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L99PM62XP
Power management IC with LIN and high speed CAN
Features
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Two 5V voltage regulators for microcontroller and peripheral supply
No electrolytic capacitor required on regulator outputs
Ultra low quiescent current in standby modes
Programmable reset generator for power-on and undervoltage
Configurable window watchdog and fail safe output
LIN 2.1 compliant (SAEJ2602 compatible) transceiver
Advanced HS CAN transceiver (ISO 11898-2/-
5 and SAE J2284 compliant) with local failure and bus failure diagnosis
HS CAN transceiver supports partial networking
Complete 3 channel contact monitoring interface with programmable cyclic sense functionality
Programmable periodic system wake up feature
ST SPI interface for mode control and diagnosis
5 fully protected high-side drivers with internal
4-channel PWM generator
2 low-side drivers with active zener clamping
4 internal PWM timers
2 operational amplifiers with rail-to-rail outputs
(V
S
) and low voltage inputs
Temperature warning and thermal shutdown
Applications
■ Automotive ECU's such as door zone and body control modules
PowerSSO-36
Description
The L99PM62XP is a power management system
IC providing electronic control units with enhanced system power supply functionality including various standby modes as well as LIN and HS CAN physical communication layers. It contains two low drop voltage regulators to supply the system microcontroller and external peripheral loads such as sensors and provides enhanced system standby functionality with programmable local and remote wake up capability.
In addition, five high-side drivers, two low-side drivers and two operational amplifiers increase the system integration level.
The ST standard SPI interface (3.0) allows control and diagnosis of the device and enables generic software development.
Table 1.
Package
Device summary
Order codes
Tube Tape and reel
PowerSSO-36 L99PM62XP L99PM62XPTR
September 2013 Doc ID 16363 Rev 4 1/98 www.st.com
1
Contents
Contents
L99PM62XP
Block diagram and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Increased output current capability for voltage regulator V
2
. . . . . . . . . 13
Voltage regulator behaviour . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
V1 standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
VBAT standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Wake up from standby modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Cyclic contact supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Timer interrupt / wake-up of microcontroller by timer . . . . . . . . . . . . . . . 19
Functional overview (truth table) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Configurable window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Change watchdog timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Reset output (NRESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
High speed CAN bus transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Wake up (from CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2/98 Doc ID 16363 Rev 4
L99PM62XP
Contents
CAN receive only mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Serial peripheral interface (ST SPI standard) . . . . . . . . . . . . . . . . . . . . . . 33
Protection and diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Temperature warning and thermal shutdown . . . . . . . . . . . . . . . . . . . . . . 37
Low-side driver outputs REL1, REL2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
PowerSSO-36 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Supply and supply monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Wake up inputs (WU1... WU3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
High speed CAN transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Doc ID 16363 Rev 4 3/98
Contents
L99PM62XP
Inputs TxD_C and TxD_L for Flash mode . . . . . . . . . . . . . . . . . . . . . . 62
Operating code definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Format of data shifted out at SDO during write cycle . . . . . . . . . . . . . . 70
Format of data shifted out at SDO during read cycle . . . . . . . . . . . . . . . 72
Read and clear status operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Read device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
®
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
PowerSSO-36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
4/98 Doc ID 16363 Rev 4
L99PM62XP
List of tables
List of tables
1
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
CAN bus common mode stabilization output termination: pin SPLIT . . . . . . . . . . . . . . . . . 54
Doc ID 16363 Rev 4 5/98
List of tables L99PM62XP
Format of data shifted out at SDO during read and clear status: global status register . . . 73
Format of data shifted out at SDO during read and clear status: data byte 1. . . . . . . . . . . 73
Format of data shifted out at SDO during read and clear status: data byte 2. . . . . . . . . . . 73
6/98 Doc ID 16363 Rev 4
L99PM62XP List of tables
Doc ID 16363 Rev 4 7/98
List of figures
List of figures
L99PM62XP
PowerSSO-36 thermal resistance junction to ambient vs PCB copper area (V1 ON) . . . . 44
Format of data shifted out at SDO during read and clear status operation . . . . . . . . . . . . 74
8/98 Doc ID 16363 Rev 4
L99PM62XP
1
Block diagram and pin descriptions
Block diagram and pin descriptions
Figure 1.
Block diagram
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Doc ID 16363 Rev 4 9/98
Block diagram and pin descriptions L99PM62XP
3
4
5
1
2
6
7
8
9
25
26
27
28
29
30
31
32
33
34
13
14
15
16
17
18
19
20…22
23
24
Table 2.
Pin
10
11
12
Pin definition
Symbol Function
AGND
RxDC
TxDC
CANH
CANL
Analog ground
CAN receive data output
CAN transmit data input
CAN high level voltage I/O
CAN low level voltage I/O
SPLIT CAN reference voltage output, CAN termination
CANSUP CAN supply input; to allow external CAN supply from V
1
or V
2
regulator.
NRESET Nreset output to micro controller; Internal pull-up of typ. 100 K Ω (reset state = LOW)
V
1
Voltage regulator 1 output: 5 V supply e.g. micro controller, CAN transceiver
V
2
TxDL
Voltage regulator 2 output: 5 V supply for external loads (IR receiver, potentiometer, sensors) or CAN Transceiver. V
2
is protected against reverse supply.
LIN Transmit data input
RxDL/NINT
OP2+
RxDL -> LIN receive data output
NINT -> indicates local/remote wake-up events or provides a programmable timer interrupt signal
Non inverting input of operational amplifier 2
OP2Inverting input of operational amplifier 2
OP2_OUT Output of operational amplifier 2
DI SPI: serial data input
DO
CLK
CSN
SPI: serial data output
SPI: serial clock input
SPI: chip select not input
WU1…3 Wake-up Inputs 1to 3: Input pins for static or cyclic monitoring of external contacts
OP1_OUT Output of operational amplifier 1
OP1Inverting input of operational amplifier 1
OP1+ Non inverting input of operational amplifier 1
OUT4 High-side driver output (7
Ω
, typ)
OUT3/FSO Configurable as high-side driver output (7 Ω , typ) or fail safe output pin (default)
OUT2 High-side driver output (7
Ω
, typ)
OUT1
OUT_HS
High-side driver output (7 Ω , typ)
High-side driver (1 Ω , typ)
V
S
LINPU
Power supply voltage
High-side driver output to switch off LIN master pull up resistor
LIN
REL1
LIN bus line
Low-side driver output (2
Ω
typ)
10/98 Doc ID 16363 Rev 4
L99PM62XP Block diagram and pin descriptions
Table 2.
Pin
35
36
Pin definition (continued)
Symbol
REL2
PGND
Function
Low-side driver output (2
Ω
typ)
Power ground (REL1/2, LIN and CAN GND), to be externally connected to AGND
Figure 2.
Pin connection (top view)
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Doc ID 16363 Rev 4 11/98
Description
2 Description
L99PM62XP
2.1.1
2.1.2
The L99PM62XP contains 2 independent and fully protected low drop voltage regulators, which are designed for very fast transient response and do not require electrolytic output capacitors for stability.
The output voltage is stable with ceramic load capacitors > 220 nF.
Voltage regulator: V
1
The V
1
voltage regulator provides 5 V supply voltage and up to 250 mA continuous load current and is mainly intended for supply of the system microcontroller. The V
1
regulator is embedded in the power management and fail-safe functionality of the device and operates according to the selected operating mode.
It can be used to supply the internal HS CAN Transceiver via the CANSUP pin externally. In case of a short circuit condition on the CAN bus, the output current of the transmitter is limited to 100 mA and the transceiver is turned off in order to ensure continued supply of the microcontroller.
In addition the regulator V
1
drives the L99PM62XP internal 5 V loads. The voltage regulator is protected against overload and overtemperature. An external reverse current protection has to be provided by the application circuitry to prevent the input capacitor from being discharged by negative transients or low input voltage. The output voltage precision is better than +/- 2% (incl. temperature drift and line-/load regulation) in active mode; respectively
+/- 3% during low current operation (i. e. in V
1 standby mode). Current limitation of the regulator ensures fast charge of external bypass capacitors. The output voltage is stable for ceramic load capacitors > 220 nF.
If the device temperature exceeds the TSD1 threshold, all outputs (OUTx, RELx, V
2
, LIN) is deactivated except V
1
. Hence the micro controller has the possibility for interaction or error logging. In case of exceeding TSD2 threshold (TSD2>TSD1), also V
1
is deactivated (see state chart in
Chapter 3: Protection and diagnosis ). A timer is started and the voltage
regulator is deactivated for t
TSD
= 1sec. During this time, all other wakeup sources (CAN,
LIN, WU1 to3 and wake up of µC by timer) are disabled. After 1 sec, the voltage regulator tries to restart automatically. If the restart fails 7 times, within one minute, without clearing and thermal shutdown condition still exists, the L99PM62XP enters the forced V
BAT
Mode.
standby
In case of short to GND at “V
1
” after initial turn on (V
1
< 2V for at least 4ms) the L99PM62XP enters the forced V
BAT standby Mode. Reactivation (wake-up) of the device can be achieved
Voltage regulator: V
2
The voltage regulator V
2
can supply additional 5 V loads (e.g. logic components or the integrated HS CAN transceiver or external loads such as sensors or potentiometers). The
12/98 Doc ID 16363 Rev 4
L99PM62XP
2.1.3
Description maximum continuous load current is 100 mA. The regulator provides accuracy better than
+ 3% at 50 mA (4 % at 100 mA and is protected against.
● Overload
●
●
●
Overtemperature
Short circuit (short to ground and battery supply voltage)
Reverse biasing
Increased output current capability for voltage regulator V
2
For applications which require high output currents, the output current capability of the regulator can be increased my means of the integrated operational amplifiers and an external pass transistor.
Figure 3.
Voltage source with external PNP
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Figure 3 shows a possible configuration with a PNP pass element using voltage regulator 2
to provide the voltage reference for the regulated output voltage V3.
Doc ID 16363 Rev 4 13/98
Description L99PM62XP
The Vs operating range for this circuit is 5.5 V to 18 V. It is important the respect the input common mode range specified for the operational amplifiers.
The output voltage V3 can be calculated using the following formula: v
3
= v
------
2
⋅
R +
---------------------
R
2
R
[ ]
The circuit in
Figure 4 provides additional current limitation using an additional PNP
transistor and R6 which allows setting the current limit.
Figure 5.
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Figure 5 shows a possible configuration with an NPN pass element using voltage regulator
2 to provide the voltage reference for the regulated output voltage V3. This circuit requires
fewer components compared to the configuration in Figure 3
but has a limited Vs operating range (6 V to 18 V).
14/98 Doc ID 16363 Rev 4
L99PM62XP
2.1.4
Description
The output voltage V3 can be calculated using the following formula: v
3
= v
------
2
⋅
R +
---------------------
R
2
R
2
V
The circuit in
Figure 6 provides additional current limitation using an additional NPN
transistor and R5 which allows setting the current limit.
Alternatively, voltage regulator 1 can be used to provide the 5 V reference for this topology.
However, the additional current consumption through R3 and R4 has to be considered in
V
1 standby mode.
Voltage regulator failure
The V
1, and V
2
regulator output voltages are monitored.
In case of a drop below the V
1,
V
2
– fail thresholds (V
1,2
< 2 V, typ for t > 2 µs), the V
1,2
-fail bits are latched. The fail bits can be cleared by a dedicated SPI command.
Short to ground detection
If 4 ms after turn on of the regulator the V
1,2 voltage is below the V
1,2
fail thresholds,
(independent for V
1,2
), the L99PM62XP identifies a short circuit condition at the related regulator output and the regulator is switched off.
In case of V
1
short to GND failure the device enters V
BAT
standby mode automatically. Bits
Forced V
BAT
STD2/SHTV
1
and V
1
fail were set.
In case of a V
2
short to GND failure the V
2 short and V
2
fail bit is set.
If the output voltage of the corresponding regulator once exceeded the V
1,2
fail thresholds the short to ground detection is disabled. If a short to ground condition occurs the regulator outputs switches off due to thermal shutdown (V
1
at TSD2; V
2
at TSD1).
Doc ID 16363 Rev 4 15/98
Description L99PM62XP
2.1.5 Voltage regulator behaviour
Figure 7.
Voltage regulator behaviour and diagnosis during supply voltage ramp-up / rampdown conditions
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The L99PM62XP can be operated in 4 different operating modes:
● Active
●
●
●
Flash
V
1
standby
V
BAT
standby
A cyclic monitoring of wake-up inputs and a periodic interrupt/wake-up by timer is available in standby modes.
All functions are available and the device is controlled by the ST SPI Interface.
To program the system microcontroller, the L99PM62 can be operated in Flash mode where the internal watchdog is disabled. This mode can also be used for software debugging.
Doc ID 16363 Rev 4
L99PM62XP Description
Note:
Except for the disabled watchdog, the Flash mode is identical to active mode and all device features are available.
The mode can be entered if one of the following conditions is applied:
●
●
V
TxDL
> V
Flash
V
TxDC
> V
Flash
At exit from Flash mode (V
TxD
< V
Flash starts with a long open window.
