIC(VSTBY). JTAG JTAG_CTRL JTAG Controller select signal—JTAG_CTRL is sampled during rising edge of TRST. Must be pulled to logic high for proper JTAG interface to debugger. Pulling JTAG_CRTL low is for internal test purposes only. TRST Test Reset Pin—External active low signal used to asynchronously initialize the JTAG controller. TDO Serial Output for test instructions and data. Changes on the falling edge of TCK. TDI Serial Input for test instructions and data. Sampled on the rising edge of TCK. TCK Test Clock to synchronize test logic and control register access through the JTAG port. TMS Test Mode Select to sequence JTAG test controller’s state machine. Sampled on rising edge of TCK. RTCK JTAG Return Clock used to enhance stability of JTAG debug interface devices. This signal is multiplexed with 1-Wire; thus, utilizing 1-Wire will render RTCK unusable and vice versa; PE16. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 5-3 Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes Secure Digital Interface (X2) SD1_CMD SD Command bidirectional signal—If the system designer does not want to make use of the internal pull-up, via the Pull-up enable register, a 4. 7K–69 K external pull up resistor must be added. This signal is multiplexed with CSPI3_MOSI; PE22. SD1_CLK SD Output Clock. This signal is multiplexed with CSPI3_SCLK; PE23. SD1_D[3:0] SD Data bidirectional signals—If the system designer does not want to make use of the internal pull-up, via the Pull-up enable register, a 50 K–69 K external pull up resistor must be added. SD1_D[3] is muxed with CSPI3_SS while SD1_D[0] is muxed with CSPI3_MISO PE21–18. SD2_CMD SD Command bidirectional signal. This signal is multiplexed with MSHC_BS; through GPIO multiplexed with SLCDC1_CS; PB8. SD2_CLK SD Output Clock signal. This signal is multiplexed with MSHC_SCLK, through GPIO multiplexed with SLCDC1_CLK; PB9. SD2_D[3:0] SD Data bidirectional signals. SD2_D[3:0] multiplexed with MSHC_DATA[0:3], also through GPIO SD2_1:0] multiplexed with SLCDC1_RS and SLDCD1_D0; PB7–PB4. SD3_CMD SD Command bidirectional signal. This signal is through GPIO PD0 multiplexed with FEC_TXD0. SD3_CLK SD Output Clock signal. This signal is multiplexed with ETMTRACEPKT15 and also through GPIO PD1 multiplexed with FEC_TXD1. Note: SD3_DATA is multiplexed with ATA_DATA3–0. UARTs (X6) UART1_RTS Request to Send input signal; PE15 UART1_CTS Clear to Send output signal; PE14 UART1_RXD Receive Data input signal; PE13 UART1_TXD Transmit Data output signal, PE12 UART2_RXD Receive Data input signal. This signal is multiplexed with KP_ROW6 signal from KPP; PE7. UART2_TXD Transmit Data output signal. This signal is multiplexed with KP_COL6 signal from KPP; PE6. UART2_RTS Request to Send input signal. This signal is multiplexed with KP_ROW7 signal from KPP; PE4. UART2_CTS Clear to Send output signal. This signal is multiplexed with KP_COL7 signal from KPP; PE3. UART3_RTS Request to Send input signal, PE11 UART3_CTS Clear to Send output signal; PE10 UART3_RXD Receive Data input signal; PE9 UART3_TXD Transmit Data output signal; PE8 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 5-4 Freescale Semiconductor Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes Note: UART 4, 5, and 6 are multiplexed with COMS Sensor Interface signals. Keypad KP_COL[5:0] Keypad Column selection signals. KP_COL[7:6] are multiplexed with UART2_CTS and UART2_TXD respectively. Alternatively, KP_COL6 is also available on the internal factory test signal TEST_WB2. The Function Multiplexing Control Register in the System Control chapter must be used in conjunction with programming the GPIO multiplexing (to select the alternate signal multiplexing) to choose which signal KP_COL6 is available. KP_ROW[5:0] Keypad Row selection signals. KP_ROW[7:6] are multiplexed with UART2_RTS and UART2_RXD signals respectively. The Function Multiplexing Control Register in the System Control chapter must be used in conjunction with programming the GPIO multiplexing (to select the alternate signal multiplexing) to choose which signals KP_ROW6 and KP_ROW7 are available. Note: KP_COL[7:6] and KP_ROW[7:6] are multiplexed with UART2 signals as show above, also see UARTs table. PWM PWMO PWM Output. This signal is multiplexed with PC_SPKOUT of PCMCIA, as well as TOUT2 and TOUT3 of the General Purpose Timer module; PE5. CSPI (X3) CSPI1_MOSI Master Out/Slave In signal, PD31 CSPI1_MISO Master In/Slave Out signal, PD30 CSPI1_SS[2:0] Slave Select (Selectable polarity) signal, the CSPI1_SS2 is multiplexed with USBH2_DATA5/RCV; and CSPI1_SS1 is multiplexed with EXT_DMAGRANT; PD26–28. CSPI1_SCLK Serial Clock signal, PD29 CSPI1_RDY Serial Data Ready signal, shared with Ext_DMAReq_B signal; PD25 CSPI2_MOSI Master Out/Slave In signal, multiplexed with USBH2_DATA1/TXDP; PD24 CSPI2_MISO Master In/Slave Out signal, multiplexed with USBH2_DATA2/TXDm; PD23 CSPI2_SS[2:0] Slave Select (Selectable polarity) signals, multiplexed with USBH2_DATA4/RXDM, USBH2_DATA3/RXDP, USBH2_DATA6/SPEED; PD19–PD21 CSPI2_SCLK Serial Clock signal, multiplexed with USBH2_DATA0/OEn; PD22 Note: CSPI3 CSPI3_MOSI, CSPI3_MISO, CSPI3_SS, andCSPI3_SCLK are multiplexed with SD1 signals. I2C I2C2_SCL I2C2 Clock, through GPIO, multiplexed with SLCDC_data8; PC6 I2C2_SDA I2C2 Data, through GPIO, multiplexed with SLCDC_data7; PC5 I2C_CLK I2C1 Clock; PD18 I2C_DATA I2C1 Data; PD17 CMOS Sensor Interface CSI_HSYNC Sensor port horizontal sync, multiplexed with UART5_RTSP; PB21 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 5-5 Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes CSI_VSYNC Sensor port vertical sync, multiplexed with UART5_CTS; PB20 CSI_D7 Sensor port data, multiplexed with UART5_RXD; PB19 CSI_D6 Sensor port data, multiplexed with UART5_TXD; PB18 CSI_D5 Sensor port data; PB17 CSI_PIXCLK Sensor port data latch clock; PB16 CSI_MCLK Sensor port master clock, PB15 CSI_D4 Sensor port data, PD14 CSI_D3 Sensor port data, multiplexed with UART6_RTS; PB13 CSI_D2 Sensor port data, multiplexed with UART6_CTS; PB12 CSI_D1 Sensor port data, multiplexed with UART6_RXD; PB11 CSI_D0 Sensor port data, multiplexed with UART6_TXD; PB10 Serial Audio Port—SSI (Configurable to I2S Protocol and AC97) (2 to 4) SSI1_CLK Serial clock signal that is output in master or input in slave; PC23 SSI1_TXD Transmit serial data; PC22 SSI1_RXD Receive serial data; PC21 SSI1_FS Frame Sync signal that is output in master and input in slave; PC20 SSI2_CLK Serial clock signal that is output in master or input in slave, multiplexed with GPT4_TIN. PC27 SSI2_TXD Transmit serial data signal, multiplexed with GPT4_TOUT; PC26 SSI2_RXD Receive serial data, multiplexed with GPT5_TIN; PC25 SSI2_FS Frame Sync signal which is output in master and input in slave, multiplexed with GPT5_TOUT: PC24 SSI3_CLK Serial clock signal which is output in master or input in slave. This signal is multiplexed with SLCDC2_CLK; through GPIO multiplexed with PC_WAIT_B; PC31. SSI3_TXD Transmit serial data signal which is multiplexed with SLCDC2_CS, through GPIO multiplexed with PC_READY; PC30 SSI3_RXD Receive serial data which is multiplexed with SLCDC2_RS; through GPIO multiplexed with PC_VS1; PC29 SSI3_FS Frame Sync signal which is output in master and input in slave. This signal is multiplexed with SLCDC2_D0; through GPIO multiplexed with PC_VS1; PC28. SSI4_CLK Serial clock signal which is output in master or input in slave; through GPIO multiplexed with PC_BVD1; PC19 SSI4_TXD Transmit serial data; through GPIO multiplexed with PC_BVD2; PC18 SSI4_RXD Receive serial data; through GPIO multiplexed with IOIS16; PC17 SSI4_FS Frame Sync signal which is output in master and input in slave; PC16 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 5-6 Freescale Semiconductor Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes General Purpose Timers (X6) TIN Timer Input Capture or Timer Input Clock—The signal on this input is applied to GPT 1–3 simultaneously. This signal is muxed with the Walk-up Guard Mode WKGD signal in the PLL, Clock, and Reset Controller module, and is also multiplexed with GPT6_TOUT; PC15. TOUT1 Timer Output signal from General Purpose Timer1 (GPT1). This signal is multiplexed with SSI1_MCLK and SSI2_MCLK signal of SSI1 and SSI2. The pin name of this signal is simply TOUT, and is also multiplexed with GPT6_TIN; PC14. Note: TOUT2, TOUT3 are multiplexed with PWMO pad; GPT4 and GPT5 signals are multiplexed with SSI2 pads. USB2.0 USBOTG_DIR/TXDM USB OTG direction/Transmit Data Minus signal, multiplexed with KP_ROW7A; PE2 USBOTG_STP/TXDM USB OTG Stop signal/Transmit Data Minus signal, multiplexed with KP_ROW6A; PE1 USBOTG_NXT/TXDM USB OTG NEXT/Transmit Data Minus signal, multiplexed with KP_COL6A; PE0 USBOTG_CLK/TXDM USB OTG Clock/Transmit Data Minus signal, PE24 USBOTG_DATA7/SUSPEND USB OTG Data7/Suspend signal, PE25 USBH2_STP/TXDM USB Host2 Stop signal/Transmit Data Minus signal, PA4 USBH2_NXT/TXDM USB Host2 NEXT/Transmit Data Minus signal, PA3 USBH2_DATA7/SUSPEND USB Host2 Data7/Suspend signal, PA2 USBH2_DIR/TXDM USB Host2 Direction/Transmit Data Minus signal, PA1 USBH2_CLK/TXDM USB Host2 Clock/Transmit Data Minus signal; PA0 USBOTG_DATA3/RXDP USB OTG data4/Receive Data Plus signal; multiplexed with SLCDC1_DAT15 through PC13 USBOTG_DATA4/RXDM USB OTG data4/Receive Data Minus signal; multiplexed with SLCDC1_DAT14 through PC12 USBOTG_DATA1/TXDP USB OTG data1/Transmit Data Plus signal; multiplexed with SLCDC1_DAT13 through PC11 USBOTG_DATA2/TXDm USB OTG data2/Transmit Data Minus signal; multiplexed with SLCDC1_DAT12 through PC10 USBOTG_DATA0/Oen USB OTG data0/Output Enable signal; multiplexed with SLCDC1_DAT11 through PC9 USBOTG_DATA6/SPEED USB OTG data6/Suspend signal; multiplexed with SLCDC1_DAT10 and USBG_TXR_INT_B through PC8 USBOTG_DATA5/RCV USB OTG data5/RCV signal; multiplexed with SLCDC1_DAT9 through PC7 USBH1_RXDP USB Host1 Receive Data Plus signal, multiplexed with UART4_RXD; multiplexed with SLCDC1_DAT6 and UART4_RTS_ALT through PB31 USBH1_RXDM USB Host1 Receive Data Minus signal; multiplexed with SLCDC1_DAT5 and UART4_CTS through PB30 USBH1_TXDP USB Host1 Transmit Data Plus signal; multiplexed with UART4_CTS, multiplexed with SLCDC1_DAT4 and UART4_RXD_ALT through PB29 USBH1_TXDM USB Host1 Transmit Data Minus signal; multiplexed with UART4_TXD, multiplexed with SLCDC1_DAT3 through PB28 USBH1_OE_B USB Host1 Output Enable signal; multiplexed with SLCDC1_DAT2 through PB27 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 5-7 Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes USBH1_FS USB Host1 Full Speed output signal, multiplexed with UART4_RTS, multiplexed with SLCDC1_DAT1 through PB26 USBH1_RCV USB Host1 RCV signal; multiplexed with SLCDC1_DAT0 through PB25 USB_OC_B USB OC signal. PB24 USB_PWR USB Power signal; PB23 USBH1_SUSP USB Host1 Suspend signal; PB22 LCD Controller and Smart LCD Controller OE_ACD Alternate Crystal Direction/Output Enable; PA31 CONTRAST This signal is used to control the LCD bias voltage as contrast control; PA30 VSYNC Frame Sync or Vsync—This signal also serves as the clock signal output for gate; driver (dedicated signal SPS for Sharp panel HR-TFT); PA29. HSYNC Line Pulse or HSync; PA28 SPL_SPR Sampling start signal for left and right scanning. Through GPIO, this signal is multiplexed with the SLCDC1_CLK; PA27. PS Control signal output for source driver (Sharp panel dedicated signal). This signal is multiplexed with the SLCDC1_CS; PA26. CLS Start signal output for gate driver. This signal is invert version of PS (Sharp panel dedicated signal). This signal is multiplexed with the SLCDC1_RS; PA25. REV Signal for common electrode driving signal preparation (Sharp panel dedicated signal). This signal is multiplexed with SLCDC1_D0; PA24. LD [17:0] LCD Data Bus—All LCD signals are driven low after reset and when LCD is off. Through GPIO, LD[15:0] signals are multiplexed with SLCDC1_DAT[15:0], SLCDC. PA23–PA6. LSCLK Shift Clock; PA5 Note: SLCDC signals are multiplexed with LCDC signals. ATA ATA_DATA15–0 ATA Data Bus, [15:0] are multiplexed with ETMTRACEPKT4–12, FEC_MDIO, ETMTRACEPKT13–14 SD3_D3–0; Through GPIO also are multiplexed with SLCDC 15–0, and FEC signals; PF23, PD16–PD2. Noisy I/O Supply Pins NVDD1–15, AVDD Noisy Supply for the I/O pins. There are 16 I/O voltage pads, N VDD1 through NVDD15 + AVDD. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 5-8 Freescale Semiconductor Signal Descriptions and Pin Assignments Table 5-1. i.MX27 Signal Descriptions (continued) Pad Name Function/Notes Analog Supply Pins FPMVDD MPLLVDD OSC26VDD UPLLVDD OSC32VDD Supply for analog blocks FPMVSS MPLLVSS OSC26VSS OSC32VSS UPLLVSS Quiet GND for analog blocks QVDD Internal Power Supply QVDD Power supply pins for silicon internal circuitry QVSS GND pins for silicon internal circuitry FUSEVDD For FuseVDD RTCVDD For RTC, SCC power supply RTCVSS For RTC, SCC GND Note: Note: Both 1-Wire and Fast Ethernet Controller signals are multiplexed with other signals. As a result these signal names do not appear in this list. The signals are listed below with the named signal that they are multiplexed. 1-Wire Signals: The 1-Wire input and output signal is multiplexed with JTAG RTCK pad, PE16. Fast Ethernet Controller (FEC) Signals: FEC_TX_EN: Transmit enable signal, through GPIO multiplexed with ATA_DATA15 pad; PF23 FEC_TX_ER: Transmit Data Error; through GPIO multiplexed with ATA_DATA14 pad; PD16 FEC_COL: Collision signal; through GPIO multiplexed with ATA_DATA13 pad; PD15 FEC_RX_CLK: Receive Clock signal; through GPIO multiplexed with ATA_DATA12 pad; PD14 FEC_RX_DV: Receive data Valid signal; through GPIO multiplexed with ATA_DATA11 pad; PD13 FEC_RXD0: Receive Data0; through GPIO multiplexed with ATA_DATA10 pad; PD12 FEC_TX_CLK: Transmit Clock signal; through GPIO multiplexed with ATA_DATA9 pad; PD11 FEC_CRS: Carrier Sense enable; through GPIO multiplexed with ATA_DATA8 pad; PD10 FEC_MDC: Management Data Clock; through GPIO multiplexed with ATA_DATA7 pad; PD9 FEC_MDIO: Management Data Input/Output, multiplexed with ATA_DATA6 pad; PD8 FEC_RXD3–1: Receive Data; through GPIO multiplexed with ATA_DATA5–3 pad; PD7–5 FEC_RX_ER: Receive Data Error; through GPIO multiplexed with ATA_DATA2 pad; PD4 FEC_TXD3–2: Transmit Data; through GPIO multiplexed with ATA_DATA1–0; pad; PD3–2 FEC_TXD1: Transmit Data; through GPIO multiplexed with SD3_CLK pad; PD1 FEC_TXD0: Transmit Data; through GPIO multiplexed with SD3_CMD pad; PD0 Note: The Rest ATA signals are multiplexed with PCMCIA Pads. 5.3 I/O Power Supply and Signal Multiplexing Scheme This section describes information about both the power supply for each I/O pin and its functional multiplexing scheme. Section 5.3.3, “I/O Mode and Supply Level” provides information on how to configure the power supply scheme for each device in the system (memory and external peripherals). The MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 5-9 Signal Descriptions and Pin Assignments functional multiplexing information shown in Table 5-2 enables the user to select the function of each pin by configuring the appropriate GPIO registers when those pins are multiplexed to provide different functions. In some cases, the use of the Function Multiplexing Control Register (FMCR) in Chapter 4, “System Control” may be required to select multiplex functionality. 5.3.1 Pull/Pull Strength/Open Drain Descriptions For Table 5-2, the following notes describe the abbreviations used in the Pull/Pull Strength/Open Drain section. • KP—Keeper Circuit permanently On when in Primary/Alternate Mode • PU—Pull Up permanently On when in Primary/Alternate Mode • PD—Pull Down permanently On when in Primary/Alternate Mode • PUEN—Pull Up controllable from Module when in Primary/Alternate Mode • PDEN—Pull Down controllable from Module when in Primary/Alternate Mode • OD—Open Drain permanently On when in Primary/Alternate Mode • ODEN—Open Drain Enable controllable from Module when in Primary/Alternate Mode 5.3.2 • • • 5.3.3 GPIO Default and Pull-Up Configuration The term Primary name is the package contact name. The Default column contains the GPIO default configuration as it appears after chip reset. Pull-up configuration and pull strength—Pin mux with GPIO means that Pull Up is controlled by the GPIO PUEN register (in Primary, Alternate or GPIO Mode), and the default pull strength is 100 K for all GPIO use. I/O Mode and Supply Level The supply level shown in Table 5-2 relates to the power bank segment. The same bank pad can be supplied same voltage. The voltage limitation relates to the I/O mode selected. • I/O type of DDR mode—Voltage rating 1.75–1.9 V. • I/O type of slow mode—Voltage rating 1.75–3.1 V. • I/O type of fast mode—Voltage rating 1.75–2.8 V. • For every analog pad a recommended supply voltage is shown. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 5-10 Freescale Semiconductor GPIO AVDD Slow/Hyst BOOT2 I BOOT2 AVDD Slow/Hyst BOOT0 I BOOT0 AVDD Slow/Hyst BOOT3 I BOOT3 AVDD Slow/Hyst BOOT1 I BOOT1 FPMVDD Supply FPMVDD static FPMVDD FPMVDD Supply FPMVSS static FPMVSS FUSEVDD Supply FUSEVDD static FUSEVDD FUSEVDD Supply FUSEVSS static FUSEVSS MPLLVDD Supply MPLLVSS static MPLLVSS MPLLVDD Supply MPLLVDD static MPLLVDD NVDD1 Supply NVSS1 static NVSS1 NVDD1 Fast NFRB I ETMTRACE PKT3 O PF0 PUEN NFRB NVDD1 Fast NFWP_B O ETMTRACE PKT1 O PF2 PUEN NFWP_B NVDD1 Fast NFALE O ETMPIPEST AT0 O PF4 PUEN NFALE NVDD1 Fast NFWE_B O ETMPIPEST AT2 O PF6 PDEN NFWE_B Default AVDD BOUT static AOUT AVDD CIN Supply BIN AVDD AIN AVSS PUEN/PDEN static Mux3 Direction1 AVSS Direction2 Signal/Pad Name Supply Signal I/O Type AVDD Signal Descriptions and Pin Assignments 5-11 Power Bank Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table GPIO PUEN NFCLE NVDD1 Fast NFRE_B O ETMPIPEST AT1 O PF5 PUEN NFRE_B NVDD1 Fast NFCLE O ETMTRACE PKT0 O PF1 PUEN NFCE_B NVDD1 DDR D14 B KP D14 NVDD1 DDR D15 B KP D15 NVDD1 DDR D11 B KP D11 NVDD1 DDR D13 B KP D13 NVDD1 DDR D9 B KP D9 NVDD1 DDR D12 B KP D12 NVDD1 DDR D7 B KP D7 NVDD1 DDR D5 B KP D5 NVDD1 DDR D3 B KP D3 NVDD1 DDR D1 B KP D1 NVDD1 Supply NVDD1 static NVDD1 DDR D10 B KP D10 NVDD1 DDR D8 B KP D8 NVDD1 DDR D6 B KP D6 Default PF3 BOUT O AOUT PUEN/PDEN ETMTRACE PKT2 CIN Mux3 O BIN Direction1 NFCE_B AIN Signal/Pad Name Fast Direction2 I/O Type NVDD1 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary NVDD1 Signal Descriptions and Pin Assignments 5-12 Table 5-2. i.MX27 Pin MUX Table (continued) KP D2 NVDD1 DDR D0 B KP D0 NVDD10 Slow/Hyst SSI2_RXDA T B GPT5_TIN I PC25 PUEN NVDD10 Slow/Hyst SSI3_RXDA T B SLCDC2_R S I PC29 PUEN NVDD10 Slow_/Hyst KP_ROW1 B PU/100k KP_ROW 1 NVDD10 Slow1/Hyst KP_ROW5 B PU/100k KP_ROW 5 NVDD10 Slow/Hyst SSI4_RXDA T B PC17 PUEN NVDD10 Slow/Hyst SSI1_RXDA T B PC21 PUEN PC21 NVDD10 Slow/Hyst SSI2_CLK B GPT4_TIN I PC27 PUEN PC27 NVDD10 Slow/Hyst SSI3_CLK B SLCDC2_CL K I PC31 PUEN NVDD10 Slow/Hyst KP_ROW3 B NVDD10 Slow/Hyst TIN I Default B BOUT D2 AOUT DDR CIN NVDD1 BIN D4 AIN KP PUEN/PDEN B Mux3 D4 Pull-up /Pull Strength /Open Drain Pull-up/Pull Strength/Open Drain2 DDR Direction2 Direction1 NVDD1 Signal Signal/Pad Name GPIO I/O Type Alternate Power Bank Primary PC25 PC_VS 1 IOIS16 PC_W AIT_B PU/100k PC29 PC17 PC31 KP_ROW 3 PC15 PUEN 5-13 GPT6_ TOUT WKGD _B PC15 Signal Descriptions and Pin Assignments MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) GPIO Slow/Hyst SSI1_CLK B PC23 PUEN NVDD10 Slow/Hyst KP_ROW2 B NVDD10 Slow/Hyst SSI3_TXDA T B SLCDC2_C S I PC30 PUEN PC_RE ADY PC30 NVDD10 Slow/Hyst SSI3_FS B SLCDC2_D0 I PC28 PUEN PC_VS 2 PC28 NVDD10 Slow/Hyst KP_ROW4 B NVDD10 Slow/Hyst TOUT O PC14 PUEN NVDD10 Slow/Hyst SSI1_TXDA T B PC22 PUEN PC22 NVDD10 Slow/Hyst SSI2_TXDA T B PC26 PUEN PC26 NVDD10 Slow/Hyst KP_ROW0 B NVDD10 Slow/Hyst SSI4_FS B PC16 PUEN PC16 NVDD10 Slow/Hyst SSI1_FS B PC20 PUEN PC20 NVDD10 Supply NVDD10 static Default NVDD10 BOUT PUEN AOUT PUEN/PDEN PC19 CIN Mux3 B BIN Direction1 SSI4_CLK AIN Signal/Pad Name Slow/Hyst Direction2 I/O Type NVDD10 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary PC_BV D1 PC19 PC23 PU/100k KP_ROW 2 PU/100k KP_ROW 4 GPT4_TOUT O PU/100k SSI_M CLK1 SSI_M CLK2 GPT6_ TIN PC14 KP_ROW 0 NVDD10 Signal Descriptions and Pin Assignments 5-14 Table 5-2. i.MX27 Pin MUX Table (continued) NVDD11 Slow/Hyst CSI_D3 I NVDD11 Slow/Hyst CSI_D5 I NVDD11 Slow/Hyst CSI_HSYN C I UART5_RTS NVDD11 Slow/Hyst CSI_D1 I UART6_RX D NVDD11 Fast/Hyst CSI_MCLK O NVDD11 Slow/Hyst CSI_D7 I UART5_RX D NVDD11 Slow/Hyst CSI_D0 I NVDD11 Slow/Hyst CSI_D2 I NVDD11 Fast/Hyst CSI_PIXCL K I Default static PUEN BOUT NVSS10 PC24 AOUT Supply O CIN NVDD10 GPT5_TOUT PUEN BIN B PC18 AIN SSI2_FS PUEN/PDEN Slow/Hyst Mux3 NVDD10 Pull-up /Pull Strength /Open Drain B Direction2 SSI4_TXDA T Signal Slow/Hyst Direction1 NVDD10 GPIO PC_BV D2 PC18 PC24 NVSS10 UART6_RTS I PB13 PUEN LCDC_ TEST9 PB13 PB17 PUEN LCDC_ TEST1 1 PB17 I PB21 PUEN LCDC_ TEST1 5 PB21 I PB11 PUEN LCDC_ TEST7 PB11 PB15 PUEN I PB19 PUEN LCDC_ TEST1 3 PB19 UART6_TXD O PB10 PUEN LCDC_ TEST6 PB10 UART6_CTS O PB12 PUEN LCDC_ TEST8 PB12 PB16 PUEN PB15 PB16 Signal Descriptions and Pin Assignments 5-15 I/O Type Pull-up/Pull Strength/Open Drain2 Alternate Power Bank Signal/Pad Name Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) GPIO I NVDD11 Slow/Hyst CSI_D6 I NVDD11 Supply NVDD11 static NVDD11 Slow/Hyst CSI_VSYN C I NVDD11 Supply NVSS11 static NVDD12 Slow/Hyst SPL_SPR O PA27 PDEN NVDD12 Slow/Hyst CONTRAST O PA30 PUEN PA30 NVDD12 Slow/Hyst HSYNC O PA28 PUEN PA28 NVDD12 Slow/Hyst PS O PA26 PDEN NVDD12 Slow/Hyst OE_ACD O PA31 PUEN NVDD12 Slow/Hyst REV O PA24 PDEN SLDCD 1_D0 PA24 NVDD12 Slow/Hyst LD16 O PA22 PUEN Ext_D MAGra nt_B PA22 UART5_TXD O PUEN LCDC_ TEST1 2 PB18 Default PB18 BOUT PB14 AOUT LCDC_ TEST1 0 CIN PUEN BIN PB14 AIN PUEN/PDEN Direction1 CSI_D4 Mux3 Signal/Pad Name Slow/Hyst Direction2 I/O Type NVDD11 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary NVDD11 UART5_CTS O PB20 PUEN LCDC_ TEST1 4 PB20 NVSS11 SLCDC 1_CLK SLCDC 1_CS PA27 PA26 PA31 Signal Descriptions and Pin Assignments 5-16 Table 5-2. i.MX27 Pin MUX Table (continued) GPIO SLCDC 1_DAT 6 PA20 NVDD12 Slow/Hyst LD10 O PA16 PUEN SLCDC 1_DAT 10 SLCDC 1_DAT 2 PA16 NVDD12 Slow/Hyst VSYNC O PA29 PUEN NVDD12 Slow/Hyst LD8 O PA14 PUEN SLCDC 1_DAT 8 NVDD12 Slow/Hyst LD6 O PA12 PUEN SLCDC 1_DAT 6 NVDD12 Slow/Hyst LD17 O PA23 PUEN NVDD12 Slow/Hyst CLS O PA25 PDEN NVDD12 Supply NVSS12 static NVDD12 Slow/Hyst LD4 O PA10 PUEN SLCDC 1_DAT 4 NVDD12 Slow/Hyst LD12 O PA18 PUEN SLCDC 1_DAT 12 Default SLCDC 1_DAT 14 BOUT PUEN AOUT PUEN/PDEN PA20 CIN Mux3 O BIN Direction1 LD14 AIN Signal/Pad Name Slow/Hyst Direction2 I/O Type NVDD12 Signal Power Bank Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary PA29 SLCDC 1_DAT 0 PA14 PA12 PA23 SLCDC 1_RS PA25 NVSS12 PA10 SLCDC 1_DAT 4 PA18 5-17 Signal Descriptions and Pin Assignments MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) GPIO SLCDC 1_DAT 5 PA19 NVDD12 Slow/Hyst LD15 O PA21 PUEN SLCDC 1_DAT 15 SLCDC 1_DAT 7 PA21 NVDD12 Slow/Hyst LD0 O PA6 PUEN SLCDC 1_DAT 0 PA6 NVDD12 Slow/Hyst LD2 O PA8 PUEN SLCDC 1_DAT 2 PA8 NVDD12 Slow/Hyst LD7 O PA13 PUEN SLCDC 1_DAT 7 PA13 NVDD12 Slow/Hyst LD5 O PA11 PUEN SLCDC 1_DAT 5 PA11 NVDD12 Slow/Hyst LD11 O PA17 PUEN SLCDC 1_DAT 11 NVDD12 Fast/Hyst LSCLK O PA5 PUEN NVDD12 Slow/Hyst LD3 O PA9 PUEN SLCDC 1_DAT 3 Default SLCDC 1_DAT 13 BOUT PUEN AOUT PUEN/PDEN PA19 CIN Mux3 O BIN Direction1 LD13 AIN Signal/Pad Name Slow/Hyst Direction2 I/O Type NVDD12 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary PA17 PA5 SLCDC 1_DAT 3 PA9 Signal Descriptions and Pin Assignments 5-18 Table 5-2. i.MX27 Pin MUX Table (continued) GPIO NVDD12 Slow/Hyst LD9 O PA15 PUEN SLCDC 1_DAT 9 NVDD12 Supply NVDD12 static NVDD12 NVDD13 Supply NVSS13 static NVSS13 NVDD13 Slow/Hyst osc32k_byp ass I osc32k_by pass NVDD13 Supply NVDD13 static NVDD13 NVDD13 Slow/Hyst Power_on_r eset I PU/100k Power_on _reset NVDD13 Slow/Hyst Power_cut I PD/100k Power_cut NVDD14 Fast/Hyst CSPI2_SS1 B NVDD14 Slow/Hyst USBH1_OE _B B NVDD14 Fast/Hyst CSPI2_SS2 B USBH2_DAT A4/RXDM NVDD14 Fast/Hyst CSPI2_SCL K B USBH2_DAT A0/OEn B PA7 SLCDC 1_DAT 1 PA15 PD20 PUEN PD20 PB27 PUEN B PD19 PUEN PD19 B PD22 PUEN PD22 SLCDC 1_DAT 2 PB27 5-19 Signal Descriptions and Pin Assignments USBH2_DAT A3/RXDP Default SLCDC 1_DAT 1 BOUT PUEN AOUT PUEN/PDEN PA7 CIN Mux3 O BIN Direction1 LD1 AIN Signal/Pad Name Slow/Hyst Direction2 I/O Type NVDD12 Signal Power Bank Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) Freescale Semiconductor PB29 PDEN SLCDC 1_DAT 4 NVDD14 Slow/Hyst USBH1_FS B UART4_RTS I PB26 PDEN SLCDC 1_DAT 1 NVDD14 Fast/Hyst CSPI1_SS2 B USBH2_DAT A5/RCV B PD26 PUEN PD26 NVDD14 Fast/Hyst CSPI2_MO SI B B PD24 PUEN PD24 UART4 _RXD_ ALT Default O BOUT UART4_CTS AOUT O CIN PUEN/PDEN USBH1_TX DP BIN Mux3 Slow/Hyst AIN Direction2 NVDD14 Direction1 Signal Pull-up /Pull Strength /Open Drain GPIO I/O Type Pull-up/Pull Strength/Open Drain2 Alternate Power Bank MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Signal/Pad Name Primary PB29 PB26 USBH2_DAT A1/TXDP NVDD14 Slow/Hyst USBH1_RX DP B UART4_RX D I PB31 PDEN SLCDC 1_DAT 6 NVDD14 Slow/Hyst USBH1_TX DM O UART4_TXD O PB28 PDEN SLCDC 1_DAT 3 NVDD14 Fast/Hyst CSPI2_SS0 B USBH2_DAT A6/SPEED B PD21 PUEN PD21 NVDD14 Slow/Hyst USB_PWR O PB23 PUEN PB23 NVDD14 Slow/Hyst I2C2_SCL B PC6 PUEN NVDD14 Slow/Hyst USBH1_SU SP B PB22 PUEN OD SLCDC 1_DAT 8 UART4 _RTS_ ALT PB31 PB28 PC6 USB_BYP _B Signal Descriptions and Pin Assignments 5-20 Table 5-2. i.MX27 Pin MUX Table (continued) Default BOUT AOUT CIN PUEN BIN PD23 AIN Pull-up /Pull Strength /Open Drain Direction2 Signal B PUEN/PDEN B GPIO Mux3 CSPI2_MIS O Alternate Pull-up/Pull Strength/Open Drain2 Fast/Hyst Direction1 I/O Type NVDD14 Signal/Pad Name Power Bank Primary PD23 USBH2_DAT A2/TXDm NVDD14 Supply NVSS14 static NVSS14 NVDD14 Supply NVDD14 static NVDD14 NVDD14 Slow/Hyst USB_OC_B I PB24 PUEN NVDD14 Slow/Hyst USBH1_RC V B PB25 PUEN SLCDC 1_DAT 0 NVDD14 Slow/Hyst USBH1_RX DM B PB30 PDEN SLCDC 1_DAT 5 NVDD14 Slow/Hyst I2C2_SDA B OD PC5 PUEN SLCDC 1_DAT 7 NVDD15 Slow/Hyst SD2_D3 B PU/PD/1 00k PB7 PDEN SLCDC 1_RS NVDD15 Fast/Hyst SD2_CLK O PB9 NVDD15 Slow/Hyst SD2_D0 B NVDD15 Slow/Hyst SD2_CMD B MSHC_DAT A3 B PU/PD/1 00k MSHC_SCL K O PU/100k MSHC_DAT A0 B PD/100k PU/100k MSHC_BS O PD/100k PB24 PB25 UART4 _CTS PB30 PC5 LCDC_ TEST3 PB7 PDEN LCDC_ TEST5 PB9 PB4 PDEN LCDC_ TEST0 PB4 PB8 PDEN LCDC_ TEST4 PB8 SLCDC 1_CS 5-21 Signal Descriptions and Pin Assignments MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) B PD/100k PB6 PDEN SLDCD 1_D0 LCDC_ TEST2 PB6 NVDD15 Slow/Hyst SD2_D1 B PU/100k MSHC_DAT A1 B PD/100k PB5 PDEN SLCDC 1_CLK LCDC_ TEST1 PB5 NVDD15 Supply NVSS15 static NVSS15 NVDD15 Supply NVDD15 static NVDD15 NVDD2 DDR SD30 B KP SD30 NVDD2 DDR A24 O KP A24 NVDD2 DDR SD27 B KP SD27 NVDD2 DDR A23 O KP A23 NVDD2 DDR SD24 B KP SD24 NVDD2 DDR A21 O KP A21 NVDD2 DDR SD21 B KP SD21 NVDD2 DDR SD10 B KP SD10 NVDD2 DDR A22 O KP A22 NVDD2 DDR SD20 B KP SD20 NVDD2 DDR SD17 B KP SD17 NVDD2 DDR A18 O KP A18 NVDD2 DDR A17 O KP A17 NVDD2 DDR SD22 B KP SD22 Default MSHC_DAT A2 BOUT PUEN/PDEN PU/100k AOUT Mux3 B CIN Pull-up /Pull Strength /Open Drain SD2_D2 BIN Direction2 Slow/Hyst AIN Pull-up/Pull Strength/Open Drain2 NVDD15 Signal Direction1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Signal/Pad Name GPIO I/O Type Alternate Power Bank Primary Signal Descriptions and Pin Assignments 5-22 Table 5-2. i.MX27 Pin MUX Table (continued) SD16 NVDD2 DDR SD14 B KP SD14 NVDD2 DDR SD11 B KP SD11 NVDD2 Supply NVSS2 static NVSS2 NVDD2 Supply NVDD2 static NVDD2 NVDD2 DDR A9 B KP A9 NVDD2 DDR A12 B KP A12 NVDD2 DDR A5 B KP A5 NVDD2 DDR A7 B KP A7 NVDD2 DDR MA10 O NVDD2 DDR SDBA1 O KP SDBA1 NVDD2 DDR A1 B KP A1 NVDD2 DDR A13 B KP A13 NVDD2 DDR A11 B KP A11 NVDD2 DDR A3 B KP A3 NVDD2 DDR SD31 B KP SD31 NVDD2 DDR A25 O KP A25 NVDD2 DDR A8 B KP A8 Default KP BOUT B AOUT SD16 CIN DDR BIN NVDD2 AIN SD19 PUEN/PDEN KP Mux3 B Pull-up /Pull Strength /Open Drain SD19 Direction2 Pull-up/Pull Strength/Open Drain2 DDR Signal Direction1 NVDD2 MA10 Signal Descriptions and Pin Assignments 5-23 Signal/Pad Name GPIO I/O Type Alternate Power Bank Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) KP SD26 NVDD2 DDR SD28 B KP SD28 NVDD2 DDR SD29 B KP SD29 NVDD2 DDR A19 O KP A19 NVDD2 DDR A4 B KP A4 NVDD2 DDR A2 B KP A2 NVDD2 DDR SD23 B KP SD23 NVDD2 DDR SDQS2 B KP SDQS2 NVDD2 DDR SD25 B KP SD25 NVDD2 DDR SDQS1 B KP SDQS1 NVDD2 DDR SD13 B KP SD13 NVDD2 DDR A0 B KP A0 NVDD2 DDR SDBA0 O KP SDBA0 NVDD2 DDR SDQS3 B KP SDQS3 NVDD2 DDR A20 O KP A20 NVDD2 DDR SD18 B KP SD18 NVDD2 DDR SD15 B KP SD15 NVDD2 DDR SD12 B KP SD12 Default B BOUT SD26 AOUT DDR CIN NVDD2 BIN A6 AIN KP PUEN/PDEN B Mux3 A6 Pull-up /Pull Strength /Open Drain DDR Direction2 Pull-up/Pull Strength/Open Drain2 NVDD2 Signal Direction1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Signal/Pad Name GPIO I/O Type Alternate Power Bank Primary Signal Descriptions and Pin Assignments 5-24 Table 5-2. i.MX27 Pin MUX Table (continued) A14 NVDD3 DDR SD4 B KP SD4 NVDD3 DDR SD1 B KP SD1 NVDD3 DDR SD9 B KP SD9 NVDD3 DDR SD5 B KP SD5 NVDD3 DDR SD3 B KP SD3 NVDD3 DDR DQM3 O KP DQM3 NVDD3 DDR SD7 B KP SD7 NVDD3 DDR SDQS0 B KP SDQS0 NVDD3 Supply NVSS3 static NVSS3 NVDD3 Supply NVDD3 static NVDD3 NVDD3 DDR SD6 B KP SD6 NVDD3 DDR A16 O KP A16 NVDD3 DDR SD8 B KP SD8 NVDD3 DDR A15 B KP A15 NVDD3 DDR SD2 B KP SD2 NVDD4 DDR RAS_B O KP RAS_B NVDD4 DDR CS1_B O Default KP BOUT B AOUT A14 CIN DDR BIN NVDD3 AIN SD0 PUEN/PDEN KP Mux3 B Pull-up /Pull Strength /Open Drain SD0 Direction2 Pull-up/Pull Strength/Open Drain2 DDR Signal Direction1 NVDD3 CS1_B Signal Descriptions and Pin Assignments 5-25 Signal/Pad Name GPIO I/O Type Alternate Power Bank Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) GPIO A10 NVDD4 DDR CAS_B O KP CAS_B NVDD4 DDR SDCKE0 O KP SDCKE0 NVDD4 DDR RW_B O NVDD4 Fast ECB_B I NVDD4 DDR EB1_B O NVDD4 Fast JTAG_CTRL I PU/100k JTAG_CT RL NVDD4 DDR DQM0 O KP DQM0 NVDD4 DDR_CLK SDCLK B SDCLK NVDD4 DDR_CLK SDCLK_B B SDCLK_B NVDD4 Fast CS4_B O NVDD4 DDR CS0_B O NVDD4 Fast CLKO O NVDD4 Fast EXT_266M I EXT_266 M NVDD4 Supply NVSS4 static NVSS4 NVDD4 Supply NVDD4 static NVDD4 Default KP BOUT B AOUT A10 CIN DDR BIN NVDD4 AIN O PUEN/PDEN Direction1 BCLK Mux3 Signal/Pad Name DDR Direction2 I/O Type NVDD4 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary BCLK RW_B PU/100k ECB_B EB1_B ETMTRACE SYNC O PF21 PUEN CS5_D TACK CS4_B CS0_B PF15 PUEN CLKO Signal Descriptions and Pin Assignments 5-26 Table 5-2. i.MX27 Pin MUX Table (continued) SDWE_B NVDD4 DDR CS3_B O KP CS3_B NVDD4 Fast CS5_B O NVDD4 DDR EB0_B O EB0_B NVDD4 Fast EXT_60M I EXT_60M NVDD4 DDR DQM2 O KP DQM2 NVDD4 DDR SDCKE1 O KP SDCKE1 NVDD4 DDR CS2_B O KP CS2_B NVDD4 DDR LBA_B O LBA_B NVDD4 DDR OE_B O OE_B NVDD5 Slow/Hyst RESET_OU T_B O NVDD5 Slow/Hyst CLKMODE0 I PU/100k CLKMOD E0 NVDD5 Slow/Hyst CLKMODE1 I PU/100k CLKMOD E1 NVDD5 Slow PC_CD2_B I ATA_DIOW O PF19 PUEN PC_CD2_ B NVDD5 Slow PC_VS1 I ATA_DA1 O PF14 PUEN PC_VS1 ETMTRACE CLK O PF22 PE17 PUEN PUEN Default KP BOUT O AOUT SDWE_B CIN DDR BIN NVDD4 AIN DQM1 PUEN/PDEN KP Mux3 O Pull-up /Pull Strength /Open Drain DQM1 Direction2 Pull-up/Pull Strength/Open Drain2 DDR Signal Direction1 NVDD4 CS5_B PC_TE ST_AH BST0 RESET_O UT_B Signal Descriptions and Pin Assignments 5-27 Signal/Pad Name GPIO I/O Type Alternate Power Bank Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) GPIO Slow PC_READY I ATA_CS0 O PF17 PUEN PC_READ Y NVDD5 Slow PC_BVD1 I ATA_DMAR Q I PF12 PUEN PC_BVD1 NVDD5 Slow PC_RW_B O ATA_IORDY I PF8 PUEN PC_RW_ B NVDD5 Slow/Hyst POR_B I POR_B NVDD5 Supply NVSS5 static NVSS5 NVDD5 Supply NVDD5 static NVDD5 NVDD5 Slow IOIS16 I ATA_INTRQ I PF9 PUEN IOIS16 NVDD5 Slow PC_POE O ATA_BUFFE R_EN O PF7 PUEN PC_POE NVDD5 Slow PC_CD1_B I ATA_DIOR O PF20 PUEN PC_CD1_ B NVDD5 Slow PC_VS2 I ATA_DA0 O PF13 PUEN PC_VS2 NVDD5 Slow PC_BVD2 I ATA_DMACK O PF11 PUEN PC_BVD2 NVDD5 Slow PC_WAIT_ B I ATA_CS1 O PF18 PUEN PC_WAIT _B Default NVDD5 PU/100k BOUT I PUEN AOUT RESET_IN_ B PF10 CIN Slow/Hyst O BIN NVDD5 ATA_RESET _B AIN O PUEN/PDEN Direction1 PC_RST Mux3 Signal/Pad Name Slow Direction2 I/O Type NVDD5 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary PC_RST RESET_I N_B Signal Descriptions and Pin Assignments 5-28 Table 5-2. i.MX27 Pin MUX Table (continued) Pull-up /Pull Strength /Open Drain GPIO Supply NVDD6 static NVDD6 NVDD6 Slow/Hyst ATA_DATA6 B FEC_MDIO B PD8 PUEN SLCDC 1_DAT 6 ATA_DATA 6 NVDD6 Slow/Hyst ATA_DATA2 B SD3_D2 B PD4 PUEN SLCDC FEC_R 1_DAT X_ER 2 ATA_DATA 2 NVDD6 Slow/Hyst SD3_CMD B PD0 PUEN FEC_T XD0 SD3_CMD NVDD6 Slow/Hyst SD3_CLK O ETMTRACE PKT15 O PD1 PUEN FEC_T XD1 SD3_CLK NVDD6 Slow/Hyst ATA_DATA1 0 B ETMTRACE PKT9 O PD12 PUEN NVDD6 Slow/Hyst ATA_DATA0 B SD3_D0 B PD2 PUEN NVDD6 Slow/Hyst ATA_DATA1 B SD3_D1 B PD3 PUEN Default NVDD6 BOUT NVSS6 AOUT static PDEN CIN NVSS6 PF16 BIN Supply O AIN NVDD6 ATA_DA2 PUEN/PDEN I Mux3 PC_PWRO N Direction2 Slow Signal NVDD5 Direction1 I/O Type Pull-up/Pull Strength/Open Drain2 Alternate Power Bank Signal/Pad Name Primary PC_PWR ON SLCDC FEC_R 1_DAT XD0 10 ATA_DATA 10 FEC_T XD2 SLCDC 1_DAT 0 ATA_DATA 0 FEC_T XD3 SLCDC 1_DAT 1 ATA_DATA 1 5-29 Signal Descriptions and Pin Assignments MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) NVDD6 Slow/Hyst ATA_DATA4 B ETMTRACE PKT14 O PD6 NVDD6 Slow/Hyst ATA_DATA5 B ETMTRACE PKT13 O NVDD6 Slow/Hyst ATA_DATA3 B SD3_D3 B NVDD6 Slow/Hyst ATA_DATA8 B ETMTRACE PKT11 NVDD6 Slow/Hyst ATA_DATA1 2 B NVDD6 Slow/Hyst ATA_DATA7 NVDD6 Slow/Hyst NVDD6 Slow/Hyst SLCDC 1_DAT 14 