STMicroelectronics STH36N60M6-7 Datasheet
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STH36N60M6-7
N-channel 600 V, 0.085
Ω typ., 30 A MDmesh™ M6
Power MOSFET in a H²PAK-7 package
Datasheet - preliminary data
Figure 1: Internal schematic diagram
Features
Order code V
DS
R
DS(on)
max. I
D
STH36N60M6-7 600 V 0.099 Ω 30 A
Reduced switching losses
Lower R
DS(on)
x area vs previous generation
Low gate input resistance
100% avalanche tested
Zener-protected
High creepage package
Excellent switching performance thanks to the extra driving source pin
Applications
Switching applications
Description
The new MDmesh™ M6 technology incorporates the most recent advancements to the well-known and consolidated MDmesh family of SJ
MOSFETs by STMicroelectronics. Compared with the previous MDmesh generation, M6 combines an excellent improvement to R
DS(on)
* area with one of the most effective switching behaviors available, and a user-friendly driving experience for maximum end-application efficiency.
Table 1: Device summary Obsolete Product(s) - Obsolete Product(s)
Order code Marking Package Packing
STH36N60M6-7 36N60M6 H²PAK-7 Tape & reel
December 2015 DocID028697 Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/13 www.st.com
Contents
Contents
STH36N60M6-7
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
4 Package information ....................................................................... 7
H2PAK-7 package information .......................................................... 7
H2PAK-7 packaging information ..................................................... 10
5 Revision history ............................................................................ 12
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Electrical ratings STH36N60M6-7
1 Electrical ratings
Symbol
Table 2: Absolute maximum ratings
Parameter
V
GS
I
D
I
D
I
P
TOT
T
J
T stg
Gate-source voltage
Drain current (continuous) at T
C
= 25 °C
Drain current (continuous) at T
C
= 100 °C
Drain current (pulsed)
Total dissipation at T
C
= 25 °C
Peak diode recovery voltage slope
MOSFET dv/dt ruggedness
Operating junction temperature
Storage temperature
Value
± 25
30
19
120
208
15
50
-55 to 150
V/ns
°C
Notes:
(1)
Pulse width limited by safe operating area
(2)
I
SD
≤ 30 A, di/dt ̤ 400 A/μs; V
DS peak
< V
(BR)DSS
, V
DD
= 400 V
(3)
V
DS
≤ 480 V
Symbol
Table 3: Thermal data
Parameter
R thj-case
R thj-pcb
Thermal resistance junction-case max.
Thermal resistance junction-pcb max.
Value
0.6
30
Unit
°C/W
Notes:
(1)
When mounted on 1 inch² FR-4, 2 Oz copper board.
Symbol
Table 4: Avalanche characteristics
Parameter Value Unit
I
AR
Avalanche current, repetitive or not repetitive
(pulse width limited by T jmax
)
5
E
AS
Single pulse avalanche energy (starting T j
= 25°C, I
D
= I
AR
,
V
DD
= 50 V)
750
Obsolete Product(s) - Obsolete Product(s) mJ
A
Unit
V
A
A
A
W
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Electrical characteristics
2 Electrical characteristics
C iss
C oss
C rss
C oss
R
G
Q g
Q gs
STH36N60M6-7
T
C
= 25 °C unless otherwise specified
Symbol Parameter
Table 5: On/off-state
Test conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source breakdown voltage V
GS
= 0 V, I
D
= 1 mA
I
DSS
Zero gate voltage drain current
V
GS
= 0 V, V
DS
= 600 V
V
GS
= 0 V, V
DS
= 600 V;
T
C
= 125 °C
I
GSS
Gate body leakage current
V
GS(th)
Gate threshold voltage
V
DS
V
DS
= 0 V, V
= V
GS
, I
GS
D
= ±25 V
= 250 µA
600
2
R
DS(on)
Static drain-source on-resistance V
GS
= 10 V, I
D
= 15 A
Symbol Parameter
Table 6: Dynamic
Test conditions
V
1 µA
100 µA
±10 µA
3 4 V
0.085 0.099 Ω
Min. Typ. Max. Unit
Q gd
Input capacitance
Output capacitance
Reverse transfer capacitance
Equivalent output capacitance
Intrinsic gate resistance
Total gate charge
Gate-source charge
Gate-drain charge
V