) no NReset pulse is generated and the watchdog
Setting both TxDL and TxDC to high voltage levels (> V
Flash
) is not allowed
2.2.3 V
1 standby mode
Note:
The transition from active mode to V
1
standby mode is controlled by SPI.
To supply the micro controller in a low power mode, the voltage regulator 1 (V
1
) remains active. In order to reduce the current consumption, the regulator goes in low current mode as soon as the supply current of the microcontroller goes below the I cmp
At this transition, the L99PM62 also deactivates the internal watchdog.
current threshold.
Relay outputs, LIN and CAN transmitters is switched off in V
1 standby mode. High-side outputs and the V
2
regulator remain in the configuration programmed prior to the standby command.
A cyclic supply of external contacts and a synchronized monitoring of the contact state can be activated and configured by SPI.
In V
1 standby mode various wake up sources can be individually programmed. Each wake up event puts the device into active mode and forces the RxDL/NINT pin to a low level indicating the wake-up condition to the microcontroller.
After power ON reset (POR) all wake up sources are activated by default except the periodic interrupt/wake timer.
With the interrupt timer the micro controller can be forced from ‘stop’ to ‘run’ after a programmable period. The RxDL/NINT pin is forced low after the timer is elapsed. The
L99PM62XP enters active mode and is awaiting a valid watchdog trigger.
Both internal timers can be used for this feature.
The interrupt timer (T
INT
) at pin RxDL/NINT is only available in V
1
standby mode.
Inputs TxDL, TxDC and CSN must be at high level or at high impedance in order to achieve
minimum standby current in V
1
standby mode.
Inputs DI and CLK must be at GND or at high impedance to achieve minimum standby current in V
1
standby mode.
Interrupt
The interrupt signal (linked to RxDL/NINT internally) indicates a wake-up event from V
1 standby mode. In case of a wake-up by Wake-up Inputs, activity on LIN or CAN, SPI access or timer-interrupt the NINT pin is pulled low for 56 µs.
In case of V
1
standby mode and (I
V1
> I cmp
), the device remains in standby mode, the V
1 regulator switches to high current mode and the watchdog starts. No Interrupt signal is generated.
Doc ID 16363 Rev 4 17/98
Description L99PM62XP
2.2.4 V
BAT standby mode
Note:
The transition from active mode to V
BAT
standby mode is initiated by an SPI command.
In V
BAT
standby mode, the V
1
voltage regulator, relay outputs, LIN and CAN transmitters are switched off. High-side outputs and the V
2
regulator remain in the configuration programmed prior to the standby command.
In V
BAT
standby mode the current consumption of the L99PM62XP is reduced to a minimum level.
Inputs TXDL, TXDC and CSN must be terminated to GND in V
BAT
standby to achieve minimum standby current.
This can be achieved with the internal ESD protection diodes of the microcontroller
(microcontroller is not supplied in this mode; V
1
is pulled to GND).
2.2.5
Wake up from standby modes
A wake-up from standby mode switches the device to active mode. This can be initiated by one or more of the following events:
Table 3.
Wake up sources
Wake up source Description
LIN bus activity
CAN bus activity
Can be disabled by SPI
Can be disabled by SPI
I
Level change of WU1 - 3 Can be individually configured or disabled by SPI
V1
> I cmp
Device remains in V
1
standby mode but watchdog is enabled (If
I cmp
= 0) and the V
1
regulator goes into high current mode (increased current consumption). No interrupt is generated.
Timer interrupt / wake up of µC by TIMER
SPI access
Programmable by SPI
– V
1 standby mode: device wakes up and Interrupt signal is generated at RxDL/NINT when programmable timeout has elapsed
– V
BAT standby mode: device wakes up, V
1
regulator is turned on and
NReset signal is generated when programmable timeout has elapsed
Always active (except in V
BAT
standby mode)
Wake up event: CSN is low and first rising edge on CLK
To prevent the system from a deadlock condition (no wake up possible) a configuration where the periodic timer interrupt and wake up by LIN and HS CAN are disabled, is not allowed. The default configuration is entered for all wake-up sources in case of such an invalid setting.
All wake-up events from V
1 standby mode (except I
V1
> I cmp
) are indicated to the microcontroller by a low-pulse at RxDL/NINT (duration: 56 µs).
Wake-up from V
1 standby by SPI Access might be used to check the interrupt service handler.
18/98 Doc ID 16363 Rev 4
L99PM62XP Description
The de-bounced digital inputs WU1 to WU3 can be used to wake up the L99PM62XP from standby modes. These inputs are sensitive to any level transition (positive and negative edge)
For static contact monitoring, a filter time of 64 µs is implemented at WU1-3. The filter is started when the input voltage passes the specified threshold.
In addition to the continuous sensing (static contact monitoring) at the wake up inputs, a cyclic sense functionality is implemented. This feature allows periodical activation of the wake-up inputs to read the status of the external contacts. The periodical activation can be
linked to Timer1 or Timer2 (see Section 2.2.7: Cyclic contact supply ). The input signal is
filtered with a filter time of 16 µs after a programmable delay (80 µs or 800 µs) according to the configured timer on-time. A wake-up is processed if the status has changed versus the previous cycle.
The outputs OUT_HS and OUT1-4 can be used to supply the external contacts with the timer setting according to the cyclic monitoring of the wake-up inputs.
If the wake-up inputs are configured for cyclic sense mode the input filter timing and input filter delay (WUx_filt in control register 2) must correspond to the setting of the high-side output which supplies the external contact switches (OUTx in control register 0).
In standby mode, the inputs WU1-3 are SPI configurable for pull-up or pull-down current source configuration according to the setup of the external. In active mode the inputs have a pull down resistor.
In active mode, the input status can be read by SPI (Status Register 2). Static sense should be configured (Control Register 2) before the read operation is started (In cyclic sense configuration, the input status is updated according to the cyclic sense timing; Therefore, reading the input status in this mode may not reflect the actual status).
2.2.8
In V
1 standby and V
BAT standby modes, any high-side driver output (OUT1..4, OUTHS) can be used to periodically supply external contacts.
The timing is selectable by SPI
Timer 1: period is Xs. The on-time is 10 ms resp. 20 ms: With X ∈ {1, 2, 3, 4 s}
Timer 2: period is X ms. The on- time is 100 µs resp. 1ms: With X ∈ {10, 20, 50, 200 ms}
Timer interrupt / wake-up of microcontroller by timer
During standby modes the cyclic wake up feature, configured via SPI, allows waking up the
µC after a programmable timeout according to timer1 or timer2.
From V
1
standby mode, the L99PM62XP wakes up (after the selected timer has elapsed) and sends an interrupt signal (via RxDL/NINT pin) to the µC. The device enters active mode and the watchdog is started with a long open window. The microcontroller can send the device back into V
1
standby after finishing its tasks.
From V
BAT standby mode, the L99PM62XP wakes up (after the selected timer has elapsed), turns on the V
1
regulator and provides an NReset signal to the µC. The device enters active mode and the watchdog is started with a long open window. The microcontroller can send the device back into V
BAT standby after finishing its tasks.
Doc ID 16363 Rev 4 19/98
Description L99PM62XP
2.3 Functional overview (truth table)
Functional overview (truth table) Table 4.
Operating modes
Function
Voltage-regulator, V
Voltage-regulator, V
Reset-generator
Window watchdog
1
2
V
V
V
1
Comments
OUT
OUT
= 5 V
= 5 V
monitor
On
On/ Off (2)
On
On
Active mode
V
1
-standby static mode
(cyclic sense)
On
(1)
On
(2)
/ Off
V
BAT
-standby static mode
(cyclic sense)
Off
On Off
Off (On: I_V
1
> I cmp threshold and I cmp
-
= 0)
Active
(3)
Off
Wake up
HS-cyclic supply
Relay driver
Operational amplifiers
Off
Oscillator time base
On / Off
On
On
On
Off
Off
Off
Off
LIN LIN 2.1
On Off
(4)
Off
HS_CAN
FSO (if configured by
SPI), active by default
Oscillator
Fail safe output
On
OUT3/FSO Off
(5)
OUT3/FSO Off
Vs-monitor
On
On
(6)
(7)
1.
Supply the processor in low current mode.
2.
Only active when selected via SPI.
3.
Unless disabled by SPI.
4.
The bus state is internally stored when going to standby mode. A change of bus state leads a wake-up after exceeding of internal filter time (if wake-up by LIN or CAN is not disabled by SPI).
5.
ON in fail-safe condition: If Standby mode is entered with active Fail Safe mode, the output remains ON in Standby mode.
6.
Activation = ON if cyclic sense is selected.
7.
cyclic activation = pulsed ON during cyclic sense.
20/98 Doc ID 16363 Rev 4
L99PM62XP
Figure 8.
Operating modes
Description
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2.4 Configurable window watchdog
During normal operation, the watchdog monitors the micro controller within a programmable trigger cycle: (10 ms, 50 ms, 100 ms, 200 ms)
In V
BAT
standby and Flash program modes, the watchdog circuit is automatically disabled.
In V
1
standby mode a wake up by timer is programmable in order to wake up the µC (see
Section 2.2.8: Timer interrupt / wake-up of microcontroller by timer ). After wake-up, the
watchdog starts with a long open window. After serving the watchdog, the µC may send the device back to V
1 standby mode.
Doc ID 16363 Rev 4 21/98
Description L99PM62XP
After power-on or standby mode, the watchdog is started with a long open window (65 ms nominal). The long open window allows the micro controller to run its own setup and then to trigger the watchdog via the SPI. The trigger is processed when the CSN input becomes
HIGH after the transmission of the SPI word.
Writing ‘1’ to the watchdog trigger bit terminates the long open window and start the window watchdog (the timing is programmable by SPI). Subsequently, the micro controller has to serve the watchdog by alternating the watchdog trigger bit within the safe trigger area (refer to
Figure 27 ). A correct watchdog trigger signal is immediately start the next cycle.
After 8 watchdog failures in sequence, the V
1
regulator is switched off for 200ms. If subsequently, 7 additional watchdog failures occur, the V
1
regulator is completely turned off and the device goes into V
BAT standby mode until a wakeup occurs.
In case of a watchdog failure, the outputs (RELx, OUTx, V
2
) are switched off and the device enters fail-safe mode (i. e. all control registers are set to default values except the ‘OUT3 control bit’).
The following diagrams illustrate the watchdog behavior of the L99PM62. The diagrams are split into 3 parts. First diagram shows the functional behavior of the watchdog without any error. The second diagram covers the behavior covering all the error conditions, which can affect the watchdog behavior. Third diagram shows the transition in and out of Flash mode.
All 3 diagrams can be overlapped to get all the possible state transitions under all circumstances. For a better readability, they were split in normal operating, operating with errors and Flash mode.
Figure 9.
Watchdog in normal operating mode (no errors)
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22/98 Doc ID 16363 Rev 4
L99PM62XP
Figure 10.
Watchdog with error conditions
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Figure 11.
Watchdog in Flash mode
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2.4.1 Change watchdog timing
There are 4 programmable watchdog timings available, which represent the nominal trigger time in window mode. To change the watchdog timing, a new timing has to be written by
SPI. The new timing gets active with the next valid watchdog trigger. The following figures illustrate the sequence, which is recommended to use, changing the timing within long open window and within window mode.
Doc ID 16363 Rev 4 23/98
Description L99PM62XP
Figure 12.
Change watchdog timing within long open window
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Figure 13.
Change watchdog timing within window mode
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If the device is in fail-safe mode, the control registers are locked for writing. To change the watchdog timing out of fail-safe mode, first the fail-safe condition must be solved, respective confirmed from the microcontroller. Afterwards the new watchdog timing can be
programmed using the sequence from Figure 14 . Since the actions to remove, a fail-safe
condition can differ from the root cause of the fail safe the following diagram shows the
general procedure how to change the watchdog timing out of fail-safe mode. Figure 15
shows the procedure to change watchdog timing with a previous watchdog failure, since this is a special fail-safe scenario.
24/98 Doc ID 16363 Rev 4
L99PM62XP Description
Figure 14.
General procedure to change watchdog timing out of fail safe mode
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Figure 15.
Change watchdog timing out of fail safe mode (watchdog failure)
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2.5 Fail mode
L99PM62XP enters fail safe mode in case of:
●
●
●
●
●
Watchdog failure
V
1
turn on failure
– V
1
short (V
1
< V
1fail
for t > 4 ms)
V
1
undervoltage (V
1
< Vrth for t > 8 µs)
Thermal shutdown TSD2
SPI failure
– DI stuck to GND or V
CC
(SPI frame = ’00 00 00’ or ‘FF FF FF’
Doc ID 16363 Rev 4 25/98
Description L99PM62XP
The fail safe functionality is also available in V
1
standby mode. During V
1
standby mode the fails safe mode is entered in the following cases:
●
●
●
V
1
undervoltage (V
1
< Vrth for t > 8 µs)
Watchdog failure (if watchdog still running due to I
V1
> I cmp
)
Thermal shutdown TSD2
In fail safe mode the L99PM62 returns to a default. The fail safe condition is indicated to the remaining system in the global status register. The conditions during fails safe mode are:
●
●
All outputs are turned off
All control registers are set to default values (except OUT3/FSO configuration)
●
●
Write operations to control registers are blocked until the fail safe condition is cleared
(see
LIN and HS CAN transmitter, OpAmps and SPI remain on
●
●
●
Corresponding failure bits in status registers are set.
