Application hints
9''
Figure 14. LPS22HB electrical connections (top view)
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The device power supply must be provided through the VDD line; a power supply decoupling capacitor C1 (100 nF) must be placed as near as possible to the supply pads of the device. Depending on the application, an additional capacitor of 4.7 μ F could be placed on VDD line.
The functionality of the device and the measured data outputs are selectable and accessible through the I²C/SPI interface. When using the I 2 C, CS must be tied to Vdd_IO.
All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to
Figure 14 ). It is possible to remove VDD while maintaining
Vdd_IO without blocking the communication bus, in this condition the measurement chain is powered off.
The HLGA package is compliant with the ECOPACK ® standard, and it is qualified for soldering heat resistance according to JEDEC J-STD-020.
24/49 DocID027083 Rev 6