ATA_DATA 14 PUEN SLCDC FEC_R 1_DAT XD2 4 ATA_DATA 4 PD7 PUEN SLCDC FEC_R 1_DAT XD3 5 ATA_DATA 5 PD5 PDEN SLCDC FEC_R 1_DAT XD1 3 ATA_DATA 3 O PD10 PUEN SLCDC FEC_C 1_DAT RS 8 ATA_DATA 8 ETMTRACE PKT7 O PD14 PUEN SLCDC FEC_R 1_DAT X_CLK 12 ATA_DATA 12 B ETMTRACE PKT12 O PD9 PUEN SLCDC 1_DAT 7 ATA_DATA 7 ATA_DATA9 B ETMTRACE PKT10 O PD11 PUEN SLCDC FEC_T 1_DAT X_CLK 9 ATA_DATA 9 ATA_DATA1 1 B ETMTRACE PKT8 O PD13 PUEN SLCDC FEC_R 1_DAT X_DV 11 ATA_DATA 11 PU/PD/1 00k FEC_T X_ER Default PDEN BOUT PD16 AOUT O CIN ETMTRACE PKT5 BIN B AIN PUEN/PDEN ATA_DATA1 4 Direction2 Slow/Hyst Signal NVDD6 Direction1 Mux3 Pull-up /Pull Strength /Open Drain GPIO I/O Type Pull-up/Pull Strength/Open Drain2 Alternate Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Signal/Pad Name Primary FEC_M DC Signal Descriptions and Pin Assignments 5-30 Table 5-2. i.MX27 Pin MUX Table (continued) NVDD6 Slow/Hyst ATA_DATA1 5 B ETMTRACE PKT4 O PF23 PDEN FEC_T X_EN NVDD7 Fast/Hyst B PC11 PUEN SLCDC 1_DAT 13 PC11 B PC10 PUEN SLCDC 1_DAT 12 PC10 B PC8 PUEN SLCDC 1_DAT 10 USBOTG_D ATA1/TXDP NVDD7 Fast/Hyst USBOTG_D ATA2/TXDm NVDD7 Fast/Hyst NVDD7 Supply NVDD7 Fast/Hyst NVSS7 static Fast/Hyst NVDD7 Fast/Hyst USBH2_CL K/TXDM USBOTG_D ATA4/RXDM ATA_DATA 13 SLCDC 1_DAT 15 ATA_DATA 15 USBG_ TXR_I NT_B PC8 NVSS7 B PC7 PUEN I PA0 PUEN B PC12 PUEN USBOTG_D ATA5/RCV NVDD7 SLCDC FEC_C 1_DAT OL 13 SLCDC 1_DAT 9 PC7 PA0 SLCDC 1_DAT 14 PC12 5-31 Signal Descriptions and Pin Assignments USBOTG_D ATA6/SPEE D Default PUEN BOUT PD15 AOUT O CIN ETMTRACE PKT6 BIN B AIN PUEN/PDEN ATA_DATA1 3 Direction2 Slow/Hyst Signal NVDD6 Direction1 Mux3 Pull-up /Pull Strength /Open Drain GPIO I/O Type Pull-up/Pull Strength/Open Drain2 Alternate Power Bank Signal/Pad Name Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) Freescale Semiconductor Default BOUT AOUT CIN PUEN/PDEN SLCDC 1_DAT 11 BIN Mux3 PUEN Direction2 PC9 Signal B USBOTG_D ATA0/Oen AIN GPIO Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Fast/Hyst Direction1 NVDD7 Signal/Pad Name I/O Type MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Power Bank Primary PC9 NVDD7 Fast/Hyst USBH2_ST P/TXDM O PA4 PUEN PA4 NVDD7 Fast/Hyst USBH2_DA TA7/SUSPE ND B PA2 PUEN PA2 NVDD7 Fast/Hyst B PC13 PUEN I PA1 PUEN PA1 I PE24 PUEN PE24 I PA3 PUEN PA3 PE1 PUEN PE1 PE0 PUEN PE0 USBOTG_D ATA3/RXDP NVDD7 Fast/Hyst NVDD7 Fast/Hyst USBH2_DI R/TXDM SLCDC 1_DAT 15 PC13 USBOTG_C LK/TXDM NVDD7 Fast/Hyst NVDD7 Fast/Hyst USBH2_NX T/TXDM O KP_ROW6A B I KP_COL6A B USBOTG_S TP/TXDM NVDD7 Fast/Hyst USBOTG_N XT/TXDM ODEN Signal Descriptions and Pin Assignments 5-32 Table 5-2. i.MX27 Pin MUX Table (continued) PE2 Default PUEN BOUT PE2 AOUT PE25 CIN PUEN BIN PE25 AIN PUEN/PDEN B Mux3 GPIO Pull-up /Pull Strength /Open Drain Direction2 Signal Alternate Pull-up/Pull Strength/Open Drain2 Fast/Hyst Direction1 I/O Type NVDD7 Signal/Pad Name Power Bank Primary USBOTG_D ATA7/SUSP END NVDD7 Fast/Hyst USBOTG_D IR/TXDM I KP_ROW7A B NVDD7 Supply NVDD7 static NVDD8 Slow/Hyst RTCK O OWIRE B NVDD8 Slow/Hyst SD1_D0 B CSPI3_MIS O NVDD8 Slow/Hyst SD1_CMD B CSPI3_MOS I NVDD8 Slow/Hyst CSPI1_MIS O B NVDD8 Slow/Hyst TDI I PU/100k TDI NVDD8 Slow/Hyst TMS I PU/100k TMS NVDD8 Slow/Hyst SD1_D2 B PE20 PUEN NVDD8 Slow/Hyst CSPI1_RDY /Ext_DMAR EQ_B I PD25 PUEN NVDD7 OD PE16 PUEN RTCK I PE18 PUEN PC_TE ST_AH BST1 PE18 O PE22 PUEN PC_TE ST_INT _ERR PE22 PD30 PUEN PD30 PC_TE ST_CA RDST1 PE20 PD25 5-33 Signal Descriptions and Pin Assignments MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) Slow/Hyst CSPI1_SS1 B PD27 PUEN NVDD8 Slow/Hyst CSPI1_MO SI B PD31 PUEN NVDD8 Slow/Hyst TDO O NVDD8 Slow/Hyst SD1_D1 B NVDD8 Slow/Hyst SD1_D3 B PU/PD/1 00k NVDD8 Slow/Hyst TCK I PU/100k NVDD8 Slow/Hyst CSPI1_SCL K B NVDD8 Supply NVDD8 static NVDD8 Slow/Hyst SD1_CLK O NVDD8 Supply NVSS8 static NVDD9 Slow2/Hyst UART2_RT S I Default NVDD8 BOUT I AOUT TRST_B PUEN CIN Slow/Hyst PD28 BIN NVDD8 PUEN/PDEN Direction1 B Mux3 Signal/Pad Name CSPI1_SS0 Direction2 I/O Type Slow/Hyst Signal Power Bank MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor NVDD8 AIN GPIO Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary PD28 PU/100k TRST_B Ext_D MAGra nt_B Ext_D MAGra nt_B PD27 PD31 TDO CSPI3_SS O PU/PD PE19 PUEN PC_TE ST_CA RDST0 PE19 PE21 PDEN PC_TE ST_CA RDST2 PE21 TCK PD29 PUEN PD29 NVDD8 CSPI3_SCL K O PE23 PUEN PC_TE ST_INT _ALL PE23 NVSS8 KP_ROW7 B PE4 PUEN UART2_R TS Signal Descriptions and Pin Assignments 5-34 Table 5-2. i.MX27 Pin MUX Table (continued) NVDD9 Slow/Hyst NVDD9 Default UART3_CT S BOUT Slow/Hyst PU/100k/ ODEN AOUT NVDD9 CIN O BIN UART2_TX D AIN Slow/Hyst PUEN/PDEN NVDD9 Mux3 B GPIO Pull-up /Pull Strength /Open Drain Direction1 KP_COL2 Direction2 Signal/Pad Name Slow/Hyst Signal I/O Type NVDD9 Alternate Pull-up/Pull Strength/Open Drain2 Power Bank Primary KP_COL2 KP_COL6 PE6 PUEN UART2_T XD O PE10 PUEN PE10 UART1_CT S O PE14 PUEN UART1_C TS Slow/Hyst I2C_CLK B OD PD18 PUEN PD18 NVDD9 Slow/Hyst KP_COL0 B PU/100k/ ODEN KP_COL0 NVDD9 Slow/Hyst KP_COL4 B PU/100k/ ODEN KP_COL4 NVDD9 Slow/Hyst UART3_TX D O PE8 PUEN PE8 NVDD9 Slow/Hyst UART1_TX D O PE12 PUEN UART1_T XD NVDD9 Slow/Hyst PWMO O PE5 PUEN NVDD9 Slow/Hyst UART1_RT S I PE15 PUEN UART1_R TS NVDD9 Slow/Hyst UART2_CT S O PE3 PUEN UART2_C TS KP_COL7 B B ODEN ODEN PC_SP TOUT2 TOUT3 KOUT PE5 5-35 Signal Descriptions and Pin Assignments MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) GPIO Slow/Hyst UART3_RT S I NVDD9 Slow/Hyst I2C_DATA B OD NVDD9 Slow/Hyst KP_COL1 B PU/100k/ ODEN KP_COL1 NVDD9 Slow/Hyst KP_COL5 B PU/100k/ ODEN KP_COL5 NVDD9 Slow/Hyst UART3_RX D I PE9 PUEN PE9 NVDD9 Slow/Hyst UART1_RX D I PE13 PUEN UART1_R XD NVDD9 Supply NVDD9 static NVDD9 NVDD9 Supply NVSS9 static NVSS9 OSC26VDD Supply OSC26VDD static OSC26VD D OSC26VDD Analog_By p XTAL26M static XTAL26M OSC26VDD Supply OSC26VSS static OSC26VS S Default NVDD9 BOUT I AOUT UART2_RX D CIN Slow/Hyst BIN NVDD9 PU/100k/ ODEN AIN B PUEN/PDEN Direction1 KP_COL3 Mux3 Signal/Pad Name Slow/Hyst Direction2 I/O Type NVDD9 Signal Power Bank Freescale Semiconductor MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary KP_COL3 KP_ROW6 B PE7 PUEN UART2_R XD PE11 PUEN PE11 PD17 PUEN PD17 Signal Descriptions and Pin Assignments 5-36 Table 5-2. i.MX27 Pin MUX Table (continued) GPIO OSC32VDD Supply OSC32VDD static OSC32VD D OSC32VDD Analog EXTAL32K I EXTAL32 K OSC32VDD Supply OSC32VSS static OSC32VS S OSC32VDD Analog XTAL32K I XTAL32K QVDD10 Supply QVSS10 static QVSS10 QVDD10 Supply QVDD10 static QVDD10 QVDD12 Supply QVSS12 static QVSS12 QVDD12 Supply QVDD12 static QVDD12 QVDD2 Supply QVSS2 static QVSS2 QVDD2 Supply QVDD2 static QVDD2 QVDD3 Supply QVSS3 static QVSS3 QVDD3 Supply QVDD3 static QVDD3 QVDD5 Supply QVSS5 static QVSS5 QVDD5 Supply QVDD5 static QVDD5 Default OSC26M_ TEST BOUT I AOUT OSC26M_T EST CIN Analog BIN OSC26VDD AIN EXTAL26 M PUEN/PDEN static Mux3 Direction1 EXTAL26M Direction2 Signal/Pad Name Analog_By p Signal I/O Type OSC26VDD Signal Descriptions and Pin Assignments 5-37 Power Bank Pull-up /Pull Strength /Open Drain Alternate Pull-up/Pull Strength/Open Drain2 Primary MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor Table 5-2. i.MX27 Pin MUX Table (continued) Freescale Semiconductor QVDD6 QVDD7 Supply QVSS7 static QVSS7 QVDD7 Supply QVDD7 static QVDD7 QVDD8 Supply QVSS8 static QVSS8 QVDD8 Supply QVDD8 static QVDD8 RTCVDD Supply RTCVSS static RTCVSS RTCVDD Supply RTCVDD static RTCVDD UPLLVDD Supply UPLLVDD static UPLLVDD UPLLVDD Supply UPLLVSS static UPLLVSS Indicates direction of primary signal. It may not indicate the direction of the pin as it may be dependent on other functions. KP = Keeper Circuit permanently On when in Primary/Alternate Mode; PU = Pull Up permanently On when in Primary/Alternate Mode; PUEN = Pull Up controllable from Module when in Primary/Alternate Mode; OD = Open Drain permanently On when in Primary/Alternate Mode; ODEN = Open Drain controllable from Module when in Primary/Alternate Mode. 3 Pin mux with GPIO has its Pull Up controlled by the GPIO PUEN register (in Primary, Alternate, or GPIO Mode) 2 Default static BOUT QVDD6 AOUT Supply CIN QVDD6 BIN QVSS6 AIN static PUEN/PDEN QVSS6 Mux3 Direction1 Supply Direction2 Signal/Pad Name QVDD6 Signal I/O Type Pull-up /Pull Strength /Open Drain GPIO Power Bank MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 1 Alternate Pull-up/Pull Strength/Open Drain2 Primary Signal Descriptions and Pin Assignments 5-38 Table 5-2. i.MX27 Pin MUX Table (continued) Chapter 6 General-Purpose I/O (GPIO) 6.1 Introduction The GPIO module in i.MX27 processor provides six general purpose I/O (GPIO) ports (PA, PB, PC, PD, PE, and PF). Each GPIO port is a 32-bit port that may be multiplexed with one or more dedicated functions. This chapter contains the description of the top level i.MX27 I/O multiplexing strategy that consists of two parts: • Software controllable multiplexing done in the GPIO module • Hardware multiplexing done by the IOMUX module The I/O multiplexing strategy is designed to configure the inputs and outputs of the BONO Device chip in different modes. It allows a user to use the same I/O pad for alternative purposes of the chip. The design of I/O multiplexer is targeted to be as flexible as possible. Refer to Chapter 5, “Signal Descriptions and Pin Assignments,” for detailed I/O multiplexing information. Figure 6-1 shows the block diagram of the GPIO and IOMUX modules’ partition at the top level of the BONO processor. Figure 6-2 shows a block diagram of an individual port of the GPIO module. NOTE A_IN, B_IN, C_IN, A_OUT, and B_OUT are internal signals and do not represent individual port signals. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-1 General-Purpose I/O (GPIO) IOMUX (Part of GPIO) Primary Function 1 GP GOUT A_IN B_IN 0 1 MUX Alternate Function MUX 0 GPIO INUSE Pin I/O 0 GDIR 1 MUX C_IN A_OUT B_OUT PUEN GIN Figure 6-1. Functional Block Diagram of GPIO MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-2 Freescale Semiconductor General-Purpose I/O (GPIO) OCR1 OCR2 DDIR[i] G_DIR[31:0] A_IN[i] G_DIR[i] G_OUT[i] MUX B_IN[i] C_IN[i] PAD i G_IN[i] DR ICONFA1 SSR MUX ICONFA2 A_OUT[i] ISR[i] 1’b0 1’b1 Interrupt Module ISR MUX ICONFB1 ICONFB2 B_OUT[i] ISR[i] 1’b0 1’b1 ICR1 ICR2 IMR GP IN_USE_RESET_SEL [31:0] GPR[31:0] GIUS IN_USE[31:0] PUEN PUEN[31:0] Figure 6-2. GPIO Block Diagram for an Individual Port 6.2 Overview The GPIO module provides General Purpose I/O capability to the device. Each I/O port can be programmed as either a general purpose input or general purpose output. In addition to GPIO functionality, pins can be changed from their default dedicated functions to alternate functions. Input and output signals of peripherals are connected to the IOMUX module at the dedicated (primary) or alternate inputs. In the output direction, one out of three alternate sources (originating from peripherals) can be selected. From the input direction, one out of two alternate destinations (input to a peripheral) can be selected. 6.3 GPIO Features The following list contains the GPIO features: • Six 32-bit ports, each with direction-configurable pins MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-3 General-Purpose I/O (GPIO) • • • • • • • • • • 6.4 Software control for input/output pin configuration through 32-bit direction register Software control for multiplexing one out of four different sources for every output. Three of them are functional pins from internal modules while the fourth is from the data register of the module. Software control for routing of every input to two different destinations Input data can be sampled to the data register. Inputs can be internally tied to a logic 1 or 0 to ensure any transitions attempted to be processed are ignored. One 32-bit general purpose register is dedicated to each GPIO port. These registers may be used for software control of IOMUX block of the GPIO. Every input is configurable as an interrupt and each interrupt can be defined as either: — Rising-edge triggered — Falling-edge triggered — Level sensitive The interrupts can be masked using a 32-bit mask register. Two levels of interrupt masking are provided. Interrupts can be individually masked at the bit level or at the port level. Software reset function: when the SWR bit (SWR register, 0 bit) is written as a 1, the entire GPIO module is reset immediately, and this reset signal is asserted for three system cycles. After this, the reset signal will be released automatically. External Signals Description Refer to Chapter 5, “Signal Descriptions and Pin Assignments” for details on the I/O multiplexing scheme and external connection to the GPIO module. 6.5 Interrupts Every external input passes through the interrupt module in the GPIO module. Inside this module, the interrupts may be defined as rising-edge triggered, or falling-edge triggered. Each interrupt can be masked and also be designated as a high-level interrupt, or a low-level sensitive interrupt. The interrupt status register bits corresponding to the interrupts waiting for service are stored as a value of 1. The interrupt status register is Write 1 to Clear (w1c). The user is responsible for clearing the interrupt status register bit after it has been serviced. 6.6 Memory Map and Register Definitions The GPIO module has six ports and each port has 17 registers. In total, the GPIO has 102 registers. The registers, other than the Sample Status Register (SSR) and the Interrupt Status Register (ISR), have both read and write capability. The Sample Status Register is a read only register, while the Interrupt Status Register is a w1c register; the register can be read, but writing a 1 to any register bit clears the bit. Writing a value of 0 to the bit has no effect. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-4 Freescale Semiconductor General-Purpose I/O (GPIO) While there are six GPIO ports, each capable of representing 32 GPIO configurable pins as inputs or outputs, not all bits are mapped to a pin and hence these bits do not have any effect and are marked as reserved. These reserved bits are indicated in Section 6.6.10, “GPIO IN USE Registers (GIUS).” Table 6-1 shows the GPIO memory map. Table 6-1. GPIO Memory Map Address Register Access Reset Value Section/Page General Registers 0x1001_5000 (PTA_DDIR) Data Direction Register R/W 0x0000_0000 6.6.2/6-9 0x1001_5100 (PTB_DDIR) Data Direction Register R/W 0x0000_0000 6.6.2/6-9 0x1001_5200 (PTC_DDIR) Data Direction Register R/W 0x0000_0000 6.6.2/6-9 0x1001_5300 (PTD_DDIR) Data Direction Register R/W 0x0000_0000 6.6.2/6-9 0x1001_5400 (PTE_DDIR) Data Direction Register R/W 0x0000_0000 6.6.2/6-9 0x1001_5500 (PTF_DDIR) Data Direction Register R/W 0x0000_0000 6.6.2/6-9 0x1001_5004 (PTA_OCR1) Output Configuration Register 1) R/W 0x0000_0000 6.6.3/6-10 0x1001_5104 (PTB_OCR1) Output Configuration Register 1 R/W 0x0000_0000 6.6.3/6-10 0x1001_5204 (PTC_OCR1) Output Configuration Register 1) R/W 0x0000_0000 6.6.3/6-10 0x1001_5304 (PTD_OCR1) Output Configuration Register 1 R/W 0x0000_0000 6.6.3/6-10 0x1001_5404 (PTE_OCR1) Output Configuration Register 1 R/W 0x0000_0000 6.6.3/6-10 0x1001_5504 (PTF_OCR1) Output Configuration Register 1 R/W 0x0000_0000 6.6.3/6-10 0x1001_5008 (PTA_OCR2) Output Configuration Register 2 R/W 0x0000_0000 6.6.4/6-11 0x1001_5108 (PTB_OCR2) Output Configuration Register 2 R/W 0x0000_0000 6.6.4/6-11 0x1001_5208 (PTC_OCR2) Output Configuration Register 2 R/W 0x0000_0000 6.6.4/6-11 0x1001_5308 (PTD_OCR2) Output Configuration Register 2 R/W 0x0000_0000 6.6.4/6-11 0x1001_5408 (PTE_OCR2) Output Configuration Register 2 R/W 0x0000_0000 6.6.4/6-11 0x1001_5508 (PTF_OCR2) Output Configuration Register 2 R/W 0x0000_0000 6.6.4/6-11 0x1001_500C (PTA_ICONFA1) Input Configuration Register A1 R/W 0xFFFF_FFFF 6.6.5/6-12 0x1001_510C (PTB_ICONFA1) Input Configuration Register A1 R/W 0xFFFF_FFFF 6.6.5/6-12 0x1001_520C (PTC_ICONFA1) Input Configuration Register A1 R/W 0xFFFF_FFFF 6.6.5/6-12 0x1001_530C (PTD_ICONFA1) Input Configuration Register A1 R/W 0xFFFF_FFFF 6.6.5/6-12 0x1001_540C (PTE_ICONFA1) Input Configuration Register A1 R/W 0xFFFF_FFFF 6.6.5/6-12 0x1001_550C (PTF_ICONFA1) Input Configuration Register A1 R/W 0xFFFF_FFFF 6.6.5/6-12 0x1001_5010 (PTA_ICONFA2) Input Configuration Register A2 R/W 0xFFFF_FFFF 6.6.6/6-13 0x1001_5110 (PTB_ICONFA2) Input Configuration Register A2 R/W 0xFFFF_FFFF 6.6.6/6-13 0x1001_5210 (PTC_ICONFA2) Input Configuration Register A2 R/W 0xFFFF_FFFF 6.6.6/6-13 0x1001_5310 (PTD_ICONFA2) Input Configuration Register A2 R/W 0xFFFF_FFFF 6.6.6/6-13 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-5 General-Purpose I/O (GPIO) Table 6-1. GPIO Memory Map (continued) Address Register Access Reset Value Section/Page 0x1001_5410 (PTE_ICONFA2) Input Configuration Register A2 R/W 0xFFFF_FFFF 6.6.6/6-13 0x1001_5510 (PTF_ICONFA2) Input Configuration Register A2 R/W 0xFFFF_FFFF 6.6.6/6-13 0x1001_5014 (PTA_ICONFB1) Input Configuration Register B1 R/W 0xFFFF_FFFF 6.6.7/6-14 0x1001_5114 (PTB_ICONFB1) Input Configuration Register B1 R/W 0xFFFF_FFFF 6.6.7/6-14 0x1001_5214 (PTC_ICONFB1) Input Configuration Register B1 R/W 0xFFFF_FFFF 6.6.7/6-14 0x1001_5314 (PTD_ICONFB1) Input Configuration Register B1 R/W 0xFFFF_FFFF 6.6.7/6-14 0x1001_5414 (PTE_ICONFB1) Input Configuration Register B1 R/W 0xFFFF_FFFF 6.6.7/6-14 0x1001_5514 (PTF_ICONFB1) Input Configuration Register B1 R/W 0xFFFF_FFFF 6.6.7/6-14 0x1001_5018 (PTA_ICONFB2) Input Configuration Register B2 R/W 0xFFFF_FFFF 6.6.8/6-15 0x1001_5118 (PTB_ICONFB2) Input Configuration Register B2 R/W 0xFFFF_FFFF 6.6.8/6-15 0x1001_5218 (PTC_ICONFB2) Input Configuration Register B2 R/W 0xFFFF_FFFF 6.6.8/6-15 0x1001_5318 (PTD_ICONFB2) Input Configuration Register B2 R/W 0xFFFF_FFFF 6.6.8/6-15 0x1001_5418 (PTE_ICONFB2) Input Configuration Register B2 R/W 0xFFFF_FFFF 6.6.8/6-15 0x1001_5518 (PTF_ICONFB2) Input Configuration Register B2 R/W 0xFFFF_FFFF 6.6.8/6-15 0x1001_501C (PTA_DR) Data Register R/W 0x0000_0000 6.6.9/6-16 0x1001_511C (PTB_DR) Data Register R/W 0x0000_0000 6.6.9/6-16 0x1001_521C (PTC_DR) Data Register R/W 0x0000_0000 6.6.9/6-16 0x1001_531C (PTD_DR) Data Register R/W 0x0000_0000 6.6.9/6-16 0x1001_541C (PTE_DR) Data Register R/W 0x0000_0000 6.6.9/6-16 0x1001_551C (PTF_DR) Data Register R/W 0x0000_0000 6.6.9/6-16 0x1001_5020 (PTA_GIUS) GPIO In Use Register A R/W 0xFFFF_FFFF 6.6.11/6-17 0x1001_5120 (PTB_GIUS) GPIO In Use Register B R/W 0xFF3F_FFF3 6.6.11/6-17 0x1001_5220 (PTC_GIUS) GPIO In Use Register C R/W 0xFFFF_FFFF 6.6.11/6-17 0x1001_5320 (PTD_GIUS) GPIO In Use Register D R/W 0xFFFE_0000 6.6.11/6-17 0x1001_5420 (PTE_GIUS) GPIO In Use Register E R/W 0xFFFC_0F27 6.6.11/6-17 0x1001_5520 (PTF_GIUS) GPIO In Use Register F R/W 0xFF00_0000 6.6.11/6-17 0x1001_5024 (PTA_SSR) Sample Status Register R 0x0000_0000 6.6.12/6-21 0x1001_5124 (PTB_SSR) Sample Status Register R 0x0000_0000 6.6.12/6-21 0x1001_5224 (PTC_SSR) Sample Status Register R 0x0000_0000 6.6.12/6-21 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-6 Freescale Semiconductor General-Purpose I/O (GPIO) Table 6-1. GPIO Memory Map (continued) Address Register Access Reset Value Section/Page 0x1001_5324 (PTD_SSR) Sample Status Register R 0x0000_0000 6.6.12/6-21 0x1001_5424 (PTE_SSR) Sample Status Register R 0x0000_0000 6.6.12/6-21 0x1001_5524 (PTF_SSR) Sample Status Register R 0x0000_0000 6.6.12/6-21 0x1001_5028 (PTA_ICR1) Interrupt Configuration Register 1 R/W 0x0000_0000 6.6.13/6-22 0x1001_5128 (PTB_ICR1) Interrupt Configuration Register 1 R/W 0x0000_0000 6.6.13/6-22 0x1001_5228 (PTC_ICR1) Interrupt Configuration Register 1 R/W 0x0000_0000 6.6.13/6-22 0x1001_5328 (PTD_ICR1) Interrupt Configuration Register 1 R/W 0x0000_0000 6.6.13/6-22 0x1001_5428 (PTE_ICR1) Interrupt Configuration Register 1 R/W 0x0000_0000 6.6.13/6-22 0x1001_5528 (PTF_ICR1) Interrupt Configuration Register 1 R/W 0x0000_0000 6.6.13/6-22 0x1001_502C (PTA_ICR2) Interrupt Configuration Register 2 R/W 0x0000_0000 6.6.14/6-23 0x1001_512C (PTB_ICR2) Interrupt Configuration Register 2 R/W 0x0000_0000 6.6.14/6-23 0x1001_522C (PTC_ICR2) Interrupt Configuration Register 2 R/W 0x0000_0000 6.6.14/6-23 0x1001_532C (PTD_ICR2) Interrupt Configuration Register 2 R/W 0x0000_0000 6.6.14/6-23 0x1001_542C (PTE_ICR2) Interrupt Configuration Register 2 R/W 0x0000_0000 6.6.14/6-23 0x1001_552C (PTF_ICR2) Interrupt Configuration Register 2 R/W 0x0000_0000 6.6.14/6-23 0x1001_5030 (PTA_IMR) Interrupt Mask Register R/W 0x0000_0000 6.6.15/6-24 0x1001_5130 (PTB_IMR) Interrupt Mask Register R/W 0x0000_0000 6.6.15/6-24 0x1001_5230 (PTC_IMR) Interrupt Mask Register R/W 0x0000_0000 6.6.15/6-24 0x1001_5330 (PTD_IMR) Interrupt Mask Register R/W 0x0000_0000 6.6.15/6-24 0x1001_5430 (PTE_IMR) Interrupt Mask Register R/W 0x0000_0000 6.6.15/6-24 0x1001_5530 (PTF_IMR) Interrupt Mask Register R/W 0x0000_0000 6.6.15/6-24 0x1001_5034 (PTA_ISR) Interrupt Status Register R/W 0x0000_0000 6.6.16/6-25 0x1001_5134 (PTB_ISR) Interrupt Status Register R/W 0x0000_0000 6.6.16/6-25 0x1001_5234 (PTC_ISR) Interrupt Status Register R/W 0x0000_0000 6.6.16/6-25 0x1001_5334 (PTD_ISR) Interrupt Status Register R/W 0x0000_0000 6.6.16/6-25 0x1001_5434 (PTE_ISR) Interrupt Status Register R/W 0x0000_0000 6.6.16/6-25 0x1001_5534 (PTF_ISR) Interrupt Status Register R/W 0x0000_0000 6.6.16/6-25 0x1001_5038 (PTA_GPR) General Purpose Register R/W 0x0000_0000 6.6.17/6-26 0x1001_5138 (PTB_GPR) General Purpose Register R/W 0x0000_0000 6.6.17/6-26 0x1001_5238 (PTC_GPR) General Purpose Register R/W 0x0000_0000 6.6.17/6-26 0x1001_5338 (PTD_GPR) General Purpose Register R/W 0x0000_0000 6.6.17/6-26 0x1001_5438 (PTE_GPR) General Purpose Register R/W 0x0000_0000 6.6.17/6-26 0x1001_5538 (PTF_GPR) General Purpose Register R/W 0x0000_0000 6.6.17/6-26 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-7 General-Purpose I/O (GPIO) Table 6-1. GPIO Memory Map (continued) Address Register Access Reset Value Section/Page 0x1001_503C (PTA_SWR) Software Reset Register R 0x0000_0000 6.6.18/6-27 0x1001_513C (PTB_SWR) Software Reset Register R 0x0000_0000 6.6.18/6-27 0x1001_513C (PTB_SWR) Software Reset Register R 0x0000_0000 6.6.18/6-27 0x1001_533C (PTD_SWR) Software Reset Register R 0x0000_0000 6.6.18/6-27 0x1001_543C (PTE_SWR) Software Reset Register R 0x0000_0000 6.6.18/6-27 0x1001_553C (PTF_SWR) Software Reset Register R 0x0000_0000 6.6.18/6-27 0x1001_5040 (PTA_PUEN) Pull-Up Enable Register R/W 0xFFFF_FFFF 6.6.19/6-28 0x1001_5140 (PTB_PUEN) Pull-Up Enable Register R/W 0xFFFF_FFFF 6.6.19/6-28 0x1001_5240 (PTC_PUEN) Pull-Up Enable Register R/W 0xFFFF_FFFF 6.6.19/6-28 0x1001_5340 (PTD_PUEN) Pull-Up Enable Register R/W 0xFFFF_FFFF 6.6.19/6-28 0x1001_5440 (PTE_PUEN) Pull-Up Enable Register R/W 0xFFFF_FFFF 6.6.19/6-28 0x1001_5540 (PTF_PUEN) Pull-Up Enable Register R/W 0xFFFF_FFFF 6.6.19/6-28 0x1001_5600 (PMASK) Port Interrupt Mask Register R/W 0x0000_003F 6.6.20/6-29 6.6.1 Register Summary The conventions in Figure 6-3 and Table 6-2 serve as a key for the register summary and individual register diagrams. Always reads 1 1 Always reads 0 0 R/W BIT Read- BIT WriteWrite 1 BIT Self-clear 0 bit only bit only bit BIT to clear w1c bit BIT N/A Figure 6-3. Key to Register Fields Table 6-2 provides a key for register figures and tables and the register summary. Table 6-2. Register Conventions Convention Description Depending on its placement in the read or write row, indicates that the bit is not readable or not writable. FIELDNAME Identifies the field. Its presence in the read or write row indicates that it can be read or written. Register Field Types R Read only. Writing this bit has no effect. W Write only. R/W Standard read/write bit. Only software can change the bit’s value (other than a hardware reset). rwm A read/write bit that may be modified by a hardware in some fashion other than by a reset. w1c Write one to clear. A status bit that can be read, and is cleared by writing a one. Self-clearing bit Writing a one has some effect on the module, but it always reads as zero. (Previously designated slfclr) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-8 Freescale Semiconductor General-Purpose I/O (GPIO) Table 6-2. Register Conventions (continued) Convention Description Reset Values 0 Resets to zero. 1 Resets to one. — Undefined at reset. u Unaffected by reset. [signal_name] 6.6.2 Reset value is determined by polarity of indicated signal. Data Direction Register (PTn_DDIR) The Data Direction registers determine whether each port pin operates as an input or an output pin. Figure 6-4 shows the register and Table 6-3 provides its field descriptions. Access: User R/W 0x1001_5000 (PTA_DDIR) 0x1001_5100 (PTB_DDIR) 0x1001_5200 (PTC_DDIR) 0x1001_5300 (PTD_DDIR) 0x1001_5400 (PTE_DDIR) 0x1001_5500 (PTF_DDIR) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R DDIR W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R DDIR W Reset 0 0 0 0 0 0 0 0 0 Figure 6-4. Data Direction Register (PTn_DDIR) Table 6-3. Data Direction Register Field Descriptions Field Description 31–0 DDIR Data Direction. This is a read/write register that defines the current direction of the 32 pins of a port in the GPIO module. 0 Pin operates as an input. 1 Pin operates as an output. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-9 General-Purpose I/O (GPIO) 6.6.3 Output Configuration Register 1 (OCR1) Each port consists of 32-pins. Because the output configuration for each pin is described using a two-bit combination the output configuration of the pins is controlled by two identical 32-bit registers (OCR1 and OCR2). The Output Configuration register 1 (OCR1) configures the output signal for lower 16 pins (0–15) of the associated port. Figure 6-5 shows the register and Table 6-4 provides its field descriptions. Access: User R/W 0x1001_5004 (PTA_OCR1) 0x1001_5104 (PTB_OCR1) 0x1001_5204 (PTC_OCR1) 0x1001_5304 (PTD_OCR1) 0x1001_5404 (PTE_OCR1) 0x1001_5504 (PTF_OCR1) 31 30 29 28 27 26 25 24 R PIN 15 PIN 14 PIN 13 PIN 12 21 20 19 18 17 16 PIN 11 PIN 10 PIN 9 PIN 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R OCR1 W Reset 22 OCR1 W Reset 23 PIN 7 0 PIN 6 0 0 PIN 5 0 0 0 PIN 4 0 PIN 3 0 0 PIN 2 0 0 PIN 1 0 0 PIN 0 0 0 0 Figure 6-5. Output Configuration Register 1 (OCR1) Table 6-4. Output Configuration Register 1 Field Descriptions Field Description 31–0 OCR1 Output Configuration Register 1. Each field selects how each pin (0–15) is used as an output by the GPIO. 00 Input A_IN output selected. 01 Input B_IN output selected. 10 Input C_IN output selected. 11 Data Register output selected. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-10 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.4 Output Configuration Register 2 (OCR2) The Output Configuration register 2 (OCR2) specifies the output signal for upper 16 pins (16–31) of the associated port. The output configuration for each pin is described with a two-bit combination. Figure 6-6 shows the register and Table 6-5 provides its field descriptions. Access: User R/W 0x1001_5008 (PTA_OCR2) 0x1001_5108 (PTB_OCR2) 0x1001_5208 (PTC_OCR2) 0x1001_5308 (PTD_OCR2) 0x1001_5408 (PTE_OCR2) 0x1001_5508 (PTF_OCR2) 31 30 29 28 27 26 25 24 R PIN 31 PIN 30 PIN 29 PIN 28 21 20 19 18 17 16 PIN 27 PIN 26 PIN 25 PIN 24 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R OCR2 W Reset 22 OCR2 W Reset 23 PIN 23 0 PIN 22 0 0 0 PIN 21 0 0 PIN 20 0 0 PIN 19 0 0 PIN 18 0 0 PIN 17 0 0 PIN 16 0 0 Figure 6-6. Output Configuration Register 2 (OCR2) Table 6-5. Output Configuration Register 2 Field Descriptions Field Description 31–0 OCR2 Output Configuration Register 2. Each field selects how each pin (16–31) is used as an output by the GPIO. 00 Input A_IN output selected. 01 Input B_IN output selected. 10 Input C_IN output selected. 11 Data Register output selected. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-11 General-Purpose I/O (GPIO) 6.6.5 Input Configuration Register A1 (ICONFA1) The input configuration registers (ICONFA1) specify the signal or value driven to the A_OUT signals that is connected to internal modules of the BONO Device processor. Each port pin is defined by two bits in the input configuration registers. Figure 6-7 shows the register and Table 6-6 provides its field descriptions. Access: User R/W 0x1001_500C (PTA_ICONFA1) 0x1001_510C (PTB_ICONFA1) 0x1001_520C (PTC_ICONFA1) 0x1001_530C (PTD_ICONFA1) 0x1001_540C (PTE_ICONFA1) 0x1001_550C (PTF_ICONFA1) 31 30 29 28 27 26 25 24 R W Reset 22 21 20 19 18 17 16 ICONFA1 PIN 15 PIN 14 PIN 13 PIN 12 PIN 11 PIN 10 PIN 9 PIN 8 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R ICONFA1 W Reset 23 PIN 7 1 PIN 6 1 1 PIN 5 1 1 1 PIN 4 1 PIN 3 1 1 PIN 2 1 1 PIN 1 1 1 PIN 0 1 1 1 Figure 6-7. Input Configuration Register A1 (ICONFA1) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-12 Freescale Semiconductor General-Purpose I/O (GPIO) Table 6-6. Input Configuration Register A1 Field Descriptions Field Description 31–0 ICONFA1 6.6.6 Input Configuration. Corresponds to port pins 0–15 and defines which one of the four options is driven to A_OUT. Each port pin requires two ICONFA1 bits to determine the input value. 00 GPIO_In 01 Interrupt Status Register 10 0 11 1 Input Configuration Register A2 (ICONFA2) The input configuration registers (ICONFA2) specify the signal or value driven to the A_OUT signals connected to internal modules. There are two bits in the input configuration registers for each port pin. Figure 6-8 shows the register and Table 6-7 provides its field descriptions. Access: User R/W 0x1001_5010 (PTA_ICONFA2) 0x1001_5110 (PTB_ICONFA2) 0x1001_5210 (PTC_ICONFA2) 0x1001_5310 (PTD_ICONFA2) 0x1001_5410 (PTE_ICONFA2) 0x1001_5510 (PTF_ICONFA2) 31 30 29 28 27 26 25 24 R W Reset Reset 22 21 20 19 18 17 16 ICONFA2 PIN 31 PIN 30 PIN 29 PIN 28 PIN 27 PIN 26 PIN 25 PIN 24 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W 23 ICONFA2 PIN 23 1 PIN 22 1 1 1 PIN 21 1 1 PIN 20 1 1 PIN 19 1 1 PIN 18 1 1 PIN 17 1 1 PIN 16 1 1 Figure 6-8. Input Configuration Register A2 (ICONFA2) Table 6-7. Input Configuration Register A2 Field Descriptions Field 31–0 ICONFA2 Description Input Configuration. Corresponds to port pins 16–31 and defines which one of the four options is driven to A_OUT. Each port pin requires two ICONFA2 bits to determine the input value. 00 GPIO_In 01 Interrupt Status Register 10 0 11 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-13 General-Purpose I/O (GPIO) 6.6.7 Input Configuration Register B1 (ICONFB1) The input configuration registers ICONFB1 specify the signal or value driven to the B_OUT signals connected to internal modules. There are two bits in the input configuration registers for each port pin. Figure 6-9 shows the register and Table 6-8 provides its field descriptions. Access: User R/W 0x1001_5014 (PTA_ICONFB1) 0x1001_5114 (PTB_ICONFB1) 0x1001_5214 (PTC_ICONFB1) 0x1001_5314 (PTD_ICONFB1) 0x1001_5414 (PTE_ICONFB1) 0x1001_5514 (PTF_ICONFB1) 31 30 29 28 27 26 25 24 R W Reset 22 21 20 19 18 17 16 ICONFB1 PIN 15 PIN 14 PIN 13 PIN 12 PIN 11 PIN 10 PIN 9 PIN 8 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R ICONFB1 W Reset 23 PIN 7 1 PIN 6 1 1 PIN 5 1 1 1 PIN 4 1 PIN 3 1 1 PIN 2 1 1 PIN 1 1 1 PIN 0 1 1 1 Figure 6-9. Input Configuration Register B1 (ICONFB1) Table 6-8. Input Configuration Register B1 Field Descriptions Name Description 31–0 ICONFB1 Input Configuration. Corresponds to pins 0–15 of the port and defines which one of the four options is driven to b_OUT. Each port pin requires two ICONFB1 bits to determine the input value. 00 GPIO_IN 01 Interrupt Status register 10 0 11 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-14 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.8 Input Configuration Register B2 (ICONFB2) The input configuration registers ICONFB2 specify the signal or value driven to the B_OUT signals connected to internal modules. There are two bits in the input configuration registers for each port pin. Figure 6-10 shows the register and Table 6-9 provides its field descriptions. Access: User R/W 0x1001_5018 (PTA_ICONFB2) 0x1001_5118 (PTB_ICONFB2) 0x1001_5218 (PTC_ICONFB2) 0x1001_5318 (PTD_ICONFB2) 0x1001_5418 (PTE_ICONFB2) 0x1001_5518 (PTF_ICONFB2) 31 30 29 28 27 26 25 24 R W Reset Reset 22 21 20 19 18 17 16 ICONFB2 PIN 31 PIN 30 PIN 29 PIN 28 PIN 27 PIN 26 PIN 25 PIN 24 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W 23 ICONFB2 PIN 23 1 PIN 22 1 1 1 PIN 21 1 1 PIN 20 1 1 PIN 19 1 1 PIN 18 1 1 PIN 17 1 1 PIN 16 1 1 Figure 6-10. Input Configuration Register B1 (ICONFB2) Table 6-9. Input Configuration Register B2 Description Name Description 31–0 ICONFB2 Input Configuration. Corresponds to pins 16–31 of the port and defines which one of the four options is driven to b_OUT. Each port pin requires two ICONFB2 bits to determine the input value. 00 GPIO_IN 01 Interrupt Status register 10 0 11 1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-15 General-Purpose I/O (GPIO) 6.6.9 Data Register (DR) The Data Register holds data for output from an associated port when a pin is configured as an output and the Data Register is chosen using Output Configuration Register 1 and Output Configuration Register 2. Figure 6-11 shows the register and Table 6-10 provides its field descriptions. Access: User R/W 0x1001_501C (PTA_DR) 0x1001_511C (PTB_DR) 0x1001_521C (PTC_DR) 0x1001_531C (PTD_DR) 0x1001_541C (PTE_DR) 0x1001_551C (PTF_DR) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R DR W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R DR W Reset 0 0 0 0 0 0 0 0 Figure 6-11. Data Register (DR) Table 6-10. Data Register Field Descriptions Field 31–0 DR Description Data Register. Contains the GPIO output values when the Output Configuration Registers select the Data Register as the output for the pin (selection 11). 