FSO Bit (Bit 0 global status register) is set
OUT3/FSO is activated if configured as fail safe output
If OUT3 is configured as FSO, the internal fail safe mode can be monitored at OUT3 (highside driver is turned on in fail-safe mode). Self protection features for OUT3 when
configured as FSO are active (see Section 3.3: High-side driver outputs ).
OUT3 is configured as fail safe output by default. It can be configured to normal high-side driver operation by SPI. It this case, the configuration remains until Vs power on.
If the fail safe mode was entered it keeps active until the fail safe condition is removed and the fail safe was read by spi. depending on the root cause of the fail safe operation, the actions to exit fail safe mode are as shown in the following table.
Table 5.
Fail safe conditions and exit modes
Failure source Failure condition Diagnosis Exit from fail-safe mode
µC (oscillator)
V
1
Temperature
Watchdog early write failure or expired window
Fail-safe = 1
WDfail = n+1
Short at turn-on
Undervoltage
T j
> TSD2
Fail-safe = 1
Forced Sleep TSD2/SHTV
1
= 1
Fail-safe = 1
V
1fail
= 1
(1)
Fail-safe = 1
TW = 1
TSD1 = 1
TSD2 = 1
SPI DI short to GND or V
CC
Fail-safe = 1
1.
if V
1
< V
1fail
(for t >2µs)
The fail-safe bit is located in the global status register (Bit 0) multiple failures – entering forced V
BAT
standby mode
TRIG = 1 during LOWi and read fail-safe bit
Read&Clear SR3 after wake
V
1
> Vrth
Read Fail-safe bit
T j
< TSD2
Read&Clear SR3
Valid SPI command
If the fail-safe condition persists and all attempts to return to normal system operation fail, the L99PM62 enters the forced V
BAT standby mode in order to prevent damage to the
26/98 Doc ID 16363 Rev 4
L99PM62XP Description
Table 6.
system. The forced V
BAT standby mode can be terminated by any regular wake-up event.
The root cause of the forced V
BAT standby is indicated in the SPI status registers
The forced V
BAT standby mode is entered in case of:
● Multiple watchdog failures: forced sleep WD = 1 (15x watchdog failure)
●
●
Multiple thermal shutdown 2: forced sleep TSD2/SHTV1 = 1 (7x TSD2)
V
1
short at turn-on: forced sleep TSD2/SHTV1 = 1 (V
1
< V
1fail
for t > 4 ms)
Persisting fail safe conditions and exit modes
Failure source Failure condition Diagnosis Exit from fail-safe mode
µC (oscillator)
15 consecutive watchdog failures
Fail-safe = 1
ForcedSleepWD = 1
Wake-up
TRIG = 1 during LOWi read & clear SR3
V
1
Temperature short at turn-on
7 times TSD2
Fail-safe = 1
ForcedSleepTSD2/SHTV
1
= 1
Fail-safe = 1
TW = 1
TSD1 = 1
TSD2 = 1
ForcedSleepTSD2/SHTV
1
= 1
Read&clear SR3 after wake-up
Read&clear SR3 after wake-up
Figure 16.
Example: exit fail safe mode from watchdog failure
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Doc ID 16363 Rev 4 27/98
Description
2.6
Note:
L99PM62XP
Reset output (NRESET)
If V
1
is turned on and the voltage exceeds the V
1
reset threshold, the reset output
“NRESET” is pulled up by internal pull up resistor to V
1
voltage after a 2 ms reset delay time.
This is necessary for a defined start of the micro controller when the application is switched on. Since the NRESET output is realized as an open drain output it is also possible to connect an external NRESET open drain NRESET source to the output. It must be considered that as soon the NRESET is released from the L99PM62 the Watchdog timing starts.
A reset pulse (2 ms) is generated in case of:
●
●
V
1
drops below Vrth (configurable by SPI) for more than 8 µs
Watchdog failure
An external pull-up resistor (1k
Ω
) to V
1
is recommended in order to ensure I
LOAD1
> I cmp during reset condition
The operational amplifiers are especially designed to be used for sensing and amplifying the voltage drop across ground connected shunt resistors. Therefore the input common mode range includes -0.2 V to 3 V.
The operational amplifiers are designed for -0.2 V to +3 V input voltage swing and rail-to-rail output voltage range.
All pins (positive, negative and outputs) are available to be able to operate in non-inverting and inverting mode. Both operational amplifiers are on-chip compensated for stability over the whole operating range within the defined load impedance.
The operational amplifiers may also be used to setup an additional high current voltage source with an external pass element. Refer to
for a detailed description.
2.8 LIN interface
Features:
●
●
Speed communication up to 20 kbit/s.
LIN 2.1 compliant (SAEJ2602 compatible) transceiver.
●
●
●
●
Function range from +40 V to -18 V DC at LIN pin.
GND disconnection fail safe at module level.
Off mode: does not disturb network.
GND shift operation at system level.
●
●
●
●
●
Micro controller Interface with CMOS compatible I/O pins.
Internal pull up resistor.
Internal high-side switch to disconnect master pull-up resistor in case of short circuit of bus signal.
ESD and transient immunity according to ISO7637 and EN / IEC61000-4-2.
Matched output slopes and propagation delay.
28/98 Doc ID 16363 Rev 4
L99PM62XP
Note:
Description
In order to further reduce the current consumption in standby mode, the integrated LIN bus interface offers an ultra low current consumption.
Use of master pull-up switch is optional.
2.8.2
Note:
The L99PM62XP provides the following 3 error handling features which are not described in the LIN Spec. V
2.1
, but are realized in different stand alone LIN transceivers / micro controllers to switch the application back to normal operation mode.
Dominant TxDL time out
If TXDL is in dominant state (low) for more than 12 ms (typ) the transmitter is disabled, the status bit is latched and can be read and optionally cleared by SPI. The transmitter remains disabled until the status register is cleared. This feature can be disabled via SPI.
Permanent recessive
If TXDL changes to dominant (low) state but RXDL signal does not follow within 40 µs the transmitter is disabled, the status bit is latched and can be read and optionally cleared by
SPI. The transmitter remains disabled until the status register is cleared.
Permanent dominant
If the bus state is dominant (low) for more than 12 ms a permanent dominant status is detected. The status bit is latched and can be read and optionally cleared by SPI. The transmitter is not disabled.
Wake up (from LIN)
In standby mode the L99PM62XP can receive a wake up from LIN bus. For the wake up feature the L99PM62XP logic differentiates two different conditions.
Normal wake up
Normal wake up can occur when the LIN transceiver was set in standby mode while LIN was in recessive (high) state. A dominant level at LIN for t linbus
, switches the L99PM62XP to active mode.
Wake up from short to GND condition
If the LIN transceiver was set in standby mode while LIN was in dominant (low) state, recessive level at LIN for t linbus
, switches the L99PM62XP to active mode.
A wake up caused by a message on the bus starts the voltage regulator and the microcontroller to switch the application back to normal operation mode.
The master node pull-up resistor (1 k Ω ) can be connected to Vs using the internal LIN_PU high-side switch. This high-side switch can be controlled by SPI in order to allow disconnection of the pull-up resistor in case of LIN bus short to GND conditions.
Doc ID 16363 Rev 4 29/98
Description
Figure 17.
LIN master node configuration using LIN_PU (optional)
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LIN_PU high-side driver characteristics:
● Activated by default and can be turned off by SPI command (CR4).
●
●
●
●
Remains active in standby modes.
Switch off only in case of over temperature (TSD2 = thermal shutdown #2).
No over current protection.
Typical R
DS on, 10 Ω .
High speed CAN bus transceiver
General requirements
● Speed communication up to 1 Mbit/s.
●
●
ISO 11898-2 and ISO 11898-5 compliant
SAE J2284 compliant
●
●
●
●
Function range from +40 V to -27 V DC at CAN pins.
GND disconnection fail safe at module level.
GND shift operation at system level.
Micro controller Interface with CMOS compatible I/O pins.
●
●
●
●
ESD and transient immunity according to ISO7637 and EN / IEC61000-4-2
Matched output slopes and propagation delay
Split output pin for stabilizing the recessive bus level
Receive-only mode available
In order to further reduce the current consumption in standby mode, the integrated CAN bus interface offers an ultra low current consumption.
30/98 Doc ID 16363 Rev 4
L99PM62XP
2.9.1
2.9.2
Description
CAN error handling
The L99PM62XP provides the following 4 error handling features which are not described in the ISO 11898-2/ISO 11898-5, but are realized in different stand alone CAN transceivers / micro controllers to switch the application back to normal operation mode.
Dominant TxDC time out
If TXDC is in dominant state (low) for t > t dom(TxD)
the transmitter is disabled, status bit is latched and can be read and optionally cleared by SPI. The transmitter remains disabled until the status register is cleared.
CAN permanent recessive
If TXDC changes to dominant (low) state but CAN bus does not follow for 4 times, the transmitter is disabled, status bit is latched and can be read and optionally cleared by SPI.
The transmitter remains disabled until the status register is cleared.
CAN permanent dominant
If the bus state is dominant (low) for t > t
CAN
a permanent dominant status is detected. The status bit is latched and can be read and optionally cleared by SPI. The transmitter is not disabled.
RXDC permanent recessive
If RXDC pin is clamped to recessive (high) state, the controller is not able to recognize a bus dominant state and could start messages at any time, which results in disturbing the overall bus communication. Therefore, if RXDC does not follow TXDC for 4 times the transmitter is disabled. The status bit is latched and can be read and optionally cleared by SPI. The transmitter remains disabled until the status register is cleared.
Wake up (from CAN)
When the L99PM62XP is in standby mode with CAN wake up option enabled, the CAN bus traffic is detected. For the wake up feature the L99PM62XP logic differentiates different conditions. During V
1
Standby mode RXDC output is kept at recessive level. Independent from the wakeup pattern selected and independent from the previous Standby mode, the
RXDC reflect immediately the bus state after the wakeup. This feature allows implementation of a ‘partial networking’ functionality controlled by the system microcontroller.
Normal pattern wake up
Normal pattern wake up can occur when CAN pattern wake up option is enabled and the
CAN transceiver was set in standby mode while CAN bus was in recessive (high) state or dominant (low) state. In order to wake up the L99PM62XP, the following criteria must be fulfilled:
●
●
The CAN interface wake-up receiver must receive a series of two consecutive valid dominant pulses, each of which must be longer than 2 µs
The distance between 2 pulses must be longer than 2 µs.
● The two pulses must occur within a time frame of 1.0 ms
Doc ID 16363 Rev 4 31/98
Description L99PM62XP
Note:
Wake up from short to GND condition
Even if CAN pattern wake up option is enabled, but the CAN transceiver was set in standby mode after a qualified permanent dominant state, recessive level at CAN, switches the
L99PM62XP to active mode.
No pattern wake up
If the CAN pattern wake up option is disabled, any transition either dominant (low) state to recessive (high) state or recessive (high) state to dominant (low) state switches the
L99PM62XP to active mode (after a filtering time of 2 µs).
A wake up caused by a message on the bus starts the voltage regulator and the microcontroller to switch the application back to normal operation mode.
Figure 18.
CAN wake up capabilities
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Pictures above illustrate the wake up behaviour from V
1 standby mode. For wake up from
V
BAT
standby mode the NRESET signal (with 2 ms timing) is generated instead of the RXDL
(Interrupt) signal.
CAN sleep mode
During active mode it is possible to deactivate the CAN transceiver with a dedicated SPI command (CR4, CAN_act = 0). The CAN transceiver remains deactivated until it is activated again. With a deactivated CAN the receiver input termination network is disconnected from the bus and the CANH, CANL bus lines is driven to GND. The SPLIT output is also deactivated in this case.
32/98 Doc ID 16363 Rev 4
L99PM62XP
2.9.4
2.9.5
Description
CAN receive only mode
With the CAN_rec_only bit in control register 4 it is possible to disable the CAN transmitter in active mode. In this mode it is possible to listen to the bus but not sending to it. The receiver termination network is still activated in this mode.
CAN looping mode
If the CAN_Loop_en bit in control register 4 is set the TXDC input is mapped directly to the
RXDC pin. This mode can be used in combination with the CAN receive only mode, to run diagnosis for the CAN protocol handler of the micro controller.
2.10 Serial peripheral interface (ST SPI standard)
A 24 bit SPI is used for bi-directional communication with the micro controller.
During active mode, the SPI
● Triggers the watchdog
●
●
●
Controls the modes and status of all L99PM62XP modules (incl. input and output drivers)
Provides driver output diagnostic
Provide L99PM62XP diagnostic (incl. over temperature warning, L99PM62XP operation status)
The SPI can be driven by a micro controller with its SPI peripheral running in following mode:
CPOL = 0 and CPHA = 0.
For this mode input data is sampled by the low to high transition of the clock CLK, and output data is changed from the high to low transition of CLK.
