STMicroelectronics STGYA75H120DF2 Datasheet
Below you will find brief information for H series STGYA75H120DF2. This IGBT is designed with an advanced trench gate field-stop structure, optimizing conduction and switching losses for efficient high-frequency conversion. Key features include a maximum junction temperature of 175 °C, 5 μs short-circuit withstand time, and a positive VCE(sat) temperature coefficient for safer paralleling. Suitable for UPS, solar inverters, welding, and PFC applications.
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STGYA75H120DF2 Datasheet Trench gate field-stop, 1200 V, 75 A, high-speed H series IGBT in a Max247 long leads package Features TAB 1 2 3 TAB 3 2 1 Max247 long leads • Maximum junction temperature: TJ = 175 °C • • 5 μs of short-circuit withstand time VCE(sat) = 2.1 V (typ.) @ IC = 75 A • • Tight parameter distribution Positive VCE(sat) temperature coefficient • • Low thermal resistance Very fast recovery antiparallel diode Applications • • • • C(2, TAB) G(1) UPS Solar inverters Welding PFC Description E(3) NG1E3C2T This device is IGBT developed using an advanced proprietary trench gate fieldstop structure. This device is part of the H series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of high switching frequency converters. Moreover, a slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. Product status link STGYA75H120DF2 Product summary Order code STGYA75H120DF2 Marking G75H120DF2 Package Max247 long leads Packing Tube DS13822 - Rev 2 - October 2021 For further information contact your local STMicroelectronics sales office. www.st.com STGYA75H120DF2 Electrical ratings 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Value Unit Collector-emitter voltage (VGE = 0 V) 1200 V Continuous collector current at TC = 25 °C 150 (1) Continuous collector current at TC = 100 °C 75 ICP(2) Pulsed collector current 300 A VGE Gate-emitter voltage ±20 V Continuous forward current at TC = 25 °C 150 (1) Continuous forward current at TC = 100 °C 75 IFP(2) Pulsed forward current 300 A PTOT Total power dissipation at TC = 25 °C 750 W TSTG Storage temperature range -55 to 150 °C TJ Operating junction temperature range -55 to 175 °C Value Unit VCES IC IF Parameter A A 1. Current level is limited by bond wires. 2. Pulse width is limited by maximum junction temperature. Table 2. Thermal data Symbol RthJC RthJA DS13822 - Rev 2 Parameter Thermal resistance, junction-to-case IGBT 0.2 Thermal resistance, junction-to-case diode 0.48 Thermal resistance, junction-to-ambient 50 °C/W °C/W page 2/15 STGYA75H120DF2 Electrical characteristics 2 Electrical characteristics TJ = 25 °C unless otherwise specified. Table 3. Static characteristics Symbol Parameter Test conditions V(BR)CES Collector-emitter breakdown voltage VCE(sat) Collector-emitter saturation voltage VF Forward on-voltage VGE = 0 V, IC = 2 mA Min. Typ. 1200 2.1 VGE = 15 V, IC = 75 A, TJ = 125 °C 2.4 VGE = 15 V, IC = 75 A, TJ = 175 °C 2.5 IF = 75 A 3.8 IF = 75 A, TJ = 125 °C 2.8 IF = 75 A, TJ = 175 °C 2.6 Gate threshold voltage VCE = VGE, IC = 