0 Drives the output signal is low. 1 Drives the output signal is high. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-16 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.10 GPIO IN USE Registers (GIUS) The GPIO In Use Registers control a multiplexer in the IOMUX module. The settings in these registers choose whether a pin is utilized for a peripheral function or for its GPIO function. If the register is set to a zero for a corresponding pin, then this register is used in conjunction with the GPR register to control the peripheral functionality. Figure 6-12 shows a GIUS overview register and Table 6-11 provides field descriptions of the GIUS registers. Reset values for individual registers are shown in the following sections. Access: User R/W 0x1001_5020 (PTA_GIUS) 0x1001_5120 (PTB_GIUS) 0x1001_5220 (PTC_GIUS) 0x1001_5320 (PTD_GIUS) 0x1001_5420 (PTE_GIUS) 0x1001_5520 (PTF_GIUS) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R GIUS W Reset1 — — — — — — — — — — — — — — — — 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 — — — — — — — R GIUS W Reset1 — — — — — — — — — 1 The reset value of this register is determined by the input value of the signal INUSE_RESET_SEL [31:0]. Figure 6-12. GPIO IN USE Register (GIUS) Table 6-11. GPIO In Use Register Field Descriptions Field Description 31–0 GIUS GPIO In Use. Informs the IOMUX module whether the port pin is utilized for its GPIO function. When the pin is utilized for its GPIO function, the multiplexed functions are not available. The reset value of this register is determined by the input value of the signal INUSE_RESET_SEL [31:0]. 0 Pin utilized for multiplexed function 1 Pin utilized for GPIO function 6.6.11 GPIO IN USE Register Reset Values The following sections describe the GPIO In Use (GIUS) reset values for the various ports. Additionally, the registers also indicate the reserved bits (unimplemented GPIO bits) of the GPIO ports. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-17 General-Purpose I/O (GPIO) 6.6.11.1 GPIO IN USE Register A (PTA_GIUS) The reset value of the PTA_GIUS register is (0xFFFF_FFFF). Figure 6-13 shows the register. 0x1001_5020 (PTA_GIUS) 31 30 29 28 Access: User R/W 27 26 25 24 23 22 21 20 19 18 17 16 R GIUS W Reset 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 R GIUS W Reset 1 1 1 1 1 1 1 1 1 Figure 6-13. GPIO IN USE Register A Reset Values (PTA_GIUS) 6.6.11.2 GPIO IN USE Register B (PTB_GIUS) The reset value of the PTB_GIUS register is (0xFF3F_FFF3). Figure 6-14 shows the register. 0x1001_5120 (PTB_GIUS) 31 30 29 28 Access: User R/W 27 26 25 24 23 22 21 20 19 18 17 16 R GIUS W Reset 1 1 1 1 1 1 1 1 0 0 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 R GIUS W Reset 1 1 1 1 1 1 1 1 1 1 1 1 0 0 Figure 6-14. GPIO IN USE Register B Reset Values (PTB_GIUS) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-18 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.11.3 GPIO IN USE Register C (PTC_GIUS) The reset value of the PTC_GIUS register is (0xFFFF_FFFF). Figure 6-15 shows the register. 0x1001_5220 (PTC_GIUS) 31 30 29 28 Access: User R/W 27 26 25 24 23 22 21 20 19 18 17 16 R GIUS W Reset 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 1 1 R GIUS W Reset 1 1 1 1 1 1 1 1 1 1 1 Figure 6-15. GPIO IN USE Register C Reset Values (PTC_GIUS) 6.6.11.4 GPIO IN USE Register D (PTD_GIUS) The reset value of the PTD_GIUS register is (0xFFFE_0000). Figure 6-16 shows the register. 0x1001_5320 (PTD_GIUS) 31 30 29 28 Access: User R/W 27 26 25 24 23 22 21 20 19 18 17 16 R GIUS W Reset 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R GIUS W Reset 0 0 0 0 0 0 0 0 0 Figure 6-16. GPIO IN USE Register D Reset Values (PTD_GIUS) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-19 General-Purpose I/O (GPIO) 6.6.11.5 GPIO IN USE Register E (PTE_GIUS) The reset value of the PTE_GIUS register is (0xFFFC_0F27). Figure 6-17 shows the register. 0x1001_5420 (PTE_GIUS) 31 30 29 28 Access: User R/W 27 26 R 25 24 1 1 23 22 21 GIUS 20 19 18 17 16 GIUS W Reset 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R GIUS W Reset 0 0 0 0 0 0 0 0 0 Figure 6-17. GPIO IN USE Register E Reset Values (PTE_GIUS) 6.6.11.6 GPIO IN USE Register F (PTF_GIUS) The reset value of the PTF_GIUS register is (0xFF00_0000). Figure 6-17 shows the register. 0x1001_5520 (PTF_GIUS) R Access: User R/W 31 30 29 28 27 26 25 24 23 1 1 1 1 1 1 1 1 0 22 21 20 19 18 17 16 GIUS W Reset 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R GIUS W Reset 0 0 0 0 0 0 0 0 0 Figure 6-18. GPIO IN USE Register F Reset Values (PTF_GIUS) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-20 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.12 Sample Status Register (SSR) The read-only Sample Status Registers contain the value of the GPIO pins for each associated port. The register is updated on every clock tick. The contents are used as a status indicator when the pins are configured as inputs. Figure 6-19 shows the register and Table 6-12 provides its field descriptions. Access: User read-only 0x1001_5024 (PTA_SSR) 0x1001_5124 (PTB_SSR) 0x1001_5224 (PTC_SSR) 0x1001_5324 (PTD_SSR) 0x1001_5424 (PTE_SSR) 0x1001_5524 (PTF_SSR) 31 30 29 28 27 26 25 24 R 23 22 21 20 19 18 17 16 SSR W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R SSR W Reset 0 0 0 0 0 0 0 0 Figure 6-19. Sample Status Register (SSR) Table 6-12. Sample Status Register Field Descriptions Field 31–0 SSR Description Sample Status. Contains the value of the GPIO pin [i]. It is sampled on every clock. 0 Pin value is low. 1 Pin value is high. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-21 General-Purpose I/O (GPIO) 6.6.13 Interrupt Configuration Register 1 (ICR1) This register specifies the external interrupt configuration for each of the lower 16 interrupts of a port. There are two bits in the register for each port pin. Figure 6-20 shows the register and Table 6-13 provides its field descriptions. Access: User R/W 0x1001_5028 (PTA_ICR1) 0x1001_5128 (PTB_ICR1) 0x1001_5228 (PTC_ICR1) 0x1001_5328 (PTD_ICR1) 0x1001_5428 (PTE_ICR1) 0x1001_5528 (PTF_ICR1) 31 30 29 28 27 26 25 24 R W Reset 22 21 20 19 18 17 16 ICR1 PIN 15 PIN 14 PIN 13 PIN 12 PIN 11 PIN 10 PIN 9 PIN 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R ICR1 W Reset 23 PIN 7 0 PIN 6 0 0 PIN 5 0 0 0 PIN 4 0 PIN 3 0 0 PIN 2 0 0 PIN 1 0 0 PIN 0 0 0 0 Figure 6-20. Interrupt Configuration Register 1 (ICR1) Table 6-13. Interrupt Configuration Register 1 Field Descriptions Field 31–0 ICR1 Description Interrupt Configuration. Corresponds to interrupts 0–15 of the port and defines which one of the four options is the sensitivity of the interrupt. Each interrupt [i] (i= 0 through 15) requires two ICR1 bits to determine the sensitivity. 00 Rising edge sensitive 01 Falling edge sensitive 10 High level sensitive 11 Low level sensitive MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-22 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.14 Interrupt Configuration Register 2 (ICR2) This register specify the external interrupt configuration for each of the upper 16 interrupts of the port. There are two bits in the register for each port pin. Figure 6-21 shows the register and Table 6-14 provides its field descriptions. Access: User R/W 0x1001_502C (PTA_ICR2) 0x1001_512C (PTB_ICR2) 0x1001_522C (PTC_ICR2) 0x1001_532C (PTD_ICR2) 0x1001_542C (PTE_ICR2) 0x1001_552C (PTF_ICR2) 31 30 29 28 27 26 25 24 R W Reset Reset 22 21 20 19 18 17 16 ICR2 PIN 31 PIN 30 PIN 29 PIN 28 PIN 27 PIN 26 PIN 25 PIN 24 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W 23 ICR2 PIN 23 0 PIN 22 0 0 0 PIN 21 0 0 PIN 20 0 0 PIN 19 0 0 PIN 18 0 0 PIN 17 0 0 PIN 16 0 0 Figure 6-21. Interrupt Configuration Register 2 (ICR2) Table 6-14. Interrupt Configuration Register 2 Field Descriptions Field Description 31–0 ICR2 Interrupt Configuration. Corresponds to interrupts 16–31 of the port and defines which one of the four options is the sensitivity of the interrupt. Each interrupt requires two ICR2 bits to determine the sensitivity. 00 Rising edge sensitive 01 Falling edge sensitive 10 High level sensitive 11 Low level sensitive MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-23 General-Purpose I/O (GPIO) 6.6.15 Interrupt Mask Register (IMR) The Interrupt Mask Registers (IMR) determine if an interrupt will be asserted when an interrupt event occurs and when the pin and corresponding bit is configured in an interrupt mode. An interrupt is asserted when corresponding bits in the IMR and ISR are set. Figure 6-22 shows the register and Table 6-15 provides its field descriptions. Access: User R/W 0x1001_5030 (PTA_IMR) 0x1001_5130 (PTB_IMR) 0x1001_5230 (PTC_IMR) 0x1001_5330 (PTD_IMR) 0x1001_5430 (PTE_IMR) 0x1001_5530 (PTF_IMR) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R IMR W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R IMR W Reset 0 0 0 0 0 0 0 0 Figure 6-22. Interrupt Mask Register (IMR) Table 6-15. Interrupt Mask Register Description Name 31–0 IMR Description Interrupt Mask. Masks the interrupts for this module. 0 Interrupt is masked. 1 Interrupt is not masked. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-24 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.16 Interrupt Status Register (ISR) The Interrupt Status Registers (ISR) indicate if an interrupt has occurred. When an interrupt event occurs, the bit in this register is set. The condition necessary to set the bit is determined by the Interrupt Configuration Registers (ICR) and the inputs satisfying the interrupt condition. Figure 6-23 shows the register and Table 6-16 provides its field descriptions. Access: User R/W 0x1001_5034 (PTA_ISR) 0x1001_5134 (PTB_ISR) 0x1001_5234 (PTC_ISR) 0x1001_5334 (PTD_ISR) 0x1001_5434 (PTE_ISR) 0x1001_5534 (PTF_ISR) 31 30 29 28 27 26 25 24 R W 22 21 20 19 18 17 16 ISR w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Reset R W 23 ISR w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c w1c 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Reset Figure 6-23. Interrupt Status Register (ISR) Table 6-16. Interrupt Status Register Field Descriptions Field Description 31–0 ISR Interrupt Status. Indicates whether the interrupt [i] has occurred for in the GPIO module. The bits of this register are write 1 to clear. The w1c bit is cleared when a value of 1 is written to the associated bit. 0 Interrupt has not occurred. 1 Interrupt has occurred. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-25 General-Purpose I/O (GPIO) 6.6.17 General Purpose Register (GPR) The General Purpose Registers (GPR) control a multiplexer in the IOMUX module. When the corresponding bit in the associated GIUS register is set to zero, the settings in these registers determine whether a pin is utilized for its primary peripheral function or for its alternate peripheral function. When the corresponding bit in the GIUS is set, the settings of this register have no effect. Figure 6-24 shows the register and Table 6-17 provides its field descriptions. Access: User R/W 0x1001_5038 (PTA_GPR) 0x1001_5138 (PTB_GPR) 0x1001_5238 (PTC_GPR) 0x1001_5338 (PTD_GPR) 0x1001_5438 (PTE_GPR) 0x1001_5538 (PTF_GPR) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R GPR W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 R GPR W Reset 0 0 0 0 0 0 0 0 Figure 6-24. General Purpose Register Table 6-17. General Purpose Register Field Descriptions Field 31–0 GPR Description General Purpose Register. Selects between the primary and alternate functions of the pin. When the associated bit in the GIUS register is set, this bit has no meaning. Note: Ensure that this bit is cleared when there is not an alternate function for the associated pin. 0 Select primary pin function 1 Select alternate pin function MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-26 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.18 Software Reset Register (SWR) The Software Reset Register (SWR) controls the reset of the individual ports in the GPIO module. When the SWR bit of the Software Reset Register is set, the GPIO circuitry for the individual port resets immediately. The total time of the software reset sequence will take six clock cycles. The reset will be asserted from the third cycle and remains asserted for three clocks. Figure 6-25 shows the register and Table 6-18 provides its field descriptions. Access: User R/W 0x1001_503C (PTA_SWR) 0x1001_513C (PTB_SWR) 0x1001_523C (PTC_SWR) 0x1001_533C (PTD_SWR) 0x1001_543C (PTE_SWR) 0x1001_553C (PTF_SWR) R 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R W Reset SWR 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 6-25. Software Reset Register (SWR) Table 6-18. Software Reset Register Field Descriptions Field Description 31–1 Reserved. These bits are reserved and should read 0 0 SWR Software Reset. Controls software reset of the port. The reset signal is active for 3 system clock cycles and then it is released automatically. It is a self-clearing bit. 0 No effect 1 GPIO circuitry for Port X reset MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-27 General-Purpose I/O (GPIO) 6.6.19 Pull-Up Enable Register (PUEN) The Pull-Up Enable (PUEN) Registers enable or disable a 69 kΩ pull-up resistor on the associated pin. The pull-up can be applied to any GPIO pin regardless of whether it is configured as primary, alternate or GPIO function. The pin is tri-stated when the pull-up is disabled and the pin is not driven. Figure 6-26 shows the register and Table 6-19 provides its field descriptions. NOTE Bits 27–24 on Port A (PTA_PUEN) enables or disables a 69 kΩ pull-down resistor on the associated pin. Bits 31–28, 26, and 9 on Port B (PTB_PUEN) enables or disables a 69 kΩ pull-down resistor on the associated pin. Access: User R/W 0x1001_5040 (PTA_PUEN) 0x1001_5140 (PTB_PUEN) 0x1001_5240 (PTC_PUEN) 0x1001_5340 (PTD_PUEN) 0x1001_5440 (PTE_PUEN) 0x1001_5540 (PTF_PUEN) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 R PUEN W Reset 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 R PUEN W Reset 1 1 1 1 1 1 1 1 1 Figure 6-26. Pull-Up Enable Register (PUEN) Table 6-19. Pull-Up Enable Register Field Descriptions Field Description 31–0 PUEN Pull-Up Enable. Determines whether the corresponding pad is pulled up to a logic-high or tri-stated. When the pin is configured as an input, clearing this bit causes the signal to be tri-stated when not driven by an external source. When the pin is configured as an output, clearing this bit causes the signal to be tri-stated when it is not enabled. 0 Pin [i] is tri-stated when not driven internally or externally. 1 Pin [i] is pulled high1 when not driven internally or externally. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-28 Freescale Semiconductor General-Purpose I/O (GPIO) 6.6.20 Port Interrupt Mask Register (PMASK) The GPIO has six ports, each with interrupt generation capability. The PMASK register provides interrupt masking capability at the port level while the Interrupt Mask Register provides control over individual interrupts. If a bit is zero, then all interrupts for that port are masked. A software reset on a port (SWR is set) will clear the corresponding mask bit of the port in this register. Figure 6-27 shows the register and Table 6-20 provides its field descriptions. 0x1001_5600 (PMASK) R Access: User R/W 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 PTF PTE PTD PTC PTB PTA 1 1 1 1 1 1 W Reset R W Reset 0 0 0 0 0 0 0 0 0 0 Figure 6-27. Port Interrupt Mask Register (PMASK) Table 6-20. Port Interrupt Mask Register Field Descriptions Field Description 31–6 Reserved. These bits are reserved and should read 0. 5 PTF Port F. The bit helps in masking the Port F interrupt. The bit clears during software reset of Port F. 0 Interrupt is masked. 1 Interrupt is not masked. 4 PTE Port E. The bit helps in masking the Port E interrupt. The bit clears during software reset of Port E. 0 Interrupt is masked. 1 Interrupt is not masked. 3 PTD Port D. The bit helps in masking the Port D interrupt. The bit clears during software reset of Port D. 0 Interrupt is masked. 1 Interrupt is not masked. 2 PTC Port C. The bit helps in masking the Port C interrupt. The bit clears during software reset of Port C. 0 Interrupt is masked. 1 Interrupt is not masked. 1 PTB Port B. The bit helps in masking the Port B interrupt. The bit clears during software reset of Port B. 0 Interrupt is masked. 1 Interrupt is not masked. 0 PTA Port A. The bit helps in masking the Port A interrupt. The bit clears during software reset of Port A. 0 Interrupt is masked. 1 Interrupt is not masked. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 6-29 General-Purpose I/O (GPIO) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 6-30 Freescale Semiconductor Chapter 7 JTAG Controller (JTAGC) 7.1 Introduction The JTAG Controller (JTAGC) module supports Debug access to ARM926 core and tri-state enabling of the I/O pads. The JTAGC is compatible with 1EEE 1149.1 Standard Test Access Port and Boundary Scan Architecture. 7.2 Features The Test and debug features of JTAG provide the following capabilities: • Provide debug access to ARM926 core and execute its specific JTAG instructions independently • Controls tri-state enable of I/O pads 7.3 Implementation The JTAG Controller consists of the JTAG Controller state machine, Instruction Register (IR), Bypass Register, Boundary Scan Register, Instruction decode, and various user specific data registers collectively reside inside the ExtraDebug register. The TDO output from the JTAG Controller is the muxed output based on whether i.MX27 JTAG Controller or ARM926 Platform JTAG mode is active. It changes on falling edge of TCK. The TDO output enable is selected based on whether i.MX27 JTAG Controller or ARM926 Platform JTAG mode is active. TCK TRST_N TMS Reset TAP_STATE RTI DR IR Capture Shift IR EIR Update RTI TDI TDO TDO_EN Figure 7-1. JTAG Signals Timing Diagram The Test Mode Select (TMS) input from external pin by default connects to the ARM926 Platform after gating with the laser fuse output. At the rising edge of TRST_B, the JTAG_control input controls whether the TMS pin should be connected to ARM926 Platform or to i.MX27 JTAG Controller. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 7-1 JTAG Controller (JTAGC) When JTAG_control input is HIGH (by default), the TMS pin will be connected to ARM926 Platform after gating with the laser fuse output. The TMS input of i.MX27 JTAG Controller will be held HIGH in this case. When JTAG_control input is LOW, the TMS pin will be connected to i.MX27 JTAG Controller. The TMS input of ARM926 Platform will be held HIGH. • The Test Reset (TRST_B) input from external pin will be connected to both ARM926 Platform and i.MX27 JTAG Controller. • The Test Data Input (TDI) input from external pin will be connected to both ARM926 Platform and i.MX27 JTAG Controller. • The Test Clock (TCK) input from external pin will be connected to both ARM926 Platform and i.MX27 JTAG Controller. 7.4 JTAG Controller Pin List Table 7-1 provides a list of the JTAGC pins. Table 7-1. JTAGC Pin List Pin Name Direction Description tdo Output tck Input Test Clock Test Clock input is used to synchronize the Test Logic. This includes an internal pull-up resistor. tdi Input Test Data Input TDI is captured during rising edge of TCK. TDI includes an internal pull-up resistor. tms Input Test Mode Select TMS is captured during rising edge of TCK. TMS includes an internal pull-up resistor. TMS input for the ARM926 Platform and JTAG Controller is gated by the system logic. trst_b Input Test Reset TRST_B includes an internal pull-up resistor Test Data Output TDO is asserted during rising edge of TCK MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 7-2 Freescale Semiconductor JTAG Controller (JTAGC) 7.5 JTAG Overview Figure 7-2 shows the i.MX27 JTAG block diagram. ARM926EJS + ICE TCK ARM JTAG CNTLR TRST_B TDI JTAG_tms JTAG_tdo i.MX27 JTAG Controller TMS TDO Figure 7-2. i.MX27 JTAG Block Diagram 7.6 JTAG Modes Two JTAG modes are created based on the I/O pin JTAG_control. These modes are used to maintain compatibility to ARM MCU Multi-ICETM products as well as maintain IEEE JTAG standards. 7.6.1 ARM926 Platform mode This mode connects the processed TMS input to the ARM926 Platform. TRST_B must be asserted to exit this mode. 7.6.2 i.MX27 JTAG Controller mode This mode will connect the processed TMS input to the i.MX27 JTAG Controller. This will provide a dedicated user-accessible test access port that uses the same communication style as the IEEE1149.1 Standard. TRST_B or POR_B must be asserted to leave this mode. In this mode, i.MX27 JTAG Controller supports the following capabilities: • Query identification information (manufacturer, part number and version) of i.MX27 (IDCODE) • Tri-state I/O pads for iddq test (HIGHZ) • BYPASS instruction 7.7 Boundary Scan Register The boundary scan register (BSR) in the i.MX27 JTAG implementation contains bits for all device signals and clock pins and associated control signals. All i.MX27 bidirectional pins have a single register bit in MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 7-3 JTAG Controller (JTAGC) the boundary scan register for pin data, and are controlled by an associated control bit in the boundary scan register. 7.8 Instruction Register The JTAG Instruction register is 3 bits wide. The settings of the IR is shown in Table 7-2. Table 7-2. JTAG Instruction Register Bit2 Bit1 Bit0 Instruction 0 0 0 IDCODE 0 0 1 SAMPLE/PRELOAD 0 1 0 EXTEST 0 1 1 ENABLE_ExtraDebug 1 0 0 HIGHZ 1 0 1 ACCESS_GENERIC_MBIST 1 1 0 CLAMP 1 1 1 BYPASS The instruction register is reset to 3’b000 which is equivalent to the IDCODE instruction. During the capture-IR state, the parallel inputs to the instruction register are loaded with the code 01 in the least significant bits as required by the IEEE standard, the most significant bits are loaded with the values 0, leading to a capture value of 3’b001. 7.8.1 EXTEST Instruction The EXTEST instruction selects the boundary scan register, and the 1149.1 test logic has control of the I/O pins. EXTEST also asserts internal reset for the Core to force a predictable internal state while performing external boundary scan operations. By using the TAP Controller, the register is capable of: • Scanning user-defined values into the output buffers • Capturing values presented to input pins controlling the direction of bidirectional pins • Controlling the output drive of tri-statable output pins For more details on the function and use of EXTEST, refer to the IEEE 1149.1 document. 7.8.2 SAMPLE/PRELOAD Instruction This selects the boundary scan register and the system logic controls the I/O pins. The SAMPLE/PRELOAD instruction provides two separate functions. First, it provides a means to obtain a snapshot of system data and control signals. The snapshot occurs on the rising edge of TCK in the capture-DR Controller state. The data can be observed by shifting it transparently through the boundary scan register. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 7-4 Freescale Semiconductor JTAG Controller (JTAGC) NOTE Since there is no internal synchronization between the JTAG clock (TCK) and the system clock (CLK), the user must provide some form of external synchronization to achieve meaningful results. The second function of SAMPLE/PRELOAD is to initialize the boundary scan register output cells prior to selection of EXTEST. This initialization ensures that known data will appear on the outputs when entering the EXTEST instruction. 7.8.3 IDCODE Instruction This selects the ID register and the system logic controls the I/O pins. This instruction is a public instruction to allow the manufacturer, part number and the version of the IC to be available through TAP. Figure 7-3 shows the ID register configuration. 0x0000_7000 (IDCODE) 31 R 30 29 Access: User R/W 28 27 Version Information 26 25 24 23 22 21 Design Center Part Number 20 19 18 17 16 Device Number [21:12] W Reset R 0 0 0 0 1 0 0 0 0 1 0 0 0 0 0 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Device Number [21:12] MFG 1 W Reset 0 0 0 0 1 0 1 1 0 0 0 1 1 1 0 1 Figure 7-3. ID Register Configuration 7.8.4 ENABLE_ExtraDebug Instruction The ExtraDebug register consists of 44 bits comprising a 40-bits register (maximum), a 3-bit address field and one read/write bit. The register data field does not need to be filled in during register read. The particular ExtraDebug register connected between TDI and TDO is selected by the ExtraDebug Controller based on the currently decoded address during Update_DR state. All communication with the ExtraDebug Controller is done through the Select-DR-Scan path of the i.MX27 JTAG Controller. 7.8.5 HIGHZ Instruction All output drivers, including the two-state drivers, are turned off (that is, high impedance). The instruction selects the bypass register. The HIGHZ instruction also asserts internal reset for the Core to force a predictable internal state while performing external boundary scan operations. In this mode, all internal pull-up resistors on all the pins (except for the TMS TDI TCK TRST COLD_START MUXCTL pins) will be disabled. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 7-5 JTAG Controller (JTAGC) 7.8.6 CLAMP Instruction Selects the 1-bit bypass register as the serial path between TDI and TDO while allowing signals driven from the component pins to be determined from the boundary scan register. During testing of ICs on PCB, it may be necessary to place static guarding values on signals that control operation of logic not involved in the test. The EXTEST instruction could be used for this purpose, but since it selects the boundary-scan register the required guarding signals would be loaded as part of the complete serial data stream shifted in, both at the start of the test and each time a new test pattern is entered. Since the CLAMP instruction allows guarding values to be applied using the boundary-scan register of the appropriate ICs while selecting their bypass registers, it allows much faster testing than does the EXTEST instruction. Data in the boundary scan cell remains unchanged until a new instruction is shifted in or the JTAG state machine is set to its reset state. The CLAMP instruction also asserts internal reset for the Core to force a predictable internal state while performing external boundary scan operations. 7.8.7 BYPASS Instruction Selects the single bit Bypass register and the system logic controls the I/O pins. This creates a shift register path from TDI to the bypass register and finally to TDO. When the bypass register is selected by the current instruction, the shift-register stage is set to a logic zero on the rising edge of TCK in the capture-DR controller state. The first bit to be shifted out after selecting the bypass register will always be a logic zero. 7.9 TMS Sequences 7.9.1 TMS Sequence to Check ID Code Table 7-1 shows the TMS sequence to check the ID Code value, starting from any point in the state machine. Table 7-1. TMS Sequence To Check ID Code Step TCK TMS State Comment 0 x5 1 Test Logic Reset 1 x1 0 Run-Test/Idle — 2 x1 1 Select DR — 3 x1 1 Select IR 4 x1 0 Capture IR 5 x1 0 Shift IR 6 x2 0 Shift — 7 x1 1 Exit1 — 8 x1 1 Update 9 x1 0 Run-Test/Idle SEQUENCE IS : IDCODE READ IR Path : Loading ’Idcode’ instr. — Shift ’Idcode’ inst.= 3'b010 thru TDI Select Idcode register — MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 7-6 Freescale Semiconductor JTAG Controller (JTAGC) Table 7-1. TMS Sequence To Check ID Code (continued) Step TCK TMS 10 x1 1 Select DR DR Path: 11 x1 0 Capture DR Capture Idcode value 12 x1 0 Shift DR Shift out Idcode on 32bits 13 x31 0 Shift — 14 x1 1 Exit1 — 15 x1 1 Update — 16 x1 0 Run-Test/Idle — 7.9.2 State Comment Reading Idcode reg. TMS Sequence to Write to ExtraDebug Register Table 7-2 shows the TMS sequence to Write to any of the ExtraDebug registers, starting from any point in the state machine. Table 7-2. TMS Sequence to Write to ExtraDebug Register Step TCK TMS State Comment 0 x5 1 Test Logic Reset 1 x1 0 Run-Test/Idle — 2 x1 1 Select DR — 3 x1 1 Select IR 4 x1 0 Capture IR 5 x1 0 Shift IR 6 x2 0 Shift — 7 x1 1 Exit1 — 8 x1 1 Update 9 x1 0 Run-Test/Idle 10 x1 1 Select DR 11 x1 0 Capture DR 12 x1 0 Shift DR 13 x43 0 Shift — 14 x1 1 Exit1 — 15 x1 1 Update 16 x1 0 Run-Test/Idle SEQUENCE IS : WRITE ExtraDebug Register IR Path : Select ExtraDebug register. — Shift ‘Enable ExtraDebug’ inst.= 3'b011 thru TDI Select ExtraDebug register — DR Path: Select Extradebug register to write data — Shift In Writ bit(1’b0) + Register Address + Data Write to the ExtraDebug register — MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 7-7 JTAG Controller (JTAGC) 7.9.3 TMS Sequence to Read ExtraDebug Register Table 7-3 shows the TMS sequence to READ any of the ExtraDebug registers, starting from any any point in the state machine. Table 7-3. TMS Sequence to Read ExtraDebug Register 7.10 Step TCK TMS State Comment 0 x5 1 Test Logic Reset 1 x1 0 Run-Test/Idle — 2 x1 1 Select DR — 3 x1 1 Select IR 4 x1 0 Capture IR 5 x1 0 Shift IR 6 x2 0 Shift — 7 x1 1 Exit1 — 8 x1 1 Update 9 x1 0 Run-Test/Idle 10 x1 1 Select DR 11 x1 0 Capture DR 12 x1 0 Shift DR 13 x3 0 Shift — 14 x1 1 Exit1 — 15 x1 1 Update 16 x1 0 Run-Test/Idle 17 x1 1 Select DR 2nd DR Path: ExtraDebug Read access 18 x1 0 Capture DR Read the ExtraDebug register 19 x1 0 Shift DR Shift out the captured value 20 x39 0 Shift — 21 x1 1 Exit1 — 22 x1 1 Update — 23 x1 0 Run-Test/Idle — SEQUENCE IS : READ ExtraDebug Register IR Path : Select ExtraDebug register. — Shift ’Enable ExtraDebug’ inst.= 3'b011 thru TDI Select ExtraDebug register — DR Path: Select Extradebug register to Read — Shift In Read bit(1’b1) + Register Address Decode the 4 bits shifted in — i.MX27 JTAG Restrictions TRST_b must be externally asserted to force the selection of ARM926 Platform TAP or i.MX27 JTAG Controller. During POR_B assertion, ARM926 Platform TAP is selected. If TMS either remains unconnected or connected to VDD, then the TAP controller cannot leave the Test-Logic-Reset state regardless of TCK. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 7-8 Freescale Semiconductor Chapter 8 Bootstrap Mode Operation 8.1 Introduction The bootstrap program is a small program that resides in the internal ROM of the i.MX27 processor. It is activated when the BOOT[3:0] selection pins are set to 4’b0000 or if there is any exception during the HAB checking during boot-up. The bootstrap operation handles the commands from either USB or UART1 to establish a channel to interface the i.MX27 processor’s hardware and the external machine such as PC. It provides the following functions. 1. For HAB Enable-type silicon, it downloads authenticated binary image code to memory so as to execute in run time or perform Flash update. 2. For HAB Disable-type silicon, it downloads binary image code to memory as to execute in run time or perform Flash update. For HAB Enable-type silicon, a shell provides essential information such as the signatures, optimized commands, and the authenticated binary image to the iROM to validate before the core to execute. 8.2 UART/USB Configuration The configuration for RS 232 is using baud rate 115200, 8 Data bits, No Parity, 1 Stop bits, and No Flow Control. The Configuration for USB is for Control Endpoint 0 with Max Packet Size equal 8 byte. Bulk IN at Endpoint 2 with Max Packet Size equal 64 bytes, Bulk OUT at Endpoint 1 with Max Packet Size equal 64 bytes. NOTE Current ROM code only supports Full Speed transmission over Full Speed transceiver(ISP1301 and Atlas) and High Speed USB transceiver (ISP 1504 or the like). The ROM code does not support high-speed transmission over high-speed USB transceiver (ISP 1504 or the like). 8.3 Enter Bootstrap Mode Configuration The i.MX27 processor enters bootstrap mode under the following conditions: 1. BOOT[3:0] is selected bootstrap mode or 2. For HAB Enabled type of silicon: HAB authentication fails when booting from Flash (for example NAND Flash, NOR Flash) Refer to Chapter 4, “System Control,” for the details of bootstrap mode configuration and operation. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 8-1 Bootstrap Mode Operation 8.4 Bootstrap Flow The overall flow of the bootstrap program is shown in Figure 8-1. Call USB/UART bootloader to download RAM Application. CSF Address Execute Address Hardware Configuration Address Valid Execute Address? YES YE HAB Enabled? NO YES YE Hardware Configuration Vector Hardware Configuration CSF Data for downloaded code HAB Process CSF Execute Address HAB Assert Verification Return Status NO Return status = HAB PASSED? HAB SU Type = Engg? NO YES YE YES YE Jump to Application code Figure 8-1. Flow Diagram for Bootstrap Mode MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 8-2 Freescale Semiconductor Bootstrap Mode Operation 8.4.1 Bootstrap Protocol and Definition In this section, bootstrap protocol and the command, response definition is defined. For the i.MX27 processor’s boot-up sequence, refer to System Boot. For the CSF, HW Configuration, Image definition, refer to the High Assurance Boot (HAB). 