This device is not limited to micro controller with a built-in SPI. Only three CMOS-compatible output pins and one input pin is needed to communicate with the device. A fault condition can be detected by setting CSN to low. If CSN = 0, the DO-pin reflects the global error flag
(fault condition) of the device.
Chip select not (CSN)
The input pin is used to select the serial interface of this device. When CSN is high, the output pin (DO) is in high impedance state. A low signal activates the output driver and a serial communication can be started. The state during CSN = 0 is called a communication frame.
If CSN = low for t > t
CSNfail
the DO output is switched to high impedance in order to not block the signal line for other SPI nodes.
Serial data in (DI)
The input pin is used to transfer data serial into the device. The data applied to the DI is sampled at the rising edge of the CLK signal and shifted into an internal 24 bit shift register.
At the rising edge of the CSN signal the contents of the shift register is transferred to Data
Input Register. The writing to the selected data input register is only enabled if exactly 24 bits are transmitted within one communication frame (i.e. CSN low). If more or less clock
Doc ID 16363 Rev 4 33/98
Description
Note:
L99PM62XP pulses are counted within one frame the complete frame is ignored. This safety function is implemented to avoid an activation of the output stages by a wrong communication frame.
Due to this safety functionality a daisy chaining of SPI is not possible. Instead, a parallel operation of the SPI bus by controlling the CSN signal of the connected IC's is recommended.
Serial data out (DO)
The data output driver is activated by a logical low level at the CSN input and goes from high impedance to a low or high level depending on the global error flag (fault condition). The first rising edge of the CLK input after a high to low transition of the CSN pin transfers the content of the selected status register into the data out shift register. Each subsequent falling edge of the CLK shifts the next bit out.
Serial clock (CLK)
The CLK input is used to synchronize the input and output serial bit streams. The data input
(DI) is sampled at the rising edge of the CLK and the data output (DO) changes with the falling edge of the CLK signal. The SPI can be driven with a CLK Frequency up to 1MHz.
34/98 Doc ID 16363 Rev 4
L99PM62XP
3 Protection and diagnosis
3.1 Power supply fail
Over and under-voltage detection on Vs
Protection and diagnosis
If the supply voltage Vs reaches the over voltage threshold (V
SOV
):
● Outputs OUTx, RELx and LIN are switched to high impedance state (load protection).
CAN is not disabled. Recovery of outputs when the overvoltage condition disappears is depending on the setting of VLOCKOUT_EN bit in Control Register 4.
– VLOCKOUT_EN = 1: Outputs are off until read and clear SR3.
– VLOCKOUT_EN = 0: Outputs switch automatically on when overvoltage condition disappears.
●
●
The over voltage bit is set and can be cleared with a ‘Read and Clear’ command. The overvoltage bit is removed automatically if VLOCKOUT_EN = 0 and the overvoltage condition disappears.
Outputs REL1,2 can be excluded from a shutdown in case of overvoltage by SPI
(LSOVUV_ Shutdown_en in CR4)
If the supply voltage Vs drops below the under voltage threshold voltage (V
SUV
)
● Outputs OUTx, RELx and LIN are switched to high impedance state (load protection).
CAN is not disabled. Recovery of outputs when the undervoltage condition disappears is depending on the setting of VLOCKOUT_EN bit.
VLOCKOUT_EN = 1: Outputs are off until read and clear SR3.
VLOCKOUT_EN = 0: Outputs switch on automatically when undervoltage condition disappears.
●
●
The undervoltage bit is set and can be cleared with a ‘Read and Clear’ command. The undervoltage bit is removed automatically if VLOCKOUT_EN = 0 and the undervoltage condition disappears
Outputs REL1,2 can be excluded from a shutdown in case of undervoltage by SPI
(LSOVUV_shutdown_en in CR4)
Doc ID 16363 Rev 4 35/98
Protection and diagnosis
Figure 19.
Over voltage and under voltage protection and diagnosis
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36/98 Doc ID 16363 Rev 4
L99PM62XP Protection and diagnosis
3.2 Temperature warning and thermal shutdown
Figure 20.
Thermal shutdown protection and diagnosis
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The thermal state machine recovers the same state were it was before entering standby mode. In case of a TSD2 it enters TSD1 state.
Doc ID 16363 Rev 4 37/98
Protection and diagnosis
3.3
Note:
L99PM62XP
High-side driver outputs
The component provides a total of 4 high-side outputs Out1 to 4, (7
Ω typ. at @ 25°C) to drive e.g. LED's or hall sensors and 1 high-side output OUT_HS with 1
Ω typ. at @ 25 °C).
The high-side outputs switch off in case of:
● Vs over and undervoltage
●
●
Over current
Overtemperature with pre warning
(a)
In case of overload or over temperature (TSD1) condition, the drivers switchs off. The according status bit is latched and can be read and optionally cleared by SPI. The drivers remain off until the status is cleared.
In case over/under voltage condition, the drivers is switched off. The according status bit is latched and can be read and optionally cleared by SPI. If the Vlockout bit (Control Register
4) is set to ‘1’ the drivers remain off until the status is cleared. If the Vlockout bit is set to ‘0’ the drivers switches on automatically if the error condition disappears.
In case of open-load condition, the according status register is latched. The status can be read and optionally cleared by SPI. The high-sides not switches off.
For OUT_HS the auto recovery feature (OUTHSREC bit Control Register 4) can be enabled. If this bit is set to ‘1’ the driver is automatically restart from a overload condition.
This overload recovery feature is intended for loads which have an initial current higher than the over current limit of the output (e.g. Inrush current of cold light bulbs). During auto recovery mode the over current status bit can not be read from SPI.
The device itself can not distinguish between a real overload and a non linear load like a light bulb. A real overload condition can only be qualified by time. As an example, the micro controller can switch on light bulbs by setting the over current recovery bit for the first 50ms.
After clearing the recovery bit, the output is automatically disabled if the overload condition still exists.
In case of a fail safe condition, the high-side drivers are switched off. The control bits are set to default values. (except OUT3/FSO if it is used as a high-side driver output)
The maximum voltage and current applied to the high-side outputs is specified in
Section 2.1: Voltage regulators
. Appropriate external protection may be required in order to respect these limits under application conditions.
3.4 Low-side driver outputs REL1, REL2
The outputs REL1, REL2 (R
DSon
= 2
Ω
typ. @25
°
C) are specially designed to drive relay loads.
The outputs provide an active output zener clamping (45 V typ.) feature for the demagnetization of the relay coil, even though a load dump condition exists.
For fail-safe reasons the relay drivers are linked with the fail safe operation: in case of entering the fail safe mode, the relay drivers switchs off and the SPI control bits are set to default (i.e. driver is off).
38/98 a.
Except OUT3 when configured as FSO.
Doc ID 16363 Rev 4
L99PM62XP Protection and diagnosis
The low-side drivers switch off in case of:
● Vs over and undervoltage
●
●
Over current
Overtemperature with pre warning
In case of overload or overtemperature (TSD1) condition, the drivers switches off. The according status bit is latched and can be read and optionally cleared by SPI. The drivers remain off until the status is cleared.
In case Vs over/undervoltage condition, the drivers is switched off. The according status bit is latched and can be read and optionally cleared by SPI. If the Vlockout bit (Control
Register 4) is set to ‘1’ the drivers remain off until the status is cleared. If the Vlockout bit is set to ‘0’ the drivers is switched on automatically if the error condition disappears.
With the LSOVUV_shutdown_en bit (Control Register 4) the drivers can be excluded from a switch off in case of Vs over/undervoltage. If the bit is set to ‘1’ the driver switchs off, otherwise the drivers remain on.
Digital diagnosis features are provided by SPI (for details please refer to
●
●
V
1
reset threshold programmable
Overtemperature including. pre warning
●
●
●
●
●
●
Open-load separately for each output stage except REL1/REL2
Overload status separately for each output stage
Vs-supply over/under voltage
V
1
and V
2
fail bit
V
2
output short to GND
Status of the WU1 to 3
●
●
●
●
●
●
●
●
●
●
●
Wake-up sources (CAN, LIN, SPI, Timer, WU1…3) chip reset bit (start from power-on reset)
Number of unsuccessful V
1
restarts after thermal shutdown
Number of sequential watchdog failures
LIN diagnosis (permanent recessive/dominant, dominant TxD)
CAN diagnosis (permanent recessive/dominant, dominant TxD, recessive RXD)
Device State (wake-up from V1 standby or V
BAT standby)
Forced V
BAT standby after WD-fail, forced V
BAT standby after overtemperature
Watchdog timer state (diagnosis of watchdog)
Fail-safe status
SPI communication error
Doc ID 16363 Rev 4 39/98
Typical application L99PM62XP
Figure 21.
Typical application diagram
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40/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
Table 7.
Absolute maximum rating
Symbol Parameter/test condition
V
S
V
1
V
2
V
DI
V
CLK
V
DO
V
RXDL
V
NRESET
V
RXDC
V
TXDC,
V
TXDL
, V
CSN
V
REL1,
V
REL2,
V
OUT1..3,
V
OUT_HS
V
WU1...4
V
OP1P,
V
OP1M,
V
OP2P,
V
OP2M,
V
OPOUT1,
V
OPOUT2
V
LIN,
V
LINPU
I
Input
Iout_inj
DC supply voltage / “jump start”
Single pulse / t max
< 400 ms “transient load dump”
Stabilized supply voltage, logic supply
Stabilized supply voltage
Logic input / output voltage range
Multi level inputs
Low-side output voltage range
High-side output voltage range
Wake up input voltage range
Opamp1 input voltage range
Opamp2 input voltage range
Analog Output voltage range
LIN bus I/O voltage range
Current injection into Vs related input pins
Current injection into Vs related outputs
V
CANSUP
V
CANH,
V
CANL,
V
SPLIT
CAN supply
CAN bus I/O voltage range
Note:
Value [DC voltage]
-0.3 to +28
-0.3 to +40
-0.3 to +5.25
-0.3 to +28
-0.3 to V
1
+0.3
-0.3 to Vs+0.3
-0.3 to +40
-0.3 to V
S
+0.3
-0.3 to V
S
+0.3
-0.3 to V
1
+0.3
-0.3 to V
S
+0.3
-20 to +40
10
10
-0.3 to +5.25
-27 to +40
Unit
V
V
V
V
V
All maximum ratings are absolute ratings. Leaving the limitation of any of these values may cause an irreversible damage of the integrated circuit!
Loss of ground or ground shift with externally grounded loads: ESD structures are configured for nominal currents only. If external loads are connected to different grounds, the current load must be limited to this nominal current.
V
V mA mA
V
V
V
V
V
V
V
Doc ID 16363 Rev 4 41/98
Electrical specifications L99PM62XP
Table 8.
All pins
(1)
All output pins
(2)
LIN
ESD protection
Parameter
CAN_H, CAN_L
Value
+/-2
+/-4
+/-8
+/-6
(3)
+/-500
Unit kV kV kV kV
All pins (charge device model) V
Corner pins (charge device model)
All pins
(4)
+/-750
+/-200
V
V
1.
HBM (human body model, 100pF, 1.5 k
Ω
) according to MIL 883C, method 3015.7 or EIA/JESD22A114-A
2.
HBM with all none zapped pins grounded.
3.
EN / IEC61000-4-2 according to report from external test house.
4.
Acc. machine model: C = 200 pF; R = 0
Ω
.
Table 9.
Symbol
T j
R thjA
Operating junction temperature
Parameter
Operating junction temperature
Thermal resistance junction / ambient
Value
-40 to 150
See
Unit
°C
°K/W
Table 10.
Temperature warning and thermal shutdown
Symbol Parameter
T
W ON
T
SD1 OFF
T
SD2 OFF
T
SD2 ON
T
SD12hys
1.
Non-overlapping
Thermal over temperature warning threshold
T j
(1)
Thermal shutdown junction temperature 1 T j
T j
Thermal shutdown junction temperature 2
Hysteresis
Min.
Typ.
Max.
Unit
120 130 140
130 140 150
140 155 170
5
°C
°C
°C
°C
42/98 Doc ID 16363 Rev 4
L99PM62XP
5.4 Package and PCB thermal data
Figure 22.
PowerSSO-36 PC board
Electrical specifications
Note:
$*9
Layout condition of R th and Z th measurements (board finish thickness 1.6 mm +/- 10% board double layer, board dimension 129x60, board Material FR4, Cu thickness 0.070 mm (front and back side), thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm,
Cu thickness on vias 0.025 mm).
Doc ID 16363 Rev 4 43/98
Electrical specifications L99PM62XP
Figure 23.
PowerSSO-36 thermal resistance junction to ambient vs PCB copper area
(V1 ON)
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Figure 24.
PowerSSO-36 Thermal Impedance junction to ambient vs PCB copper area (single pulse with V1 ON)
AG00025V1
44/98 Doc ID 16363 Rev 4
L99PM62XP
Figure 25.
PowerSSO-36 thermal fitting model (V1 ON)
Electrical specifications
$*9
Equation 1: pulse calculation formula
Z
TH δ
= R
TH
⋅ δ
+ Z
THtp
( 1 –
δ ) where
δ
= t p
⁄ T
Table 11.