2 mA ICES Collector cut-off current IGES Gate-emitter leakage current 5 Unit V VGE = 15 V, IC = 75 A VGE(th) Max. 6 2.6 V V 7 V VGE = 0 V, VCE = 1200 V 25 µA VCE = 0 V, VGE = ±20 V ±250 nA Table 4. Dynamic characteristics Symbol DS13822 - Rev 2 Parameter Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance Qg Total gate charge Qge Gate-emitter charge Qgc Gate-collector charge Test conditions VCE = 25 V, f = 1 MHz, VGE = 0 V VCC = 960 V, IC = 75 A, VGE = 0 to 15 V (see Figure 29. Gate charge test circuit) Min. Typ. Max. Unit - 6300 - pF - 420 - pF - 146 - pF - 313 - nC - 50 - nC - 153 - nC page 3/15 STGYA75H120DF2 Electrical characteristics Table 5. IGBT switching characteristics (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time 61 - ns tr Current rise time 34 - ns 1810 - A/µs 366 - ns 40 - ns 4.3 - mJ (di/dt)on Turn-on current slope td(off) Turn-off delay time tf Current fall time VCE = 600 V, IC = 75 A, VGE = 15 V, RG = 10 Ω (see Figure 28. Test circuit for inductive load switching) Eon (1) Turn-on switching energy Eoff(2) Turn-off switching energy 3.9 - mJ Ets Total switching energy 8.2 - mJ td(on) Turn-on delay time 55 - ns tr Current rise time 40 - ns 1560 - A/µs 387 - ns 128 - ns 6 - mJ (di/dt)on Turn-on current slope td(off) Turn-off delay time tf Current fall time VCE = 600 V, IC = 75 A, VGE = 15 V, RG = 10 Ω, TJ = 175 °C (see Figure 28. Test circuit for inductive load switching) Eon(1) Turn-on switching energy Eoff(2) Turn-off switching energy 5.2 - mJ Ets Total switching energy 11.2 - mJ tsc Short-circuit withstand time - µs VCC ≤ 600 V, VGE = 15 V, TJstart ≤ 150 °C 5 1. Including the reverse recovery of the diode. 2. Including the tail of the collector current. Table 6. Diode switching characteristics (inductive load) Symbol DS13822 - Rev 2 Parameter Test conditions Min. Typ. Max. Unit - 356 - ns trr Reverse recovery time Qrr Reverse recovery charge IF = 75 A, VR = 600 V, - 2.6 - µC Irrm Reverse recovery current VGE = 15 V, di/dt = 1550A/µs - 26.9 - A dIrr/dt Peak rate of fall of reverse recovery current during tb (see Figure 28. Test circuit for inductive load switching) - 1360 - A/µs Err Reverse recovery energy - 0.98 - mJ trr Reverse recovery time - 595 - ns Qrr Reverse recovery charge IF = 75 A, VR = 600 V, - 6.9 - µC Irrm Reverse recovery current VGE = 15 V, di/dt = 1550 A/µs, TJ = 175 °C - 37 - A dIrr/dt Peak rate of fall of reverse recovery current during tb (see Figure 28. Test circuit for inductive load switching) - 505 - A/µs Err Reverse recovery energy - 2.85 - mJ page 4/15 STGYA75H120DF2 Electrical characteristics (curves) 2.1 Electrical characteristics (curves) Figure 1. Power dissipation vs case temperature Figure 2. Collector current vs case temperature GADG130920210946PDT PTOT (W) VGE ≥ 15 V, TJ ≤ 175 °C IC (A) 600 150 400 100 200 50 0 25 75 125 175 TC(°C) Figure 3. Output characteristics (TJ = 25 °C) IC (A) GADG130920210954OC25 VGE=15 V 13 V 250 0 25 IC (A) 150 150 9V 100 50 2 4 VCE(sat) (V) 7V 8 6 VCE (V) GADG130920211000VCET VGE=15 V IC = 150 A TC (°C) GADG130920210955OC175 VGE=15 V 13 