DS
= 100 V, f = 1 MHz,
V
GS
= 0 V
V
DS
= 0 to 480 V, V
GS
= 0
V f = 1 MHz open drain
V
DD
= 480 V, I
D
= 30 A,
V
GS
= 10 V,
(See Figure 3: "Test circuit for gate charge behavior" )
-
-
-
-
-
-
-
-
1800
140
2.8
317
1.4
48
8
23
-
-
-
-
-
-
-
- pF pF pF pF
Ω nC nC nC
Notes:
(1)
C oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C oss
when V
DS increases from 0 to 80% V
DSS
Symbol Parameter
Table 7: Switching times
Test conditions Min. Typ. Max. Unit t t d(on) t r d(off)
Turn-on delay time
Rise time
Turn-off delay time
V
DD
= 300 V, I
D
= 15 A, R
G
= 4.7 Ω,
V
GS
= 10 V (See Figure 2: "Test circuit and Figure 7: "Switching time
-
-
-
16
10
7
-
-
- t f
Fall time
- 60 - ns ns ns ns
4/13 DocID028697 Rev 1
STH36N60M6-7
Symbol Parameter
I
SD
Source-drain current
I
Source-drain current
(pulsed)
V
Forward on voltage t
Q rr rr
I
RRM t rr
Q rr
I
RRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Table 8: Source-drain diode
Test conditions
I
I
SD
SD
V
I
SD
= 30 A, V
DD
GS
= 0 V
= 30 A, di/dt = 100 A/µs,
= 30 A, di/dt = 100 A/µs,
V
DD
= 60 V, T j
= 150 °C
(See Figure 7: "Switching time waveform" )
Electrical characteristics
-
-
-
-
-
-
-
Min. Typ. Max. Unit
- 30 A
- 120 A
340
5.3
31
430
7.7
36
1.6 V ns
µC
A ns
µC
A
Notes:
(1)
Pulse width limited by safe operating area
(2)
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Obsolete Product(s) - Obsolete Product(s)
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Test circuits
3 Test circuits
Figure 2: Test circuit for resistive load switching times
STH36N60M6-7
Figure 3: Test circuit for gate charge behavior
Figure 4: Test circuit for inductive load switching and diode recovery times
Figure 5: Unclamped inductive load test circuit
Figure 6: Unclamped inductive waveform Figure 7: Switching time waveform
Obsolete Product(s) - Obsolete Product(s)
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STH36N60M6-7
4
4.1
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
H
2
PAK-7 package information
Figure 8: H²PAK-7 package outline
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Package information
Dim.
H
H1
L
L1
L2
L3
M
R
V e1 e2
E
F
A
A1
C e
Table 9: H²PAK-7 package mechanical data mm
Min. Typ.
10.00
7.40
14.75
1.27
4.35
6.85
1.90
0.20
0°
4.30
0.03
1.17
2.34
4.88
7.42
0.45
0.50
-
STH36N60M6-7
Max.
10.40
7.60
15.25
1.40
4.95
7.25
2.50
0.60
8°
4.80
0.20
1.37
2.74
5.28
7.82
0.60
0.70
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STH36N60M6-7
Figure 9: H²PAK-7 recommended footprint
Package information
Dimensions are in mm.
Obsolete Product(s) - Obsolete Product(s)
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Package information
4.2 H
2
PAK-7 packaging information
Figure 10: Tape outline
STH36N60M6-7
Figure 11: Reel outline
T
REE L DIMENS IONS
40 mm min.
Acc ess ho le
At slot location
B
D Obsolete Product(s) - Obsolete Product(s)
C
N
A
G mea sured
At hu b
Full rad ius
Tape slot
In core for
Tape start
10/13 DocID028697 Rev 1
STH36N60M6-7
Dim.
P1
P2
R
T
W
A0
B0
D
D1
E
F
K0
P0
11.9
1.9
50
0.25
23.7
10.5
15.7
1.5
1.59
1.65
11.4
4.8
3.9
Tape
Package information
Table 10: Tape and reel mechanical data
Reel mm mm
Dim.
Min. Max. Min. Max.
10.7
15.9
1.6
1.61
1.85
11.6
5.0
4.1
12.1
2.1
0.35
24.3
A
B
C
D
G
1.5
12.8
20.2
24.4
N
T
100
Base quantity
Bulk quantity
330
13.2
26.4
30.4
1000
1000
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Revision history
5
STH36N60M6-7
Revision history
Date
14-Dec-2015
Table 11: Document revision history
Revision
1
Changes
Initial release.
Obsolete Product(s) - Obsolete Product(s)
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STH36N60M6-7
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics
– All rights reserved
Obsolete Product(s) - Obsolete Product(s)
13/13 DocID028697 Rev 1
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