Thermal parameter
Area/island (cm
2
)
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
C1 (W.s/°C)
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
Footprint
0.01
0.1
0.8
2
2
8
20
36
2
4
15.5
29
0.2
1
3
8
0.2
1.5
6
4
10
18
Doc ID 16363 Rev 4 45/98
Electrical specifications L99PM62XP
5.5.1 Supply and supply monitoring
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin T j
= -40 °C to 130 °C, unless otherwise specified.
Table 12.
Supply and supply monitoring
Symbol Parameter Test condition Min.
Typ.
Max.
Unit
V
S
V
SUV
V hyst_UV
V
SOV
V hyst_OV t ovuv_filt
Supply voltage range
V
S
undervoltage threshold
Vs undervoltage hysteresis
V
S
overvoltage threshold
Vs overvoltage hysteresis
Vs over/undervoltage filter time
V
S
increasing / decreasing
V
S
increasing / decreasing
Hysteresis
I
I
V(act)
V(BAT)
Current consumption in active mode
Current consumption in
V
BAT
standby mode
Vs = 12V
TxD CAN = high
TxD LIN = high
V
1
= on, V
2
= on
V
S
= 12V
Both voltage regulators deactivated, no wake-up request
(1)
I
V(BAT)CS
Current consumption in
V
BAT
standby mode with cyclic sense enabled
V
S
= 12V
Both voltage regulators deactivated,
T = 50 ms, ton = 100 µs no wake-up request
6
5.11
0.0
18.5
0.5
8
40
13.5
0.1
1
64*T
6
12
75 osc
I
V(BAT)CW
Current consumption in
V
BAT standby mode with cyclic wake enabled
V
S
= 12V
Both voltage regulators deactivated
During standby phase no wake-up request
40 75
I
(V1)
Current consumption in
V
1
-standby mode
V
S
= 12V
Voltage Regulator V
1
active,
(I v1
< I cmp
) no wake-up request
16 51
1.
Conditions for no wake-up request are (all conditions must be met):
2 V < LIN < (Vs-2 V)
0.4 V < (CAN_H – CAN_L) < 1,2 V
1 V < V
WUth
< (Vs-2 V)
The current consumption in standby modes with cyclic sense can be calculated using the following formulas:
I
V(BAT)CS
I
(V1)CS
= I
V(BAT)
= I
V1
+ 55 µA + (2 mA * (t
+ 55 µA + (2 mA * (t
ON
ON
+ 100 µs) / T)
+ 100 µs) / T)
18
5.81
0.15
22
1.5
12
28
125
125
76 mA
µA
µA
µA
µA
V
V
V
V
V
46/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
5.5.2 Oscillator
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 4.5 V < V
S
< 28 V; all outputs open; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 13.
Oscillator
Symbol Parameter
F
CLK
Oscillation frequency
Test condition Min.
0.80
Typ.
Max.
Unit
1.0
1.35
MHz
All outputs open; T j
= -40°C to 130°C, unless otherwise specified.
Table 14.
Power-on reset (V s
)
Symbol Parameter Test condition
V
POR
V
POR
V
V
POR
POR
threshold
threshold
Vs increasing
Vs decreasing
(1)
1.
This threshold is valid if Vs had already reached 7V previously
Min.
2.65
Typ.
Max.
Unit
3.45
4.5
3.5
V
V
5.5.4 Voltage regulator V
1
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 4.5 V < V
S
< 28 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 15.
Voltage regulator V
1
Symbol Parameter Test condition
V
1
Output voltage
V
V
V
V
1 hc
STB
DP
1
1
1
Output voltage tolerance
Active mode
Output voltage tolerance active mode, high current
Output voltage tolerance
V
1
-standby mode
Drop-out Voltage
I
LOAD1
= 1mA to 100 mA,
V
S
= 13.5 V
I
LOAD1
= 100 mA to 250 mA,
V
S
= 13.5 V
I
LOAD1
= 250 mA
V
S
= 13.5 V
I
LOAD1
= 0 µA to 1 mA,
V
S
= 13.5 V
I
LOAD1
= 50 mA, V
S
= 5 V
I
LOAD1
= 100 mA, V = 4.5 V
I
LOAD1
= 100 mA, V
S
= 5 V
I
LOAD1
= 150 mA, V
S
= 4.5 V
I
LOAD1
= 150 mA, V
S
= 5.0 V
I
I
CC
1 Output current in active mode Max. continuous load current
CC max1 Short circuit output current Current limitation
C load1
Load capacitor1 Ceramic (+/- 20%)
Min.
400
0.22
(1)
Typ.
5.0
0.2
0.2
0.3
0.45
0.45
600
Max.
Unit
V
+/- 2
+/- 3
+/- 5%
+/- 4%
0.4
0.5
0.5
0.6
0.6
250
950
%
%
%
%
V
V
V
V
V mA mA
µF
Doc ID 16363 Rev 4 47/98
Electrical specifications L99PM62XP
Table 15.
Voltage regulator V
1
(continued)
Symbol Parameter Test condition Min.
Typ.
Max.
Unit t
TSD
V
1
deactivation time after thermal shutdown
1 sec
I cmp_ris
I cmp_fal
I cmp_hys
V
1fail tV tV
1fail
1short
Current comp. rising thresh.
Current comp. falling threshold
Current comp. hysteresis
V
1
fail threshold
V
1
fail filter time
V
1
short filter time
Rising current
Falling current
V
1
forced
1.2
0.8
2.5
1.95
0.5
2
2
4
4
2.8
1.
Nominal capacitor value required for stability of the regulator. Tested with 220 nF ceramic (+/- 20 %). Capacitor must be located close to the regulator output pin.
mA mA mA
V
µs ms
5.5.5 Voltage regulator V
2
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 4.5 V < V
S
< 28 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 16.
Voltage regulator V
2
Symbol Parameter Test condition Min.
Typ.
Max.
Unit
V
V
V
V
2
2 hc1
2
Output voltage
Output voltage tolerance active mode
Output voltage tolerance active mode
Output voltage tolerance active mode, high current
I
I
I
LOAD2
V
V
S
S
= 1 mA to 50 mA,
= 13.5 V
LOAD2
= 50 mA to 80 mA,
= 13,5 V
LOAD2
= 100 mA, V
S
= 13,5 V
5,0
+/- 3
+/- 4
+/- 6
V
%
%
%
V
V
STB2
DP2
Output voltage tolerance
V
1
standby mode
Drop-out voltage
I
LOAD2
= 0 µA to 1 mA
V
S
= 13,5 V
I
LOAD2
= 25 mA, Vs = 5.25 V
I
LOAD2
= 50 mA, Vs = 5.25 V
Max. continuous load current
0.3
0.4
+/-6
0.4
0.7
%
V
V
I
CC2
I
CCmax2
C load
V
2fail t t
V2fail
V2short
Output current in active mode
Short circuit output current
Load capacitor
V
2
fail threshold
V
2
fail filter time
V
2
short filter time
Current limitation
Ceramic (+/- 20 %)
V
2
forced
200
0.22
(1)
300
2
4
100
500
2
1.
Nominal capacitor value required for stability of the regulator. Tested with 220 nF ceramic (+/- 20 %). Capacitor must be located close to the regulator output pin.
mA mA
µF
V
µs ms
48/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 4.0 V < V
S
= 28 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 17.
Reset output
Symbol Parameter Test condition
V
V
RT1
V
RT2
RESET
Reset threshold voltage1
Reset threshold voltage2
V
RT3
V
RT4
Reset threshold voltage3
Reset threshold voltage4
VRT4 Reset threshold voltage4
Reset pin low output voltage
V
1
decreasing
V
1
decreasing
V
1
decreasing
V1
decreasing
V
1
increasing
V
1
> 1V, I
RESET
5 mA
=
R
RESET t
RR t
UV1
Trd
Reset pull up int. resistor
Reset reaction time
V
1
under-voltage filter time
Reset pulse duration
I
LOAD1
= 1 mA
Min.
Typ.
Max.
Unit
3.7
4.2
4.25
4.5
4.7
3.9
4.3
4.4
4.60
4.8
4.1
4.45
4.55
4.75
4.9
V
V
V
V
V
80
6
1.5
0,2
110
16
2
0,4
150
40
2.5
V k Ω
µs
µs ms
5.5.7 Watchdog
4.5 V < V
S
< 28 V; 4.8 V < V
1
< 5.2 V; T j
= -40 °C to 130 °C, unless otherwise specified, see
Table 18.
Watchdog
Symbol Parameter t
LW
T
EFW1
T
LFW1
T
SW1
T
EFW2
T
LFW2
T
SW2
T
EFW3
T
LFW3
T
SW3
T
EFW4
T
LFW4
T
SW4
Long open window
Early failure window 1
Late failure window 1
Safe window 1
Early failure window 2
Late failure window 2
Safe window 2
Early failure window 3
Late failure window 3
Safe window 3
Early failure window 4
Late failure window 4
Safe window 4
TBD
Test condition Min.
48,75
20
7.5
100
37.5
200
75
400
150
Typ.
Max.
Unit
65 81,25
4.5
12
22.5
60
45
120
90
240 ms ms ms ms ms ms ms ms ms ms ms ms ms
Doc ID 16363 Rev 4 49/98
Electrical specifications
Figure 26.
Watchdog timing (long, early, late and safe window)
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7
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7
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7
&:
7
2:
7
&:
7
2: 7
&:
7
/:
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7
/:
7
/:
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7
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7
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7
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7
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50/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
Figure 27.
Watchdog early, late and safe windows
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7():Q (DUO\)DLOXUHZLQGRZ
7/):Q /DWHIDLOXUHZLQGRZ
7/):QBPLQ
76:QBPD[
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7():QBPD[
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IDLOXUH
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The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.8 V < V
1
< 5.2 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 19.
Output (OUT_HS)
Symbol Parameter
R
DS
ON
Static drain source on-resistance
(IOUT_HS = 150 mA)
Switch on delay time t d
ON t d
OFF Switch off delay time t
SCF
Short circuit filter time t d
ARHS Auto recovery filter time dV
OUT
/dt Slew rate
I
OUT
Short circuit shutdown current
I
OLD t
OLDT
Open-load detection current
I
FW
1
Open-load detection time
Loss of GND current
(ESD structure)
Test condition
T j
= 25 °C
T j
= 125 °C
0.2 V
S
0.8 V
S
Tested by scan chain
Tested by scan chain
Min.
5
40
0,18
Typ.
1,0
1.6
35
95
64*T
OSC
400*T
OSC
0,5
Max.
Unit
2
3
60
Ω
Ω
µs
150 µs
0,8 V/µs
Tested by scan chain
480
40
100
900
80
64*T
OSC
1320 mA
120 mA mA
Doc ID 16363 Rev 4 51/98
Electrical specifications L99PM62XP
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.8 V < V
1
< 5.2 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 20.
Outputs (OUT1...4)
Symbol Parameter
R t
DS
ON
OLDT
Static drain source on-resistance
(IOUT_HS = 150mA)
Open-load detection time
1.
Parameter guaranteed by design
I
T
LOAD j
= 60 mA @
= +25 °C
I
OUT
Short circuit shutdown current 8 V < V s
< 16 V
I
OLD
Open-load detection current 1 dV
OUT
/dt Slew rate
Switch ON delay time t dON t dOFF t
SCF
Switch OFF delay time
Short circuit filter time
0.2 V s
0.8 V s
Tested by scan chain
I
FW
(1)
Loss of GND current
(ESD structure)
Tested by scan chain
Min.
Typ.
7
140
0.9
0.2
5
30
235
2
0.5
35
95
64*T
OSC
350 mA
4.5
mA
0.8
V/µs
60
150
µs
µs
100 mA
64*T
OSC
Max.
Unit
13 Ω
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.8 V < V
1
< 5.2 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 21.
Relay drivers
Symbol Parameter Test condition Min.
Typ.
Max.
Unit
R
DSON
I
OUT
V
Z t
ONHL
DC output resistance
Short circuit shutdown current
Output clamp voltage
(1)
Turn on delay time to 10% V
OUT
I
LOAD
8 V < V s
I
LOAD
= 100 mA @ T
< 16 V
= 100 mA j
= +25 °C
250
40
5
2
375
50
3
Ω
500 mA
48
100
V
µs t
OFFLH t
SCF
Turn off delay time to 90% V
Short circuit filter time
OUT
Tested by scan chain
5 50
64*T
OSC
100 µs dV
OUT
/dt Slew Rate 0.2
2 4
1.
The output is capable to switch off relay coils with the impedance of R
L dump condition)
= 160 Ω ; L = 300mH (R
L
= 220 Ω ; L = 420mH); at V
S
= 40V (Load
V/µs
52/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
5.5.10 Wake up inputs (WU1... WU3)
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 22.
Wake up inputs (WU1... WU3)
Symbol Parameter
V
V
WUthp
WUthn
Wake-up negative edge threshold voltage
Wake-up positive edge threshold voltage
V
HYST t
WU_stat
I
WU_stdby
Hysteresis
Static wake filter time
Input current in standby mode
R
WU_act
Input resistor to Gnd in active mode and in standby mode during wake-up request t
WU_cyc
Cyclic wake filter time
1.