8.4.1.1 Synchronization Operation When bootstrap is firstly entered, the status of the iROM can be obtained by issuing the command shown in Figure 8-2. PC to i.MX27: SYNCH COMMAND i.MX27 to PC: RESPONSE A Figure 8-2. iROM Status Command The SYNC COMMAND consists of 16 bytes using the format shown in Table 8-1. : Table 8-1. Synch Command Response Definition Header (2 bytes) Address (4 bytes) Format (1 byte) Bytecount (4 bytes) Data (4 bytes) End (1 byte) 0505 00000000 00 00000000 00000000 00 RESPONSE A is 4 bytes long using the format shown in Table 8-2. Table 8-2. Response A Definition 8.4.1.2 Byte 0 Byte 1 Byte 2 Byte 3 STATUS CODE STATUS CODE STATUS CODE STATUS CODe Write Register Operation To write to a register through bootstrap, requires a specific protocol. After the command is sent from PC to MX27 processor, two responses are returned from MX27. One is used to indicate the type of silicon (either HAB enable or disable), the other is used to indicate whether the write operation is successful. PC to i.MX27: i.MX27 to PC: WRITE COMMAND RESPONSE B RESPONSE C Figure 8-3. Write Register Command MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 8-3 Bootstrap Mode Operation WRITE COMMAND is 16 bytes long using the format shown in Table 8-3. Table 8-3. Write Register Command Definition Header (2 bytes) Address (4 bytes) Format (1 byte) Bytecount (4 bytes) Data (4 bytes) End (1 byte) 0202 Address to be written Format to be written (08: byte access 10: halfword access 20: word access) 00 Data to be written to the register 00 RESPONSE B indicates type of silicon. It is composed of 8 bytes using the format shown in Table 8-4. Table 8-4. Response B Definition Byte 0 Byte 1 Byte 2 Byte 3 HAB Disable/ Development 56 78 78 56 HAB Enable 12 34 34 12 RESPONSE C indicates the success of a write operation as shown in Table 8-5. Table 8-5. Response C Definition Byte 0 Byte 1 Byte 2 Byte 3 12 8A 8A 12 Remarks: For HAB enabled silicon, users can only write the following range of registers: 1. System Control registers (address: 0x10027800-0x10027870) 2. Phase-Locked Loop, Clock and Reset Controller registers (address: 0x10027000–0x10027034) 3. NFC registers (address: 0xD8000000–0xD8000FFF) 4. SDRAMC registers (address: 0xD8001000–0xD8001FFF) 5. WEIM registers (address: 0xD8002000–0xD8002FFF) 6. Memory area of CS0, CS1, CS2, CS3, CS4, CS5, CSD0, and CSD1 (address: 0xA0000000–0xD7FFFFFF) 8.4.1.3 Download Operation Memory is initialized before downloading a binary file to it. The following command can be used: PC to i.MX27: i.MX27 to PC: DOWNLOAD COMMAND BINARY DATA RESPONSE B Figure 8-4. Download Command MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 8-4 Freescale Semiconductor Bootstrap Mode Operation The DOWNLOAD COMMAND is 16 bytes long using the formats shown in Table 8-6. Table 8-6. Download Command Definition Header (2 bytes) Address (4 Bytes) Format (1 byte) CSF 0404 Start address where the binary data is to be downloaded 00 HWC 0404 Start address where the binary data is to be downloaded Image file 0404 Image file 0404 Bytecount (4 bytes) Data (4 bytes) End (1 byte) Number of byte to be written in Hex Start address in memory where data is to be written CC 00 Number of byte to be written in Hex Start address in memory where data is to be written EE Start address where the binary data is to be downloaded 00 Number of byte to be written in Hex (max 0x1F0000) Start address in memory where data is to be written 00 Start address where the binary data is to be downloaded 00 Number of byte to be written in Hex Start address in memory where data is to be written AA RESPONSE B indicates the type of silicon. It is 8 bytes long using the format shown in Table 8-7. Table 8-7. Response B Silicon Type Definition BYTE 0 BYTE 1 BYTE 2 BYTE 3 HAB Disable/ Development 56 78 78 56 HAB Enable 12 34 34 12 After the RESPONSE B is received by the MX27 processor, the attached PC can start to download the binary data to MX27 until all the BYTECOUNT is downloaded. Each time the Image File is downloaded through HEADER (0404), the maximum data to be download is 0x1F0000. Thus, if the Image File size is greater then 0x1F0000, it will send the command repeatedly with END (0x00). After all the data is downloaded, PC must send a DOWNLOAD command with END (AA) to the target execution address. 8.4.1.4 Bootstrap End Indication Operation After all the bootstrap operations are completed, the i.MX27 processor will send RESPONSE D to PC after the Application Pointer was sent to indicate bootstrap was completed. After RESPONSE D, it will enter iROM to perform the authentication check for HAB enable silicon or to execute the image for HAB disable/development silicon. i.MX27 to PC: RESPONSE D Figure 8-5. Bootstrap End Indication Operation Diagram MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 8-5 Bootstrap Mode Operation RESPONSE D is indicates the success of the write operation as shown in Table 8-8. Table 8-8. Bootstrap End Indication Operation Diagram BYTE 0 BYTE 1 BYTE 2 BYTE 3 88 88 88 88 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 8-6 Freescale Semiconductor Book II: Applications Processors’ Core and Peripherals Introduction Book II comprises detailed information on the applications processors’ core and peripherals. Book II includes the following chapters. Book II, Part 1: ARM9 Core and Interrupts Chapter 9, “ARM9 Platform,” on page 9-1 Chapter 10, “ARM926EJ-S Interrupt Controller (AITC),” on page 10-1 Book II, Part 2: Security Chapter 11, “Security Controller (SCC),” on page 11-1 Chapter 12, “Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2),” on page 12-1 Chapter 13, “Run-Time Integrity Checker (RTIC),” on page 13-1 Chapter 14, “IC Identification (IIM),” on page 14-1 Book II, Part 3: External Interfaces Chapter 15, “External Memory Interface (EMI),” on page 15-1 Chapter 16, “Multi-Master Memory Interface (M3IF),on page 16-1 Chapter 17, “Wireless External Interface Module (WEIM),” on page 17-1 Chapter 18, “Enhanced SDRAM Controller (ESDRAMC),” on page 18-1 Chapter 19, “NAND Flash Controller (NFC),” on page 19-1 Chapter 20, “Personal Computer Memory Card International Association (PCMCIA) Controller,” on page 20-1 Book II, Part 4: Connectivity Peripherals Chapter 21, “1-Wire Interface (1-Wire),” on page 21-1 Chapter 22, “Advanced Technology Attachment (ATA)”, on page 22-1 Chapter 23, “Configurable Serial Peripheral Interface (CSPI),” on page 23-1 Chapter 24, “Inter-Integrated Circuit (I2C),” on page 24-1 Chapter 25, “Keypad Port (KPP),” on page 25-1 Chapter 26, “Memory Stick Host Controller (MSHC),” on page 26-1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor II-1 Chapter 27, “Secured Digital Host Controller (SDHC),” on page 27-1 Chapter 28, “Universal Asynchronous Receiver/Transmitters (UART),” on page 28-1 Chapter 29, “Fast Ethernet Controller (FEC),” on page 29-1 Chapter 30, “High-Speed USB On-The-Go (HS USB-OTG),” on page 30-1 Book II, Part 5: Timer Peripherals Chapter 31, “General Purpose Timer (GPT),” on page 31-1 Chapter 32, “Pulse-Width Modulator (PWM),” on page 32-1 Chapter 33, “Real Time Clock (RTC),” on page 33-1 Chapter 34, “Watchdog Timer (WDOG),” on page 34-1 Book II, Part 6: System Control Peripherals Chapter 35, “AHB-Lite IP Interface (AIPI) Module,” on page 35-1 Chapter 36, “Multi-Layer AHB Crossbar Switch (MAX),” on page 36-1 Chapter 37, “Direct Memory Access Controller (DMAC),” on page 37-1 Book II, Part 7: Multimedia Peripherals Chapter 38, “Digital Audio MUX (AUDMUX),” on page 38-1 Chapter 39, “CMOS Sensor Interface (CSI),” on page 39-1 Chapter 40, “Video Codec (Video_Codec),” on page 40-1 Chapter 41, “enhanced Multimedia Accelerator Light (eMMA_lt),” on page 41-1 Chapter 42, “Synchronous Serial Interface (SSI),” on page 42-1 Chapter 43, “Liquid Crystal Display Controller (LCDC),” on page 43-1 Chapter 44, “Smart Liquid Crystal Display Controller (SLCDC),” on page 44-1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 II-2 Freescale Semiconductor Book II, Part 1: ARM9 Core and Interrupts Introduction This part provides an overview of the modules that make up the ARM9 core and interrupts. Chapter 9, “ARM9 Platform,” on page 9-1 Chapter 10, “ARM926EJ-S Interrupt Controller (AITC),” on page 10-1 ARM9 Platform The ARM9 Platform consists of the ARM926EJ-S processor, ETM9, ETB9, a 6 x 3 Multi-Layer AHB crossbar switch (MAX), and a “primary AHB” complex. The instruction bus of the ARM926EJ-S processor (I-AHB) is connected directly to MAX Master Port 0. The data bus of the ARM926EJ-S processor (D-AHB) is connected directly to MAX Master Port 1. All four alternate bus master interfaces are connected to MAX Master Ports 2-5. The three slave ports of the MAX are AHB-Lite compliant buses. Slave Port 0 is designated as the “primary” AHB. The primary AHB is internal to the platform and has six slaves connected to it: the AITC interrupt module, the MCTL memory controller, two AIPI peripheral interface gaskets, and a ROMPATCH module. Slave ports 1 and 2 of the MAX are referred to as “secondary” AHBs. Each of the secondary AHB interfaces is only accessible off platform. ARM936EJ-S Interrupt Controller (AITC) The ARM926EJ-S Interrupt Controller (AITC) is a 32-bit peripheral which collects interrupt requests from up to 64 sources and provides an interface to the ARM926EJ-S core. The AITC includes software controlled priority levels for normal interrupts. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor II.1-1 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 II.1-2 Freescale Semiconductor Chapter 9 ARM9 Platform 9.1 Introduction The ARM9 Platform consists of the ARM926EJ-S processor, ETM9, ETB9, a 6 x 3 Multi-Layer AHB crossbar switch (MAX), and a “primary AHB” complex. The instruction bus of the ARM926EJ-S processor (I-AHB) is connected directly to MAX Master Port 0. The data bus of the ARM926EJ-S processor (D-AHB) is connected directly to MAX Master Port 1. All four alternate bus master interfaces are connected to MAX Master Ports 2–5. The three slave ports of the MAX are AHB-Lite compliant buses. Slave Port 0 is designated as the “primary” AHB. The primary AHB is internal to the platform and has six slaves connected to it: the AITC interrupt module, the MCTL memory controller, two AIPI peripheral interface gaskets, and a ROMPATCH module. Slave ports 1 and 2 of the MAX are referred to as “secondary” AHBs. Each of the secondary AHB interfaces is only accessible off platform. The four alternate bus master ports on the ARM9 Platform, which are connected directly to master ports of the Multi-Layer Crossbar Switch (MAX), are designed to support connections to multiple AHB masters external to the platform. An external arbitration and AHB control module is needed if multiple external masters are desired to share an ARM9 Platform alternate bus master port. However, the alternate bus master ports on the platform support seamless connection to a single master with no external interface logic required. A PAHBMUX module (primary AHBMUX) performs address decoding, read data muxing, bus watchdog, and other miscellaneous functions for the primary AHB within the platform. A clock control module (CLKCTL) is provided to support a power conscious design methodology as well as implementation of several clock synchronization circuits. The JAM (Just Another Module) implements the platform’s general purpose registers and also contains miscellaneous platform logic. A block diagram of the ARM9 Platform can be seen in Figure 9-1. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-1 ARM9 Platform External RAM/ROM Interrupts RT Debug Two IP-bus Peripheral Ports JTAG ARM926 PLATFORM AITC CLKCTL MCTL AIPI1 AIPI2 JTAG SYNC Primary AHB ETM9 IP Bus ETB IP Bus ETM PAHBMUX JAM ARM926EJ-S IP Bus D-AHB ROMPATCH I-AHB 6x3 MAX I-AHB Patch M0 S0 D-AHB Patch M1 S1 M2 S2 M3 M4 M5 Four AHB-Lite Alternate Bus Master Ports (ABM) CCM Clock Control “Bus Request” Two AHB-Lite “Secondary” Slave Ports Figure 9-1. ARM9 Platform Block Diagram 9.1.1 Design Methodology Summary Other than the CPU and ETB memories, this platform is a fully synthesizable, mux-D, rising edge clock based design. DFT goals are for 95% fault coverage and the design includes BIST engines for all memories implemented on the ARM926EJ-S, the ETB module and RAM or ROM controlled by the MCTL module. The platform will be designed with a DFT friendly scan wrapper to allow for deeply embedded integrations. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-2 Freescale Semiconductor ARM9 Platform 9.1.2 Performance Characteristics The ARM9 Platform will support two main clocks—clk and hclk. clk will be connected to the ARM926EJ-S processor, ETM9, ETB and the Clock Control Module only. The remainder of the platform will be connected to hclk. The I-AHB and D-AHB from the ARM926EJ-S BIU module will run at the hclk frequency and will be controlled by a single hclken input—that is, the two buses cannot be decoupled. Refer to Section 9.6, “Platform Clocking” for more information on ARM926EJ-S clock control. 9.1.2.1 Performance Target The ARM9 Platform team has committed to making an operating frequency of 266MHz characterized at the 1.1V, 105C WCS 3 sigma cmos90lp standard Vt library and 400MHz characterized at the 1.45V, 105C WCS 3 sigma cmos90lp standard Vt library. This is the level of performance required to meet functional requirements. Due to the increased leakage of the cmos90lp library, well back-biasing will be employed along with other standard low power clocking methodologies. 9.2 ARM9 Platform Sub-Modules The sub-modules of the platform are listed below along with short functional descriptions. 9.2.1 ARM926EJ-S Processor The ARM926EJ-S (ARM926) is a member of the ARM9 family of general-purpose microprocessors targeted at multi-tasking applications. The ARM926 supports the 32-bit ARM and 16-bit THUMB instructions sets. The ARM926 includes features for efficient execution of Java byte codes. A JTAG port is provided to support the ARM Debug Architecture, along with associated signals to support the ETM9 real-time trace module. The ARM926EJ-S is a Harvard cached architecture including an ARM9EJ-S integer core, a Memory Management Unit (MMU), separate instruction and data AMBA AHB interfaces, separate instruction and data caches, and separate instruction and data tightly coupled memory (TCM) interfaces. The ARM926 co-processor, instruction TCM, and data TCM interfaces will be tied off within the ARM9 Platform and will not be available for external connection. The ARM926EJ-S processor is a fully synthesizable macrocell with a configurable memory system. Both instruction and data caches will be 16 Kbytes on the platform. The cache is virtually accessed and virtually tagged. The data cached has physical tags as well. The MMU provides virtual memory facilities which are required to support various platform operating systems such as Symbian OS, Windows CE, and Linux. The MMU contains eight fully associative TLB entries for lockdown and 64 set associative entries. Refer to the ARM926EJ-S Technical Reference Manual for more information. 9.2.1.1 ARM926EJ-S Co-Processor Interface The co-processor interface will not exit the ARM9 platform and will be tied off internally and synthesized away to improve routing congestion and timing. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-3 ARM9 Platform 9.2.1.2 TCM Interfaces Both instruction and data tightly-coupled memory (TCM) interfaces will not exit the ARM9 platform and will be tied off internally and synthesized away to improve routing congestion and timing. 9.2.2 ARM9 Embedded Trace Macrocell and Embedded Trace Buffer The ARM9 platform will include an ARM9 Embedded Trace Macrocell (ETM9) and Embedded Trace Buffer (ETB) supporting real-time instruction and data tracing. The ETM9/ETB external interface may run at the ARM926EJ-S clock frequency or at half the ARM926EJ-S clock frequency. The Embedded Trace Buffer is sized at 2048x 32 and can be used as general scratch pad memory when not being used for real-time tracing. This scratch pad memory is accessible via AIPI2 slots 27 and 28. The ETB registers can be accessed via AIPI2 slot 29. Refer to the ETM9 and ETB technical reference manuals for more information. 9.2.3 The 6 x 3 Multi-Layer AHB Crossbar Switch (MAX) The ARM926EJ-S processor’s instruction and data buses and all alternate bus master interfaces arbitrate for resources via a 6 X 3 Multi-Layer AHB Crossbar Switch (MAX). There are six (M0–M5) fully functional master ports and three (S0–S2) fully functional slave ports. The MAX is uni-directional. All master and slave ports are AHB-Lite compliant. See Section 9.9.1, “Definition of AHB-Lite,” for an explanation of AHB-Lite. The design of the crossbar switch allows for concurrent transactions to proceed from any master port to any slave port. That is, it is possible for all three slave ports to be active at the same time as a result of three independent master requests. If a particular slave port is simultaneously requested by more than one master port, arbitration logic exists inside the crossbar to allow the higher priority master port to be granted the bus, while stalling the other requestor(s) until that transaction has completed. The slave port arbitration schemes supported are fixed, programmable fixed, programmable default input port parking, and a round robin arbitration scheme. The Crossbar Switch also monitors the ccm_br input (clock control module bus request) which request a bus grant from all four slave ports. The priority of ccm_br is programmable and defaults to the highest. Upon receiving bus grants for all four output ports, the ccm_bg output will assert. At this point, the clock control module can turn off hclk and be assured there are no outstanding AHB transactions in progress. Once the CCM is granted a port, no other master will receive a grant on that port until the CCM bus request (ccm_br) negates. Brief descriptions below provide more detail on the MAX. For complete functionality, refer to the ARM9 Platform “Multi-Layer AHB Crossbar Switch” Module (MAX) specification. 9.2.3.1 MAX Configuration Registers The Crossbar Switch has configuration and control registers accessible via the IP Bus (slot 31 of AIPI2). Programmable registers exist to control arbitration schemes, bus parking, as well as other crossbar bus switch functionality. Alternate master priority registers exists within the MAX module for each slave MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-4 Freescale Semiconductor ARM9 Platform output port. The alternate priority register can be selected for use by the internal arbitration logic by driving the sx_ampr_sel (x=0-2) input high. A write-block sticky bit is implemented for those applications where it is desirable to prevent changes to the MAX registers after boot. Refer to the MAX module design specification for more details. 9.2.3.2 Master Ports Master Port 0 of the MAX is connected directly to the ARM926EJ-S I-AHB. Master Port 1 of the MAX is connected directly to the ARM926EJ-S D-AHB. The other four master ports exit the platform and will be connected to external alternate bus masters. Multiple external masters may be attached to a single alternate bus master port via use of an external arbiter. See Section 9.9.3, “Single Master Seamless Connection to ABM Port,” and Section 9.9.4, “Multiple External Masters Connection to ABM Port,” for more information on how to connect either a single master or multiple masters to a single alternate master port. Master Port priorities are determined by the MAX priority register bit settings. Refer to the MAX module design specification for more details. 9.2.3.3 Slave Ports Slave port 0 through 2 are identical AHB-Lite buses. Slave Port 0 is designated as the “Primary AHB” bus, and is internal to the platform. Slave port 1 and 2 are identical “Secondary AHB” buses and are available external to the platform. See Section 9.9.6, “MAX AHB Slave Ports,” for more details. 9.2.3.4 Debug Support In addition to the JTAG, ETM9 and ETB9 interfaces, several internal ARM926EJ-S signals, several internal primary AHB signals as well as some internal signals from Master Ports 0 and 1, have been brought out of the platform. These signals, along with alternate bus master and secondary AHB signals already available on the top-level of the platform, enable the user to gain insight into the operation of the processor and the MAX. Specifically, it is possible to monitor these signals and determine which master currently owns each slave port. In addition, it is possible to determine which slave each master is targeting for its next request. 9.2.4 ARM Interrupt Controller (AITC) The ARM9 platform’s interrupt controller is called the AITC and is connected to the primary AHB as a slave device. It will generate the normal and fast interrupts to the ARM926EJ-S processor. The AITC also supports hardware assisted vectoring. NOTE If hardware assisted vectoring is used, the vector space must be marked non-cacheable. Since the vector is dynamically “jammed” in by the AITC during a vector fetch, there would be no way to do this if cached. Refer to the AITC specification for more details. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-5 ARM9 Platform 9.2.5 Memory Controller and BIST Engine (MCTL) The MCTL module interfaces the primary AHB to RAM and ROM. BIST engines are provided for both RAM and ROM. 9.2.5.1 RAM The ram_connect input on the ARM9 Platform must be tied high if RAM exists on the MCTL RAM interface. The MCTL module supports a minimum of 1 Kbyte of RAM and a maximum of 1 Mbyte. Non power-of-two sizes between 1 Kbyte and 1 Mbyte are supported by strapping the ram_max_addr[9:0] inputs, which correspond to the primary AHB’s haddr[19:10]. The ram_wait input should be tied high at integration time if a wait state is required to make read data timing on RAM accesses (writes will still be zero wait state). The RAM interface will support single clock edge non late-write style compiled memories, and will implement an internal write buffer to mimic the late-write capability for improved performance. A configurable BIST engine is provided. Refer to the ARM9 Platform MCU Memory Controller specification for more detail on the RAM controller design. Refer to Table 9-4 for the RAM’s location within the platform’s memory map. 9.2.5.2 ROM The rom_connect input on the ARM9 Platform must be tied high if ROM exists on the MCTL ROM interface. The MCTL module supports a minimum of 1 Kbyte of ROM and a maximum of 4 Mbyte. Non power-of-two sizes between 1 Kbyte and 4 Mbyte are supported by strapping the rom_max_addr[11:0] inputs, which correspond to the primary AHB’s haddr[21:10]. The rom_wait input should be tied high at integration time if a wait state is required to make read data timing on ROM accesses. A configurable BIST engine is provided. 9.2.5.2.1 ROM Addressing The first 16 Kbytes of ROM will always be mapped starting at haddr[31:0]=32’h0000_0000. Any ROM larger than 16Kbyte will have the remainder of its space mapped starting at haddr[31:0]=32’h0040_4000. Any ROM size smaller than 16 Kbyte, will be aliased throughout the 16 Kbyte region. Accesses to the “hole” between these two regions will be terminated with an ERROR response by the MCTL. Refer to the ARM9 Platform MCU Memory Controller specification for more detail on the ROM controller design. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-6 Freescale Semiconductor ARM9 Platform 9.2.6 AHB IP Bus Interface (AIPI) There are two AHB IP Bus Interface (AIPI) modules that interface the primary AHB to two external IP Bus interfaces. The IP Bus interfaces and their peripherals will conform to the IP Bus Rev 2.0/3.0 specification. Each AIPI module supports up to 31 peripherals (the AIPI configuration registers consume the slot 0), however the ARM9 Platform will only support 48 external peripherals as shown in Table 9-1. Table 9-1. AIPI ARM9 Platform IP Bus Support AIPI # Module Slot(s) Use 1 0 1 1–31 2 0 2 1–17 Off platform IP Bus module support 2 18–26 Reserved 2 27 On platform ETB Register Interface 2 28 On platform ETB RAM Interface 2 29 On platform ETB RAM Interface 2 30 On platform JAM Interface 2 31 On platform MAX Interface AIPI1 Configuration Registers Off platform IP Bus module support AIPI2 Configuration Registers Refer to the ARM9 Platform AIPI specification for more details on the operation of the AIPI. 9.2.7 PAHBMUX–Primary AHB Mux The PAHBMUX module is responsible for address decoding for the primary AHB module selects. In addition, the PAHBMUX module will perform the primary AHB read data muxing, the primary AHB watchdog, and other miscellaneous functions. Refer to the ARM9 Platform AHBMUX design specification for more detail. 9.2.8 ROMPATCH The ROMPATCH will sit on the ARM926EJ-S I-AHB and D-AHB interfaces which are connected to MAX Master Ports 0 and 1. This location will allow for patching of both internal and external memory addresses on both ARM926EJ-S processor buses. The registers of the ROMPATCH will be programmed via the Primary AHB. The ROMPATCH can be used to patch source code or data tables. The ROMPATCH supports 32 patches. 9.2.8.1 External Boot An external boot feature exists in the ROMPATCH module which allows patching of the reset vector fetch (address = 32’h0000_0000) if the boot_int signal is negated. This mechanism will cause the ARM926EJ-S to, in effect, fetch the reset vector from the address indicated by the ext_boot_addr[31:2] inputs. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-7 ARM9 Platform Refer to the ARM9 Platform ROMPATCH design specification for more details. 9.2.9 Clock Control Module (CLKCTL) The CLKCTL module performs block level clock gating, ARM926EJ-S JTAG synchronization requirements, as well as other miscellaneous clock control for the platform. Refer to the ARM9 Platform CLKCTL design specification for more detail on design implementation. 9.2.10 JAM The JAM (“Just Another Module”) implements miscellaneous logic with the platform. Functionality within the JAM includes IP Bus #2 read data muxing, gating of the AHB debug signals in order to save power, and an IP Bus interface for accessing ARM9 Platform general purpose registers. The IP Bus interface on the JAM populates AIPI2, slot 30. The IP bus registers implemented in the JAM are shown in Table 9-2. Table 9-2. JAM IP Bus General Purpose Registers Primary haddr Register Name Type Implementation 32’h1003_E000 ARM9P_GPR0 Write/Read {30’h0, etb_reg_clken, ahb_dbg_en} 32’h1003_E010 ARM9P_GPR4 Read Only tapid[31:0] The registers may be aliased throughout the AIPI2 slot 30 location; however, the registers should only be accessed at the above listed addresses. Attempts to access the registers at aliased locations may result in an error response. Additionally, attempts to access the registers in user mode or in non-word sizes will result in an error response. Writes to the read only ARM9P_GPR4 register are ignored and will not cause an AHB transfer error. ARM9P_GPR0 bit [1], etb_reg_clken, is reset to zero on power-up and disables the clocks to the ETB for non debug purposes. When set to one, etb_reg_clken will enable clocks to the ETB such that the memory in the ETB can be used as general scratch-pad memory. ARM9P_GPR0 bit [0], ahb_dbg_en, is reset to zero on power-up and disables the AHB debug related signals from toggling in order to save power. When set to a one, ahb_dbg_en enables the following top-level platform AHB related signals to toggle for platform debug: • I-AHB: dbg_iahb_hready, dbg_iahb_htrans1, dbg_iahb_haddr[31:29] • D-AHB: dbg_dahb_hready, dbg_dahb_htrans1, dbg_dahb_haddr[31:29] • P-AHB: dbg_dahb_hready, dbg_dahb_htrans1, dbg_dahb_hmaster These signals, along with signals available on the alternate bus master and secondary AHB ports, can be used to gain insight into the functionality of the MAX. ARM9P_GPR4 is provided for software to determine the version of the platform. These bits correspond to the static state of the tapid[31:0] signals which include the tapid_ver[3:0] platform inputs. See Section 9.4, “JTAG ID Register,” for more details. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-8 Freescale Semiconductor ARM9 Platform 9.2.11 Test Wrapper The ARM9 Platform’s test architecture is composed primarily of two functions: scan and BIST. The test module (ARM926P_TEST) includes a test control unit which decodes primary test mode input signals and places the platform into various test modes including scan, ac path testing, BIST, and safe state. These test modes support the ability to test a deeply embedded platform. Refer to the ARM9 Platform DFT specification for more information. 9.3 ARM9 Platform Hierarchy The first two levels of the ARM9 Platform design hierarchy are shown in Figure 9-2. ARM9P PLATFORM ARM926P_CORE ARM926P_TEST ARM926P_DEBUG ARM926P_WRAPPER ETM9 ARM926P_TCU ARM926EJ-S ETB9 ARM926P_ROUTER CLKCTL MAX (CROSSBAR SWITCH) ARM926P_TSECURE ARM926P_TCLOCKS JAM PAHBMUX MCTL ROMPATCH AIPI1 JAM AIPI2 AITC Figure 9-2. ARM9 Platform Hierarchy MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-9 ARM9 Platform 9.4 JTAG ID Register The ARM926EJ-S processor has a 32-bit input bus which corresponds to the JTAG ID register. This 32-bit register is defined fields as shown in Table 9-3. ARM requires bits [31:12] be set in accordance with their general rules such that Multi-ICE can auto-detect the device type. Table 9-3. ARM926EJ-S JTAG ID Register Definition tapid[31:28] tapid[27:12] Version Part Number 4’b0 16’h7926 9.5 tapid[11:8] tapid[7:1] tapid[0] Manufacturing ID tapid_ver[3:0] 1’b1 7’b001_0000 1’b1 System Memory Map haddr[31:29] on the MAX master ports are decoded determine which slave port has been selected. Only three bits are used in order to keep output port decode time to a minimum. Table 9-4 shows a simplified breakdown of the eight 512 Mbyte regions decoded within the 4 Gbyte address space. Table 9-4. Upper Address Bit Decode haddr[31:29] Size Use 3’b000 512 Mbyte Primary AHB—AIPI1, AIPI2, AITC, MCTL (ROM), ROMPATCH 3’b001 512 Mbyte Reserved 3’b010 512 Mbyte Reserved 3’b011 512 Mbyte Reserved 3’b100 512 Mbyte Secondary AHB Slave Port 1 3’b101 1 Gbyte Secondary AHB Slave Port 2 512 Mbyte Primary AHB–MCTL (RAM) 3’b110 3’b111 9.5.1 ARM9 Platform Memory Map Table 9-5 shows the complete ARM9 Platform memory map. Table 9-5. ARM9 Platform Memory Map Address Range Size Use 0000_0000–0000_3FFF 16 Kbytes ROM: First 16 Kbytes (Primary AHB) 0000_4000–0040_3FFF 4 Mbytes Reserved 0040_4000–007F_FFFF 4 Mbytes–16 Kbytes 0080_0000–0FFF_FFFF 256 Mbytes–8 Mbytes 1000_0000–1000_0FFF 4 Kbytes AIPI1 Control Registers (Primary AHB) 1000_1000–1001_FFFF 124 Kbytes AIPI1 Peripheral Space (Primary AHB) ROM: Exceeding 16 Kbytes (Primary AHB) Reserved MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-10 Freescale Semiconductor ARM9 Platform Table 9-5. ARM9 Platform Memory Map (continued) 9.5.2 Address Range Size Use 1002_0000–1002_0FFF 4 Kbytes AIPI2 Control Registers (Primary AHB) 1002_1000–1003_1FFF 68 Kbytes AIPI2 Peripheral Space (Primary AHB) 1003_2000–1003_AFFF 36 Kbytes Reserved 1003_B000–1003_BFFF 4 Kbytes AIPI2—ETB Registers (Primary AHB) 1003_C000–1003_CFFF 4 Kbytes AIPI2—ETB RAM (Primary AHB) 1003_D000–1003_DFFF 4 Kbytes AIPI2—ETB RAM (Primary AHB) 1003_E000–1003_EFFF 4 Kbytes AIPI2—JAM (Primary AHB) 1003_F000–1003_FFFF 4 Kbytes AIPI2—MAX (Primary AHB) 1004_000–1004_0FFF 4 Kbytes AITC (Primary AHB) 1004_1000–1004_1FFF 4 Kbytes ROMPATCH (Primary AHB) 1004_2000–1FFF_FFFF 256 Mbytes–280 Kbytes Reserved 2000_0000–7FFF_FFFF 1.5 Gbytes Reserved 8000_0000–9FFF_FFFF 512 Mbytes Secondary AHB Slave Port 1 A000_0000–DFFF_FFFF 1 Gbyte Secondary AHB Slave Port 2 E000_0000–FFEF_FFFF 511 Mbytes FFF0_0000–FFFF_FFFF 1 Mbyte Reserved (Aliased RAM Space) RAM (Primary AHB) External Peripheral Space AIPI1 supports 31 external peripherals starting at 32’h1000_1000. AIPI2 has three slots used internal to the ARM9 Platform and supports 17 external peripherals from 1002_1000–1003_EFFF. NOTE Care should be taken when programming the PSR of AIPI2 since slot 31 (MAX), slot 30 (JAM), slot 29 (ETB Registers), slot 28 (ETB RAM) and slot 27 (ETB RAM) will always be occupied and slots 26:18 will always be unoccupied. 9.5.3 External Boot When the boot_int input signal is asserted, the ARM926EJ-S will boot internal from ROM on the Primary AHB. When boot_int is negated, the ARM926EJ-S reset vector fetch will essentially be routed to an address indicated by the ext_boot_addr[31:2] input pins. This vectoring is done by the ROMPATCH module, which monitors the I-AHB of the ARM926EJ-S and over-rides the reset vector fetch. Refer to the ROMPATCH design specification for more detail on the external boot mechanism. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-11 ARM9 Platform NOTE When boot_int is negated and the ARM926EJ-S boots externally the ARM9 Platform is placed in an insecure state. 9.5.4 • • • • 9.6 Memory Map Considerations Accesses to “Reserved” locations in Table 9-5 other than aliased RAM space will result in an AHB error response. Accesses to unsupported address locations through the MAX will result in an AHB error response and the access will not pass through the MAX. Accesses to address locations on the Primary AHB bus which do not map to a specific module will time-out in accordance with the bmon_timeout[2:0] inputs. Accesses to unimplemented locations within the AITC and ROMPATCH register space will be terminated without a bus-error. Writes will have no effect and reads will return all zeros. Platform Clocking This section will describe some of the clocking considerations within the ARM9 Platform. The circuits contained in the ARM9 Platform to address most of these issues will be implemented within the Clock Control Module (CLKCTL). However, there are some external clock control issues that will be discussed. Refer to the ARM9 Platform CLKCTL Module design specification for more detail. 