MP34DB02
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
•
Speech recognition
•
A/V eLearning devices
•
Gaming and virtual reality input devices
•
Digital still and video cameras
•
Antitheft systems
Description
The MP34DB02 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface with stereo operation capability.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process
Features
•
Single supply voltage
•
Low power consumption
•
120 dBSPL acoustic overload point
•
62.6 dB signal-to-noise ratio
•
Omnidirectional sensitivity
•
–26 dBFS sensitivity
•
PDM single-bit output with option for stereo dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DB02 has an acoustic overload point of 120 dBSPL with a best-on-the-market 62.6 dB configuration
•
RHLGA package
−
Bottom-port design
−
SMD-compliant
−
EMI-shielded
−
ECOPACK
®
, RoHS and “Green” compliant signal-to-noise ratio and -26 dBFS sensitivity.
The MP34DB02 is available in a bottom-port,
SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
•
Mobile terminals
•
Laptop and notebook computers
•
Portable media players
•
VoIP
Part number
Table 1: Device summary range [°C]
MP34DB02TR -40 to +85
Package
RHLGA 4 LD
(3x4x1) mm
Packing
Tape and reel
April 2016 DocID026103 Rev 2
This is information on a product in full production.
1/17 www.st.com
Contents
Contents
MP34DB02
1 Pin description ................................................................................ 5
2 Acoustic and electrical specifications ........................................... 6
2.1
2.2
2.3
Acoustic and electrical characteristics ............................................... 6
Timing characteristics ....................................................................... 7
Frequency response ......................................................................... 8
3 Sensing element .............................................................................. 9
4 Absolute maximum ratings ........................................................... 10
5 Functionality .................................................................................. 11
5.1
L/R channel selection ...................................................................... 11
6 Application recommendations ..................................................... 12
7 Package information ..................................................................... 13
7.1
7.2
Soldering information ...................................................................... 13
RHLGA package information........................................................... 14
8 Revision history ............................................................................ 16
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MP34DB02
List of tables
List of tables
Table 1: Device summary ........................................................................................................................... 1
Table 2: Pin description .............................................................................................................................. 5
Table 3: Acoustic and electrical characteristics .......................................................................................... 6
Table 4: Distortion specifications ................................................................................................................ 6
Table 5: Timing characteristics ................................................................................................................... 7
Table 6: Absolute maximum ratings ......................................................................................................... 10
Table 7: L/R channel selection ................................................................................................................. 11
Table 8: Recommended soldering profile limits ........................................................................................ 13
Table 9: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package mechanical data ....................... 14
Table 10: Document revision history ........................................................................................................ 16
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List of figures
List of figures
MP34DB02
Figure 1: Pin connections ........................................................................................................................... 5
Figure 2: Timing waveforms ....................................................................................................................... 7
Figure 3: Frequency response .................................................................................................................... 8
Figure 4: MP34DB02 electrical connections ............................................................................................. 12
Figure 5: MP34DB02 electrical connections for stereo configuration ....................................................... 12
Figure 6: Recommended soldering profile limits ...................................................................................... 13
Figure 7: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package outline ..................................... 14
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MP34DB02
1 Pin description
Figure 1: Pin connections
Pin description
Pin number
1
2
3
4
5 (ground ring)
Table 2: Pin description
Pin name
CLK
LR
Vdd
DOUT
GND
Function
Synchronization input clock
Left/right channel selection
Power supply
Left/right PDM data output
0 V supply
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MP34DB02 Acoustic and electrical specifications
2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Parameter
Table 3: Acoustic and electrical characteristics
Test condition Min.
Typ.
(1)
Max. Sym.
Vdd Supply voltage
Idd
IddPdn
Current consumption in normal mode
Current consumption in
power-down mode
(3)
Scc Short-circuit current
AOP Acoustic overload point
So Sensitivity
SNR Signal-to-noise ratio
PSR Power supply rejection
Mean value
(2)
at 1 kHz, 1 Pa
A-weighted at 1 kHz,
1 Pa
100 mVpp square wave @ 217 Hz,
A-weighted
1.64
1
-29
1.8
0.65
20
120
-26
62.6
-86
3.6
10
-23
Unit
V mA
µA mA dBSPL dBFS dB dBFS
Clock
Input clock frequency
(4)
TWK
Wake-up time
(5)
Top
Operating temperature range guaranteed by design
1
-40
2.4 3.25
10
+85
MHz ms
°C
Notes:
(1)
Typical specifications are not guaranteed.
(2)
No load on DOUT line.
(3)
Input clock in static mode.
(4)
Duty cycle: min = 40% max = 60%
(5)
Time from the first clock edge to valid output data.