Blanking time 80 µs or 800 µs.
1 V > V in
> (V s
- 2 V)
Min.
0,4*V s
0,5*V s
Typ.
0.45*V s
0,55*V s
Max.
Unit
0,5*V s
0,6*V s
0.05*V s
10
0.1*V s
64*T
OSC
20
0.15*V s
30
80 160
16
(1)
300
V
V
V
µs
µA k Ω
µs
5.5.11
High speed CAN transceiver
(b)
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin.
6 V < V
S
< 18 V; 4.8 V < Vcansup. < 5.2 V; T junction
= -40 °C to 130 °C, unless otherwise specified.
Table 23.
CAN transmit data input: pin TXDC
Symbol
V
TXDCLOW
Parameter Test condition
Input voltage dominant level
Active mode, V
1
= 5 V
V
TXDCHIGH
V
TXDCHYS
R
TXDCPU
Input voltage recessive level
Active mode, V
1
= 5 V
V
TXDCHIGH
-V
TXDCLOW
Active mode, V
1
= 5 V
TXDC pull up resistor Active mode, V
1
= 5 V
Min.
1.35
0.7
10
Typ.
1.8
2.5
1
20
Max.
2.8
35
Unit
V
V
V k Ω
Table 24.
CAN receive data output: pin RXDC
Symbol Parameter Test condition
V
RXDCLOW
V
RXDCHIGH
Output voltage dominant level Active mode, V
1
= 5 V, 2 mA
Output voltage recessive level Active mode, V
1
= 5 V, 2 mA
Min.
4.5
Typ.
Max.
Unit
0.2
0.5
V
V b.
ISO 11898-2 and ISO 11898-5 compliant; SAE J2284 compliant.
Doc ID 16363 Rev 4 53/98
Electrical specifications L99PM62XP
Table 25.
CAN bus common mode stabilization output termination: pin SPLIT
Symbol Parameter Test Condition Min.
Typ.
V
SPLIT,l
Split output voltage, loaded condition (normal mode)
Active mode;
V
TXDC
= V
TXDCHIGH
;
|Isplit| = 500 µA
V
SPLIT,u
Split output voltage, unloaded condition (normal mode)
I
SPLIT
Split leakage current (low power mode)
Active mode;
V
TXDC
= V
TXDCHIGH
; No Load
V
1
-standby mode;
-12 V < V
SPLIT
< 12 V
Max.
0.3*
V
CANSUP
0.5*
V
CANSUP
0.7*
V
CANSUP
0.5*
V
CANSUP
0.55*
V
CANSUP
5
Unit
V
V
µA
Table 26.
CAN transmitter and receiver: pins CANH and CANL
Symbol Parameter Test Condition
V
V
V
DIFF,domOUT
V
CANHdom
CANLdom
V
CM
CANHrec
CANH voltage level in dominant state
Active mode;
V
TXDC
R
L
= V
= 60 Ω
TXDCLOW
;
CANL voltage level in dominant state
Active mode;
V
TXDC
R
L
= V
= 60 Ω
TXDCLOW
;
Differential output voltage in dominant state:
V
CANHdom
- V
CANLdom
Driver symmetry:
V
CANHdom
+ 0V
CANLdom
Active mode;
V
TXDC
R
L
= V
= 60 Ω
TXDCLOW
;
Active mode;
V
TXDC
R
L
= V
= 60 Ω ;
TXDCLOW
;
C
SPLIT
= 4.7 pF
CANH voltage level in recessive state (normal mode)
Active mode;
V
TXDC
= V no load
TXDCHIGH
;
V
V
CANLrec
CANHrecLP
CANL voltage level in recessive state (normal mode)
Active mode;
V
TXDC
= V no load
TXDCHiGH
;
CANH voltage level in recessive state (low power mode)
V
1
standby mode;
V
TXDC no load
= V
TXDCHIGH
;
V
V
CANLrecLP
DIFF,recOUT
V
DIFF,recOUTL
P
CANL voltage level in recessive state (low power mode)
V
1
standby mode;
V
TXDC
= V
TXDCHiGH
; no load
Differential output voltage in recessive state (normal mode):
V
CANHrec
- V
CANLrec
Differential output voltage in recessive state (low power mode): V
CANHrec
- V
CANLrec
Active mode;
V
TXDC no load
= V
TXDCHIGH
;
V
1
V
standby mode;
TXDC no load
= V
TXDCHIGH
;
Min.
2.75
0.5
1.5
Typ.
Max.
Unit
4.5
2.25
3
0.9*
V
CANSUP
V
CANSUP
1.1*
V
CANSUP
2
2
-0.1
-0.1
-50
-50
2.5
2.5
0
0
3
3
0.1
0.1
50
50
V
V
V
V
V
V
V
V mV mV
54/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
Table 26.
CAN transmitter and receiver: pins CANH and CANL (continued)
Symbol Parameter Test Condition Min.
Typ.
V
CANHL,CM
I
OCANH,dom
I
OCANL,dom
I
Leakage
R in
R in,diff
C in
C in,diff
V
THdom
V
THdomLP
V
THrec
V
THrecLP
Common mode Bus voltage
CANH output current in dominant state
CANL output current in dominant state
Input leakage current
Internal resistance
Differential receiver threshold voltage dominant to recessive state (normal mode)
Differential receiver threshold voltage dominant to recessive state (low power mode)
Measured with respect to the ground of each CAN node
Active mode;
V
TXDC
V
CANH
= V
TXDCLOW
;
= 0 V
Active mode;
V
TXDC
V
CANL
= V
TXDCLOW
;
= 5 V
Unpowered device;
V
BUS
= 5 V
Active mode & V
1 standby mode;
V
TXDC no load
= V
TXDCHIGH
;
Differential internal resistance Active mode & V
1 standby mode;
V
TXDC no load
= V
TXDCHIGH
;
Internal capacitance Guaranteed by design
Differential internal capacitance Guaranteed by design
Active mode Differential receiver threshold voltage recessive to dominant state (normal mode)
Differential receiver threshold voltage recessive to dominant state (low power mode)
V
1
standby mode
Active mode
V
1
standby mode
-12
-160
45
0
20
50
0.5
0.4
-75
75
27.5
60
20
10
Max.
Unit
12 V
-45 mA
160 mA
250 µA
38
75
0.9
1.15
k Ω k Ω pF pF
V
V
V
V
Table 27.
CAN transceiver timing
Symbol Parameter tTXpd,hl tTXpd,lh t wake
Propagation delay TXDC to
RXDC (high to low)
Propagation delay TXDC to
RXDC (low to high)
Wake up filter time
Test condition
Active mode; 50 % V
TXDC
to 50 %
V
RXDC
; C
RXDC
= 100 pF; R
L
= 60
Ω
Active mode; 50 % V
TXDC
to 50 %
V
RXDC
; C
RXDC
= 100 pF; R
L
= 60
Ω
Min.
Typ.
Max.
Unit
0 255 ns
0
0.5
255
5 ns
µs
Doc ID 16363 Rev 4 55/98
Electrical specifications
Table 27.
CAN transceiver timing (continued)
Symbol Parameter Test condition t dom(TXDC) t
CAN
TXDC dominant time-out
CAN permanent dominant time-out
L99PM62XP
Min.
Typ.
Max.
Unit
700 µs
700 µs
5.5.12
LIN transceiver
(c)
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin.
6 V < V
S
< 18 V; 4.8 V < V
1
< 5.2 V; T junction
= -40 °C to 130 °C unless otherwise specified.
Table 28.
LIN transmit data input: pin TXD
Symbol Parameter Test condition
V
TXDLOW
V
TXDHIGH
V
TXDHYS
R
TXDPU
Input voltage dominant level Active mode; V
1
= 5 V
Input voltage recessive level Active mode; V
1
= 5 V
V
TXDHIGH
-V
TXDLOW
TXD pull up resistor
Active mode; V
Active mode; V
1
1
= 5 V
= 5 V
Min.
Typ.
Max.
Unit
1,35 1.8
0.7
10
2.5
1
20
2.8
35
V
V
V k Ω
Table 29.
LIN receive data output: pin RXD
Symbol Parameter Test condition
V
RXDLOW
V
RXDHIGH
Output voltage dominant level
Active mode;
V
1
= 5 V, I
LOAD1
= 2 mA
Output voltage recessive level
Active mode;
V
1
= 5 V, I
LOAD1
= 2 mA
Table 30.
LIN transmitter and receiver: pin LIN
Symbol Parameter Test condition
V
THdom
V
THrec
V
THhys
V
THcnt
V
THwkup
Receiver threshold voltage recessive to dominant state
Receiver threshold voltage dominant to recessive state
Receiver threshold hysteresis:
V
THrec
-V
THdom
Receiver tolerance center value: (V
THrec
+V
THdom
)/2
Receiver wakeup threshold voltage
Min.
Typ. Max.
Unit
0.2
0.5
V
4.5
V
Min.
Typ.
Max.
0.4*V
S
0.45*V
S
0.5*V
S
Unit
V
0.5*V
S
0.55*V
S
0.6*V
S
V
0.07*V
S
0.1*V
S
0.175*V
S
V
0.475*V
S
0.5*V
S
0.525*V
S
V
1.0
1.5
2 V c.
LIN 2.1 compliant for Baud rates up to 20 kBit/s
SAE J2602 compatible
56/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
Table 30.
LIN transmitter and receiver: pin LIN (continued)
Symbol Parameter Test condition
V
THwkdwn
Receiver wakeup threshold voltage t linbus
Dominant time for wakeup via bus
Sleep mode; edge: rec-dom
I bus_PAS_dom
I
I
LINDomSC bus_PAS_rec
Transmitter input current limit in dominant state
V
TXD
= V
TXDLOW
;
V
LIN
= V
BATMAX
= 18 V
Input leakage current at the receiver incl. pull-up resistor
Transmitter input current in recessive state
V
TXD
V
LIN
= V
TXDHIGH
;
= 0 V; V
BAT
= 12 V
(1)
V
TXD
= V
TXDHIGH
;
8 V < V
LIN
;
V
BAT
< 18 V; V
LIN
>= V
BAT in standby modes
I bus_NO_GND
V
V
LINdom
R
I bus
LINrec
LINup
1.
Slave mode.
Input current if loss of GND at device
Input current if loss of V device
BAT
LIN voltage level in dominant state
LIN voltage level in recessive state
LIN output pull up resistor
at
GND = V
S
;
0 V < V
LIN
< 18 V;
V
BAT
= 12 V
GND = V
S
;
0 V < V
LIN
< 18 V
Active mode;
I
V
TXD
LIN
= V
TXDLOW
= 40 mA
;
Active mode;
I
V
TXD
LIN
= V
TXDHIGH
= 10 µA
;
V
LIN
= 0 V
Min.
V
S
-3.5
40
-1
-1
0.8*V
S
20
Typ.
V
S
-2.5
64*T
OSC
100
40
Max.
V
S
-1.5
180
20
1
100
1.2
1
60
Unit
V
µs mA mA
µA mA
µA
V
V k Ω
Table 31.
LIN transceiver timing
Symbol Parameter Test condition t
RXpd t
RXpd_sym
Receiver propagation delay time
Symmetry of receiver propagation delay time
(rising vs. falling edge) t
RXpd
= max(t
RXpdr
, t
RXpdf
); t
RXpdf
= t(0.5 V
RXD
) - t(0.45 V
LIN
); t
RXpdr
= t(0.5 V
RXD
) - t(0.55 V
LIN
);
V
S
= 12 V; C
RXD
= 20 pF;
R bus
, = 1 k Ω , C bus
= 1 nF;
R bus
= 660 Ω , C bus
= 6.8 nF;
R bus
= 500 Ω , C bus
= 10 nF t
RXpd_sym
= t
RXpdr
- t
RXpdf
;
V
S
= 12 V;
R bus
= 1 k
Ω
, C bus
= 1 nF
Min.
Typ.
Max.
Unit
-2
6
2
µs
µs
Doc ID 16363 Rev 4 57/98
Electrical specifications
Table 31.
LIN transceiver timing (continued)
Symbol Parameter Test condition
D1
D2
D3
D4
Duty cycle 1
Duty cycle 2
Duty cycle 3
Duty cycle 4
TH
Rec
(max) = 0.744*V
S
;
TH
Dom
(max) = 0.581*V
S
;
V
S
= 7 V to 18 V, t bit
= 50 µs;
D1 = t bus_rec
(min)/(2xt bit
);
R
R
R bus bus bus
= 1 k
Ω
, C
= 660 Ω bus
, C
= 500
Ω
, C
= 1 nF; bus bus
= 6.8 nF;
= 10 nF
TH
Rec
(min) = 0.284*V
S
;
TH
Dom
(min) = 0.422*V
S
;
V
S
= 7.6 to 18 V, t bit
= 50 µs;
D2 = t bus_rec
(max)/(2xt bit
);
R
R
R bus bus bus
= 1 k Ω , C
= 660
Ω bus
, C
= 500 Ω , C
= 1 nF; bus bus
= 6.8 nF;
= 10 nF
TH
Rec
(max) = 0.778*V
S
;
TH
Dom
(max) = 0.616*V
S;
V
S
= 7 V to 18 V, t bit
= 96 µs;
D3 = t bus_rec
(min)/(2xt bit
);
R
R
R bus bus bus
= 1 k
Ω
, C
= 660 Ω bus
, C
= 500 Ω , C
= 1 nF; bus bus
= 6.8 nF;
= 10 nF
TH
Rec
(min) = 0.251*V
S
;
TH
Dom
(min) = 0.389*V
S
;
V
S
= 7.6 V to 18 V, t bit
= 96 µs;
D4 = t bus_rec
(max)/(2xt bit
);
R
R
R bus bus bus
= 1 k Ω , C
= 660 Ω bus
, C
= 500 Ω , C
= 1 nF; bus bus
= 6.8 nF;
= 10 nF t dom(TXDL)
TXDL dominant time-out t
LIN
LIN permanent recessive time-out t dom(BUS)
LIN bus permanent dominant time-out
Table 32.
