STM32L162VC, STM32L162RC
7.3
Package information
UFBGA100, 7 x 7 mm, 100-ball ultra thin, fine pitch ball grid array package information
Figure 35. UFBGA100, 7 x 7 mm, 0.5 mm pitch package outline
Z Seating plane ddd Z
A4
A3 A2 e
E1
F
A1 A
A1 ball identifier
A1 ball index area
X
E
A
F
D1 D e
Y
M
12 1
BOTTOM VIEW
Øb (100 balls)
Ø
Ø eee fff
M
M
Z Y X
Z
TOP VIEW
A0C2_ME_V4
1. Drawing is not to scale.
Table 68. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data millimeters inches
(1)
Symbol
Min Typ Max Min Typ Max
D1
E
E1 e
F ddd
A3
A4 b
D
A
A1
A2
5.450
6.950
5.450
-
0.700
-
0.460
0.050
0.400
0.080
0.270
0.200
6.950
5.500
7.000
5.500
0.500
0.750
-
0.530
0.080
0.450
0.130
0.320
0.250
7.000
5.550
7.050
5.550
-
0.800
0.100
0.600
0.110
0.500
0.180
0.370
0.300
7.050
0.2146
0.2736
0.2146
-
0.0276
-
0.0181
0.0020
0.0157
0.0031
0.0106
0.0079
0.2736
0.2165
0.2756
0.2165
0.0197
0.0295
-
0.0209
0.0031
0.0177
0.0051
0.0126
0.0098
0.2756
0.2185
0.2776
0.2185
-
0.0315
0.0039
0.0236
0.0043
0.0197
0.0071
0.0146
0.0118
0.2776
DS8928 Rev 12
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Package information STM32L162VC, STM32L162RC
Table 68. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data (continued) millimeters inches (1)
Symbol
Min Typ Max Min Typ Max eee fff
-
-
-
-
0.150
0.050
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
-
0.0059
0.0020
Figure 36. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package recommended footprint
Dpad
Dsm
A0C2_FP_V1
Table 69. UFBGA100, 7 x 7 mm, 0.50 mm pitch, recommended PCB design rules
Dimension Recommended values
Pitch
Dpad
Dsm
Stencil opening
Stencil thickness
0.5
0.280 mm
0.370 mm typ. (depends on the soldermask registration tolerance)
0.280 mm
Between 0.100 mm and 0.125 mm
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DS8928 Rev 12
STM32L162VC, STM32L162RC Package information
UFBGA100 device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below.
Figure 37. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package top view example
Product identification
(1) STM32L
162VCH6
Ball A1 identification
Date code
Y WW
R
Revision code
MS37510V1
1. Parts marked as ES or E or accompanied by an engineering sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity.
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