STMicroelectronics STGWA25M120DF3 Datasheet
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STGWA25M120DF3 Datasheet Trench gate field-stop, 1200 V, 25 A, low-loss, M series IGBT in a TO-247 long leads package Features • Maximum junction temperature: TJ = 175 °C • • 10 μs of short-circuit withstand time Low VCE(sat) = 1.85 V (typ.) @ IC = 25 A • • Tight parameter distribution Positive VCE(sat) temperature coefficient • • Low thermal resistance Soft- and fast-recovery antiparallel diode C(2, TAB) Applications • • • • G(1) E(3) Industrial drives UPS Solar Welding NG1E3C2T Description Product status link STGWA25M120DF3 This device is an IGBT developed using an advanced proprietary trench gate fieldstop structure. The device is part of the M series IGBTs, which represent an optimal balance between inverter system performance and efficiency where the low-loss and the short-circuit functionality is essential. Furthermore, the positive VCE(sat) temperature coefficient and the tight parameter distribution result in safer paralleling operation. Product summary Order code STGWA25M120DF3 Marking G25M120DF3 Package TO-247 long leads Packing Tube DS12637 - Rev 1 - June 2018 For further information contact your local STMicroelectronics sales office. www.st.com STGWA25M120DF3 Electrical ratings 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Value Unit 1200 V Continuous collector current at TC = 25 °C 50 A Continuous collector current at TC = 100 °C 25 A Pulsed collector current 100 A Gate-emitter voltage ±20 V Transient gate-emitter voltage ±30 V Continuous forward current at TC = 25 °C 50 A Continuous forward current at TC = 100 °C 25 A IFP(1) Pulsed forward current 100 A PTOT Total dissipation at TC = 25 °C 375 W TSTG Storage temperature range -55 to 150 °C Operating junction temperature range -55 to 175 °C Value Unit Thermal resistance junction-case IGBT 0.4 °C/W Thermal resistance junction-case diode 0.96 °C/W 50 °C/W VCES IC ICP(1) VGE IF TJ Parameter Collector-emitter voltage (VGE = 0 V) 1. Pulse width is limited by maximum junction temperature. Table 2. Thermal data Symbol RthJC RthJA DS12637 - Rev 1 Parameter Thermal resistance junction-ambient page 2/15 STGWA25M120DF3 Electrical characteristics 2 Electrical characteristics TJ = 25 °C unless otherwise specified Table 3. Static characteristics Symbol V(BR)CES Parameter Test conditions Collector-emitter breakdown voltage VGE = 0 V, IC = 2 mA Min. VGE = 15 V, IC = 25 A, Forward on-voltage IF = 25 A 2.95 IF = 25 A, TJ = 125 °C 2.95 IF = 25 A, TJ = 175 °C 1.9 VGE(th) Gate threshold voltage VCE = VGE, IC = 1 mA ICES Collector cut-off current IGES Gate-emitter leakage current V 2.2 TJ = 175 °C VF 2.3 2.1 TJ = 125 °C Unit V 1.85 VGE = 15 V, IC = 25 A, VCE(sat) Max. 1200 VGE = 15 V, IC = 25 A Collector-emitter saturation voltage Typ. 5 6 4.1 V 7 V VGE = 0 V, VCE = 1200 V 25 µA VCE = 0 V, VGE = ±20 V ±250 nA Unit Table 4. Dynamic characteristics Symbol Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance Qg Qge Qgc DS12637 - Rev 1 Parameter Test conditions VCE = 25 V, f = 1 MHz, VGE = 0 V Min. Typ. Max. - 1550 - - 180 - - 65 - Total gate charge VCC = 960 V, IC = 25 A, - 85 - Gate-emitter charge VGE = 0 to 15 V - 11.5 - Gate-collector charge (see Figure 29. Gate charge test circuit) - 45.5 - pF nC page 3/15 STGWA25M120DF3 Electrical characteristics Table 5. IGBT switching characteristics (inductive load) Symbol td(on) tr (di/dt)on td(off) tf Parameter Typ. Max. Unit Turn-on delay time 28 - ns Current rise time 15 - ns 1370 - A/µs 150 - ns 155 - ns 0.85 - mJ Turn-on current slope Turn-off delay time Current fall time Test conditions Min. VCE = 600 V, IC = 25 A, VGE = 15 V, RG = 15 Ω (see Figure 28. Test circuit for inductive load switching) Eon(1) Turn-on switching energy (2) Turn-off switching energy 1.3 - mJ Total switching energy 2.15 - mJ Turn-on delay time 28 - ns Current rise time 17 - ns Eoff Ets td(on) tr (di/dt)on td(off) Turn-on current slope VCE = 600 V, IC = 25 A, 1270 - A/µs Turn-off delay time VGE = 15 V, RG = 15 Ω, 155 - ns 240 - ns 1.6 - mJ Current fall time TJ = 175 °C Eon (1) Turn-on switching energy (see Figure 28. Test circuit for inductive load switching) Eoff(2) Turn-off switching energy 1.9 - mJ Ets Total switching energy 3.5 - mJ tsc Short-circuit withstand time - µs tf VCC ≤ 600 V, VGE = 15 V, TJstart ≤ 150 °C 10 1. Including the reverse recovery of the diode 2. Including the tail of the collector current Table 6. Diode switching characteristics (inductive load) Symbol Test conditions Min. Typ. Max. Unit - 265 - ns trr Reverse recovery time Qrr Reverse recovery charge IF = 25 A, VR = 600 V, - 1.2 - µC Irrm Reverse recovery current VGE = 15 V, di/dt = 1000 A/µs - 19 - A dIrr/dt Peak rate of fall of reverse recovery current during tb (see Figure 28. Test circuit for inductive load switching) - 1090 - A/µs Err Reverse recovery energy - 0.22 - µJ trr Reverse recovery time - 585 - ns - 5 - µC - 30 - A - 270 - A/µs - 0.75 - µJ Qrr DS12637 - Rev 1 Parameter Reverse recovery charge Irrm Reverse recovery current dIrr/dt Peak rate of fall of reverse recovery current during tb Err Reverse recovery energy IF = 25 A, VR = 600 V, VGE = 15 V, TJ = 175 °C, di/dt = 1000 A/µs (see Figure 28. Test circuit for inductive load switching) page 4/15 STGWA25M120DF3 Electrical characteristics (curves) 2.1 Electrical characteristics (curves) Figure 1. Power dissipation vs case temperature GIPD301020140906FSR Ptot (W) VGE ≥ 15 V, T J ≤ 175 °C 320 Figure 2. Collector current vs case temperature GIPD301020140909FSR IC (A) VGE ≥ 15 V, T J ≤ 175 °C 50 40 240 30 160 20 80 10 0 0 100 50 TC(°C) 150 Figure 3. Output characteristics (TJ = 25 °C) GIPD301020140913FSR IC (A) 0 0 100 50 Figure 4. Output characteristics (TJ = 175 °C) GIPD301020140919FSR IC (A) VGE=15V 13V VGE=15V TC(°C) 150 13V 80 80 11V 11V 60 60 40 9V 40 9V 20 20 7V 0 0 7V 1 2 3 4 VCE(V) 5 Figure 5. VCE(sat) vs junction temperature VCE(sat) (V) GIPD301020140924FSR VGE=15V IC=50A 3.2 0 0 1 2 3 4 VCE(V) Figure 6. VCE(sat) vs collector current GIPD301020141133FSR VCE(sat) (V) 3.2 Tj=175°C VGE=15V 2.8 2.8 5 Tj=25°C 2.4 2.4 IC=25A 2.0 2.0 IC=12.5A 1.6 1.2 -50 DS12637 - Rev 1 Tj=-40°C 1.6 1.2 0 50 100 150 TC(°C) 0.8 0 10 20 30 40 IC(A) page 5/15 STGWA25M120DF3 Electrical characteristics (curves) Figure 7. Collector current vs switching frequency GIPD301020141144FSR IC (A) Figure 8. Safe operating area GIPD301020141151FSR IC (A) TC=80°C 60 TC=100°C 100 1µs 40 10µs 10 20 Rectangular current shape, (duty cycle=0.5, Vcc= 600V Rg=15Ω, Vge=0/15V, Tj=175 °C) 0 1 Single pulse, Tc=25°C Tj<175°C, VGE=15V f(kHz) 10 100 10 1ms 1000 VCE(V) Figure 10. Diode VF vs forward current Figure 9. Transfer characteristics GIPD301020141159FSR IC (A) 1 1 100µs GIPD301020141203FSR VF (V) Tj=-40°C Tj=25°C 6 80 5 60 VCE = 8V 4 40 Tj=25°C 3 Tj=175°C Tj=175°C 2 20 0 3 1 5 7 9 11 VGE(V) Figure 11. Normalized VGE(th) vs junction temperature GIPD301020141315FSR VGE(th) (norm) VCE=VGE IC=1mA 1.1 0 0 0.96 0.8 0.92 DS12637 - Rev 1 100 80 IC(A) IC=2mA 1.04 0.9 50 60 GIPD301020141322FSR V(BR)CES (norm) 1.0 0 40 Figure 12. Normalized V(BR)CES vs junction temperature 1.0 0.7 -50 20 150 TC(°C) 0.88 -50 0 50 100 150 TC(°C) page 6/15 STGWA25M120DF3 Electrical characteristics (curves) Figure 13. Capacitance variations Figure 14. Gate charge vs gate-emitter voltage GIPD301020141335FSR C(pF) GIPD301020141341FSR VGE(V) VCC = 960 V IC = 25 A IG = 1 mA 16 Cies 1000 12 8 100 Coes f= 1MHz 4 10 0.1 Cres 100 10 1 VCE(V) Figure 15. Switching energy vs collector current GIPD301020141347FSR E(mJ) 