LIN pull-up: pin LINPU
Symbol Parameter
RDS
ON
I leak
ON resistance
Leakage current
Test condition
L99PM62XP
Min.
Typ.
Max.
Unit
0.396
0.417
12
40
12
0.581
0.590
Min.
Typ.
Max.
Unit
10.5
16
1
Ω
µA ms
µs ms
58/98 Doc ID 16363 Rev 4
L99PM62XP
Figure 28.
LIN transmit, receive timing
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9
7['
9
/,1
9
7+UHF
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7+GRP
9
/,1GRP
9
5['
W
5;SGI
9
/,1UHF
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7;SGU
Electrical specifications
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Note:
The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; T j
= -40 °C to 130 °C, unless otherwise specified.
Table 33.
Operational amplifier
Symbol Parameter Min.
Typ.
Max.
GBW GBW product
AVOL
DC
DC open loop gain
PSRR Power supply rejection
1
80
3.5
7.0
DC, Vin = 150 mV 80
V off
Input offset voltage -5 +5
V
ICR
V
OH
V
OL
I
Lim+
Common mode input range
Output voltage range high I
LOAD
Output voltage range low I
LOAD
Output current limitation + DC
I lim-
Output current limitation -
SR+ Slew rate positive
DC
= 1 mA to V
S
-0.2
0
10
-10
1
0 3
= 1 mA to Gnd V
S
-0.2 V
S
15
15
4
0.2
30
-30
10
SRSlew rate negative -1 -4 -10
Unit
V
V
V mA
MHz dB dB mV mA
V/µs
V/µs
The operational amplifier is on-chip stabilized for external capacitive loads C
L
< 25 pF (all operating conditions)
Doc ID 16363 Rev 4 59/98
Electrical specifications L99PM62XP
5.5.14 SPI
Input: CSN
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.5 V < V
130 °C, unless otherwise specified.
1
< 5.3 V; all outputs open; T j
= -40 °C to
Input: CSN
Table 34.
Input: CSN
Symbol Parameter
VCSNLOW Input voltage low level
VCSNHIGH Input voltage high level
VCSNHYS VCSNHIGH - VCSNLOW
ICSNPU CSN pull up resistor
Test condition
Normal mode, V
1
= 5 V
Normal mode, V
1
= 5 V
Normal mode, V
1
= 5 V
Normal mode, V
1
= 5 V
Min.
Typ.
Max.
Unit
1.35
0.6
10
1.8
2
1.0
20
2.8
1.5
35
V
V
V k Ω
CLK, DI
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.5 V < V
1
< 5.3 V; all outputs open; T j
= -40 °C to
130 °C, unless otherwise specified.
Table 35.
Input CLK, DI
Symbol Parameter Test condition Min.
Typ.
Max.
Unit
V in H
V in Hyst
C f t
V
I set in L
in in
(1)
CLK delay time from standby to active mode
Switching from standby to active mode. Time until output drivers are enabled after CSN going to high.
input low level input high level input hysteresis
V
1
= 5 V
V
1
= 5 V
V
1
= 5 V pull down current at input
V in
= 1.5 V input capacitance at input CSN, CLK, DI and
PWM
1,2
0 V < V
1
< 5.3 V
SPI input frequency at
CLK
1.0
1.5
0.4
5
160
2.05
2.8
0.75
30
10
1.
Value of input capacity is not measured in production test. Parameter guaranteed by design.
300
2.5
3.5
1.5
60
15
1
µs
µA pF
MHz
V
V
V
DI timing
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.5 V < V
130 °C, unless otherwise specified.
1
< 5.3 V; all outputs open; T j
= -40 °C to
60/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
Table 36.
DI timing
(1)
Symbol Parameter Test condition t t t t t t
CLK
CLKH
CLKL set CSN set CLK t set DI hold DI t t r in f in
Clock period
Clock high time
V
1
= 5 V
V
1
= 5 V
Clock low time V
1
= 5 V
CSN setup time, CSN low before rising edge of CLK
V
1
= 5 V
CLK setup time, CLK high before rising edge of CSN
V
1
= 5 V
DI setup time V
1
= 5 V
V
1
= 5 V DI hold time
Rise time of input signal
DI, CLK, CSN
V
1
= 5 V
Fall time of input signal
DI, CLK, CSN
V
1
= 5 V
1.
See
.
Min.
1000
400
400
400
Typ.
Max.
Unit
-
-
ns ns ns
ns
400
200
200 -
-
-
-
ns ns ns
100 ns
100 ns
DO
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.5 V < V
130 °C, unless otherwise specified.
1
< 5.3 V; all outputs open; T j
= -40 °C to
Table 37.
DO output pin
Symbol Parameter
V
DOL
V
DOH
I
DOLK
C
DO
2
Test condition
Output low level V
1
= 5 V, I
D
= -4 mA output high level V = 5 V, I
D
= 4 mA
3-state leakage current V
CSN
= V
1
, 0 V < V
DO
< V
1
3-state input capacitance
V
CSN
= V
1
,
0 V < V
1
< 5.3 V
Min.
Typ.
Max.
0.5
4.5
-10 10
10 15
Unit
V
V
µA pF
DO timing
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.5 V < V
1
< 5.3 V; all outputs open; T j
= -40 °C to
130 °C, unless otherwise specified.
Table 38.
DO timing
(1)
Symbol Parameter t t r DO f DO t en DO tri L
DO rise time
DO fall time
DO enable time from 3-state to low level
Test condition
C
L
= 100 pF, I
LOAD
= -1 mA
C
L
= 100 pF, I
LOAD
= 1 mA
C
L
= 100 pF, I
LOAD
= 1 mA pull-up load to V
1
Min.
Typ.
Max.
Unit
-
50
50
100
100 ns ns
50 250 ns
Doc ID 16363 Rev 4 61/98
Electrical specifications L99PM62XP
Table 38.
DO timing
(1)
(continued)
Symbol Parameter t dis DO L tri
DO disable time from low level to 3-state t en DO tri H
DO enable time from 3-state to high level t dis DO H tri
DO disable time from high level to 3-state t d DO
DO delay time
Test condition
C
L
= 100 pF, I
LOAD
= 4 mA pull-up load to V
1
C
L
= 100 pF, I
LOAD
= -1 mA pull-down load to GND
C
L
= 100 pF, I
LOAD
= -4 mA pull-down load to GND
V
DO
< 0.3 V
1
,
V
DO
> 0.7 V
1
,
C
L
= 100 pF
1.
See
Min.
Typ.
Max.
Unit
-
-
-
50
50
50
50
250
250
250
250 ns ns ns ns
CSN timing
The voltages are referred to ground and currents are assumed positive, when the current flows into the pin. 6 V < V
S
< 18 V; 4.5 V < V
130 °C, unless otherwise specified.
1
< 5.3 V; all outputs open; T j
= -40 °C to
Table 39.
CSN timing
(1)
Symbol Parameter tCSN_HI,min
Minimum CSN HI time, active mode t
CSNfail
1.
See
.
CSN low timeout
Test Condition
Transfer of SPI-command to Input register
Tested by scan chain
Min. Typ. Max. Unit
6 µs
20 35 50 ms
6 V
≤
Vs
≤
18 V; 4.5 V
≤
V
1
≤
5.3 V; T j
= -40 °C to 130 °C, voltages are referred to PGND, all outputs open
Table 40.
Inputs TxD_C and TxD_L for Flash mode
Symbol Parameter Test condition
V
FlashL
V
FlashH
V
FlashHYS
Input low level (V
TXDC/L
rising) V
1
= 5 V
Input high level (V
TXDC/L
falling) V
1
= 5 V
Input Voltage Hysteresis V
1
= 5 V
Min.
Typ.
Max.
Unit
6.1
7.4
0.6
7.25
8.4
0.8
8.4
9.4
1.0
V
V
V
62/98 Doc ID 16363 Rev 4
L99PM62XP Electrical specifications
Figure 29.
SPI – transfer timing diagram
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The SPI can be driven by a micro controller with its SPI peripheral running in following mode:
CPOL = 0 and CPHA = 0.
For this mode input data is sampled by the low to high transition of the clock CLK, and output data is changed from the high to low transition of CLK.
Figure 30.
SPI - input timing
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Doc ID 16363 Rev 4 63/98
Electrical specifications
Figure 31.
SPI output timing (part 1)
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L99PM62XP Electrical specifications
Figure 32.
SPI output timing (part 2)
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Figure 33.
SPI – CSN low to high transition and global status bit access
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Doc ID 16363 Rev 4 65/98
ST SPI L99PM62XP
6.1 SPI communication flow
6.1.2
The proposed SPI communication is based on a standard SPI interface structure using CSN
(Chip Select Not), SDI (Serial Data In), SDO (Serial Data Out/Error) and SCK (Serial Clock) signal lines.
At device start-up the master reads the <SPI-frame-ID> register (ROM address 3EH) of the slave device. This 8-bit register indicates the SPI frame length (24bit) and the availability of additional features.
Each communication frame consists of an instruction byte which is followed by 2 data bytes.
The data returned on SDO within the same frame always starts with the <Global Status> register. It provides general status information about the device. It is followed by 2 data bytes (i. e. ‘In-frame-response’).
For write cycles the <Global Status> register is followed by the previous content of the addressed register.
For read cycles the <Global Status> register is followed by the content of the addressed register.
A write command is only accepted as a valid command by the device if the counted number of clocks is exact 24, otherwise the command is rejected.
Command byte
Each communication frame starts with a command byte. It consists of an operating code which specifies the type of operation (<Write>, <Read>, <Read and Clear>, <Read Device
Information>) and a 6 bit address. If less than 6 address bits are required, the remaining bits are unused but are reserved.
Table 41.
Command byte
MSB
OC1
Op code
OC0 A5 A4 A3
Address
A2 A1
LSB
A0
OCx: operating code
Ax: address
Operating code definition
Table 42.
Operating code definition
OC1 OC0
0
0
0
1
Meaning
<Write Mode>
<Read Mode>
66/98 Doc ID 16363 Rev 4
L99PM62XP
Table 42.
Operating code definition (continued)
OC1
1
1
OC0
0
1
Meaning
<Read and Clear Status>
<Read Device Information>
ST SPI
The <Write Mode> <Read Mode> and <Read and Clear Status> operations allow access to the RAM of the device, i. e. to write to control registers or read status information.
A <Read and Clear Status> operation addressed to a device specific status register reads back and subsequently clear this status register.
A <Read and Clear Status> operation with address 3FH clears all status registers (including the Global Status Register). Configuration register is read by this operation.
<Read Device Information> allows access to the ROM area which contains device related information such as the product family, product name, silicon version, register width and availability of a watchdog.
More detailed descriptions of the device information are available in ‘Read Device
Information’.
register
(d)
Table 43.
Global status register
Bit 7 Bit 6 Bit 5
Global error flag (GEF)
Comm error
Not (chip reset
OR comm error)
Bit 4
TSD2
Bit 3
TSD1
Bit 2
V
1
Fail
Bit 1
VS Fail
(OV/UV)
Bit 0
Fail safe
The <Configuration> register is accessible at RAM address 3FH.
For the config register, the 8 bits are located in the low byte (LSB).
The configuration register is implemented for compliance purpose to ST SPI standard.
Table 44.
Configuration register
Bit 7 Bit 6 Bit 5 Bit 4
0 0 0 0
Bit 3
0
Bit 2
0
Bit 1
0
Bit 0
WD trigger
<WD trigger>: this bit is reserved to serve the watchdog.
d.
See
Doc ID 16363 Rev 4 67/98
ST SPI
Figure 34.
Read configuration register
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1.
The configuration register is implemented for compliance with ST standard SPI 3.0 and contains only the watchdog trigger bit at D0
Figure 35.
Write configuration register
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1.
The configuration register is implemented for compliance with ST standard SPI 3.0 and contains only the watchdog trigger bit at D0
68/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI
Table 45.
Address mapping
RAM adress
Description
3FH
13H
12H
11H
06H
05H
04H
03H
02H
01H
00H
<Configuration>
Status register 3
Status register 2
Status register 1
Control register 6
Control register 5
Control register 4
Control register 3
Control register 2
Control register 1
Reserved
Access
R/W
R
R
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
ROM adress
3FH
3EH
…
03H
Description
Reserved
<SPI frame ID>
Unused
<product code 2>
Access
N/A
R
N/A
N/A
02H
01H
00H
<product code 1>
<silicon version>
<ID Header>
R
R
R
The RAM memory area consists of 16 bit registers.