9.6.1 ARM926EJ-S Clock Considerations The ARM926EJ-S processor design uses a single clock, clk. In many systems, it will be desirable for the ARM926EJ-S processor to run at a higher frequency than the AHB system bus (which runs on hclk). To support this, ARM926EJ-S requires a separate AHB clock enable for each of the two bus masters. dhclken is used to signify the rising edge of hclk for the system in which the data BIU is the bus master. ihclken is used to signify the rising edge of hclk for the system in which the instruction BIU is the bus master. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-12 Freescale Semiconductor ARM9 Platform Figure 9-3 shows the relationship between clk, hclk and dhclken/ihclken. The ARM9 Platform will provide a single hclken input pin that will be fed to both the dhclken and ihclken inputs on the ARM926EJ-S. If hclk and clk are the same frequency, the hclken input to the platform must be tied HIGH. (hclken) Figure 9-3. AHB Clock Relationship clk and hclk must be synchronous and the skew between clk and hclk to the ARM9 Platform should be minimized. This will require some synchronization inside the chip clock control module. An example of this is provided in Figure 9-4. In the example, clk and hclk are completely asynchronous and clk must be much faster to sample the slower clock, otherwise a different scheme will be needed. Also, if clk and hclk are synchronous to each other by design, then a synchronizer may not be needed, but care must still be taken in aligning the rising edges of both clocks to the ARM9 Platform. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-13 ARM9 Platform hclken BUS CLOCK (Slow Clock) D Q CLK D Q CLK D Q Insertion Delay HCLK CLK CLK CPU CLOCK (Fast Clock) Insertion Delay + F/F Clk->Q >Q CLK_ALWAYS Insertion Delay + F/F Clk->Q CLK GATE_HCLK GATE_CLK ARM9 Platform CCM Boundary Boundary Figure 9-4. Example hclk to clk Synchronization when clk is Faster 9.6.2 ARM926EJ-S JTAG Port Clocking Considerations The ARM926EJ-S does not support direct connection to the JTAG interface. The JTAG interface must be synchronized to the clk domain. This synchronization will take place within the platform’s CLKCTL module. Refer to the ARM9 Platform CLKCTL design specification for more detail. 9.6.2.1 JTAG_TCK The jtag_tck clock must be less than 1/8 the frequency of the clk input in order for the JTAG port and synchronizer to function properly. Note that the frequency of clk can vary when executing low-power code. Therefore, care must be taken such that jtag_tck is less than 1/8 the lowest possible frequency of clk. 9.6.3 External Alternate Bus Master Interfaces All four alternate bus master ports on the ARM9 Platform MUST have the AHB synchronized to hclk external to the platform. All alternate bus master AHB inputs and outputs to/from the ARM9 Platform will be synchronous to hclk. 9.6.4 External Secondary AHB Ports Both secondary AHB ports inputs and outputs to and from the ARM9 Platform must be synchronous to the hclk and will run at the hclk frequency. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-14 Freescale Semiconductor ARM9 Platform 9.7 Platform Resets This section will describe the various ARM9 Platform reset inputs. Figure 9-5 shows the reset paths within the ARM9 Platform. ARM9 Platform ARM926P_CORE ARM926P_TEST hreset_b tcu_hreset_b hreset_b ARM926EJ-S HRESETn ctbuf DBGnTRST ETM9 nRESET CLKCTL nTRST por OR and sync jtag_trst_b dbg_clear_b ETB9 ctbuf HRESETn nTRST clk_always nRESET hreset_b (to all other platform modules) Figure 9-5. ARM9 Platform Resets 9.7.1 HRESET The hreset_b input is the asynchronous system reset for both the clk and hclk domains. It is gated with a test mode signal in the scan wrapper, and is then buffered for distribution throughout the platform. The hreset_b signal must satisfy the setup and hold time requirements relative to both clk and hclk rising edges. 9.7.2 POR and JTAG_TRST The power-on-reset (POR) and the JTAG reset (jtag_trst_b) will be combined in the CLKCTL module to drive the dbg_clear_b signal to the ARM926EJ-S and ETM9 modules. The dbg_clear_b output of the CLKCTL module can be considered as the JTAG or debug reset of the platform. The dbg_clear_b signal will assert asynchronously when either POR or jtag_trst_b asserts, and will negate synchronously to clk MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-15 ARM9 Platform (through a synchronizer). Refer to the CLKCTL module design specification for more detailed information. 9.8 9.8.1 Power Management Register Level Clock Gating A Synopsys power compiler will be used to implement clock-gating on all components of the ARM9 Platform. That is, under normal operating conditions, clocks internal to the platform will only be issued to registers or banks of flops that need a rising edge for proper functionality. Otherwise, the clocks will be held low. 9.8.2 Block Level Clock Gating Clocks to individual modules within the platform will be enabled only when necessary. On the Primary AHB for example, the CLKCTL module will only enable hclk to a slave module when the current AHB access is addressed to that module. Slaves can also drive a signal to the CLKCTL if it requires its hclk to run for any other reason. See the CLKCTL module design specification for more detail. 9.8.3 External Clock Gating The ARM926EJ-S processor may be put into a low-power state by the wait-for-interrupt instruction. This instruction switches the ARM926EJ-S into a low-power state until either an interrupt (nIRQ/nFIQ) or a debug request occurs. The switch into the low-power state is indicated by the assertion of the arm_standbywfi output signal. If arm_standbywfi is asserted then it is guaranteed that all ARM926EJ-S external interfaces will be in an IDLE state. The arm_standbywfi signal is intended to be used to shut down clocks to the other parts of the system, such as external coprocessors, which do not need to be clocked if the ARM926EJ-S is idle. NOTE: The ARM926EJ-S clk must NOT be stopped during wait-for-interrupt mode if an external debugger is connected to the JTAG port. An active clk is required to be able to write values into the ARM9EJ-S debug control register, which is required for a debugger to be able to force wait-for-interrupt mode to be exited. It should also be noted that the ARM926EJ-S needs clk to run in order for an interrupt to cause the negation of arm_standbywfi. The JTAG synchronizer in the CLKCTL module needs to have an “always” clock running to it in order to, at any time, detect JTAG activity and thereby determine that a debugger is connected to the JTAG port. The presence of an active JTAG debugger will be detected by monitoring the JTAG TMS signal. After POR (or trst_b) assertion, a low state on TMS coincident with a rising-edge on TCK will transition the JTAG tap-controller from the test-logic-reset state to the run-test-idle state. The dbgen signal will be asserted, and held asserted, whenever the tap-controller is not in the test-logic-reset state. Once dbgen asserts, an active trst_b or POR is required to clear it (that is, once a debugger is detected to be connected, it is assumed to stay connected). When asserted, the a9p_clk_off output of the platform will indicate to an external clock control module that clk and hclken should be turned off at the earliest opportunity. However, in order to assure that no alternate bus masters are in the middle of a transaction, the external clock control module must assert the ccm_br input (bus request) of the crossbar switch. This will request ownership of all AHB Output Ports. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-16 Freescale Semiconductor ARM9 Platform Once the bus grant is asserted (ccm_bg), the external clock control module is then free to gate off hclk as all transactions on both the primary and secondary AHBs will have completed. Figure 9-6 shows a block diagram of how the clocks to the platform might be handled in a typical implementation. ARM9 PLATFORM CLK CLK ARM926EJ-S CLK IHCLKEN HCLKEN HCLKEN STANDBYWFI DHCLKEN RESET FLOP ETB9 HCLK HCLK Module Clk Gating CLK_ALWAYS ETM CG Individual Module Enables ETM9 CLK DBGTCKEN “ARM” JTAG JTAG SYNC JTAG CCM_BR IRQ_B AITC CLKCTL CCM_BG DBGEN FIRQ_B irq[63:0] A9P_CLK_OFF EXTERNAL CLOCK CONTROL MODULE IP Bus Figure 9-6. ARM9 Platform Clocking Strategy 9.8.4 Well Biasing A well bias clamp enable input, wt_en, will be driven by an external clock control module to the ARM9 Platform. When asserted, VBB+ will be shorted to VDD and VBB- will be shorted to GND. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-17 ARM9 Platform 9.9 Platform AHB Interfaces This section will describe the major bus interfaces of the ARM9 Platform and the crossbar switch. A simple block diagram of the bus connections to the platform is shown in Table 9-1. A definition of AHB-Lite, a functional description of the alternate bus master ports, and finally a description of the multi-layer crossbar switch slave ports follows. 9.9.1 Definition of AHB-Lite All master and slave ports of the Multi-Layer AHB Crossbar switch are AHB-Lite compliant. Therefore, all AHBs connected externally to the ARM9 Platform must be AHB-Lite compliant. The definition of “AHB-Lite” for the ARM9 Platform is as follows: • AHB split and retry protocols are not supported within the ARM9 Platform. This means that all slaves connected to AHB-Lite ports (input or output) are prohibited from requesting a split or a retry. This also means there is only one response signal, hresp0. • AMBA bus request and bus grant are not supported on the AHB-Lite interfaces. • Bursts are supported. The default configuration of the Crossbar Switch (MAX) insures no early fixed length burst terminations due to the switch arbiter. 9.9.2 Alternate Bus Master Ports There are four alternate bus master ports (ABM) on the ARM9 Platform which are connected directly to the Multi-Layer AHB Crossbar Switch. These four ABM interfaces are AHB-Lite compliant. Table 9-6 lists the ABM interface signals (“x” is equal to 2 through 5). All signals function as documented in the AMBA Specification, Rev 2.0, AMBA AHB chapter. It is assumed that the alternate bus masters are using the same hclk and hreset_b as the ARM9 Platform. Table 9-6. Alternate Bus Master Interface Signal List Pin List Direction1 mx_haddr[31:0] Input AHB Address Bus mx_hmaster[3:0] Input AHB Master ID mx_htrans[1:0] Input AHB Transfer Type mx_hprot[3:0] Input AHB Access Protection Indicator mx_hlock Input AHB Master Lock Indicator mx_hmastlock Input AHB-Lite Master Lock Indicator mx_hwrite Input AHB Access Write Indicator mx_hsize[1:0] Input AHB Transfer Size mx_hburst[2:0] Input AHB Access Burst Type mx_hwdata[31:0] Input AHB Write Data mx_hready_out Output Description AHB Termination/Take Indicator MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-18 Freescale Semiconductor ARM9 Platform Table 9-6. Alternate Bus Master Interface Signal List (continued) 1 9.9.3 Pin List Direction1 mx_hrdata[31:0] Output AHB Read Data mx_hresp0 Output AHB Error Indicator Description Direction is relative to the ARM9 Platform. Single Master Seamless Connection to ABM Port A single external master can connect seamlessly (no logic) to any of the four alternate bus master interfaces (all four ABM interfaces are identical). In this configuration, Table 9-7 lists the AHB signals which deserve special consideration. Table 9-7. Single External Master Connections to an Alternate Bus Master Interface AHB Signal Master’s hbusreq Output If present leave unconnected Master’s hgrant Input If present tie asserted (high) Master’s hready Input Connect to ABM hready_out Output Master’s hlock Output If present connect to ABM hlock Input1 Master’s hmastlock Output 1 2 Connection If present connect to ABM hmastlock Input2 If the Master does not have an hlock output, tie the ABM hlock input negated (low). If the Master does not have an hmastlock output, tie the ABM hmastlock input negated (low). NOTE The alternate bus master must drive htrans = IDLE when not requesting the bus as the arbiter may be parked on that input port. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-19 ARM9 Platform 9.9.4 Multiple External Masters Connection to ABM Port The four alternate bus master interfaces of the ARM9 Platform have been designed to support connection of multiple external AHB-Lite masters and slaves directly to the interface. Figure 9-7 shows the connection of two external masters to a ARM9 Platform alternate bus master interface. Note the location of the ARM9 Platform in the figure below and that only one of four ABM ports is shown. EXTERNAL ARBITER DATA_SELECT ADR_SELECT (Only one of four alternate Bus Master Interfaces Shown) M1_HBUSREQ M1_HBGRANT BUS MASTER #1 HREADY M1_HADDR/CTRL ARM9 PLATFORM HADDR/CTRL M2_HADDR/CTRL HWDATA HRDATA HWDATA A9P_HRDATA M2_HWDATA M2_HRDATA M2_HBUSREQ M2_HGRANT A9P_HREADY HREADY BUS MASTER #2 M2_HREADY_OUT M2_HADDR/CTRL HWDATA HRDATA Figure 9-7. Example of Two External Masters Connected to an ABM Port In the figure, two external masters, #1 and #2, arbitrate for control of the ABM interface on the ARM9 Platform. An external arbiter is required. The arbiter accepts the bus master’s hbusreq signals, and responds to the masters with hgrants. The arbiter also controls the address/control and data muxing in the external AHBMUX module. 9.9.5 Alternate Bus Master Design Considerations This section will discuss various issues which should be taken into account by engineers designing AHB masters to connect to the ARM9 Platform’s alternate bus master interfaces. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-20 Freescale Semiconductor ARM9 Platform 9.9.5.1 Edge Based Design All alternate bus masters should be edge-based designs in order to meet the stringent timing imposed. Specifically, an AHB master’s address and control information should be driven directly from the output of a flip-flop. Similarly, an AHB master’s read data should go directly to a D-input of a flip-flop. 9.9.5.2 htrans [1:0] Some important issues to remember about the AHB htrans signals: • It is important that alternate bus masters drive htrans = IDLE when not requesting the bus. This is critical because the arbiter can grant the bus to a master even when the master is not requesting it (for example, a “parked” condition). • Although the AMBA AHB specification does not require it, it is suggested that alternate bus masters assert htrans = NSEQ with the initial assertion of hbusreq. In those systems where only a single master is connected to an input port, the hgrant signal will tied high, and improved performance may result. • It is highly recommended that alternate bus masters insert an IDLE cycle after any locked sequence to provide an opportunity for the arbitration to change before commencing further transfers. 9.9.5.3 hlock/hmastlock The mx_hlock and mx_hmastlock ABM interface signal connections are dependent on whether there is a single external master or connection to an external arbiter. The following notes specify the connections: • For single masters only, the mx_hlock input should be connected directly to the master’s hlock output. In this case, the mx_hmastlock input should be tied LOW. If the single master produces an hmastlock instead the mx_hmastlock input should be connected directly to the master’s hmastlock output. In this case, the mx_hlock input should be tied LOW. • For multiple master connections on an ABM port, the mx_hmastlock input signal should be connected to the external arbiter’s hmastlock output. In this case, mx_hlock should be tied LOW. In either case above, logic within the crossbar switch will insure the locked cycles’ functionality. 9.9.5.4 hmaster Alternate bus masters external to the ARM9 Platform should be aware that four values of the hmaster field are used by bus masters internal to the platform. The reserved and available hmaster encodings are shown in Table 9-8. Table 9-8. hmaster Encodings hmaster Use 4’h0 Reserved: MAX default 4’h1 Reserved 4’h2 Reserved: ARM926EJ-S I-AHB MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-21 ARM9 Platform Table 9-8. hmaster Encodings (continued) hmaster 4’h3 4’h4–4’hF 9.9.5.5 Use Reserved: ARM926EJ-S D-AHB Available to External Bus Masters hresp0—Bus Error A slave two cycle ERROR response (hresp0 = HIGH) allows for a bus master to cancel the remaining transfers in a burst. However, this is not an AHB requirement, and it is acceptable for the master to continue the remaining transfers of the burst. AHB error responses generated on accesses to cacheable or bufferable memory address on the I-AHB and D-AHB interfaces of the ARM926EJ-S are normally ignored by the processor. In the ROMPATCH module, a feature can be enabled which will, on the above described accesses, gate 0’s onto hrdata[31:0] on data reads, and SWI opcodes onto hrdata[31:0] for instruction prefetches. At the same time, the ROMPATCH module will generate an abort which will guarantee entry into the ARM926EJ-S platform’s abort exception handler. See the ARM9 Platform ROMPATCH design specification for more detail. 9.9.5.6 Unaligned Transfers Alternate bus masters should not request unaligned transfers. That is, a word access to a non-word aligned address; and, a halfword access to a non-halfword aligned address should not be requested as neither transactions are supported by this platform. The transfers will complete as normal, however the lower order address bits will be ignored according to Figure 9-4 and Figure 9-5. 9.9.5.7 Alternate Bus Master Throttle Control Alternate bus masters should be designed with programmable maximum burst lengths as well as programmable bus request interval timers. This will allow software to effectively “tune” the overall system for maximum throughput and efficiency. 9.9.5.8 Halt Request (ccm_br) Care must be taken to ensure that the Halt Low Priority bit is not changing as the Clock Control Module’s Halt request is asserted. This will result in unpredictable behavior. This can be avoided by not modifying this bit in the Slave General Purpose Control Register or in the Alternate Slave General Purpose Control register in software where Halt could be requested. Also, the Halt Low Priority bit should be programmed the same in both the Slave General Purpose Control Register and the Alternate Slave General Purpose Control Register, if it is likely the MAX can change between the General Purpose and Alternate registers during the time Halt could be requested. Care should also be taken to ensure that the Clock Control Module’s Halt request is not asserted until at least two clock cycles after the last locked access performed by any master connected to the MAX. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-22 Freescale Semiconductor ARM9 Platform 9.9.6 MAX AHB Slave Ports Each slave port of the Multi-Layer Crossbar Switch is an AHB-Lite compliant bus. Brief functional descriptions and attributes of each output port are provided. 9.9.6.1 Slave Port 0—Primary AHB (Internal) Slave Port 0 of the MAX is connected to the “Primary” AHB of the ARM9 Platform. The primary AHB is completely contained within the ARM9 Platform. A simplified block diagram of the Primary AHB components is shown in Figure 9-8. MCTL AITC AIPI1 ROM PATCH REGS AIPI2 hsel_x haddr hcontrol hwdata aipi2_rdata aitc_rdata AHB MULTI-LAYER CROSSBAR SWITCH (MAX) haddr aipi1_rdata mctl_rdata addr decode select hrdata[31:0] hrdata hready hready rompatch_rdata hresp0 hresp0 gnd (ONLY PRIMARY AHB SLAVE PORT 0 SIGNALS ARE SHOWN) combine aitc_rdata_ovr hready_out, hresp0 from slaves bus monitor PAHBMUX Figure 9-8. The Primary AHB The primary AHB will have the AITC, AIPI (2), MCTL and ROMPATCH modules connected as slave devices. The PAHBMUX (Primary AHB mux) module is the glue that pulls the primary AHB and its components together. It will decode the primary AHB haddr lines and issue module selects to the slaves, combine the slave hready and hresp0 signals from the slaves into the single bus hready and hresp0, and mux the read data from the currently selected slave onto the bus hrdata lines. A bus monitor module inside of PAHBMUX will terminate timed-out bus transactions. In addition, the PAHBMUX will contain logic to terminate any IDLE cycles and issue the required assertion of hready following negation of the hreset_b. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-23 ARM9 Platform 9.9.6.1.1 Primary AHB Device Latencies The latency of each slave device on the primary AHB can be found in Table 9-1. The clock latency number does not take into account the possible one clock arbitration delay of the MAX. Table 9-1. Primary AHB Slave Device Latencies Slave Device Transaction Type Latency AITC Register Access 1 clock AIPI1 Writes Reads 3 clocks 2 clocks MCTL Memory Access 1 clock2 ROMPATCH Register Access 1 clock 1 The latency listed for the AIPIs are best case and based on a zero wait state response from the IP bus target device. Each wait state the IP Bus target device adds will add one extra clock to the listed latency value. 2 Assumes ram_wait and rom_wait are negated. 9.9.6.2 Secondary AHB Slave Ports 1 and 2 Each of the secondary AHB slave ports are identical AHB-Lite compliant buses. It is envisioned that these ports will interface predominately to internal and external memory. However, it is possible to connect an external AIPI interface along with associated peripherals to these ports. The secondary port slave signals are list in Table 9-2 where “x” is equal to 1 or 2. Table 9-2. Secondary AHB Interface Signal List 1 Pin List Direction1 sx_haddr[31:0] Output AHB Address Bus sx_hmaster[3:0] Output AHB Master ID sx_htrans[1:0] Output AHB Transfer Type sx_hprot[3:0] Output AHB Access Protection Indicator sx_hmastlock Output AHB-Lite Master Lock Indicator sx_hwrite Output AHB Access Write Indicator sx_hsize[1:0] Output AHB Transfer Size sx_hburst[2:0] Output AHB Access Burst Type sx_hwdata[31:0] Output AHB Write Data sx_hready Input AHB Termination/Take Indicator sx_hrdata[31:0] Input AHB Read Data sx_hresp0 Input AHB Error Indicator Description Direction is relative to the ARM9 Platform. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-24 Freescale Semiconductor ARM9 Platform 9.9.7 Endian Modes The ARM9 Platform will support both Big and Little Endian modes. The relevant signals to/from the ARM926EJ-S processor are shown in Table 9-3 below along with brief descriptions. Table 9-3. ARM926EJ-S Endian Related Signals Signal Direction BIGENDINIT Input CFGBIGEND Output Description Determines the setting of the BIGEND bit held in the CP15 control register after system reset. When HIGH, the reset state of the BIGEND bit will be 1 (Big Endian). When LOW, the reset state of the BIGEND bit will be 0 (Little Endian). ARM926EJ-S BIGEND configuration indicator. This signal reflects the value of the BIGEND bit held in the CP15 control register, which is used to determine the behavior of the ARM926EJ-S WRT endianness. When HIGH, the ARM926EJ-S treats bytes in memory as being in Big Endian format. When LOW, memory is treated as Little Endian. The bigendinit platform input is connected directly to the BIGENDINIT input of the ARM926EJ-S and determines the processor and platform Endian mode of operation upon exiting system reset. However, the endian mode of operation of the processor (and therefore the platform and associated memory systems) may be changed according to the BIGEND bit in the CP15 control register. This output, cfg_bigend, reflects the BIGEND bit and is used to indicate the current Endian mode of operation for the platform as well as all external bus masters and slaves. The relevant Endian signals are shown in Figure 9-9. ARM9 PLATFORM ETM/ETB etm_bigend ARM926EJ-S ROMPATCH AIPI(2) bigendinit BIGENDINIT MCTL cfg_bigend CFGBIGEND (to external AHB masters and slaves) Figure 9-9. Endian Configuration Routing The DHBL signals of the ARM926EJ-S will not be used within the platform. Instead, all modules affected by the Endian mode will use the cfg_bigend signal in conjunction with hsize and haddr[1:0] in order to handle non-word transfers correctly. It is not envisioned that applications will need to dynamically change Endianness. However, this is still under investigation, and should be possible since the platform will support both Endian modes in hardware. It then becomes a software issue to insure a graceful mode change. For example, the write buffers should be drained prior to changing Endian modes. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-25 ARM9 Platform 9.9.7.1 Affected Modules Only the AIPI (2), MCTL (RAM and ROM) and ROMPATCH modules are affected by the cfg_bigend signal within the platform. ETM9/ETB is affected by the Endian mode, and instead is connected to the etm_bigend signal internally. 9.9.7.2 Unaffected Modules The AITC module is 32-bit write only. The registers within the MAX are also 32-bit access only, and the Endian mode is transparent from the AHB switch perspective. The PAHBMUX module has no registers associated with it and the Endian mode is transparent to its data muxing. 9.9.7.3 Un-Aligned Transfers Unaligned transfers are not supported by the ARM9 Platform and therefore should not be attempted by alternate bus masters connected to it. That is, alternate bus masters should not attempt a 32-bit access to a non-word aligned address, nor a 16-bit access to a non half-word aligned address. The transfers will complete as normal, however the lower order address bits will be ignored according to Figure 9-4 and Figure 9-5. 9.9.7.4 Endian Mode and Alternate Bus Masters Alternate bus masters must be cognizant of the Endian mode if they are capable of performing non-word accesses. Non-word register and memory transactions will be performed according to the state of the cfg_bigend output signal. The manner in which memory is accessed in the two Endian modes is described in the following two sections. 9.9.7.5 Little Endian Operation A Little Endian configured ARM9 Platform (cfg_bigend = 0) should have memory connected to its secondary AHB ports as follows: • Byte 0 of the memory connected to D[7:0] • Byte 1 of the memory connected to D[15:8] • Byte 2 of the memory connected to D[23:16] • Byte 3 of the memory connected to D[31:24] The byte write enables should be decoded by the AHB slaves as in Table 9-4. Table 9-4. Little Endian Byte Write Enable Decoding hwrite hsize[1:0] haddr[1:0] we[31:24] we[23:16] we[15:8] we[7:0] 0 x x 0 0 0 0 1 00 00 0 0 0 1 1 00 01 0 0 1 0 1 00 10 0 1 0 0 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-26 Freescale Semiconductor ARM9 Platform Table 9-4. Little Endian Byte Write Enable Decoding (continued) 9.9.7.6 hwrite hsize[1:0] haddr[1:0] we[31:24] we[23:16] we[15:8] we[7:0] 1 00 11 1 0 0 0 1 01 0x 0 0 1 1 1 01 1x 1 1 0 0 1 10 xx 1 1 1 1 1 11 Reserved Big Endian Operation A Big Endian configured ARM9 Platform (cfg_bigend=1) should have memory connected to its secondary AHB ports as follows: • Byte 0 of the memory connected to D[31:24] • Byte 0 of the memory connected to D[23:16] • Byte 0 of the memory connected to D[15:8] • Byte 0 of the memory connected to D[7:0] The byte write enables should be decoded by the slaves as in Table 9-5. Table 9-5. Big Endian Byte Write Enable Decoding hwrite hsize[1:0] haddr[1:0] we[31:24] we[23:16] we[15:8] we[7:0] 0 x x 0 0 0 0 1 00 00 1 0 0 0 1 00 01 0 1 0 0 1 00 10 0 0 1 0 1 00 11 0 0 0 1 1 01 0x 1 1 0 0 1 01 1x 0 0 1 1 1 10 xx 1 1 1 1 1 11 Reserved MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-27 ARM9 Platform 9.10 Preliminary Size Estimate Table 9-6 show preliminary size estimates for the ARM9 Platform. Note that the area estimates correspond to C90LP, WCS, 1.1V, 105C. clk = 266MHz, hclk = 133 MHz. Gate equivalents are scaled to the area of the C90LP NAND2_2 cell. Table 9-6. ARM9 Platform Size Estimates Block Number Included in Platform Area in μm2 Gate Count Total (NAND2_2) I-Cache Data Memory (1024x32) 4 259,512 — I-Cache Tag Memory (128x22) 4 74,990 — I-Cache Valid Memory (32x24) 1 16,122* — D-Cache Data Memory (1024x32) 4 259,512 — D-Cache Tag Memory (256x22) 4 149,980* — D-Cache Valid Memory (32x24) 1 16,122* — D-Cache Dirty Memory (128x8) 1 8,242 — MMU RAM (32x64) 2 73,286 — ETB RAM (1024x32) 2 129,756 — Memories Total 23 987,522 350K ARM926 Core 1 — TBD ETM9 (Medium +) 1 — TBD ETB11 1 — TBD AITC 1 — TBD MCTL + ROM BIST 1 — TBD AIPI 2 — TBD AHBMUX 1 — TBD MAX 1 — TBD Scan Wrapper 1 — TBD ROMPATCH 1 — TBD BIST for Memories 4 — TBD IP to AHB (for ETB11) 1 — TBD Clock and Sync Control 1 — TBD JAM 1 — TBD Secure ROM monitor 1 — TBD Clock Tree 2 — TBD Logic Total — TBD TBD MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-28 Freescale Semiconductor ARM9 Platform Table 9-6. ARM9 Platform Size Estimates (continued) 9.11 Block Number Included in Platform Area in μm2 Gate Count Total (NAND2_2) 55% routing efficiency (logic only) — TBD TBD Platform Total — TBD TBD Power Consumption Table 9-7 summarizes preliminary power estimates for the various ARM9 Platform operating modes. Power numbers will be measured off of the final freeze post-route netlist. There is no padding or margin included in these numbers. Table 9-7. ARM9 Platform Power Estimates Mode of Operation BCS Corner (1.3 V –20C) TYP Corner (1.2 V 25C) WCS Corner (1.1 V, 105C) Run Mode TBD TBD TBD Doze Mode TBD TBD TBD Sleep Mode without Well Bias Active TBD TBD TBD Sleep Mode with Well Bias Active TBD TBD TBD The operating modes are described below: • Run Mode clk, clk_always = 266MHz, hclk = 133MHz. Code running out of cache, once instructions loaded into cache. Exercising cache/MMU memories. Core busy with arithmetic operations. Activity on all alternate master ports and all slave ports concurrently. Compiled memory models pessimistic when memories not being accessed. Estimated loads on all platform outputs ranging from 0.5pf to 1.5pf. • Doze Mode clk, clk_always, and hclken stopped. hclk = 117MHz. No alternate bus master activity. Estimated loads on all platform outputs ranging from 0.5pf to 1.5pf. • Sleep Mode All clocks stopped. Includes: clk, clk_always, hclken, and hclk. Basically represents platform leakage current. No Dynamic or Static power in Sleep Mode. Well bias active power TYP very crude estimate of 10x reduction + compiled memories. Power due to charge pump not included since charge pump is external to the platform. WCS measured with well bias standard cell library. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-29 ARM9 Platform 9.12 ARM9 Platform I/O Signal List The complete list of inputs and outputs for the ARM9 Platform are listed in Table 9-8. Table 9-8. ARM9 Platform Signal List Signal Type Description Clocks and Resets clk Input Processor and Nexus reference clock clk_always Input CLK that always runs hclk Input AHB domain reference clock hclken Input Controls ARM926EJ-S sampling of HCLK domain a9p_clk_off Output por Input Power-On Reset hreset_b Input System reset (ARM926EJ-S and AHB reset) To External Clock Control Module: The ARM9 Platform CLK may be turned off Platform Configuration bigendinit Input 1 = Big Endian, 0 = Little Endian Determines initial Endian mode out of reset cfg_bigend Output boot_int Input Internal Boot Indicator ext_boot_adr[31:2] Input External Boot Address bmon_timeout[2:0] Input Bus monitor timeout 1 = Big Endian, 0 = Little Endian Reflects the value of BIGEND bit in ARM926EJ-S CP15 register. Determines endianness of platform slaves and external AHBs. JTAG Interface and Related I/O jtag_tck Input JTAG Test Clock jtag_trst_b Input JTAG Test Reset jtag_tms Input JTAG Test Mode Select jtag_tdi Input JTAG Test Data Input jtag_tdo Output JTAG Test Data Output jtag_tdoen_b Output JTAG Test Data Output Tri-state Control tapid_ver[3:0] Input dbgrtck Output Platform Version Number (JTAG ID register bits [11:8]) TCK “return clock” from JTAG synchronization ARM926 Debug Related Signals dbgrq Input dbgack Output To ARM926: Debug request (connected to EDBGRQ) From ARM926: Debug Acknowledge MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-30 Freescale Semiconductor ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description dbgext[1:0] Input To ICE: External breakpoints/watchpoints dbgiebkpt Input To ARM926: Instruction breakpoint dbgdewpt Input To ARM926: Data watchpoint arm_dbgrng[1:0] Output From ARM926: Embedded ICE-RT range out arm_standbywfi Output From ARM926: Processor is in wait for interrupt mode arm_java_mode Output From ARM926: Processor is in JAVA mode arm_thumb_mode Output From ARM926: Processor is in THUMB mode arm_fiq_b Output From AITC: Fast interrupt request to processor arm_irq_b Output From AITC: Interrupt request to processor arm_fiq_disable Output From ARM926: Processor has disabled FIQ interrupts arm_irq_disable Output From ARM926: Processor has disabled IRQ interrupts arm_cpsr_mode[4:0] Output From ARM926: Processor CPSR mode bits Platform Debug Related Signals dbg_iahb_hready Output ARM926EJ-S I-AHB hready dbg_iahb_htrans1 Output ARM926EJ-S I-AHB htrans[1] dbg_iahb_haddr[31:29] Output ARM926EJ-S I-AHB requested address (top 3 bits) dbg_dahb_hready Output ARM926EJ-S D-AHB hready dbg_dahb_htrans1 Output ARM926EJ-S D-AHB htrans[1] dbg_dahb_haddr[31:29] Output ARM926EJ-S D-AHB requested address (top 3 bits) dbg_pahb_hready Output Primary AHB hready dbg_pahb_htrans1 Output Primary AHB htrans[1] dbg_pahb_hmaster[3:0] Output Primary AHB hmaster ownership dbg_a9p_ahb_en Output Enable output used for GPIO muxing of these debug signals MCTL ROM Memory Interface rom_connect Input Indicates ROM exists on the MCTL interface. rom_max_addr[11:0] Input Indicates ROM size. Corresponds to HADDR[21:10]. Smallest size supported is 1Kbyte, largest 4 Mbyte. rom_wait Input ROM wait-state indicator 0 = No wait-state required 1 = One wait-state required mctl_ce_rom_b Output MCU ROM chip enable mctl_addr_rom[19:0] Output MCU ROM address. mem_q_rom[31:0] Input ROM read data MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-31 ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description MCTL RAM Memory Interface ram_connect Input Indicates RAM exists on the MCTL interface. ram_max_addr[9:0] Input Indicates RAM size. Corresponds to HADDR[19:10]. Smallest size supported is 1Kbyte, largest 1 Mbyte. ram_wait Input RAM read cycle wait-state indicator 0 = No wait-state required 1 = One wait-state required mctl_mbist_sddtm Output MCU RAM mbist SDD test mode output extram_oe Output Testmode control of external memories’ output enable. This output should be connected to the OEN ports of all memories external to the ARM9 Platform (SRAM and TCM). mctl_ce_ram_b Output MCU RAM chip enable mctl_wr_ram_b Output MCU RAM access type: read=0, write=1 mctl_addr_ram[17:0] Output MCU RAM address mctl_ben_ram_7_0 Output MCU RAM byte enables mctl_ben_ram_15_8 Output MCU RAM byte enables mctl_ben_ram_23_16 Output MCU RAM byte enables mctl_ben_ram_31_24 Output MCU RAM byte enables mctl_d_ram[31:0] Output RAM write data mem_q_ram[31:0] Input RAM read data Multi-Layer AHB Master Port 2 m2_hlock Input AHB Locked Cycle Indicator (bus request timing) m2_hmastlock Input AHB Locked Cycle Indicator (address timing) m2_hmaster[3:0] Input AHB Master m2_htrans[1:0] Input AHB Transfer Type m2_hprot[3:0] Input AHB Protection Control m2_hwrite Input AHB Write/Read Indicator m2_hsize[1:0] Input AHB Transfer Size m2_hburst[2:0] Input AHB Burst Length m2_haddr[31:0] Input AHB Address m2_hwdata[31:0] Input AHB Write Data m2_hready_out Output AHB Transfer Done Out m2_hrdata[31:0] Output AHB Read Data m2_hresp0 Output AHB Transfer Response MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-32 Freescale Semiconductor ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description Multi-Layer AHB—Master Port 3 m3_hlock Input AHB Locked Cycle Indicator (bus request timing) m3_hmastlock Input AHB Locked Cycle Indicator (address timing) m3_hmaster[3:0] Input AHB Master m3_htrans[1:0] Input AHB Transfer Type m3_hprot[3:0] Input AHB Protection Control m3_hwrite Input AHB Write/Read Indicator m3_hsize[1:0] Input AHB Transfer Size m3_hburst[2:0] Input AHB Burst Length m3_haddr[31:0] Input AHB Address m3_hwdata[31:0] Input AHB Write Data m3_hready_out Output AHB Transfer Done Out m3_hrdata[31:0] Output AHB Read Data m3_hresp0 Output AHB Transfer Response Multi-Layer AHB Master Port 4 m4_hlock Input AHB Locked Cycle Indicator (bus request timing) m4_hmastlock Input AHB Locked Cycle Indicator (address timing) m4_hmaster[3:0] Input AHB Master m4_htrans[1:0] Input AHB Transfer Type m4_hprot[3:0] Input AHB Protection Control m4_hwrite Input AHB Write/Read Indicator m4_hsize[1:0] Input AHB Transfer Size m4_hburst[2:0] Input AHB Burst Length m4_haddr[31:0] Input AHB Address m4_hwdata[31:0] Input AHB Write Data m4_hready_out Output AHB Transfer Done Out m4_hrdata[31:0] Output AHB Read Data m4_hresp0 Output AHB Transfer Response Multi-Layer AHB Master Port 5 m5_hlock Input AHB Locked Cycle Indicator (bus request timing) m5_hmastlock Input AHB Locked Cycle Indicator (address timing) m5_hmaster[3:0] Input AHB Master MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-33 ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description m5_htrans[1:0] Input AHB Transfer Type m5_hprot[3:0] Input AHB Protection Control m5_hwrite Input AHB Write/Read Indicator m5_hsize[1:0] Input AHB Transfer Size m5_hburst[2:0] Input AHB Burst Length m5_haddr[31:0] Input AHB Address m5_hwdata[31:0] Input AHB Write Data m5_hready_out Output AHB Transfer Done Out m5_hrdata[31:0] Output AHB Read Data m5_hresp0 Output AHB Transfer Response Multi-Layer AHB Slave Port 1 s1_hmastlock Output AHB Locked Transfer s1_hmaster[3:0] Output AHB Master s1_htrans[1:0] Output AHB Transfer Type s1_hprot[3:0] Output AHB Protection Control s1_hwrite Output AHB Write/Read Indicator s1_hsize[1:0] Output AHB Transfer Size s1_hburst[2:0] Output AHB Burst Length s1_haddr[31:0] Output AHB Address s1_hwdata[31:0] Output AHB Write Data s1_hrdata[31:0] Input AHB Read Data s1_hready Input Transfer Done s1_hresp0 Input Transfer Response Multi-Layer AHB Slave Port 2 s2_hmastlock Output AHB Locked Transfer s2_hmaster[3:0] Output AHB Master s2_htrans[1:0] Output AHB Transfer Type s2_hprot[3:0] Output AHB Protection Control s2_hwrite Output AHB Write/Read Indicator s2_hsize[1:0] Output AHB Transfer Size s2_hburst[2:0] Output AHB Burst Length s2_haddr[31:0] Output AHB Address MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-34 Freescale Semiconductor ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description s2_hwdata[31:0] Output AHB Write Data s2_hrdata[31:0] Input AHB Read Data s2_hready Input Transfer Done s2_hresp0 Input Transfer Response MAX Specific (Crossbar Switch) ccm_hbusreq Input External Clock Control Module Low-power Bus Request ccm_hgrant Output s0_ampr_sel Input Slave port 0 alternate master priority register select. s1_ampr_sel Input Slave port 1 alternate master priority register select. s2_ampr_sel Input Slave port 2 alternate master priority register select. Low-power Mode Bus Grant IP Bus #1 (A) ipsa_module_en[31:1] Output IP Bus “A” Module Select ipsa_addr[11:0] Output IP Bus “A” Address ipsa_wdata[31:0] Output IP Bus “A” Write Data ipsa_byte_31_24 Output IP Bus “A” Byte Select ipsa_byte_23_16 Output IP Bus “A” Byte Select ipsa_byte_15:8 Output IP Bus “A” Byte Select ipsa_byte_7_0 Output IP Bus “A” Byte Select ipsa_rwb Output IP Bus “A” Read/Write Indicator ipsa_supervisor_access Output IP Bus “A” Supervisor Mode Access Control ipsa_rdata[31:0] Input IP Bus “A” Read Data ipsa_xfr_wait Input IP Bus “A” Transfer Wait State Indicator ipsa_xfr_err Input IP Bus “A” Transfer Error Indicator IP Bus #2 (B) ipsb_module_en[17:1] Output IP Bus “B” Module Select ipsb_addr[11:0] Output IP Bus “B” Address ipsb_wdata[31:0] Output IP Bus “B” Write Data ipsb_byte_31_24 Output IP Bus “B” Byte Select ipsb_byte_23_16 Output IP Bus “B” Byte Select ipsb_byte_15:8 Output IP Bus “B” Byte Select ipsb_byte_7_0 Output IP Bus “B” Byte Select ipsb_rwb Output IP Bus “B” Read/Write Indicator MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-35 ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description ipsb_supervisor_access Output ipsb_rdata[31:0] Input IP Bus “B” Read Data ipsb_xfr_wait Input IP Bus “B” Transfer Wait State Indicator ipsb_xfr_err Input IP Bus “B” Transfer Error Indicator IP Bus “B” Supervisor Mode Access Control ETM/ETB etm_traceclk Output ETM Trace Clock etm_clkdivtwoen Output ETM half rate clocking mode etm_dbgrq Output Debug Request. etm_etmen Output ETM Enabled etm_pipestat[2:0] Output Pipeline Status etm_tracepkt[15:0] Output ETM Trace Packet etm_tracesync Output Trace synchronization. etm_portsize[2:0] Output ETM Port Size. etm_portmode[1:0] Output Normal, Multiplexed, or Demultiplexed mode of operation etb_full Output ETB Overflow Indicator etb_acqcomp Output ETB Trace Acquisition Complete etm_extout Output External ETM Outputs ect_dbgrq Input Debug Request. etm_extin[3:0] Input External ETM Inputs. Miscellaneous aitc_rise_arb Output Interrupt pending, raise arbitration priority if desired a9p_mem_on Input Used with a9p_mem_pwr_dn to power off ARM926 ICACHE, DCACHE, and MMU memories a9p_mem_pwr_dn Input Used with a9p_mem_on to power off ARM926 ICACHE, DCACHE, and MMU memories a9p_int_b[63:0] Input External Interrupts a9p_dsm_int_holdoff Input Deep Sleep Module Interrupt Disable wt_en Input Well Tie Input (Physical connection only) wt_en_dnw Input Well Tie Input for deep n-wells (Physical connection only) Platform Scan Test Interface ipt_mode[3:0] Input Test Mode Control ipt_clk_se Input Clock Gating Cell Scan Enable MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-36 Freescale Semiconductor ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type Description ipt_memory_read_inhibit_int Input Disables memory read operations from internal memories (caches, ETB) during scan testing. Read data is forced to zeros when asserted. When negated, memories function normally. ipt_scan_size[1:0] Input Scan Chain Length Control ipt_scan_enable Input Scan Shift Enable ipt_scan_in[66:0] Input Platform Test Serial In ipt_scan_out[66:0] Output Platform Test Serial Out Scan Wrapper Test Interface ipt_wrapper_clk_in[1:0] Input Platform Wrapper Clocks [0] = CLK Domain [1] = HCLK Domain ipt_wrapper_se Input Scan Shift Enable ipt_wrapper_scan_size[1:0] Input Scan Wrapper Chain Length ipt_wrapper_scan_in[23:0] Input Scan Wrapper Test Serial In [2:0] = CLK [11:3] = HCLK ipt_wrapper_scan_out[23:0] Output Scan Wrapper Test Serial Out [2:0] = CLK [11:3] = HCLK Memory BIST Interface ipt_bist_fail Output Aggregate Memory BIST Fail Status ipt_bist_done Output Aggregate Memory BIST Execution Status ipt_bist_bitmap[15:0] Output Memory BIST Bitmap Data Out ipt_bist_sdo Output Memory BIST Bitmap Serial Data Out ipt_bist_addr_out[17:0] Output Memory BIST Address Out ipt_bist_bmdata_avail Output Memory BIST Bitmap Data Strobe ipt_bist_done_dcache Output Data Cache Memory BIST Done ipt_bist_done_etb Output ETB Memory BIST Done ipt_bist_done_icache Output Instruction Cache Memory BIST Done ipt_bist_done_mmu Output MMU Memory BIST Done ipt_bist_done_mram Output MCTL RAM Memory BIST Done ipt_bist_done_mrom Output MCTL ROM Memory BIST Done ipt_bist_fail_dcache Output Data Cache Memory BIST Fail ipt_bist_fail_etb Output ETB Memory BIST Fail ipt_bist_fail_icache Output Instruction Cache Memory BIST Fail MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-37 ARM9 Platform Table 9-8. ARM9 Platform Signal List (continued) Signal Type ipt_bist_fail_mmu Output MMU Memory BIST Fail ipt_bist_fail_mram Output MCTL RAM Memory BIST Fail ipt_bist_config_addr_mode[2:0] Input Memory BIST Address Mode Selection ipt_bist_config_alt_al_en Input Memory BIST Alternate Algorithm Enable ipt_bist_config_aftest_en Input Memory BIST Address Fault Test Enable ipt_bist_config_dpat_en[7:0] Input Memory BIST Data Pattern Enable ipt_bist_config_dret_en Input Memory BIST Data Retention Test Enable ipt_bist_config_dsof Input Memory BIST Disable “Stop on Fail” ipt_bist_config_marchc_en Input Memory BIST Marching Pattern Test Enable ipt_bist_config_sdd_en Input Memory BIST SDD Test Enable ipt_bist_config_sel_dcache Input Memory BIST Data Cache Engine Select ipt_bist_config_sel_etb Input Memory BIST ETB Engine Select ipt_bist_config_sel_icache Input Memory BIST Instruction Cache Engine Select ipt_bist_config_sel_mmu Input Memory BIST MMU Engine Select ipt_bist_config_sel_mram Input Memory BIST MCTL RAM Engine Select ipt_bist_config_sel_mrom Input Memory BIST MCTL ROM Engine Select ipt_bist_config_usrctrl_bm Input Memory BIST User Controlled Parallel Bitmap Output Rate ipt_bist_invoke Input Memory BIST Invoke ipt_bist_mode[2:0] Input Memory BIST Mode Select ipt_bist_release Input Memory BIST Pause State Release ipt_bist_repdata_out_en Input Memory BIST Repair Data Output Enable ipt_bist_reset Input Memory BIST Reset ipt_bist_retention_en Input Memory BIST Retention Enable ipt_bist_sdi Input Memory BIST Serial Data In ipt_bist_serial_data_en Input Memory BIST Serial Data Enable ipt_bist_shift_clk Input Memory BIST Shift Clock 9.13 Description Electrical Specifications This section will present timing information for all major AHBs (both internal and external) to the platform. Timing information on all other signals on the platform periphery will be grouped by functionality and presented after the AHB timings. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-38 Freescale Semiconductor ARM9 Platform 9.13.1 Conditions The timing presented in this section were derived from an ARM926EJ-S synthesis run using the C90LP library, worst case process, 105oC, 1.10V with clk running at 266 MHz. In this case, the hclk domain (all AHBs) will run at half the clk speed or 133 MHz. 9.13.2 Well Bias Mode The timing specifications in this section do not cover the well bias mode of operation. At the present time, well bias mode is planned to be used in Sleep Mode only. That is, clk and hclk will be stopped and the platform buses will be inactive. However, the negation of the a9p_clock_off output when an interrupt is asserted is still required in order for the external clock control module to exit Sleep Mode and turn on the clocks. The delay for the a9p_int_b[61:0] to a9p_clock_off path will be affected by well bias mode, but not significantly so. 9.13.2.1 Functional Operation in Well Bias Mode Programmable options should be used to support laboratory testing of the platform in well bias mode. The platform’s AC performance will be impacted (slower) when well biasing is enabled and is TBD. Care should be taken to identify external interfaces which may not be running in well bias mode as clock insertion and clock skew differences may prevent proper operation. 9.13.3 clk and jtag_tck Relationship The jtag_tck clock input must always be less than 1/8 the frequency of the clk clock input. This constraint is due to the JTAG synchronization logic in the CLKCTL module. During the execution of low-power code, the frequency of clk is dynamic, and therefore care should be taken that jtag_tck is always less than 1/8 the frequency of clk at any given instant. To maximize throughput via the JTAG port when uploading/downloading code or memory images, it is suggested the debugger enter debug mode directly out of reset with clk and jtag_tck running as fast as possible. However, once normal mode low-power code execution begins, the jtag_tck frequency should be set to be 1/8 the frequency of the lowest possible clk frequency. 9.13.4 Clocks and Reset Timing Table 9-9 and Figure 9-10 are valid for all AHB interfaces on the ARM9 Platform. The same clock insertion delay and hreset_b negation timing will be used for all modules on the ARM9 Platform. Table 9-9. ARM9 Platform AHB Clock and Reset Timing Constraints Description CLK_ROOT Period CLK_ROOT jitter (3% rounded up) HCLK_ROOT Period HCLK_ROOT jitter (3% rounded up) Delay 3.75 ns (266 MHz) 115.0 ps 7.5 ns (133 MHz) 230.0 ps MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-39 ARM9 Platform Table 9-9. ARM9 Platform AHB Clock and Reset Timing Constraints (continued) Description Delay CLK_ROOT to CLK and HCLK_ROOT to HCLK Insertion Delay (Tinsert) 1.60 +/– 0.100 ns CLK and HCLK Uncertainty 200 ps HRESET_B hold time to HCLK_LEAF (Tihrst) 1.80 ns HRESET_B setup time to HCLK_LEAF (Tisrst) 1.60 ns HCLKEN setup time to CLK_LEAF (Tisclken) 2.00 ns HCLKEN hold time to CLK_LEAF (Tihclken) 0.00 ns CLK_ROOT CLK_LEAF HCLK_ROOT HCLK_LEAF HRESET_B Tihrst Tisrst Tinsert HCLKEN Tisclken Figure 9-10. ARM9 Platform AHB Clock and Reset Timing Relationship 9.13.5 Alternate Bus Master (ABM) Interface Timing Table 9-10 shows the loading constraints used on all ARM9 Platform Alternate Bus Master bus interfaces. The timing parameters in Figure 9-11 reflect these constraints. The Alternate Bus Master signals are designated by the “MX_” prefix attached to the normal AHB naming convention. Table 9-10. Alternate Bus Master Constraints Description All Output Loading Input Transition Time (platform boundary) Value 0.50 pf 0.750 ns (20/80) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-40 Freescale Semiconductor ARM9 Platform HCLK_ROOT Tinsert HCLK_LEAF MX_HTRANS[1:0] MX_HPROT[3:0] MX_HLOCK MX_HMASTLOCK MX_HMASTER Transfer Type Tihtr Tistr MX_HADDR[31:0] Address Tiha Tisa MX_HBURST[3:0] Transfer Control MX_HWRITE Tihctl Tisctl MX_HWDATA[31:0] Write Data (A) MX_HSIZE[2:0] Tihwd Tiswd MX_HREADY_OUT Tovrdyo MX_HRDATA[31:0] Tohrdyo Read Data (A) Tovrd Tohrd OK MX_HRESP[1:0] Tovrsp Tohrsp Figure 9-11. Alternate Bus Master Timing Parameters MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-41 ARM9 Platform Table 9-11. Alternate Bus Master Interface AC Timing Parameters Description Parameter Timing (ns) HCLK_LEAF minimum clock period including jitter Tclk 7.27 MX_HMASTER/MX_HTRANS/MX_HPROT/MX_HLOCK/MX_HMASTLOCK/MX_HMAS TER Transfer Type setup time before HCLK_LEAF Tistr 6.23 MX_HMASTER/MX_HTRANS/MX_HPROT/MX_HLOCK/MX_HMASTLOCK/ MX_HMASTER Transfer Type hold time after HCLK_LEAF Tihtr >0 MX_HADDR[31:0] Address setup time before HCLK_LEAF Tisa 6.23 MX_HADDR[31:0] Address hold time after HCLK_LEAF Tiha >0 MX_HWRITE/MX_HSIZE/MX_HBURST control signal setup time before HCLK_LEAF Tisctl 6.23 MX_HWRITE/MX_HSIZE/MX_HBURST control signal hold time after HCLK_LEAF Tihctl >0 MX_HWDATA Write Data setup time before HCLK_LEAF Tiswd 6.00 MX_HWDATA Write Data hold time after HCLK_LEAF Tihwd >0 MX_HREADY_OUT Ready Out valid time after HCLK_LEAF Tovrdyo 4.80 MX_HREADY_OUT Ready Out hold time after HCLK_LEAF Tohrdyo >0 MX_HRDATA Read Data valid time after HCLK_LEAF Tovrd 6.00 MX_HRDATA Read Data hold time after HCLK_LEAF Tohrd >0 MX_HRESP0 valid time after HCLK_LEAF Tovrsp 6.00 MX_HRESP0 hold time after HCLK_LEAF Tohrsp >0 9.13.6 Secondary AHB Timing Table 9-12 shows the loading constraints used on all ARM9 Platform Secondary AHB interfaces. The timing parameters in Figure 9-13 reflect these constraints. The constraints and AC parameters are valid for all 3 of the platform’s secondary AHBs. The Secondary AHB signals are designated by the “SX_” prefix attached to the normal AHB naming convention. Table 9-12. Secondary AHB Constraints Description Value SX_HADDR, SX_HWDATA Loading 0.50 pf All Other Output Loading 0.50 pf Input Transition Time (at platform boundary) 0.75 ns (20/80) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-42 Freescale Semiconductor ARM9 Platform HCLK_ROOT Tinsert HCLK_LEAF SX_HTRANS[1:0] SX_HPROT[3:0] SX_HMASTLOCK SX_HMASTER[3:0] Transfer Type Tohtr Tovtr Address SX_HADDR[31:0] Toha Tova SX_HWRITE SX_HSIZE[1:0] Transfer Control Tohctl SX_HBURST[3:0] Tovctl Write Data (A) SX_HWDATA[31:0] Tohwd Tovwd SX_HREADY Tisrdy Tihrdy SX_HRDATA[31:0] Read Data (A) Tisrd Tihrd OK SX_HRESP0 Tisrsp Tihrsp Figure 9-12. Secondary AHB AC TIming Parameters Table 9-13. Secondary AHB AC Timing Parameters Description Parameter Timing (ns) HCLK_LEAF minimum clock period including jitter Tclk 7.27 SX_HTRANS/SX_HPROT/SX_HMASTLOCK/SX_HMASTER Transfer Type valid time after HCLK_LEAF Tovtr 5.00 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-43 ARM9 Platform Table 9-13. Secondary AHB AC Timing Parameters (continued) Description Parameter Timing (ns) SX_HTRANS/SX_HPROT/SX_HMASTLOCK/SX_HMASTER Transfer Type hold time after HCLK_LEAF Tohtr >0 SX_HADDR[31:0] Address valid time after HCLK_LEAF Tova 4.30 SX_HADDR[31:0] Address hold time after HCLK_LEAF Toha >0 SX_HWRITE/SX_HSIZE/SX_HBURST control signal valid time after HCLK_LEAF Tovctl 5.70 SX_HWRITE/SX_HSIZE/SX_HBURST control signal hold time after HCLK_LEAF Tohctl >0 SX_HWDATA Write Data valid time after HCLK_LEAF Tovwd 5.70 SX_HWDATA Write Data hold time after HCLK_LEAF Tohwd >0 SX_HREADY setup time before HCLK_LEAF (input to slaves) Tisrdy 5.60 SX_HREADY hold time after HCLK_LEAF Tihrdy >0 SX_HRDATA setup time before HCLK_LEAF Tisrd 4.10 SX_HRDATA hold time after HCLK_LEAF Tihrd >0 SX_HRESP0 setup time before HCLK_LEAF Tisrsp 4.10 SX_HRESP0 hold time after HCLK_LEAF Tihrsp >0 9.13.7 RAM and ROM Interface Timing Table 9-14 shows the loading constraints used when generating timing parameters on the ARM9 Platform’s RAM and ROM interfaces. External RAM and ROM interface signals not shown in the table below are either static or test related. Table 9-14. RAM and ROM Interface Loading Constraints Signal Type Constraint MCTL_OEN_RAM Output 0.50 pf MCTL_CE_RAM_B Output 0.25 pf MCTL_WR_RAM_B Output 0.50 pf MCTL_ADDR_RAM[17:0] Output 0.50 pf MCTL_BEN_RAM_*_* Output 0.50 pf MCTL_D_RAM[31:0] Output 0.50 pf MEM_Q_RAM[31:0] Input 0.75 ns (Input Transition Time) Output 0.25 pf RAM ROM MCTL_CE_ROM_B MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-44 Freescale Semiconductor ARM9 Platform Table 9-14. RAM and ROM Interface Loading Constraints (continued) Signal Type Constraint MCTL_ADDR_ROM[19:0] Output 0.50 pf MEM_Q_ROM[31:0] Input 0.75 ns (Input Transition Time) hclk hclk_leaf Tovaram mctl_addr_ram[17:0] Tovdram mctl_d_ram[31:0] Tovcram mctl_ce_ram_b Tovwram mctl_wr_ram_b Tovbram mctl_ben_ram Tisqram mem_q_ram[31:0] Tovarom mctl_addr_rom[19:0] Tovcrom mctl_ce_rom_b Tisqrom mem_q_rom[31:0] Figure 9-13. RAM and ROM Interface AC Timing Parameters Table 9-15. RAM and ROM Interface AC Timing Parameters Description Parameter Timing (ns) HCLK_LEAF minimum clock period Tclk 8.40 Tovaram 6.65 RAM MCTL_ADDR_RAM valid time after HCLK_LEAF MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 9-45 ARM9 Platform Table 9-15. RAM and ROM Interface AC Timing Parameters (continued) Description Parameter Timing (ns) MCTL_D_RAM valid time after HCLK_LEAF Tovdram 6.60 MCTL_CE_RAM_B valid time after HCLK_LEAF Tovcram 6.70 MCTL_WR_RAM_B valid time after HCLK_LEAF Tovwram 6.55 MCTL_BEN_RAM_*_* valid time after HCLK_LEAF Tovbram 6.6 MEM_Q_RAM setup time before HCLK_LEAF Tisqram 4.65 MEM_Q_RAM hold time after HCLK_LEAF Tihqram >0 MCTL_ADDR_ROM valid time after HCLK_LEAF Tovarom 6.55 MCTL_CE_ROM_B valid time after HCLK_LEAF Tovcrom 6.80 MEM_Q_ROM setup time before HCLK_LEAF Tisqrom 3.85 MEM_Q_ROM hold time after HCLK_LEAF Tihqrom >0 ROM MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 9-46 Freescale Semiconductor Chapter 10 ARM926EJ-S Interrupt Controller (AITC) The ARM926EJ-S Interrupt Controller (AITC) is a 32-bit peripheral that collects interrupt requests from up to 64 sources, and provides an interface to the ARM926EJ-S core. The AITC includes software-controlled priority levels for normal interrupts. Figure 10-1 shows the simplified block diagram of the AITC. aitc_fiq 64 INTENABLE fipend 64 64 intin FORCE 64 64 64 64 nipend INTTYPE 6 Priority Encoder Software Priority Encoder fivector nivector 6 aitc_irq aitc_rdata_ovr NM 32 Equals to 0x0000_0018? haddr Equals to 0x0000_001C? FM Opcode Generator 32 aitc_rdata hready Figure 10-1. AITC Block Diagram 10.1 Overview The AITC consists of a set of control registers and associated logic to perform interrupt masking, and priority support of normal interrupts. Interrupt source registers (INTSRCH/INTSRCL) are a pair of 32-bit status registers with a single interrupt source associated with each of the 64 bits. An interrupt line or set of interrupt lines are routed from each interrupt source to the INTSRCH or INTSRCL register. This allows up to 64 distinct interrupt sources in an implementation. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-1 ARM926EJ-S Interrupt Controller (AITC) 10.1.1 Features 10.1.2 Modes of Operation Interrupt requests may be forced to be asserted by way of the interrupt force registers (INTFRCH/INTFRCL). Each bit in this register is logically “OR-ed” with the corresponding hardware request line prior to feeding the INTSRCH or INTSRCL register inputs. There is a corresponding set of interrupt enable registers (INTENABLEH/INTENABLEL), also 32-bits wide which allow individual bit masking of the INTSRCH/INTSRCL registers. There is also a corresponding set of interrupt type register (INTTYPEH/INTTYPEL), which selects whether an interrupt source will generate a normal or fast interrupt to the ARM926EJ-S core. There is a corresponding set of normal interrupt pending registers (NIPNDH/NIPNDL) which indicate pending normal interrupt requests. These registers are equivalent to the logical AND of the interrupt source registers (INTSRCH/INTSRCL), the interrupt enable registers (INTENABLEH/INTENABLEL), and the NOT of the interrupt type registers (INTTYPEH/INTTYPEL). (Refer to Figure 10-1) The NIPNDH/NIPNDL register bits are bit-wise “NOR-ed” together to form the nIRQ signal routed to the ARM926EJ-S core. This core input signal is maskable by the normal interrupt disable bit (I bit) in the processor status register (CPSR). The normal interrupt vector register (NIVECSR) indicates the vector index of highest priority pending normal interrupt. There is a corresponding set of fast interrupt pending registers (FIPNDH/FIPNDL) which indicate pending fast interrupt requests. These registers are equivalent to logical AND of interrupt source registers (INTSRCH/INTSRCL), interrupt enable registers (INTENABLEH/INTENABLEL), and interrupt type registers (INTTYPEH/INTTYPEL). (Refer to Figure 10-1) FIPNDH/FIPNDL register bits are bit-wise “NOR-ed” together to form the nFIQ signal routed to the ARM926EJ-S core. This core input signal is maskable by the fast interrupt disable bit (F bit) in the CPSR. The fast interrupt vector register (FIVECSR) indicates the vector index of highest priority pending fast interrupt. AITC supports two vector table modes: high memory and low memory. If AITC is in high memory vector table mode, opcode is “LDR PC, [PC,#-(288-4*(vector index)]”. This causes ARM926-ES core to load the Program Counter (PC) with a vector from a table of 64 vectors located at 0xFFFF_FF00 to 0xFFFF_FFFF; more specifically the PC is loaded with the vector located at 0xFFFF_FF00 + 4*(vector index). If AITC is in low memory vector table mode, this opcode is “LDR PC, [PC, #((table pointer)+4*(vector index) –32]”. This causes the ARM926-EJS core to load the PC with a vector from a table of 64 vectors beginning at (table pointer) and ending at (table pointer)+0xFF; more specifically the PC is loaded with the vector located at (table pointer) + 4*(vector index). This hardware mechanism alleviates the need for software to determine which interrupt source caused the interrupt to be asserted. All interrupt controller registers can be read and written during privileged mode only. Writes attempted to read-only registers will be ignored. These registers can be only modified using 32-bit writes. INTFRCH/INTFRCL registers are provided for software generation of interrupts. By enabling interrupts for these bit positions, software can force an interrupt request. This register can also be used to debug hardware interrupt service routines by providing an alternate method of interrupt assertion. The interrupt requests are prioritized in the following sequence: 1. Fast interrupt requests, in order of highest number 2. Normal interrupt requests, in order of highest priority level, then highest source number with the same priority MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-2 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) AITC provides 16 software controlled priority levels for normal interrupts. Every interrupt can be placed in any priority level. The AITC also provides a normal interrupt priority level mask (NIMASK) which disables any interrupt with a priority level lower than or equal to the mask. If a level 0 normal interrupt and a level 1 normal interrupt are asserted at the same time, the level 1 normal interrupt will be selected assuming that NIMASK has not disabled level 1 normal interrupts. If two level 1 normal interrupts are asserted at the same time, the level 1 normal interrupt with the highest source number will be selected, also assuming that NIMASK has not disabled level 1 normal interrupts. 10.2 Memory Map and Register Definition AITC module has 26 registers. All of these registers are single cycle access as the AITC sits on the native bus of the ARM926EJ-S core. This section provides the detailed descriptions for all of the AITC registers. 10.2.1 Memory Map Table 10-1 shows the AITC memory map. Table 10-1. AITC Memory Map Address Register Access Reset Value Section/Page General Registers 0x1004_0000 (INTCNTL) Interrupt Control Register R/W 0x0000_0000 10.2.3/10-8 0x1004_0004 (NIMASK) Normal Interrupt Mask Register R/W 0x0000_001F 10.2.4/10-10 0x1004_0008 (INTENNUM) Interrupt Enable Number Register R/W 0x0000_0000 10.2.5/10-11 0x1004_000C (INTDISNUM) Interrupt Disable Number Register R/W 0x0000_0000 10.2.6/10-12 0x1004_0010 (INTENABLEH) Interrupt Enable Register High R/W 0x0000_0000 10.2.7/10-13 0x1004_0014 (INTENABLEL) Interrupt Enable Register Low R/W 0x0000_0000 10.2.7/10-13 0x1004_0018 (INTTYPEH) Interrupt Type Register High R/W 0x0000_0000 10.2.8/10-14 0x1004_001C (INTTYPEL) Interrupt Type Register Low R/W 0x0000_0000 10.2.8/10-14 0x1004_0020 (NIPRIORITY7) Normal Interrupt Priority Level Register 7 R/W 0x0000_0000 10.2.9/10-15 0x1004_0024 (NIPRIORITY6) Normal Interrupt Priority Level Register 6 R/W 0x0000_0000 10.2.9/10-15 0x1004_0028 (NIPRIORITY5) Normal Interrupt Priority Level Register 5 R/W 0x0000_0000 10.2.9/10-15 0x1004_002C (NIPRIORITY4) Normal Interrupt Priority Level Register 4 R/W 0x0000_0000 10.2.9/10-15 0x1004_0030 (NIPRIORITY3) Normal Interrupt Priority Level Register 3 R/W 0x0000_0000 10.2.9/10-15 0x1004_0034 (NIPRIORITY2) Normal Interrupt Priority Level Register 2 R/W 0x0000_0000 10.2.9/10-15 0x1004_0038 (NIPRIORITY1) Normal Interrupt Priority Level Register 1 R/W 0x0000_0000 10.2.9/10-15 0x1004_003C (NIPRIORITY0) Normal Interrupt Priority Level Register 0 R/W 0x0000_0000 10.2.9/10-15 0x1004_0040 (NIVECSR) Normal Interrupt Vector and Status Register R 0xFFFF_FFFF 10.2.10/10-23 0x1004_0044 (FIVECSR) Fast Interrupt Vector and Status Register R 0xFFFF_FFFF 10.2.11/10-24 0x1004_0048 (INTSRCH) Interrupt Source Register High R 0x0000_0000 10.2.12/10-25 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-3 ARM926EJ-S Interrupt Controller (AITC) Table 10-1. AITC Memory Map (continued) Address Register Access Reset Value Section/Page 0x1004_004C (INTSRCL) Interrupt Source Register Low R 0x0000_0000 10.2.12/10-25 0x1004_0050 (INTFRCH) Interrupt Force Register High R/W 0x0000_0000 10.2.13/10-28 0x1004_0054 (INTFRCL) Interrupt Force Register Low R/W 0x0000_0000 10.2.13/10-28 0x1004_0058 (NIPNDH) Normal Interrupt Pending Register High R 0x0000_0000 10.2.14/10-29 0x1004_005C (NIPNDL) Normal Interrupt Pending Register High R 0x0000_0000 10.2.14/10-29 0x1004_0060 (FIPNDH) Fast Interrupt Pending Register High R 0x0000_0000 10.2.15/10-30 0x1004_0064 (FIPNDL) Fast Interrupt Pending Register Low R 0x0000_0000 10.2.15/10-30 10.2.2 Register Summary Figure 10-2 shows the key to the register fields and Table 10-2 shows the register figure conventions. Always reads 1 1 Always reads 0 0 R/W BIT Read- BIT Write-only bit only bit bit BIT Write 1 BIT Self-clear 0 to clear bit w1c BIT N/A Figure 10-2. Key to Register Fields Table 10-2. Register Figure Conventions Convention Description Depending on its placement in the read or write row, indicates that the bit is not readable or not writable. FIELDNAME Identifies the field. Its presence in the read or write row indicates that it can be read or written. Register Field Types r Read only. Writing this bit has no effect. w Write only. rw Standard read/write bit. Only software can change the bit’s value (other than a hardware reset). rwm A read/write bit that may be modified by a hardware in some fashion other than by a reset. w1c Write one to clear. A status bit that can be read, and is cleared by writing a one. Self-clearing bit Writing a one has some effect on the module, but it always reads as zero. Reset Values 0 Resets to zero. 1 Resets to one. — Undefined at reset. u Unaffected by reset. [signal_name] Reset value is determined by polarity of indicated signal. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-4 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-3 shows the AITC register summary. Table 10-3. AITC Register Summary Name R 0x1004_0000 (INTCNTL) 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 NIA D FIA D 0 0 W R 0 0 0 NIDI FIDI S S MD 0 0 0 0 0 POINTER W R 0x1004_0004 (NIMASK) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R NIMASK W R 0x1004_0008 (INTENNUM) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W R 0x1004_000C (INTDISNUM) ENNUM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W R W DISNUM R INTENABLE[63:48] 0x1004_0010 W (INTENABLEH) R INTENABLE[47:32] W R INTENABLE[31:16] 0x1004_0014 (INTENABLEL) W R INTENABLE[15:0]] W R INTTYPE[63:48] 0x1004_0018 (INTTYPEH) W R INTTYPE[47:32] W MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-5 ARM926EJ-S Interrupt Controller (AITC) Table 10-3. AITC Register Summary (continued) Name 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R INTTYPE[31:16] 0x1004_001C (INTTYPEL) W R INTTYPE[16:0] W R NIPR63 NIPR62 NIPR61 NIPR60 NIPR59 NIPR58 NIPR57 NIPR56 NIPR55 NIPR54 NIPR53 NIPR52 NIPR51 NIPR50 NIPR49 NIPR48 NIPR47 NIPR46 NIPR45 NIPR44 NIPR43 NIPR42 NIPR41 NIPR40 NIPR39 NIPR38 NIPR37 NIPR36 NIPR35 NIPR34 NIPR33 NIPR32 NIPR31 NIPR30 NIPR29 NIPR28 NIPR27 NIPR26 NIPR25 NIPR24 NIPR23 NIPR22 NIPR21 NIPR20 NIPR19 NIPR18 NIPR17 NIPR16 NIPR15 NIPR14 NIPR13 NIPR12 NIPR11 NIPR10 NIPR9 NIPR8 0x1004_0020 W (NIPRIORITY7) R W R 0x1004_0024 W (NIPRIORITY6) R W R 0x1004_0028 W (NIPRIORITY5) R W R 0x1004_002C W (NIPRIORITY4) R W R 0x1004_0030 W (NIPRIORITY3) R W R 0x1004_0034 W (NIPRIORITY2) R W R 0x1004_0038 W (NIPRIORITY1) R W MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-6 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-3. AITC Register Summary (continued) Name 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR7 NIPR6 NIPR5 NIPR4 NIPR3 NIPR2 NIPR1 NIPR0 0x1004_003C W (NIPRIORITY0) R W R 0x1004_0040 (NIVECSR) NIVECTOR W R NIPRILVL W R 0x1004_0044 (FIVECSR) FIVECTOR W R FIVECTOR W R 0x1004_0048 (INTSRCH) INTIN[63:48] W R INTIN[48:32] W R 0x1004_004C (INTSRCL) INTIN[31:16] W R INTIN[15:0] W R 0x1004_0050 (INTFRCH) FORCE[63:48] W R FORCE[47:32] W R 0x1004_0054 (INTFRCL) FORCE[31:16] W R FORCE[15:0] W R 0x1004_0058 (NIPNDH) NIPEND[63:48] W R NIPEND[47:32] W MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-7 ARM926EJ-S Interrupt Controller (AITC) Table 10-3. AITC Register Summary (continued) Name 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R 0x1004_005C (NIPNDL) NIPEND[31:16] W R NIPEND[15:0] W R 0x1004_0060 (FIPNDH) FIPEND[63:48] W R FIPEND[47:32] W R 0x1004_0064 (FIPNDL) FIPEND[31:16] W R FIPEND[15:0] W 10.2.3 Interrupt Control Register (INTCNTL) INTCNTL controls the interrupts in AITC. Both normal and fast interrupts can be enabled to jump directly to the interrupt service routine. For fast interrupts, it may be faster to begin to fast interrupt routine at 0x0000_001C instead of jumping to a service routine. The vector table can be sourced in high memory, 0xFFFF_FF00 to 0xFFFF_FFFF, or in low memory. If the vector table is located in low memory (MD=1), a register has been provided to control where the vector table is located. This register is located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. This register can be only modified using 32-bit writes. 0x1004_0000 (INTCNTL) R Access: Supervisor read/write 31 30 29 28 27 26 25 24 23 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 0 0 0 0 0 0 0 0 W Reset R 21 20 19 18 17 0 0 0 0 0 3 2 NIDIS FIDIS NIAD FIAD POINTER W Reset 22 0 0 0 0 0 0 0 0 0 0 16 MD 0 1 0 0 0 0 0 Figure 10-3. Interrupt Control Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-8 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-4. Interrupt Control Register Field Description Field Description 31–23 Reserved. These bits are reserved and should read 0. 22 NIDIS Normal Interrupt Disable. This bit, when set, disables the generation of the normal interrupt signal. This bit is similar to the I bit of the ARM926EJ-S core. This bit along with the FIDIS bit is used to enable secure operations. 0 Does not affect the normal interrupt generation 1 Disable all normal interrupts 21 FIDIS Fast Interrupt Disable. This bit, when set, disables the generation of the fast interrupt signal. This bit is similar to the F bit of the ARM926EJ-S core. This bit along with the NIDIS bit is used to enable secure operations. 0 Does not affect the fast interrupt generation 1 Disable all fast interrupts 20 NIAD Normal Interrupt Arbiter Rise ARM Level. This bit, when asserted, increases bus arbitration priority of ARM core when normal interrupt signal (nIRQ) is asserted. If an alternate master has ownership of the bus when a normal interrupt occurs, bus will be given back to the processor core after the DMA device has completed its accesses. NIAD bit does not affect alternate master accesses that are in progress. To prevent an alternate master from accessing the bus during an interrupt service routine, the interrupt flag must not be cleared until the end of the service routine. Another option is to use the ABFEN and ABFLAG bits. 0 Disregard the normal interrupt flag when evaluating bus requests 1 Normal interrupt flag increases bus arbitration priority of the ARM core to decrease the latency of Interrupt service routine 19 FIAD Fast Interrupt Arbiter Rise ARM Level. This bit functions same as NIAD bit except for the fast interrupts (nFIQ). 0 Disregard the fast interrupt flag when evaluating bus requests 1 Fast interrupt flag increases bus arbitration priority of the ARM core to decrease the latency of interrupt service routine. 18–17 Reserved. These bits are reserved and should read 0. 16 MD 15–12 Interrupt Vector Table Mode. Indicates whether the interrupt vector is located in high memory or low memory. 0 Interrupt vector table located in high memory from 0xFFFF_FF00 to 0xFFFF_FFFF 1 Interrupt vector table located in low memory from POINTER to POINTER+0xFF Reserved. These bits are reserved and should read 0. 11–2 Interrupt Vector Table Pointer. Indicates start of vector table when in low memory (MD =1). Only word-aligned tables POINTER are allowed, and 2 zeros are added in the LSBs when this value is used by AITC. The value stored here is left shifted by 2 bits, so the actual table vector can be directly written into the appropriate bits. The value stored in 10 bits, times 4, must be set greater than or equal to 0x0000_0024 and less than or equal to 0x0000_0F00. 1–0 Reserved. These bits are reserved and should read 0. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-9 ARM926EJ-S Interrupt Controller (AITC) 10.2.4 Normal Interrupt Mask Register (NIMASK) NIMASK controls the normal interrupt mask level. All normal interrupts with a priority level lower than or equal to NIMASK are disabled. The priority level of normal interrupts are determined by the normal interrupt priority level registers (NIPRIORITY7–0). Reset state of this register does not disable any normal interrupts. Writing all 1’s, or –1, to NIMASK sets normal interrupt mask to –1 which does not disable any normal interrupt priority levels. This hardware mechanism can be used to create reentrant normal interrupt routines by disabling lower priority normal interrupts. Refer Section 10.3.6 for more details on use of NIMASK register. This register is located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. This register can be only modified using 32-bit writes. Address 0x1004_0004 (NIMASK) R Access: Supervisor read/write 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 W Reset R NIMASK W Reset 1 1 1 Figure 10-4. Normal Interrupt Mask Register Format Table 10-5. Normal Interrupt Mask Register Field Description Field 31–5 4–0 NIMASK Description Reserved. These bits are reserved and should read 0. Normal Interrupt Mask. Controls normal interrupt mask level. All normal interrupts of priority level lower than or equal to the NIMASK will be disabled. 0 Disable priority level 0 normal interrupts 1 Disable priority level 1 and lower normal interrupts ... 0xE (14)Disable priority level 14 and lower normal interrupts 0xF (15)Disable all normal interrupts 0x10–0x1FDo not disable any normal interrupts MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-10 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) 10.2.5 Interrupt Enable Number Register (INTENNUM) The Interrupt Enable Number Register provides hardware accelerated enabling of interrupts. Any write to this register enables an interrupt source. If 6 LSBs are 000000, then interrupt source 0 is enabled. If 6 LSBs are 000001, then interrupt source 1 is enabled. And so forth. This register is decoded into a one hot mask that is logically OR-ed with INTENABLEH/INTENABLEL register. This hardware mechanism alleviates the need for an atomic read/modify/write sequence to enable an interrupt source. To enable interrupts 10 and 20, software only preforms two writes to AITC: first write 10 to INTENNUM register, then write 20 to INTENNUM register (order of writes is irrelevant). This register is located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. This register can be only modified using 32-bit writes. This register always reads back all 0s. Address 0x1004_0008 (INTENNUM) R Access: Supervisor read/write 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R W Reset ENNUM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 10-5. Interrupt Enable Number Register Format Table 10-6. Interrupt Enable Number Register Description Field 31–6 5–0 ENNUM Description Reserved. These bits are reserved and should read 0. Interrupt Enable Number. Writing to this register will enable the interrupt source associated with this value. 0 Enable interrupt source 0 1 Enable interrupt source 1 ... 63 Enable interrupt source 63 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-11 ARM926EJ-S Interrupt Controller (AITC) 10.2.6 Interrupt Disable Number Register (INTDISNUM) The Interrupt Disable Number Register provides hardware accelerated disabling of interrupts. Any write to this register disables one interrupt source. If the 6 LSBs are equal 000000, then interrupt source 0 is disabled. If the 6 LSBs equal 000001, then interrupt source 1 is disabled, and so on. This register is decoded into a one hot mask which is inverted and logically AND-ed with the INTENABLEH/INTENABLEL register. The hardware mechanism alleviates the need for an atomic read/modify/write sequence to disable an interrupt source. To disable interrupts 10 and 20, the software need only preform two writes to the AITC: first write 10 to INTDISNUM register, then write 20 to INTDISNUM register (the order of the writes is irrelevant). This register is located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. This register can be only modified using 32-bit writes. This register always reads back all 0s. Address 0x1004_000C (INTDISNUM) R Access: Supervisor read/write 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 W Reset R W Reset DISNUM 0 0 Figure 10-6. Interrupt Enable Number Register Format Table 10-7. Interrupt Disable Number Register Field Description Field 31–6 5–0 DISNUM Description Reserved. These bits are reserved and should read 0. Interrupt Disable Number. Writing to this register will disable the interrupt source associated with this value. 0 Disable interrupt source 0 1 Disable interrupt source 1 ... 63 Disable interrupt source 63 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-12 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) 10.2.7 Interrupt Enable Register High (INTENABLEH) and Low (INTENABLEL) The INTENABLEH and INTENABLEL registers are used to enable pending interrupt requests to the ARM9 core. Each bit in these registers corresponds to an interrupt source available in the system. The reset state of these registers are to have all interrupts masked. These registers can be updated by various methods: writing directly to INTENABLEH/INTENABLEL registers, setting bits in the INTENNUM register, or clearing bits in the INTDISNUM register. These registers are located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. These registers can be only modified using 32-bit writes. Address 0x1004_0010 (INTENABLEH) 31 30 29 28 Access: Supervisor read 27 26 25 R W rwm Reset 23 22 21 20 19 18 17 16 rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R INTENABLE[47:32] W rwm Reset 24 INTENABLE[63:48] 0 rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 10-7. Interrupt Enable Register High Format Address 0x1004_0014 (INTENABLEL) 31 30 29 28 Access: Supervisor read 27 26 25 R W rwm Reset 23 22 21 20 19 18 17 16 rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R INTENABLE[15:0] W rwm Reset 24 INTENABLE[31:16] 0 rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm rwm 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 10-8. Interrupt Enable Register Low Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-13 ARM926EJ-S Interrupt Controller (AITC) Table 10-8. Interrupt Enable Register Low and High Field Descriptions Field Description 31–0 Interrupt Enable. This bit enables the corresponding interrupt source to request a normal interrupt or a fast INTENABLE interrupt. A reset operation clears this bit. If an enable bit is set and the corresponding interrupt source is asserted, the interrupt controller will assert a normal or a fast interrupt request depending on associated INTTYPEH/INTTYPEL setting. 0 Interrupt disabled 1 Interrupt enabled and will generate a normal or fast interrupt upon assertion 10.2.8 Interrupt Type Register High (INTTYPEH) and Low (INTTYPEL) The INTTYPEH and INTTYPEL registers are used to select whether a pending interrupt source, when enabled with the INTENABLEH/INTENABLEL, will create a normal interrupt or a fast interrupt to the ARM9 core. Each bit in these registers corresponds to an interrupt source available in the system. The reset state of these registers will cause all enabled interrupt sources to generate a normal interrupt. These registers are located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. These registers can be only modified using 32-bit writes. Address 0x1004_0018 (INTTYPEH) 31 30 29 28 Access: Supervisor read/write 27 26 25 R 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R INTTYPE[47:32] W Reset 23 INTTYPE[63:48] W Reset 24 0 0 0 0 0 0 0 0 0 Figure 10-9. Interrupt Type Register High Format Address 0x1004_001C (INTTYPEL) 31 30 29 28 Access: Supervisor read/write 27 26 25 R 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R INTTYPE[15:0] W Reset 23 INTTYPE[31:16] W Reset 24 0 0 0 0 0 0 0 0 0 Figure 10-10. Interrupt Type Register Low Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-14 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-9. Interrupt Type Register High and Low Register Description Field Description 31–0 INTTYPE Interrupt Type. This bit indicates whether the corresponding interrupt source will request a normal interrupt or a fast interrupt. If INTTYPE bit is set and the corresponding interrupt source is asserted, the interrupt controller will assert a fast interrupt request. 0 Interrupt source will generate a normal interrupt (nIRQ). 1 Interrupt source will generate a fast interrupt (nFIQ). Normal Interrupt Priority Level Registers (NIPRIORITYn) 10.2.9 The Normal Interrupt Priority Level Registers (NIPRIORITY7–0) provide a software controllable prioritization of normal interrupts. Normal interrupts with a higher priority level will preempt normal interrupts with a lower priority. The reset state of these registers forces all normal interrupts to the lowest priority level. If a level 0 normal interrupt and a level 1 normal interrupt are asserted at the same time, the level 1 normal interrupt will be selected assuming that NIMASK has not disabled level 1 normal interrupts. If two level 1 normal interrupts are asserted at the same time, the level 1 normal interrupt with the highest source number will be selected, also assuming that NIMASK has not disabled level 1 normal interrupts. These registers can only be accessed to in privileged mode using 32-bit writes. Address 0x1004_0020 (NIPRIORITY7) 31 R 28 27 26 25 24 23 NIPR62 22 21 20 19 NIPR61 18 17 16 NIPR60 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR59 W Reset 29 NIPR63 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR58 0 0 0 0 NIPR57 0 0 0 0 NIPR56 0 0 0 0 0 Figure 10-11. Normal Interrupt Priority Level 7 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-15 ARM926EJ-S Interrupt Controller (AITC) Table 10-10. Normal Interrupt Priority Level Register 7 Field Description Bits Field Description 31–28 NIPR63 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 27–24 NIPR62 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt 23–20 NIPR61 19–16 NIPR60 15–12 NIPR59 11–8 NIPR58 7–4 NIPR57 3–0 NIPR56 Address 0x1004_0024 (NIPRIORITY6) 31 R 28 27 26 25 24 23 NIPR54 22 21 20 19 NIPR53 18 17 16 NIPR52 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR51 W Reset 29 NIPR55 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR50 0 0 0 0 NIPR49 0 0 0 0 NIPR48 0 0 0 0 0 Figure 10-12. Normal Interrupt Priority Level 6 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-16 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-11. Normal Interrupt Priority Level Register 6 Field Description Field Description 31–28 NIPR55 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 27–24 NIPR54 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt 23–20 NIPR53 19–16 NIPR52 15–12 NIPR51 11–8 NIPR50 7–4 NIPR49 3–0 NIPR48 Address 0x1004_0028 (NIPRIORITY5) 31 R 28 27 26 25 24 23 NIPR46 22 21 20 19 NIPR45 18 17 16 NIPR44 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR43 W Reset 29 NIPR47 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR42 0 0 0 0 NIPR41 0 0 0 0 NIPR40 0 0 0 0 0 Figure 10-13. Normal Interrupt Priority Level 5 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-17 ARM926EJ-S Interrupt Controller (AITC) Table 10-12. Normal Interrupt Priority Level Register 5 Field Description Field Description 31–28 NIPR47 27–24 NIPR46 23–20 NIPR45 19–16 NIPR44 15–12 NIPR43 11–8 NIPR42 7–4 NIPR41 3–0 NIPR40 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt Address 0x1004_002C (NIPRIORITY4) 31 R 28 27 26 25 24 23 NIPR38 22 21 20 19 NIPR37 18 17 16 NIPR36 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR35 W Reset 29 NIPR39 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR34 0 0 0 0 NIPR33 0 0 0 0 NIPR32 0 0 0 0 0 Figure 10-14. Normal Interrupt Priority Level 4 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-18 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-13. Normal Interrupt Priority Level Register 4 Field Description Field Description 31–28 NIPR39 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 27–24 NIPR38 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt 23–20 NIPR37 19–16 NIPR36 15–12 NIPR35 11–8 NIPR34 7–4 NIPR33 3–0 NIPR32 Address 0x1004_0030 (NIPRIORITY3) 31 R 28 27 26 25 24 23 NIPR30 22 21 20 19 NIPR29 18 17 16 NIPR28 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR27 W Reset 29 NIPR31 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR26 0 0 0 0 NIPR25 0 0 0 0 NIPR24 0 0 0 0 0 Figure 10-15. Normal Interrupt Priority Level 3 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-19 ARM926EJ-S Interrupt Controller (AITC) Table 10-14. Normal Interrupt Priority Level Register 3 Field Description Field Description 31–28 NIPR31 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 27–24 NIPR30 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt 23–20 NIPR29 19–16 NIPR28 15–12 NIPR27 11–8 NIPR26 7–4 NIPR25 3–0 NIPR24 Address 0x1004_0034 (NIPRIORITY2) 31 R 28 27 26 25 24 23 NIPR22 22 21 20 19 NIPR21 18 17 16 NIPR20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR19 W Reset 29 NIPR23 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR18 0 0 0 0 NIPR17 0 0 0 0 NIPR16 0 0 0 0 0 Figure 10-16. Normal Interrupt Priority Level 2 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-20 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-15. Normal Interrupt Priority Level Register 2 Field Description Bits Field Description 31–28 NIPR23 27–24 NIPR22 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 23–20 NIPR21 19–16 NIPR20 15–12 NIPR19 11–8 NIPR18 7–4 NIPR17 3–0 NIPR16 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt Address 0x1004_0038 (NIPRIORITY1) 31 R 28 27 26 25 24 23 NIPR14 22 21 20 19 NIPR13 18 17 16 NIPR12 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR11 W Reset 29 NIPR15 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR10 0 0 0 0 NIPR9 0 0 0 0 NIPR8 0 0 0 0 0 Figure 10-17. Normal Interrupt Priority Level 1 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-21 ARM926EJ-S Interrupt Controller (AITC) Table 10-16. Normal Interrupt Priority Level Register 1 Field Description Field Description 31–28 NIPR15 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 27–24 NIPR14 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt 23–20 NIPR13 19–16 NIPR12 15–12 NIPR11 11–8 NIPR10 7–4 NIPR9 3–0 NIPR8 Address 0x1004_003C (NIPRIORITY0) 31 R 28 27 26 25 24 23 NIPR6 22 21 20 19 NIPR5 18 17 16 NIPR4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R NIPR3 W Reset 29 NIPR7 W Reset 30 Access: Supervisor read/write 0 0 0 NIPR2 0 0 0 0 NIPR1 0 0 0 0 NIPR0 0 0 0 0 0 Figure 10-18. Normal Interrupt Priority Level 1 Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-22 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-17. Normal Interrupt Priority Level Register 0 Field Description Bits Field Description 31–28 NIPR7 27–24 NIPR6 Normal Interrupt Priority Level. Selects the software controlled priority level for the associated normal interrupt source. These registers do not affect the prioritization of fast interrupt priorities. 23–20 NIPR5 19–16 NIPR4 15–12 NIPR3 11–8 NIPR2 7–4 NIPR1 3–0 NIPR0 0 Lowest priority normal interrupt ... 15 Highest priority normal interrupt 10.2.10 Normal Interrupt Vector and Status Register (NIVECSR) The NIVECSR register displays the priority of the highest pending normal interrupt and also provides vector index of the interrupt’s service routine. This number can be used directly as an index into a vector table to select the highest pending normal interrupt source. This read-only register can only be accessed to in privileged mode. Address 0x1004_0040 (NIVECSR) 31 30 29 28 Access: Supervisor read 27 26 25 R 24 23 22 21 20 19 18 17 16 NIVECTOR W Reset 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 NIPRILVL W Reset 0 0 0 0 0 0 0 0 0 Figure 10-19. Normal Interrupt Vector and Status Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-23 ARM926EJ-S Interrupt Controller (AITC) Table 10-18. Normal Interrupt Vector and Status Register Field Description Field Description 31–16 Normal Interrupt Vector. Indicates vector index for the highest pending normal interrupt. NIVECTOR –1 No normal interrupt request pending 0 Interrupt 0 highest priority pending normal interrupt 1 Interrupt 1 highest priority pending normal interrupt ... 63 Interrupt 63 highest priority pending normal interrupt 64+ (not –1)unused, will not occur 15–0 NIPRILVL Normal Interrupt Priority Level. Indicates priority level of highest priority normal interrupt. This number can be written to NIMASK to disable current priority normal interrupts to build a reentrant normal interrupt system. –1 No normal interrupt request pending 0 Highest priority normal interrupt is level 0 1 Highest priority normal interrupt is level 1 ... 15 Highest priority normal interrupt is level 15 16+ (not –1)unused, will not occur 10.2.11 Fast Interrupt Vector and Status Register (FIVECSR) FIVECSR provides the vector index for highest priority active fast interrupt’s service routine (higher the source number of fast interrupt, higher will be the priority level). This hardware mechanism replaces the previous necessity for core support of the FF1 command. This number can be directly used as an index into a vector table to select the highest pending fast interrupt source. This read-only register is located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. Address 0x1004_0044 (FIVECSR) 31 30 29 28 Access: Supervisor read 27 26 25 R 24 23 22 21 20 19 18 17 16 FIVECTOR[31:16] W Reset 1 1 1 1 1 1 1 15 14 13 12 11 10 9 R 1 1 1 1 1 1 1 1 1 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 FIVECTOR[15:0] W Reset 1 1 1 1 1 1 1 1 1 Figure 10-20. Fast Interrupt Vector and Status Register Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-24 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-19. Fast Interrupt Vector and Status Register Description Field Description 31–0 FIVECTOR Fast Interrupt Vector. Indicates vector index for the highest pending fast interrupt. –1 No fast interrupt request pending (–1 is defined as all bits in the field are set to 1.) 0 Interrupt 0 highest pending fast interrupt 1 Interrupt 1 highest pending fast interrupt ... 63 Interrupt 63 highest pending fast interrupt 64+ (not –1)unused, will not occur 10.2.12 Interrupt Source Register High (INTSRCH) and Low (INTSRCL) INTSRCH and INTSRCL are both 32-bits wide. INTSRCH and INTSRCL reflect the status of all interrupt request inputs into the interrupt controller. Unused bit positions always read zero (no request pending). The state of this register out of reset is determined by the peripheral circuits generating the requests; normally, the requests would be inactive. These read-only registers can only be accessed in privileged mode and can only accessed with 32-bit reads. Address 0x1004_0048 (INTSRCH) 31 30 29 28 Access: Supervisor read 27 26 25 R 24 23 22 21 20 19 18 17 16 INTIN[63:48] W Reset1 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 INTIN[47:32] W Reset1 0 0 0 0 0 0 0 0 0 Figure 10-21. Interrupt Source Register High Format 1 The state of this register out of reset is determined by the peripheral circuits generating the requests; normally, the requests would be inactive. Address 0x1004_004C (INTSRCL) 31 30 29 28 Access: Supervisor read 27 26 25 R 24 23 22 21 20 19 18 17 16 INTIN[31:16] W Reset1 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 INTIN[15:0] W Reset1 0 0 0 0 0 0 0 0 0 Figure 10-22. Interrupt Source Register High Format MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-25 ARM926EJ-S Interrupt Controller (AITC) 1 The state of this register out of reset is determined by the peripheral circuits generating the requests; normally, the requests would be inactive. Table 10-20. Interrupt Source Register High and Low Description Field 31–0 INTIN Description Interrupt Source. Indicates the state of the corresponding hardware interrupt source. 0 Interrupt source negated 1 Interrupt source asserted 10.2.12.1 Interrupt Assignments High Table 10-21. Interrupt Source High (INTSRCH) Assignment Name Bit INT_DPTC Bit 31 Dynamic Process Temperature Compensate (DPTC) — INT_IIM Bit 30 IC Identify Module (IIM) — INT_LCDC Bit 29 LCD Controller (LCDC) — INT_SLCDC Bit 28 Smart LCD Controller (SLCDC) — INT_SAHARA Bit 27 Symmetric/Asymmetric Hashing and Random Accelerator — INT_SCM Bit 26 SCC SCM — INT_SMN Bit 25 SCC SMN — INT_USBOTG Bit 24 USB OTG — INT_USBHS2 Bit 23 USB HOST2 — INT_USBHS1 Bit 22 USB HOST1 — INT_H264 Bit 21 H264 — INT_EMMAPP Bit 20 eMMA Post Processor — INT_EMMAPRP Bit 19 eMMA Pre Processor — INT_FEC Bit 18 Fast Ethernet Controller — INT_UART5 Bit 17 UART5 — INT_UART6 Bit 16 UART6 — INT_DMACH15 Bit 15 DMA Channel 15 — INT_DMACH14 Bit 14 DMA Channel 14 — INT_DMACH13 Bit 13 DMA Channel 13 — INT_DMACH12 Bit 12 DMA Channel 12 — INT_DMACH11 Bit 11 DMA Channel 11 — INT_DMACH10 Bit 10 DMA Channel 10 — INT_DMACH9 Bit 9 DMA Channel 9 — INT_DMACH8 Bit 8 DMA Channel 8 — Interrupt Source Module Notes MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-26 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-21. Interrupt Source High (INTSRCH) Assignment (continued) Name Bit INT_DMACH7 Bit 7 DMA Channel 7 — INT_DMACH6 Bit 6 DMA Channel 6 — INT_DMACH5 Bit 5 DMA Channel 5 — INT_DMACH4 Bit 4 DMA Channel 4 — INT_DMACH3 Bit 3 DMA Channel 3 — INT_DMACH2 Bit 2 DMA Channel 2 — INT_DMACH1 Bit 1 DMA Channel 1 — INT_DMACH0 Bit 0 DMA Channel 0 — Interrupt Source Module Notes 10.2.12.2 Interrupt Assignments Low Table 10-22. Interrupt Source Low (INTSRCL) Assignment Name Bit INT_CSI Bit 31 CMOS Sensor Interface (CSI) INT_ATA Bit 30 Advanced Technology Attachment (ATA) INT_NFC Bit 29 NAND Flash Controller (NFC) — INT_PCMCIA Bit 28 PCMCIA/CF Host Controller (PCMCIA) — INT_WDOG Bit 27 Watchdog (WDOG) — INT_GPT1 Bit 26 General Purpose Timer (GPT1) — INT_GPT2 Bit 25 General Purpose Timer (GPT2) — INT_GPT3 Bit 24 General Purpose Timer (GPT3) — INT_PWM Bit 23 Pulse Width Modulator (PWM) — INT_RTC Bit 22 Real-Time Clock (RTC) — INT_KPP Bit 21 Key Pad Port (KPP) — INT_UART1 Bit 20 UART1 — INT_UART2 Bit 19 UART2 — INT_UART3 Bit 18 UART3 — INT_UART4 Bit 17 UART4 — INT_CSPI1 Bit 16 Configurable SPI (CSPI1) — INT_CSPI2 Bit 15 Configurable SPI (CSPI2) — INT_SSI1 Bit 14 Synchronous Serial Interface (SSI1) — INT_SSI2 Bit 13 Synchronous Serial Interface (SSI2) — Bit 12 I2C — INT_I2C1 Interrupt Source Module Bus Controller (I2C1) Notes — Hard Disk MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-27 ARM926EJ-S Interrupt Controller (AITC) Table 10-22. Interrupt Source Low (INTSRCL) Assignment (continued) Name Bit Interrupt Source Module Notes INT_SDHC1 Bit 11 Secure Digital Host Controller (SDHC1) — INT_SDHC2 Bit 10 Secure Digital Host Controller (SDHC2) — INT_SDHC3 Bit 9 Secure Digital Host Controller (SDHC3) — INT_GPIO Bit 8 General Purpose Input/Output (GPIO) — INT_MSHC Bit 7 Memory Stick Host Controller (MSHC) — INT_CSPI3 Bit 6 Configurable SPI (CSPI3) — INT_RTIC Bit 5 Real Time Integrity Checker (RTIC) — INT_GPT4 Bit 4 General Purpose Timer (GPT4) — INT_GPT5 Bit 3 General Purpose Timer (GPT5) — INT_GPT6 Bit 2 General Purpose Timer (GPT6) — INT_I2C2 Bit 1 I2C Bus Controller (I2C2) — Reserved Bit 0 Reserved — 10.2.13 Interrupt Force Register High (INTFRCH) and Low (INTFRCL) INTFRCH and INTFRCL are both 32-bits wide. They allow software generation of interrupts for each of the possible interrupt sources for functional or debug purposes. System level design may reserve one or more sources for software purposes to allow software to self-schedule interrupts by forcing one or more of these “sources” in appropriate interrupt force register(s). These registers can only be accessed to in privileged mode. These registers can be only modified using 32-bit writes. Address 0x1004_0050 (INTFRCH) 31 30 29 28 Access: Supervisor read/write 27 26 25 R 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R FORCE[47:32] W Reset 23 FORCE[63:48] W Reset 24 0 0 0 0 0 0 0 0 0 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-28 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Address 0x1004_0054 (INTFRCL) 31 30 29 Access: Supervisor read/write 28 27 26 25 R 22 21 20 19 18 17 16 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 R FORCE[15:0] W Reset 23 FORCE[31:16] W Reset 24 0 0 0 0 0 0 0 0 0 Figure 10-23. Interrupt Force Register Format Table 10-23. Interrupt Force Register High and Low Field Description Field 31–0 FORCE Description Interrupt Source Force Request. Used to force a request for the corresponding interrupt source. 0 Standard interrupt operation 1 Interrupt forced asserted 10.2.14 Normal Interrupt Pending Register High (NIPNDH) and Low (NIPNDL) NIPNDH and NIPNDL are both 32-bits wide registers used to monitor the outputs of the enable and masking operations. These registers are actually a set of buffers; therefore, reset state of these registers are determined by normal interrupt enable registers, interrupt mask register and interrupt source registers. The value reflected in these registers is unaffected by the value of NIMASK register. These read-only registers are located on ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed in privileged mode Address 0x1004_0058 (NIPNDH) 31 30 29 28 Access: Supervisor read 27 26 25 R 24 23 22 21 20 19 18 17 16 NIPEND[63:48] W Reset 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 NIPEND [47:32] W Reset 0 0 0 0 0 0 0 0 0 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-29 ARM926EJ-S Interrupt Controller (AITC) Address 0x1004_005C (NIPNDL) 31 30 29 28 Access: Supervisor read 27 26 25 R 24 23 22 21 20 19 18 17 16 NIPEND[31:16] W Reset 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 NIPEND[15:0] W Reset 0 0 0 0 0 0 0 0 0 Table 10-24. Normal Interrupt Pending Register High and Low Description Field Description 31–0 NIPEND Normal Interrupt Pending Bit. If a normal interrupt enable bit is set and the corresponding interrupt source is asserted, the interrupt controller will assert a normal interrupt request. The normal interrupt pending bits reflect the interrupt input lines which are asserted and are currently enabled to generate a normal interrupt. 0 No normal interrupt request 1 Normal interrupt request pending 10.2.15 Fast Interrupt Pending Register High (FIPNDH) and Low (FIPNDL) FIPNDH and FIPNDL are both 32-bits wide registers used to monitor the outputs of enable and masking operations. These registers are actually a set of buffers; therefore, reset state of these registers are determined by fast interrupt enable registers, interrupt mask register and interrupt source registers. These read-only registers are located on the ARM926EJ-S native bus, accessible in 1 cycle, and can only be accessed to in privileged mode. Address 0x1004_0060 (FIPNDH) 31 30 29 Access: Supervisor read 28 27 26 25 R 24 23 22 21 20 19 18 17 16 FIPEND[63:48] W Reset 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 FIPEND[47:32] W Reset 0 0 0 0 0 0 0 0 0 MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-30 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Address 0x1004_0064 (FIPNDL) 31 30 29 Access: Supervisor read 28 27 26 25 R 24 23 22 21 20 19 18 17 16 FIPEND[31:16] W Reset 0 0 0 0 0 0 0 15 14 13 12 11 10 9 R 0 0 0 0 0 0 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 FIPEND[15:0] W Reset 0 0 0 0 0 0 0 0 0 Figure 10-24. Fast Interrupt Pending Register High and Low Format Table 10-25. Fast Interrupt Pending Register High and Low Field Description Field Description 31–0 FIPEND Fast Interrupt Pending Bit. If fast interrupt enable bit is set and the corresponding interrupt source is asserted, interrupt controller will assert fast interrupt request. Fast interrupt pending bits reflect interrupt input lines which are asserted and are currently enabled to generate a fast interrupt. 