MP33AB01
MEMS audio surface-mount bottom-port silicon microphone with analog output
Datasheet
-
production data
RHLGA 3.76 x 2.95 x 1.0 mm
Description
The MP33AB01 is a compact, low-power microphone built with a low-profile sensing element.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.
The MP33AB01 has an acoustic overload point of
125 dBSPL with a 63 dB signal-to-noise ratio.
The MP33AB01 is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -30 °C to +100 °C.
Features
Single supply voltage
Low power consumption
Omnidirectional sensitivity
High signal-to-noise ratio
High bandwidth
Package compliant with reflow soldering
Order code
MP33AB01
MP33AB01TR
Table 1. Device summary
Temperature range [°C] Package
-30 to +100
-30 to +100
RHLGA (3.76 x 2.95 x 1.0) mm
RHLGA (3.76 x 2.95 x 1.0) mm
Packing
Tray
Tape and reel
September 2013
This is information on a product in full production.
DocID24159 Rev 2 1/13 www.st.com
5
6
3
4
1
2
Contents
Contents
MP33AB01
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13 DocID24159 Rev 2
MP33AB01
Figure 1. Pin connections
3
4 5
6
1
2
Pin #
4
5
6
1
2
3
TOP VIEW BOTTOM VIEW
Pin name
Output
GND
GND
Vdd
GND
GND
Table 2. Pin description
Function
Analog output
0 V supply
0 V supply
Power supply
0 V supply
0 V supply
Pin description
DocID24159 Rev 2 3/13
13
Acoustic and electrical specifications
2 Acoustic and electrical specifications
MP33AB01
2.1 Acoustic electrical characteristics
The values listed in the table below are specified for Vdd = 2.2 V unless otherwise noted.
Symbol
Table 3. Acoustic and electrical characteristics
Parameter
Vdd Supply voltage
Idd Current consumption
FR Frequency range
So Sensitivity
SNR Signal-to-noise ratio
Test condition Min. Typ.
(1)
1.5
mean value = 2 V
100 at 1 kHz (0 dB = 1 V/Pa) -41 at 1 kHz (0 dB = 1 V/Pa)
-30
2.2
-38
63
1.
Typical specifications are not guaranteed.
Max.
Unit
3.6
0.25
10000
-35
+100
V mA
Hz dBV dB
°C
Parameter
Distortion
Distortion
Table 4. Distortion specifications at 1 kHz
Test condition
94 dBSPL
125 dBSPL
Value
< 1% THD
10% THD (typ.)
4/13 DocID24159 Rev 2
MP33AB01 Acoustic and electrical specifications
10
0
-10
-20
-30
10
30
Figure 2. Typical frequency response normalized at 1 kHz
20
10000 100
Frequency (Hz)
1000
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Absolute maximum ratings
3 Absolute maximum ratings
MP33AB01
Stresses above those listed as “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Symbol
Table 5. Absolute maximum ratings
Ratings
T
Vdd Supply voltage
STG
Storage temperature range
Maximum value
-0.5 to 4
-40 to +100
Unit
V
°C
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to the part.
6/13 DocID24159 Rev 2
MP33AB01 Application recommendations
Figure 3. MP33AB01 electrical connections and external component values
Vdd
C2 C3
Typical values:
C1 > 1 µF
C2 ~ 1000 pF
C3 = 1 µF
Pin.4
MP33AB01
Pin.2,3,5,6
Pin.1
( Vout )
C1
(Ground)
Vref
R1
-
+
R2
R
Vref
Ext. gain = (R1+R2) / R1
The DC-blocking capacitor C1 is required on the Vout pin as shown in
Figure 3 . The C1
value and the input resistance of the interface circuit (R) affect the cut-off frequency of the
Audio signal path as:
3 dB cut-off freq = 1 / 2
RC1
It's advisable to have a cut-off frequency well below 20 HZ, so for a typical input resistance of about 20 k
it is recommended to use a C1 > 1 µF.