V 11 V 9V 100 0 0 2 2.2 VCE (V) GADG130920211001VCEC VGE=15 V TJ = 175 °C TJ = 25 °C 3 IC = 75 A 7V 8 6 VCE(sat) (V) 4 2.6 4 Figure 6. VCE(sat) vs collector current 5 3.0 TJ = -40 °C 2 IC = 35 A 1.8 DS13822 - Rev 2 175 50 Figure 5. VCE(sat) vs junction temperature 1.4 -50 125 250 11 V 200 3.4 75 Figure 4. Output characteristics (TJ = 175 °C) 200 0 0 GADG130920210947CCT VGE ≥ 15 V, TJ ≤ 175 °C 0 50 100 1 150 TJ (°C) 0 0 50 100 150 200 250 IC (A) page 5/15 STGYA75H120DF2 Electrical characteristics (curves) Figure 7. Collector current vs switching frequency IC (A) Figure 8. Safe operating area IC (A) GADG130920211100CCS GADG130920211001FSOA 180 150 TC= 80 °C 120 tp= 1 µs 10 2 tp= 10 µs TC= 100 °C 90 tp= 100 µs 10 1 60 30 Rectangular current shape (duty cycle = 0.5, VCC = 600 V, 0 RG = 10 Ω, VGE= 0/15 V , Tj = 175 °C 10 0 10 1 tp= 1 ms f (kHz) 10 1 10 2 VF (V) GADG130920211004TCH GADG130920211004DVF TJ= 25 °C 250 VCE (V) 10 3 Figure 10. Diode VF vs forward current Figure 9. Transfer characteristics IC (A) VCE=10 V 10 0 10 0 Single pulse, TC = 25 °C, TJ ≤ 175 °C, VGE = 15 V TJ = -40 °C 8 TJ = 25 °C 200 6 150 TJ= 175 °C 4 TJ = 175 °C 100 2 50 0 4 6 8 10 12 VGE (V) Figure 11. Normalized VGE(th) vs junction temperature VGE(th) (norm) GIPG130320141400FSR IC= 2mA VCE= VGE 1.1 0 0 50 100 150 200 250 IF (A) Figure 12. Normalized V(BR)CES vs junction temperature GIPG130320141405FSR V(BR)CES (norm) 1.06 IC= 2mA 1.0 1.02 0.9 0.98 0.8 0.94 0.7 0.6 -50 DS13822 - Rev 2 0 50 100 150 TJ(°C) 0.9 -50 0 50 100 150 TJ(°C) page 6/15 STGYA75H120DF2 Electrical characteristics (curves) Figure 13. Capacitance variations C (pF) GADG130920211005CVR Cies Figure 14. Gate charge vs gate-emitter voltage GADG130920211005GCGE VGE (V) VCC = 960 V, IC = 75 A, IG = 4 mA 15 10 3 12 9 10 2 f = 1 MHz 10 1 10 -1 10 0 10 1 10 2 Coes 6 Cres 3 10 3 VCE (V) Figure 15. Switching energy vs collector current GADG130920211007SLC E (mJ) VCC = 600 V, RG = 10 Ω, VGE = 15 V, TJ=175 ℃ 18 0 0 50 100 150 250 GADG130920211034SLG E (mJ) VCC = 600 V, VGE = 15 V, IC = 75 A, TJ = 175 ℃ 8 Eoff Eon 6 Eoff 9 5 6 4 3 30 60 90 120 IC (A) Figure 17. Switching energy vs junction temperature GADG130920211014SLT E (mJ) VCC = 600 V, RG = 10 Ω, VGE = 15 V, IC= 75 A 6.0 3 0 5 10 15 20 GADG130920211033SLV E (mJ) IC= 75 A, RG = 10 Ω, VGE = 15 V, TJ= 175 ℃ 12 Eon 8 Eoff 5.0 6 Eoff 4.5 RG (Ω) Figure 18. Switching energy vs collector emitter voltage 10 Eon 5.5 4 4.0 DS13822 - Rev 2 Qg (nC) Figure 16. Switching energy vs gate resistance 7 12 3.5 0 300 Eon 15 0 0 200 2 50 100 150 TJ (°C) 0 300 400 500 600 700 800 900 VCE (V) page 7/15 STGYA75H120DF2 Electrical characteristics (curves) Figure 19. Switching times vs collector current GADG130920211035STC t (ns) VCC = 600 V, VGE = 15 V, RG = 10 Ω, TJ = 175 ℃ Figure 20. Switching times vs gate resistance t (ns) GADG130920211036STR td(off) td(off) tf tf 10 2 10 2 td(on) td(on) tr 10 1 0 30 60 90 120 IC (A) Figure 21. Reverse recovery current vs diode current slope Irrm (A) 40 GADG150920211222RRC 6 75 VCC = 600 V, VGE = 15 V, IC = 75 A, TJ = 175 ℃ 0 5 10 15 20 10 