3.2 20 40 60 80 Qg(nC) Figure 16. Switching energy vs gate resistance GIPD301020141410FSR E(mJ) VCC=600V, VGE=15V IC=25A, Tj=175°C VCC=600V, VGE=15V Rg=15Ω, Tj=175°C 2.4 0 0 2.6 2.2 Eoff Eoff 1.6 1.8 Eon 0.8 0 0 1.4 10 20 30 40 50 IC(A) Figure 17. Switching energy vs junction temperature GIPD301020141418FSR E(mJ) 1 0 10 20 30 40 50 60 Rg(Ω) Figure 18. Switching energy vs collector emitter voltage GIPD301020141422FSR E(mJ) VCC=600V, VGE=15V IC=25A, Rg=15Ω 1.8 Eon VGE=15V, Tj=175°C IC=25A, Rg=15Ω 2.5 1.6 2 Eoff 1.4 Eoff Eon 1.5 1.2 1 0.8 DS12637 - Rev 1 0 1 Eon 50 100 150 TJ(°C) 0.5 200 400 600 800 VCE(V) page 7/15 STGWA25M120DF3 Electrical characteristics (curves) Figure 19. Short-circuit time and current vs VGE GIPD301020141425FSR Isc(A) tsc(µs) VCC ≤ 600V TJ ≤150 °C 35 Figure 20. Switching times vs collector current GIPD301020141429FSR t(ns) VCC=600V, VGE=15V Isc Tj=175°C, Rg=15Ω tf 140 tsc tdoff 100 tdon 100 25 tr 10 15 5 60 9 10 11 12 13 14 15 20 VGE(V) Figure 21. Switching times vs gate resistance 20 10 30 Irrm (A) VCC=600V, VGE=15V Tj=175°C, IC=25A 48 tf 40 50 IC(A) Figure 22. Reverse recovery current vs diode current slope GIPD301020141432FSR t(ns) 100 1 0 GIPD301020141437FSR VCC=600V, VGE=15V Tj=175°C, IF=25A 40 tdoff 32 tdon 24 tr 10 0 10 20 30 40 50 60 Rg(Ω) Figure 23. Reverse recovery time vs diode current slope 16 200 800 1400 Figure 24. Reverse recovery charge vs diode current slope GIPD301020141439FSR trr (ns) 2000 di/dt(A/µs) GIPD301020141442FSR Qrr (µC) 700 5.2 600 5 4.8 500 4.6 400 300 200 DS12637 - Rev 1 VCC=600V, VGE=15V Tj=175°C, IF=25A 800 1400 4.4 2000 di/dt(A/µs) 4.2 200 VCC=600V, VGE=15V Tj=175°C, IF=25A 800 1400 2000 di/dt(A/µs) page 8/15 STGWA25M120DF3 Electrical characteristics (curves) Figure 25. Reverse recovery energy vs diode current slope GIPD301020141445FSR Err (mJ) 0.9 0.8 0.7 0.6 0.5 VCC=600V, VGE=15V Tj=175°C, IF=25A 0.4 200 800 2000 di/dt(A/µs) 1400 Figure 26. Thermal impedance for IGBT K ZthTO2T_A δ = 0.5 δ = 0.2 δ = 0.05 δ = 0.1 δ = 0.02 10 -1 δ = 0.01 Single pulse 10 -2 10 -5 10 -4 10 -3 10 -2 10 -1 tp (s) Figure 27. Thermal impedance for diode DS12637 - Rev 1 page 9/15 STGWA25M120DF3 Test circuits 3 Test circuits Figure 28. Test circuit for inductive load switching C A Figure 29. Gate charge test circuit A k k L=100 µH G E B B G + 3.3 µF C RG 1000 µF VCC k D.U.T E k - k k AM01505v1 AM015 04v 1 Figure 31. Diode reverse recovery waveform Figure 30. Switching waveform di/dt 90% 10% VG 90% VCE Qrr trr IF ts tf 10% Tr(Voff) 90% IC Td(on) Ton Tr(Ion) 10% IRRM 10% Td(off) t IRRM Tcross VRRM Tf Toff dv/dt AM01506v1 DS12637 - Rev 1 GADG180720171418SA page 10/15 STGWA25M120DF3 Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 4.1 TO-247 long leads package information Figure 32. TO-247 long leads package outline 8463846_2_F DS12637 - Rev 1 page 11/15 STGWA25M120DF3 TO-247 long leads package information Table 7. TO-247 long leads package mechanical data Dim. mm Min. Typ. Max. A 4.90 5.00 5.10 A1 2.31 2.41 2.51 A2 1.90 2.00 2.10 b 1.16 1.26 b2 3.25 b3 2.25 c 0.59 0.66 D 20.90 21.00 21.10 E 15.70 15.80 15.90 E2 4.90 5.00 5.10 E3 2.40 2.50 2.60 e 5.34 5.44 5.54 L 19.80 19.92 20.10 L1 DS12637 - Rev 1 4.30 P 3.50 Q 5.60 S 6.05 3.60 3.70 6.00 6.15 6.25 page 12/15 STGWA25M120DF3 Revision history Table 8. Document revision history DS12637 - Rev 1 Date Version 20-Jun-2018 1 Changes Initial release. This part number was previously included in datasheet DS10300. page 13/15 STGWA25M120DF3 Contents Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.1 TO-247 long leads package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 DS12637 - Rev 1 page 14/15 STGWA25M120DF3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12637 - Rev 1 page 15/15 ">
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