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D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
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The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document.
Copyright © 2008-2012 Spansion Inc. All rights reserved. Spansion
®
, the Spansion logo, MirrorBit
®
, MirrorBit
®
Eclipse™, ORNAND™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
72 S29VS/XS-R MirrorBit
®
Flash Family S29VS_XS-R_00_08 July 30, 2012
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Table of contents
- 3 Features
- 3 General Description
- 3 Performance Characteristics
- 7 Ordering Information
- 7 Valid Combinations
- 8 Input/Output Descriptions & Logic Symbol
- 9 Block Diagrams
- 10 Physical Dimensions/Connection Diagrams
- 10 Related Documents
- 10 Special Handling Instructions for FBGA Package
- 12 Product Overview
- 13 Address Space Maps
- 14 Data Address & Quantity Nomenclature
- 15 Flash Memory Array
- 17 Address/Data Interface
- 18 Bus Operations
- 19 Device ID and CFI (ID-CFI)
- 21 Device Operations
- 22 Asynchronous Read
- 22 Synchronous (Burst) Read Mode and Configuration Register
- 28 Status Register
- 31 Blank Check
- 31 Simultaneous Read/Write
- 32 Writing Commands/Command Sequences
- 32 Program/Erase Operations
- 38 Handshaking
- 39 Hardware Reset
- 39 Software Reset
- 39 Sector Protection/Unprotection
- 39 Sector Lock/Unlock Command
- 40 Sector Lock Range Command
- 40 Hardware Data Protection Methods
- 41 SSR Lock
- 41 Secure Silicon Region
- 43 Power Conservation Modes
- 43 Standby Mode
- 43 Automatic Sleep Mode
- 43 Output Disable (OE#)
- 44 Electrical Specifications
- 44 Absolute Maximum Ratings
- 44 Operating Ranges
- 45 DC Characteristics
- 46 Capacitance
- 46 AC Test Conditions
- 46 Key to Switching Waveforms
- 47 Power Up
- 47 CLK Characterization
- 48 AC Characteristics
- 56 Appendix
- 56 Command Definitions
- 58 Device ID and Common Flash Memory Interface Address Map
- 70 Revision History
- 48 S29VS_XS-R_00_08 July
- 31 Simultaneous Operation Circuit
- 32 44-Ball Very Thin Fine-Pitch Ball Grid Array, Top View, Balls Facing Down
- 33 VDJ044—44-Ball Very Thin Fine-Pitch Ball Grid Array
- 48 Synchronous Read
- 66 Maximum Negative Overshoot Waveform
- 66 Maximum Positive Overshoot Waveform
- 68 Input Pulse and Test Point
- 68 Output Load
- 69 Power-up Diagram
- 69 CLK Characterization
- 70 Synchronous Read Mode - ADM Interface
- 71 Asynchronous Mode Read - ADM Interface
- 72 Asynchronous Program Operation Timings - ADM Interface