Table 4: Distortion specifications
Parameter
Distortion
Test condition
100 dBSPL (50 Hz - 4 kHz)
Value
< 1% THD + N
Distortion 115 dBSPL (1 kHz) < 5% THD + N
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MP34DB02
2.2 Timing characteristics
Parameter
Acoustic and electrical specifications
Table 5: Timing characteristics
Description Min Max Unit f
CLK f
PD
T
CLK
T
R,EN
T
R,DIS
T
L,EN
T
L,DIS
Clock frequency for normal mode
Clock frequency for power-down mode
Clock period for normal mode
Data enabled on DATA line, L/R pin = 1
Data disabled on DATA line, L/R pin = 1
Data enabled on DATA line, L/R pin = 0
Data disabled on DATA line, L/R pin = 0
1
308
18
(1)
18
(1)
3.25
0.23
1000
30
(1)
16
(1)
30
(1)
16
(1)
MHz
MHz ns ns ns ns ns
Notes:
(1)
From design simulations
Figure 2: Timing waveforms
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Acoustic and electrical specifications
2.3 Frequency response
Figure 3: Frequency response
MP34DB02
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MP34DB02
3
Sensing element
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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Absolute maximum ratings
4 Absolute maximum ratings
MP34DB02
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Symbol
Table 6: Absolute maximum ratings
Ratings Maximum value Unit
Vdd
Vin
T
STG
ESD
Supply voltage
Input voltage on any control pin
Storage temperature range
Electrostatic discharge protection
-0.3 to 6
-0.3 to Vdd +0.3
-40 to +125
2 (HBM)
V
V
°C kV
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MP34DB02
5
5.1
Functionality
Functionality
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7:
"L/R channel selection" . The L/R pin must be connected to Vdd or GND.
L/R
Table 7: L/R channel selection
CLK low CLK high
GND
Vdd
Data valid
High impedance
High impedance
Data valid
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MP34DB02 Application recommendations
6 Application recommendations
Figure 4: MP34DB02 electrical connections
CODE C
Vdd
L/R
1
2
4
3
5 Top view
100nF
10 µF
Figure 5: MP34DB02 electrical connections for stereo configuration
CODE C
Vdd
Mic1
1
2
4
3
5 Top view
Mic2
1
2
4
3
5 Top view
100 nF Obsolete Product(s) - Obsolete Product(s)
10 µF
Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 3 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection" ).
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MP34DB02
7
7.1
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Soldering information
The RHLGA (3 x 4 x 1) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6: Recommended soldering profile limits
Desription
Table 8: Recommended soldering profile limits
Parameter Pb free
Average ramp rate 3 °C/sec max T
L
to T
P
Preheat
T
SMIN
150 °C
Minimum temperature
T
SMAX
200 °C
Maximum temperature t
S
60 sec to 120 sec
Time (T
SMIN
to T
SMAX
)
Obsolete Product(s) - Obsolete Product(s)
60 sec to 150 sec Time maintained above liquidus temperature
T
SMAX
to T
L t
L
Liquidus temperature T
L
217 °C
Peak temperature T
P
260 °C max
Time within 5 °C of actual peak temperature
Ramp-down rate
Time 25 °C (t25 °C) to peak temperature
20 sec to 40 sec
6 °C/sec max
8 minutes max
DocID026103 Rev 2 13/17
Package information
7.2 RHLGA package information
MP34DB02
Figure 7: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package outline
E1
E4
M
T2
L2
N2
T2
G5xG5 Pin 1 Indicator d K d K
R3 j KE
4
3
1
2
D
2XG6
R2
E j KD
A2
G7
A1
E2
R1
G3
G4
G8
TOP VIEW BOTTOM VIEW
8413120_A
Table 9: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package mechanical data mm.
Symbol
Min. Typ. Max.
A1
A2
D1
D2
0.900
0.200
3.900
0.900
1.000
0.250
4.000
1.000
1.100
0.300
4.100
1.100
D3
D4
R1
R2
1.000
3.610
0.200
1.100
3.700
0.250
0.280
1.200
3.790
0.300
R3
E1
E2
2.900
1.300
0.250
3.000
1.500
3.100
1.700
E4 2.610 2.700 2.790
L1 0.650 0.700 0.750 Obsolete Product(s) - Obsolete Product(s)
L2 0.850 0.900 0.950
N1 1.000 1.050 1.100
N2 0.400 0.450 0.500
T1
T2
G1
G2
G3
0.350
0.550
3.050
3.750
2.050
0.400
0.600
3.100
3.800
2.100
0.450
0.650
3.150
3.850
2.150
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MP34DB02
Symbol
G4
G5
G6
G7
G8
M
K
Min.
2.750
0.250
0.050
0.500
0.800 mm.
Typ.
2.800
0.300
0.100
0.550
0.850
0.100
0.050
Package information
Max.
2.850
0.350
0.150
0.600
0.900
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Revision history
8
MP34DB02
Revision history
Date Revision
Table 10: Document revision history
Changes
21-Mar-2014
28-Apr-2016
1
2
Initial release
Updated Table 1: "Device summary"
Updated PSR in Table 3: "Acoustic and electrical characteristics"
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MP34DB02
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
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