DocID24159 Rev 2 7/13
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Package mechanical data
5 Package mechanical data
MP33AB01
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Soldering information
The RHLGA (3.76 x 2.95) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com
.
T
P
Figure 4. Recommended soldering profile limits t p
RAMP-UP
CRITICAL ZONE
T
L to T
P
T
L
T
SMAX t
L
T
SMIN ts
PREHEAT
RAMP-DOWN
8/13
T25°C to PEAK
TIME
30 60 90 120 150 180 210 240 270 300 330 360 390
AM045166v1
Table 6. Recommended soldering profile limits
Description Parameter
T
L
to T
P
Average ramp rate
Preheat
Minimum temperature
Maximum temperature
Time (T
SMIN
to T
SMAX
)
Ramp-up rate
Time maintained above liquidous temperature
Liquidous temperature
Peak temperature
Time within 5 °C of actual peak temperature
Ramp-down rate
Time 25 °C (t25 °C) to peak temperature
T
SMIN
T
SMAX t
S
T
SMAX
to T
L t
L
T
L
T
P
Pb free
3 °C/sec max
150 °C
200 °C
60 sec to 120 sec
60 sec to 150 sec
217 °C
260 °C max
20 sec to 40 sec
6 °C/sec max
8 minutes max
DocID24159 Rev 2
MP33AB01 Package mechanical data
Figure 5. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package outline
Pin 1 Indicator
K
E1 A1
C
G1
N2
L2
P2
Pin 1 Indicator d
E
K E
// K C
K
Pad 5
D G3
Pad 6
G2
G4
TOP VIEW
K D
E2
N3
L3
BOTTOM VIEW
G5
Symbol
Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions mm inch.
Min.
Typ.
Max.
Min.
Typ.
G1
G2
G3
G4
L3
N1
N2
N3
G5
P1
P2
E1
E2
L1
L2
A1
D1
D2
R1
1.981
1.300
0.916
0.965
0.673
0.512
0.562
0.562
0.900
3.660
0.600
0.200
2.850
1.325
2.690
1.882
1.174
1.680
1.275
2.031
1.350
0.966
1.015
0.723
0.562
0.612
0.612
1.000
3.760
0.750
0.250
2.950
1.475
2.740
1.932
1.224
1.730
1.325
2.181
1.400
1.116
1.065
0.763
0.612
0.662
0.662
1.100
3.860
0.900
0.300
3.050
1.625
2.790
1.982
1.274
1.780
1.375
0.0780
0.0512
0.0361
0.0380
0.0265
0.0202
0.0221
0.0221
0.0354
0.1441
0.0236
0.0079
0.1122
0.0522
0.1059
0.0741
0.0462
0.0661
0.0502
0.0800
0.0531
0.0380
0.0400
0.0285
0.0221
0.0241
0.0241
0.0394
0.1480
0.0295
0.0098
0.1161
0.0581
0.1079
0.0761
0.0482
0.0681
0.0522
R1
8233292_D
Max.
0.0859
0.0551
0.0440
0.0419
0.0300
0.0241
0.0261
0.0261
0.0433
0.1520
0.0354
0.0118
0.1201
0.0640
0.1098
0.0780
0.0502
0.0701
0.0541
DocID24159 Rev 2 9/13
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Package mechanical data MP33AB01
Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued) mm inch.
Symbol
Min.
Typ.
Max.
Min.
Typ.
Max.
d
K
0.150
0.050
0.0059
0.0020
Figure 6. Device footprint and PCB land pattern
10/13 DocID24159 Rev 2
MP33AB01 Package mechanical data
Figure 7. Recommended stencil openings
DocID24159 Rev 2 11/13
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Revision history
Table 8. Document revision history
Date
17-Jan-2013
13-Sep-2013
Revision
1
2
Initial release
Modified
Figure 3 on page 7
Changes
MP33AB01
12/13 DocID24159 Rev 2
MP33AB01
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