1 RG (Ω) Figure 22. Reverse recovery time vs diode current slope trr (ns) GADG130920211045RRT 6 75 1000 35 tr 900 30 800 25 700 20 600 15 10 0 500 1000 1500 2000 di/dt (A/µs) Figure 23. Reverse recovery charge vs diode current slope Qrr (µC) GADG130920211047RRQ 6 75 500 0 1000 1500 2000 di/dt (A/µs) Figure 24. Reverse recovery energy vs diode current slope Err (mJ) 3.0 7 500 GADG130920211059RRE 6 75 2.4 6 1.8 5 1.2 4 3 0 DS13822 - Rev 2 0.6 500 1000 1500 2000 di/dt (A/µs) 0.0 0 500 1000 1500 2000 di/dt (A/µs) page 8/15 STGYA75H120DF2 Electrical characteristics (curves) Figure 25. Thermal impedance for IGBT K MAX247LL_ZthJC 10 -1 JC 10 -2 10 -5 10 -4 10 -3 10 -2 10 -1 t p (s) Figure 26. Thermal impedance for diode Zth = k*RthJC δ = tp/t tp t DS13822 - Rev 2 page 9/15 STGYA75H120DF2 Test circuits 3 Test circuits Figure 28. Gate charge test circuit Figure 27. Test circuit for inductive load switching C A A k L=100 µH G E B B 3.3 µF C G + k RG 1000 µF VCC k D.U.T k E k k AM01505v1 AM01504v1 Figure 29. Switching waveform Figure 30. Diode reverse recovery waveform di/dt Qrr 90% IF 10% VG trr ts tf 90% VCE 10% IRRM tcross 90% IC td(on) ton td(off) tr(Ion) t IRRM 10% tr(Voff) VRRM 10% tf toff dv/dt AM01506v1 DS13822 - Rev 2 GADG180720171418SA page 10/15 STGYA75H120DF2 Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 Max247 long leads package information Figure 31. Max247 long leads package outline Section C-C, D-D, E-E Bottom view Top view DM00176969_rev_3 DS13822 - Rev 2 page 11/15 STGYA75H120DF2 Max247 long leads package information Table 7. Max247 long leads package mechanical data Dim. DS13822 - Rev 2 mm Min. Typ. Max. A 4.90 5.00 5.10 A1 2.31 2.41 2.51 A2 1.90 2.00 2.10 a 0 0.15 a' 0 0.15 b 1.16 1.26 b1 1.15 b2 1.96 b3 1.95 b4 2.96 b5 2.95 1.20 1.22 2.06 2.00 2.02 3.06 3.00 3.02 b6 2.25 b7 3.25 c 0.59 0.66 c1 0.58 0.60 0.62 D 20.90 21.00 21.10 D1 16.25 16.55 16.85 D2 1.05 1.17 1.35 D3 0.58 0.68 0.78 D4 2.90 3.00 3.10 E 15.70 15.80 15.90 E1 13.10 13.26 13.50 E3 1.35 1.45 1.55 E4 1.14 1.24 1.34 e 5.34 5.44 5.54 K 4.25 4.35 4.45 L 19.80 19.92 20.10 L1 3.90 4.30 M 0.70 1.30 P 2.40 T 9.80 10.20 U 6.00 6.40 2.50 2.60 page 12/15 STGYA75H120DF2 Revision history Table 8. Document revision history DS13822 - Rev 2 Date Revision Changes 08-Sep-2021 1 First release. 13-Oct-2021 2 Updated Table 3. Static characteristics. page 13/15 STGYA75H120DF2 Contents Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.1 Max247 long leads package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 DS13822 - Rev 2 page 14/15 STGYA75H120DF2 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS13822 - Rev 2 page 15/15 ">
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Maximum junction temperature: 175 °C
5 μs short-circuit withstand time
VCE(sat) = 2.1 V (typ.) @ IC = 75 A
Low thermal resistance
Very fast recovery antiparallel diode
Positive VCE(sat) temperature coefficient
よくある質問
This IGBT is suitable for UPS, solar inverters, welding, and PFC applications.
The maximum junction temperature (TJ) is 175 °C.
The short-circuit withstand time is 5 μs.