0 No fast interrupt request 1 Fast interrupt request pending 10.3 10.3.1 ARM926EJ-S Interrupt Controller Operation ARM926EJ-S Prioritization of Exception Sources The ARM926EJ-S core imposes the following priority among the various exceptions: • Reset (highest priority) • Data Abort • Fast Interrupt • Normal Interrupt • Prefetch Abort • Undefined Instruction and SWI (lowest priority) 10.3.2 AITC Prioritization of Interrupt Sources AITC module prioritizes various interrupt sources by source number where higher source numbers have higher priority. Fast interrupt always have higher priority over normal interrupts. Interrupt requests are prioritized in the following sequence: 1. Fast interrupt requests, in order of highest source number 2. Normal interrupt requests, in order of highest priority level, then in order of highest source number with the same priority level MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-31 ARM926EJ-S Interrupt Controller (AITC) 10.3.3 Assigning and Enabling Interrupt Sources Interrupt controller provides for flexible assignment of any interrupt source to one of the two core interrupt request inputs. This is done by setting the appropriate bits in INTENABLEH/INTENABLEL registers and INTTYPEH/INTTYPEL registers. Usually, interrupt assignment is done once during system initialization and does not affect interrupt latency. Interrupt assignment is the first of three steps required to enable an interrupt source, and this is done at chip integration. The second step is to program the source to generate interrupt requests. The final step is to enable the interrupt inputs in the core by clearing the normal interrupt disable (I) and/or the fast interrupt disable (F) bits in the program status register (CPSR). 10.3.4 Enabling Interrupt Sources There are two methods of enabling or disabling interrupts in the AITC. The first method is directly reading INTENABLEH/INTENABLEL registers, logically OR or BIT CLEAR these registers with a generated masks, then writing back to INTENABLEH/INTENABLEL registers. The second method is performing an atomic write to source number in INTENNUM register. AITC will decode this 6-bit register and enable one of the 64 interrupt sources. AITC will automatically generate a “one hot” enable mask and logically OR this mask to the correct INTENABLEH or INTENABLEL register. To disable interrupts is the same except the source number is written to the INTDISNUM register. 10.3.5 Typical Interrupt Entry Sequences Table 10-26 shows a typical pipeline sequence for ARM926EJ-S core when a normal interrupt occurs, assuming single cycle memories, it approximately takes 6 clocks from normal interrupt acknowledgment within ARM926EJ-S to fetch first opcode of interrupt routine. Table 10-27 shows a typical pipeline sequence for ARM926EJ-S core when a fast interrupt occurs, assuming that FIQ service routine begins at 0x0000_001C and single cycle memories. Table 10-26. Typical Hardware Accelerated Normal Interrupt Entry Sequence TIME ADDR –2 –1 nIRQ assert Last ADDR before nIRQ +4 / +2 +8 / +4 0x0000_0018 +4 +8 Vector Table Fetch 0 1 2 3 4 5 Link Adjust Fetch Dec Exec Data Wrbk Fetch Dec 6 7 8 Fetch Dec Exec nIRQ ack. Dec Exec Fetch Dec Fetch Fetch Vector n/a nIRQ Routine MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-32 Freescale Semiconductor ARM926EJ-S Interrupt Controller (AITC) Table 10-26. Typical Hardware Accelerated Normal Interrupt Entry Sequence (continued) TIME ADDR –2 –1 0 1 2 3 4 5 6 +4 7 8 Fetch Dec +8 Fetch Table 10-27. Typical Fast Interrupt Entry Sequence TIME ADDR –2 –1 nFIQ assert Last ADDR before nFIQ +4 / +2 +8 / +4 Fetch 0 1 2 Link Adjust Fetch Dec Exec Fetch Dec nFIQ ack. Dec Exec Fetch Dec Fetch 0x0000_001c +4 +8 10.3.6 3 Fetch Writing Reentrant Normal Interrupt Routines AITC can be used to create a reentrant normal interrupt system. This enables preempting of lower priority level interrupts by higher priority level interrupts. This requires a small amount of software support and overhead. 1. Push the link register (LR_irq) on to the stack (SP_irq) 2. Push the saved status register (SPSR_irq) on to the stack 3. Read the current value of NIMASK and push this value on to the stack 4. Read current priority level via NIVECSR 5. Interrupts of the equal or lesser priority than the current priority level must be masked via the NIMASK register by writing value from NIVECSR 6. Clear I bit in ARM926EJ-S core by a MSR or MRS command sequence (now a higher priority normal interrupt can preempt a lower priority one). Also change operating mode of the core to System Mode from IRQ mode 7. Push System Mode link register (LR) on to the stack (SP_user) 8. The traditional interrupt service routine is now included 9. Pop System Mode link register (LR) from the stack (SP_user) 10. Set I bit in ARM926EJ-S core by MSR or MRS command sequence (disables all normal interrupts) 11. Also change the operating mode of the core to IRQ Mode from System mode 12. Pop the original value of normal interrupt mask and write to the NIMASK register MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 10-33 ARM926EJ-S Interrupt Controller (AITC) 13. The saved status register must be popped from the stack (SP_irq) 14. The link register must be popped from the stack into the PC 15. Return from nIRQ NOTE Steps 1, 2, 13, and 14 are automatically done by most C compilers and are included for completeness. 10.3.7 AHB Interface of AITC AITC is AHB compliant. This means, IDLE or BUSY cycles which are presented to AITC will receive an aitc_hready (as required by specification). MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 10-34 Freescale Semiconductor Book II, Part 2: Security Introduction This part provides an overview of the modules that make up the i.MX27 security systems. Chapter 11, “Security Controller (SCC),” on page 11-1 Chapter 12, “Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2),” on page 12-1 Chapter 13, “Run-Time Integrity Checker (RTIC),” on page 13-1 Chapter 14, “IC Identification (IIM),” on page 14-1 Security Controller (SCC) The Security Controller (SCC) is a hardware component of the Platform Independent Security Architecture (PISA) baseline, and is itself composed of two sub-blocks, the Secure RAM and the Security Monitor. The primary functionality of the SCC is associated with establishing the following: • A centralized security state controller and hardware security state with a hardware configured, unalterable security policy • An uninterruptable hardware mechanism to detect and respond to threat detection signals (specifically platform test access signals) • A device-unique data protection/encryption resource to enable off chip storage of security sensitive data • An internal storage resource that automatically and irrevocably destroys plain text security sensitive data upon threat detection Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) is a security co-processor that forms part of the Platform Independent Security Architecture (PISA), and can be used on cell phone baseband processors or wireless PDAs. It implements block encryption algorithms, (AES, DES, and 3DES), hashing algorithms (MD5, SHA-1, SHA-224, and SHA-256), stream cipher algorithm (ARC4), and a hardware random number generator. It has a slave IP bus interface for the host to write configuration and command information, and to read status information. It also has a DMA controller, with an AHB bus interface, to reduce the burden on the host to move the required data to and from memory. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor II.2-1 Run Time Integrity Checker (RTIC) The Run Time Integrity Checker (RTIC) is part of the Platform Independent Security Architecture (PISA) family of platform security components. Its function is to ensure the integrity of the peripheral memory contents and assist with boot authentication. The RTIC has the ability to verify the memory contents during system boot and during run time execution. If the memory contents at runtime fail to match the hash signature, an error in the security monitor is triggered. IC Identification (IIM) The IC Identification Module (IIM) provides an interface for reading and in some cases programming and/or overriding identification and control information stored in on-chip fuse elements. The module supports electrically-programmable poly fuses (e-Fuses). The IIM also provides a set of volatile software-accessible signals which can be used for software control of hardware elements, not requiring non-volatility. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 II.2-2 Freescale Semiconductor Chapter 11 Security Controller (SCC) The Security Controller (SCC) is composed of two sub-blocks, the Secure RAM and the Security Monitor (see Figure 11-1). The primary functionality of the SCC is associated with establishing the following: • A centralized security state controller and a hardware security state with a hardware configured, unalterable security policy • An uninterruptible hardware mechanism that detects and responds to threat detection signals (specifically, platform test access signals) • A device-unique data protection/encryption resource that enables off-chip storage of security-sensitive data An internal storage resource that automatically and irrevocably destroys plain text security-sensitive data upon threat detection. Debug Ports (indicating JTAG or Test modes) Security Key (SLID) Debug Detector Secure State Controller Timer Key Encryption Module Red Memory Status Security Policy State Algorithm Sequence Checker Black Memory Memory Controller Security Monitor Secure RAM Bus Interface Security Controller (SCC) IP Bus Figure 11-1. Security Controller Block Diagram MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 11-1 Security Controller (SCC) 11.1 Overview Security and security services, in an embedded or data processing platform, refer to the platform’s ability to provide mandatory and optional information protection services. Information in this context refers to all embedded data, both to program store and data load. Therefore, a secure platform is intended to protect information and data from unauthorized access in the form of inspection (read), modification (write), or execution (use). 11.2 External Signal Description The SCC has no external signals. NOTE Contact your Freescale Semiconductor sales office or distributor for additional information on SCC. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 11-2 Freescale Semiconductor Chapter 12 Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) The Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) is a security co-processor that forms part of Platform Independent Security Architecture (PISA), and can be used on cell phone baseband processors or wireless PDAs. It implements block encryption algorithms, (AES, DES, and 3DES), hashing algorithms (MD5, SHA-1, SHA-224, and SHA-256), stream cipher algorithm (ARC4), and a hardware random number generator. It has a slave IP bus interface for the host to write configuration and command information, and to read status information. It also has a DMA controller, with an AHB bus interface, to reduce the burden on the host to move the required data to and from memory. 12.1 Features SAHARA2 accelerates the following security functions: • AES encryption/decryption — ECB, CBC, CTR, and CCM modes — 128 bit key • DES/3DES — EBC, CBC and CTR modes — 56-bit key with parity (DES) — 112-bit or 168-bit key with parity (3DES) • ARC4 (RC4-compatible cipher) — 5-16 byte key — Host accessible S-box • MD5, SHA-1, SHA-224 and SHA-256 hashing algorithms. — Messages lengths which are multiples of bytes. — Autopadding supported. — HMAC (support for IPAD and OPAD via descriptors). — Up to 232 byte message length. • Random number generator (based NIST Approved PRNG - FIPS 186-2). — Entropy is generated via an independent free running ring oscillators SAHARA2 also provides the following enhanced features: • Descriptor based processing to reduce communication between host processor and SAHARA2 • Low power design MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 12-1 Symmetric/Asymmetric Hashing and Random Accelerator (SAHARA2) • • — Automatic power down of individual blocks when not in use — Clock gating on registers — RNG sleep mode Restricted access to potentially sensitive information — Internal registers are cleared after descriptor chain has completed processing in BATCH mode — Security Monitor can cause data to be cleared. — Scan reset and scan exit signals prevent data being scanned out. Mixed Endianness support. NOTE Contact your Freescale Semiconductor sales office or distributor for additional information on SAHARA2. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 12-2 Freescale Semiconductor Chapter 13 Run-Time Integrity Checker (RTIC) The Run-Time Integrity Checker (RTIC) function is to ensure the integrity of the peripheral memory contents, and assist with boot authentication. The RTIC has the ability to verify the memory contents during system boot and during run-time execution. If the memory contents at run-time fail to match the hash signature, an error in the security monitor is triggered. Figure 13-1 is a block diagram of the RTIC. AHB SAM hclk_gated DMAC en IP-Bus hclk Clock IP-Bus Controller Controller Run-time IP-Bus T-Secure Timer Hash Once Timer Module Hash hclk_gated scc_rtic_err Register File ckil (32 kHz) Figure 13-1. RTIC Block Diagram 13.1 Features The RTIC offers the following features: • SHA-1 message authentication • Input DMA interface • Segmented data gathering to support non-contiguous data blocks in memory (up to two segments per block) • Works with high assurance boot process • Support for up to four independent memory blocks • Programmable DMA bus duty cycle timer and watchdog timer • Power-saving clock gating logic MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 13-1 Run-Time Integrity Checker (RTIC) • • Hardware configurable Big/Little-Endian data format Full word memory reads (word-aligned addresses, multiple of 32-bit lengths) 13.1.1 Modes of Operation The RTIC operates in two primary modes: • One-time hash mode — Is used during high assurance boot for code authentication or one time integrity checking — Stores hash result internally and signals interrupt to host • Continuous hash mode — Is used at run-time to continuously to verify integrity of memory contents — Checks re-generated hash against internally stored values and interrupts host only if error occurs 13.2 Initialization/Application Information 13.2.1 System Application The RTIC is intended to serve as a single-use hash accelerator to assist with code authentication and other services at boot time, and as an autonomous/passive memory integrity checker during run-time. It is programmed through the IP-slave interface, and scans the peripheral memory contents over the AHB interface using direct memory access. A typical system configuration using the RTIC is shown in Figure 13-2. Memory A Memory B Memory C Memory D ARM Host Processor AHB ipi_err_int SCC Run-Time Integrity Checker IP Interface Figure 13-2. System Diagram In this example, there are four independent memory blocks that can be checked by the RTIC. Memories A,B, and C have their contents partitioned over non-contiguous spaces. Memory D does not contain any MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 13-2 Freescale Semiconductor Run-Time Integrity Checker (RTIC) physical partitioning. The host would program the RTIC with the starting address and length of each partition inside memory A, B, and C. For memory D, only one starting address and length would be specified, with the second start address/length fields for memory D being set to 0. After setting the A/B/C/D hash once memory enable bits in the RTIC control register and hash once bit in the RTIC command register, the RTIC hashes each memory and stores the result in its hash register file to be read by the host. If the RTIC is used to verify that the memories are not corrupted during run-time, the A/B/C/D run-time memory enable bits in the control register must be set, followed by the tun time check bit in the RTIC command register. The RTIC re-hashes each enabled memory in a continuous loop until either an error occurs or the RTIC is reset. NOTE Contact your Freescale Semiconductor sales office or distributor for additional information on RTIC. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 13-3 Run-Time Integrity Checker (RTIC) MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 13-4 Freescale Semiconductor Chapter 14 IC Identification (IIM) The IC Identification Module (IIM) provides an interface for reading and, in some cases, programming and/or overriding identification and control information stored in on-chip fuse elements. The IIM also provides a set of volatile software-accessible signals that can be used for software control of hardware elements, not requiring non-volatility. 14.1 Overview The IIM provides the primary user-visible mechanism for interfacing with on-chip fuse elements. Among the uses for the fuses are unique chip identifiers, mask revision numbers, cryptographic keys, and various control signals requiring permanent non-volatility. The IIM also provides up to 28 volatile control signals. The IIM consists of a master controller and a set of registers to hold the values of signals visible outside the module. Up to eight arrays of fuses (e-Fuses) are associated with the IIM. The IIM is accessible using an 8-bit IP bus interface. An 8-bit interface is used because it matches the natural width of the fuse arrays. 14.1.1 • • • • • • • • • • • Features Up to eight independent fuse banks (number of fuse banks and size of the bank are parameterized) Maximum usable fuse bank size is 2048 bits Laser- and e-Fuse banks may be intermixed on a per bank basis Support for driving secure JTAG challenge and response values to the SJC (size of each field configurable using RTL parameter; challenge default size is 64 bits, response default size is 56 bits) Up to 28 externally visible software-controlled volatile signals (driving SoC-level nets for feature enabling) lockable in groups of 7 Ability to provide up to two distinct 168-bit 3DES keys from a single set of fuses Ability to override fuse values in software (does not affect the fuse element); override capability can be permanently disabled on a per-bank basis Ability to write-protect e-Fuses on a per-bank basis Ability to scan-protect (read and program) on a per-bank basis Fuses may be programmed by software, directly by JTAG, or indirectly by JTAG using a processor Recommended signal assignments to maximize software re-use MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 14-1 IC Identification (IIM) NOTE Contact your Freescale Semiconductor sales office or distributor for additional information on IIM. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 14-2 Freescale Semiconductor Book II, Part 3: External Interfaces Introduction The i.MX27 contains the following external interfaces: Chapter 15, “External Memory Interface (EMI),” on page 15-1 Chapter 16, “Multi-Master Memory Interface (M3IF),” on page 16-1 Chapter 17, “Wireless External Interface Module (WEIM),” on page 17-1 Chapter 18, “Enhanced SDRAM Controller (ESDRAMC),” on page 18-1 Chapter 19, “NAND Flash Controller (NFC),” on page 19-1 Chapter 20, “Personal Computer Memory Card International Association (PCMCIA) Controller,” on page 20-1 External Memory Interface (EMI) The External Memory Interface (M3IF) controls all IC external memory accesses (read/write/erase/program) from all the masters in the system, through two Master Port Gaskets (MPG)—(interface [AHB 32-bit] and MPG64 [AHB 64-bit])—to different external memories. All accesses are arbitrated by the Multi Master Memory Interface (M3IF) module and controlled by the respective memory controller. The EMI contains different external memory controllers to support several memory devices: • M3IF—Multi Master Memory Interface • ESDCTL/MDDRC—Enhanced SDRAM/LPDDR memory controller • PCMCIA—PCMCIA memory controller • NFC—NAND Flash memory controller • WEIM—SRAM/PSRAM/FLASH memory controller Multi-Master Memory Interface (M3IF) The Multi-Master Memory Interface (M3IF) controls memory accesses (read/write/erase/program) from one or more masters through different port interfaces to different external memory controllers ESDCTL/MDDRC, PCMCIA, NANDFLASH, and WEIM. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor II.3-1 Wireless External Interface Module (WEIM) The Wireless External Interface Module (WEIM) provides the capability to the system for accessing external Flash and RAM memories connected to either of its six chip selects. It has the ability to provide a single-cycle burst access for external flashes and support for multiple burst devices when not using its smart burst feature. Other features include Big/Endian mode support, Cellular RAM support, and support for multiplexed address/data bus. Enhanced SDRAM Controller (ESDCTL) The Enhanced Synchronous Dynamic RAM Controller (ESDCTL) provides interface and control for synchronous DRAM memories for the system. SDRAM memories use a synchronous interface with all signals registered on a clock edge. A command protocol is used for initialization, read, write, and refresh operations to the SDRAM and is generated on the signals by the controller when required due to external or internal requests. It has support for both single data rate RAMs and double data rate SDRAMs. It supports 64, 128, 256, and 512-Mbit, 4 bank synchronous DRAM by two independent chip selects and with up to 64 Mbytes addressable memory per chip select. NAND Flash Controller (NFC) The NAND Flash Controller (NFC) device is a type of flash memory that is optimized for data storage applications with its unique cell structure, providing significant cost advantages over conventional NOR flash memory. The NAND Flash Controller integrates the functionality necessary for access to these devices. NAND Flash has a smaller bit cell but has a fast sequential access as compared to a NOR flash which has a large bit cell but a fast random access. This makes NAND Flash perfect as a data memory for storing audio/video files in NAND Flash because typically these files are stored in sequential manner while access to processor code is quite random. Personal Computer Memory Card International Association (PCMCIA) Controller The PCMCIA host adapter module provides the control logic for PCMCIA socket interfaces, and requires some additional external analog power switching logic and buffering. The additional external buffers allow the PCMCIA host adapter module to support one PCMCIA socket. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 II.3-2 Freescale Semiconductor Chapter 15 External Memory Interface (EMI) The Master Memory Interface (M3IF) is an External Memory Interface that controls all IC external memory accesses (read/write/erase/program) from all the masters in the system, through two port interfaces (MPG (AHB 32 bit) and MPG64 (AHB 64-bit) to different external memories. All accesses are arbitrated by the M3IF module and controlled by the respective memory controller. EMI contains different external memory controllers in order to support several memory devices: • M3IF—Multi Master Memory Interface • ESDRAMC/MDDRC—Enhanced SDRAM/LPDDR memory controller • PCMCIA—PCMCIA memory controller • NFC—NAND Flash memory controller • WEIM—SRAM/PSRAM/FLASH memory controller 15.1 Overview The M3IF-ESDCTL/MDDRC interface is optimized and designed to reduce access latency by generating multiple accesses through dedicated ESDCTL/MDDRC arbitration (MAB) module, which controls access to/from the Enhanced SDRAM/MDDR memory controller. For other memory interfaces, M3IF only arbitrates and forwards the masters requests received through the Master Port Gasket (MPG/MPG64) interface (and M3IF arbitration) to the respective memory controller. When a master request a memory access, the access will immediately be taken by the M3IF if no other access is in progress. The M3IF will forward the access to the respective memory controller (slave), and depending on the respective memory controller state a command to the memory will be generated. If the access can’t be started due to a previous active access, the master request pends (“HREADY” held negated) until it will be executed by the memory controller. When the access execution is completed the HREADY will be asserted and a new request can be processed. EMI provides the ability to connect to a wide variety of memory devices. This chapter contains technical information about the operation and configuration of the EMI modules in the chip to allow the designer to quickly integrate external memory devices into new and existing designs. Several of the modules in the EMI portion of the chip share pins with the PCMCIA, EIM, SDRAMC, and NAND controllers. The chip contains interfaces for the following types of memory devices: • PCMCIA • Flash Memory Devices • SDRAM/Low Power DDR (LPDDR) Figure 15-1 shows the M3IF block diagram. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 15-1 External Memory Interface (EMI) External Module Interface (EMI) Multi Master Memory Interface (M3IF) DMA M2 S2 M3 32 #3 MPG RTIC/ SAHARA2 M4 H264-PO 64 64 32 USBOTG #4 MPG64 #5 MPG64 H264-PO 64 #6 MPG64 H264-PO M5 SDRAM/MDDR ESDCTL/MDDRC CONTROLLER PCMCIA #7 MPG H264-AHB NAND FLASH A/P MAX SRAM/PSRAM FLASH Application (ARM) Platform PCMCIA CONTROLLER 64 eMMA-IT NAND FLASH CONTROLLER #2 MPG64 64 FEC WEIM CONTROLLER #1 MPG64 SLCDC M3IF ARBITRATION (AMB + M3A) TMAX 64 EMI I/O MUX #0 MPG64 EMI AHB MUX LCDC Figure 15-1. M3IF System Block Diagram MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 15-2 Freescale Semiconductor External Memory Interface (EMI) 15.2 Features M3IF includes these distinctive features: • Multi Master Memory Interface (M3IF) — Supports multiple requests from 8 masters through two different input ports interfaces: Master Port Gasket (MPG)—ARM9 AMBA AHB-Lite bus protocol. Master Port Gasket (MPG64)—AMBA AHB access with 64 bits data bus width. — Supports memory “snooping,” which monitors a region (from 2 Kbytes up to 16 Mbytes) in external memory for write accesses. • Enables AHB accesses to four different memory controllers (that share some of their I/O pads, through the EMI AHB MUX and EMI I/O MUX) • Enhanced SDRAM Controller (ESDCTL) or MDDR Controller (MDDRC) — Up to two chip selects (due to PADS sharing all 2 chip selects are supported only in case that WEIM CS2 and CS3 are not is use). — Supports 32 bit SDR SDRAM (up to 2 Gbytes @133 MHz) — Supports 32 bit MDDR SDRAM (up to 2 Gbytes @ 266 MHz) • NAND Flash Controller (NFC) — 8/16 bit NAND Flash (up to 2 Gbyte address space) — 2-Kbyte RAM Internal Buffer • Personal Computer Memory Card International Association Controller (PCMCIA) — Support PCMCIA Rel 2.1 — Compact Flash — PC Card — TrueID Mode • Wireless External Interface Memory Controller (WEIM) — Up to 6 chip selects (due to PADS sharing all 6 chip selects are supported only in case that both ESDCTL/MDDRC chip selects are not is use). — Supports 16-bit SRAM memories — Supports 16-bit PSRAM (up to 133 MHz) memories — Support s16-bit (NOR) FLASH memories MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 15-3 External Memory Interface (EMI) 15.3 PCMCIA Host Adapter The Personal Computer Memory Card International Association (PCMCIA) interface provides a glueless interface to devices that comply with the PCMCIA association standard PCMCIA 2.1, which defines usage of memory and I/O devices as insertable and exchangeable peripherals for personal computers or PDAs. Examples of these types of devices include Compact Flash and WLAN adapters. Figure 15-2 shows a simplified block diagram of the PCMCIA controller. A[25:0] PC Card PCMCIA Controller D[15:0] OE CARD Interface WE IORD IOWR REG WAIT CE1 AHB bus CE2 AHB Interface R/W POE RESET access error RDY/BSY IOIS16/WP BVD1 interrupts INT GEN Static BVD2 Signals CD1 Interface CD2 debug_signals VS1 VS2 Vcc/Vpp PWRON Card Power Circuit endianness pcmcia_access Figure 15-2. PCMCIA Host Adapter Simplified Block Diagram PCMCIA host adapter module provides the all the necessary control logic for a single PCMCIA socket and only requires some additional external analog power switching logic and buffering for PC card operations. PCMCIA host adapter module can support one PCMCIA socket. PCMCIA controller shares its pins with other modules in the EIM area of the chip. The modules that share pins with PCMCIA are EIM, SDRAMC and NAND controllers. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 15-4 Freescale Semiconductor External Memory Interface (EMI) 15.3.1 Interrupt Generation There are 14 interrupt sources in PCMCIA controller. In addition, PCMCIA generates a signal which is a locator of all the possible interrupts. It is up to the system’s integrator to decide which signal(s) to connect to the system’s interrupt controller module. PCMCIA Input Pins Register (PIPR) reports any change of inputs from the PCMCIA card to the host (BVD,CD,RDY,VS). PCMCIA Controller Status Changed Register (PSCR) contents are logically ANDed with PCMCIA Controller Enable Register (PER) to generate a PCMCIA controller interrupt. The interrupt level is user programmable and the PCMCIA controller can generate an additional interrupt for RDY/IREQ that can trigger upon a level (low or high) change or edge (fall or rise) of the input signal. 15.3.2 Card Extraction When a PC card is extracted the PCMCIA controller’s registers are not reset. The registers settings remain the same as before the card’s extraction. This allows the host software to quickly activate the card once the CIS indicates that it is the same card on reinsertion. 15.3.3 TrueIDE Support The ATA standard specifies an AT attachment interface between the host systems and storage devices. PCMCIA controller can be dynamically configured to support a PCMCIA-compatible ATA disk interface (commonly known as IDE) instead of the standard PCMCIA card interface. Using the TrueIDE interface on the PCMCIA controller changes the function of some card socket signals to support the needs of ATA disk interface. 15.4 NAND Flash Controller (NFC) The NFC module interfaces standard NAND Flash devices to the IC and hides the complexities of accessing a NAND Flash memory device. It provides a glueless interface to both 8-bits and 16-bits NAND Flash parts with page sizes of 512 Bytes or 2 Kilobytes and densities up to 2 Gbit. Figure 15-3 shows a simplified block diagram of the NAND Flash controller. MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 Freescale Semiconductor 15-5 External Memory Interface (EMI) RAM BUFFER ECC CONTROL BOOTLOADER READ and WRITE CLE ALE CE HOST CONTROL WE DATA OUTPUT REGISTER (COMMAND ADDRESS/ STATUS) ADDRESS CONTROL NAND FLASH CONTROL AHB BUS INTERFACE AHB BUS RE WP RB DIN DOUT Figure 15-3. NAND Flash Controller Simplified Block Diagram 15.4.1 Operation Communicating with a Flash memory device begins by the AHB host initiating a read from the NAND Flash controller (NFC). This is accomplished by configuring the NFC and then waiting for an interrupt from the Flash memory device to be generated. When the NFC receives the interrupt, it inputs a page from the Flash memory device, and upon completion, generates an interrupt to the AHB Host. When AHB host receives the NFC interrupt, it reads the content from the internal RAM buffer of the NFC. To complete the operation the AHB host checks the status of operation by reading the NFC status registers. Data that is exchanged with the Flash memory device is temporarily maintained in a 2 kilobyte RAM buffer. This buffer is used as the boot RAM during a cold reset (if the IC is configured for a boot to be carried out from the NAND Flash device). After the boot load completes, the RAM is available as buffer RAM for normal Flash memory operations. 15.4.1.1 Internal and External Communications To ensure the greatest degree of flexibility, NFC provides an internal X16 bit and X32 bit interface to the AHB bus allowing, 16-bit or 32-bit bus transfers, and a pin selectable X8 or X16 interface to the external NAND Flash memory device. All communications between the NFC and the ARM9 platform is accomplished through the AHB host. Configuration and control of the NFC by the host is done using 14 16-bit registers. NFC generates all the control signals that controls the NAND Flash: CE (Flash Chip Enable), RE (Read Enable for read operations), WE (Flash Write Enable), CLE (Flash Command Latch Enable), ALE (Flash Address Latch Enable). It also monitors the R/nB (Flash Ready/Busy indication) signal to check if the NAND Flash MCIMX27 Multimedia Applications Processor Reference Manual, Rev. 0.4 15-6 Freescale Semiconductor External Memory Interface (EMI) memory device is currently in the middle of an operation. Flash memory data’s integrity is monitored by automatic generation of ECC code of data during NFCs data loading from NAND Flash memory devices. 15.4.1.2 Sharing of I/O Pins The NFC provides necessary logic to share I/O pins with pins of another memory controller. NFC state machine halts when a request to free the pins is asserted. NAND Flash signals when it finishes the existing transfer allowing other memory controller to control them. Since NAND Flash memory accesses are typically long and relatively slow, priority is given to other memory controller sharing the pins. NFC must wait until other memory controller is finished wi">
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