For the device information (ROM memory area) the eight most significant bits of the memory cell are used. The remaining 8 are zero.
All unused RAM and ROM addresses is read as ‘0’.
Note: 1 The register definition for RAM address 00H is unused. A register value of all 0 must cause the device to enter a fail-safe state (interpreted as ‘SDI stuck to GND’ failure).
2 ROM address 3FH is unused. An attempt to access this address must be recognized as a
communication error (‘SDI stuck to V
CC
’ failure) and must cause the device to enter a failsafe state.
The write operation starts with a command byte followed by 2 data bytes. The number of data bytes is specified in the <SPI-frame-ID>.
Write command format
Table 46.
Write command format: command byte
MSB
Op Code Address
0 0 A5 A4 A3 A2 A1
LSB
A0
Doc ID 16363 Rev 4 69/98
ST SPI
6.1.7
L99PM62XP
Table 47.
Write command format: data byte 1
MSB
D15 D14 D13 D12 D11
Table 48.
Write command format: data byte 2
MSB
D7 D6 D5 D4 D3
D10 D9
LSB
D8
D2 D1
LSB
D0
OC0, OC1: operating code (00 for ‘write’ mode)
A0 to A5: address bits
An attempt to write 00H at RAM address 00H is recognized as a failure (SDI stuck to GND).
The device enters a fail-safe state.
Format of data shifted out at SDO during write cycle
Table 49.
Format of data shifted out at SDO during write cycle: global status register
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Global error flag (GEF)
Comm error
Not (chip reset or comm error)
TSD2 TSD1 V
1
Fail
V
S
Fail
(OV/UV)
Fail safe
Table 50.
Format of data shifted out at SDO during write cycle: data byte 1
MSB Previous content of addressed register LSB
D15 D14 D13 D12 D11 D10 D9 D8
Table 51.
Format of data shifted out at SDO during write cycle: data byte 2
MSB Previous content of addressed register LSB
D7 D6 D5 D4 D3 D2 D1 D0
Failures are indicated by activating the corresponding bit of the <Global Status> register.
The returned data byte(s) represent(s) the previous content of the accessed register.
70/98 Doc ID 16363 Rev 4
L99PM62XP
Figure 36.
Format of data shifted out at SDO during write cycle
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The read operation starts with a command byte followed by 2 data bytes. The number of data bytes is specified in the <SPI-frame-ID>. The content of the data bytes is ‘don’t care’.
The content of the addressed register is shifted out at SDO within the same frame (‘in-frame response’).
Read command format
Table 52.
Read command format: command byte
MSB
Op Code Address
0 1 A5 A4 A3 A2 A1
LSB
A0
Table 53.
Read command format: data byte 1
MSB
0 0 0 0 0
Table 54.
Read command format: data byte 2
MSB
0 0 0 0 0
OC0, OC1: operating code (01 for ‘read’ mode)
A0 to A5: address bits
0
0
0
0
LSB
0
LSB
0
Doc ID 16363 Rev 4 71/98
ST SPI
6.1.9
L99PM62XP
Format of data shifted out at SDO during read cycle
Table 55.
Format of data shifted out at SDO during read cycle: global status register
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Global error flag (GEF)
Comm error
Not (chip reset or comm error)
TSD2 TSD1 V
1
Fail
V
S
Fail
(OV/UV)
Fail safe
Table 56.
Format of data shifted out at SDO during read cycle: data byte 1
MSB Previous content of addressed register LSB
D15 D14 D13 D12 D11 D10 D9 D8
Table 57.
Format of data shifted out at SDO during read cycle: data byte 2
MSB Previous content of addressed register LSB
D7 D6 D5 D4 D3 D2 D1 D0
Failures are indicated by activating the corresponding bit of the <Global Status> register.
The returned data byte(s) represent(s) the content of the register to be read.
Figure 37.
Format of data shifted out at SDO during read cycle
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6.1.10 Read and clear status operation
The ‘Read and Clear Status’ operation starts with a command byte followed by 2 data bytes.
The number of data bytes is specified in the <SPI-frame-ID>. The content of the data bytes
72/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI is ‘don’t care’. The content of the addressed status register is transferred to SDO within the same frame (‘in-frame response’) and is subsequently cleared.
A ‘Read and Clear Status’ operation with address 3FH clears all status registers (incl. the
<Global Status> register). The configuration register is read by this operation.
Read and clear status command format
Table 58.
Read and clear status command format: command byte
MSB
1
Op Code
01 A5 A4 A3
Address
A2 A1
LSB
A0
Table 59.
Read and clear status command format: data byte 1
MSB
0 0 0 0 0 0
Table 60.
Read and clear status command format: data byte 2
MSB
0 0 0 0 0 0
0
LSB
0
0
LSB
0
OC0, OC1: operating code (10 for ‘read and clear status’ mode)
A0 to A5: address bits
Format of data shifted out at SDO during read and clear status operation
Table 61.
Format of data shifted out at SDO during read and clear status: global status register
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Global error flag (GEF)
Comm error
Not (chip reset or comm error)
TSD2 TSD1 V
1
Fail
V
S
Fail
(OV/UV)
Fail safe
Table 62.
Format of data shifted out at SDO during read and clear status: data byte 1
MSB Previous content of addressed register
D15 D14 D13 D12 D11 D10 D9
LSB
D8
Table 63.
Format of data shifted out at SDO during read and clear status: data byte 2
MSB Previous content of addressed register LSB
D7 D6 D5 D4 D3 D2 D1 D0
Doc ID 16363 Rev 4 73/98
ST SPI L99PM62XP
Failures are indicated by activating the corresponding bit of the <Global Status> register.
The returned data byte(s) represent(s) the content of the register to be read.
Figure 38.
Format of data shifted out at SDO during read and clear status operation
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6.1.11 Read device information
The device information is stored at the ROM addresses defined below and is read using the respective operating code.
Table 64.
Op code
Read device information
OC1 OC0
ROM address
1 1
1
1
1
1
1
1
1
1
1
1
1
1
Device information Value
3FH
3EH
Reserved
<SPI frame ID> includes frame width and availability of watchdog
04H to 3DH unused
03H
02H
<product code 2> unique product identifier
<product code 1> unique product identifier
01H
00H
<silicon version> indicates Design Version
<ID Header> device family max adress of device information
00
42 Hex
00
4E Hex
44 Hex
According to silicon version
43 Hex
74/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI
The <ID-Header> (ROM address 00H) indicates the product family and specifies the highest address which contains product information
Table 65.
ID-header
Bit 7 Bit 6 Bit 5
0
Family Identifier
1
Bit 4 Bit 3 Bit 2
0 0 0 0
Highest address containing device information
Bit 1
1
Bit 0
1
<Family Identifier>: 01 Hex (BCD)
<Highest address>: 03 Hex
Table 66.
Family identifier
Bit 7 Bit 6
0
0
1
1
0
1
0
1
Meaning
VIPower
BCD
VIPower hybrid
Tbd
The <Product Code 1> (ROM address 02H) and <Product Code 2> (ROM address 03H) represents a unique code to identify the product name.
<Product Code 1> 44 Hex
<Product Code 2> 4E Hex
The <Silicon Version> (ROM address 01H) provides information about the silicon version according to the table below:
Table 67.
Silicon version identifier
Bit 7 Bit 6 Bit 5 Bit 4
Reserved
Bit 3 Bit 2 Bit 1
Silicon version
Bit 0
The <SPI-frame-ID> (ROM address 3EH) provides information about the register width (1,
2, 3 bytes) and the availability of ‘Burst Mode Read’ and watchdog.
Table 68.
SPI-frame-ID
Bit 7 Bit 6 Bit 5
0
BR
1
WD
0
X
Bit 4
0
X
Bit 3
0
X
Bit 2
0
32-bit
Bit 1
1
24-bit
Bit 0
0
16-bit
BR: burst-mode read (1 = burst-mode read is supported)
WD: watchdog (1 = available, 0 = not available)
32-bit, 24-bit, 16-bit: width of SPI frame (see table below)
Doc ID 16363 Rev 4 75/98
ST SPI
<Burst Mode>: not supported
<Watchdog>: available
<Frame Width>: 24 bit
L99PM62XP
6.2.1 Overview
Overview command byte
Table 69.
SPI register: command byte
Read/write x x x x x
Address x
Table 72.
SPI register: STAT register selection
STAT register. 1…3
0
0
0
1
1
1
0
0
0
0
0
0
0
1
1
1
0
1
Overview of control register data bytes x x
Table 70.
SPI register: mode selection
Read/write
0
0
1
1
0
1
0
1
Table 71.
SPI register: CTRL register selection
CTRL register 1…6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
1
0
1
1
0
1
0
1
0
1
Mode selection
Write
Read
Read and clear
Read device info
CTRL register selection
CTRL register1
CTRL register2
CTRL register3
CTRL register4
CTRL register5
CTRL register6
STAT register selection
STAT register1
STAT register2
STAT register3
76/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI
Table 73.
Overview of control registers data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Defaults 0 0
Function
OUT
HS
OUT
HS
Group
0
OUT
4
0 0
OUT
4
OUT
HS_EXT
HS control
0
OUT
3
Defaults
Function Res Res
Group
0
Inp.
Filt 3
0
Inp.
Filt 3
0
Inp.
Filt 2
Wake-up control
0
Inp.
Filt 2
Control register 1, data
0
OUT
2
0
OUT
1
0
REL
2
0
REL
1
0
V
2
0
V
2
Res
0
Stby sel
LS Output, V
2
and mode control
0
Go
Stby
Control register 2, data
0
Inp.
Filt 1
0
Inp.
Filt1
0 0 0 0
Res
Input
Pu/Pd 3
Input
Pu/Pd 2
Input
Pu/Pd 1
Res
Wake-up control
1
WU
EN 3
Control register 3, data
1
WU
EN 2
0
Trig
1
WU
EN 1
Defaults
Function Res
T1
On
Group
0 0
T1
Per
0
T1
Per
Res
Timer Settings
0
T2
On
0
T2
Per
0
T2
Per
Res Res
0
WD time
0
WD time
1
LIN
WU
En
1
CAN
WU
En
Watchdog and cyclic wake up settings
0
Wake timer
En
0
Wake
Timer
Select
Control register 4, data
1 0 Defaults
Group
0
Function Res I
CMP
0
OutHS
Rec
En
1
Vlock
Out
En
Res
Control (other)
1 0
LS
OV/UV shut down_en
V
1
Reset
Level
0
V
1
Reset
Level
1
LIN
Pu
En
1
Res
Control register 5, data
1
Lin
TxD
Tout
En
1
CAN
ACT
0
CAN
Loop
En
Transceiver settings
1
CAN
Patt.
wake
En
CAN split
On
CAN
Rec
Only
Defaults 1 1 1
Function Res
PWM2
Off-
DC
PWM2
Off-
DC
PWM2
Off-
DC
Group
1
PWM2
Off-
DC
PWM2 setting
1
PWM2
Off-
DC
1 1 0 0 0 0 0 0 0 0
PWM2
Off-
DC
PWM2
Off-
DC
PWM
Freq
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1 setting
Control register 6, data
Defaults
Function Res
Group
1
PWM4
Off-DC
1
PWM4
Off-DC
1
PWM4
Off-DC
1
PWM4
Off-
DC
PWM4 setting
1
PWM4
Off-
DC
1 1
PWM4
Off-DC
PWM4
Off-DC
Res
0 0 0 0 0 0 0
PWM3
ON-
DC
PWM3
ON-
DC
PWM3
ON-
DC
PWM3
ON-
DC
PWM3
ON-
DC
PWM3
ON-
DC
PWM3
ON-
DC
PWM3 setting
Doc ID 16363 Rev 4 77/98
ST SPI L99PM62XP
Control register 1
Table 74.
Control register 1: command and data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 0 0 0 0 1 Data, 8bit
2 nd
data byte
Data, 8 bit
Table 75.
Control register 1, data bytes
1 st
data byte <15:8>
Defaults
Function
Group
0
OUT
HS_2
0
OUT
HS_1
0
OUT
4_2
0
OUT
4_1
HS control
0
OUT
HS_EXT
0
OUT
3
0
OUT
2
0
OUT
1
0
REL
2
2 nd
data byte <7:0>
0
REL
1
V
0
2_2
V
0
2_1
Res
0
Stby sel
LS Output, V
2
and mode control
0
Go
Stby
0
Trig
Table 76.
Control register 1, bits
Bit Name
OUTHS 15
14
Select mode of OUTHS
OUTHS_EXT OUTHS_2
0
1
1
0
0
0
1
1 x
0
0
1
Comment
OUTHS_1
1
0
1
0
1
0
Mode
HS off
HS cyclic on with timer 1
HS controlled by PWM4
HS cyclic on with Timer 2
PWM3
(1)
HS on
Active and standby mode
1) PWM4 (CR6) must be unequal 0% in order to enable PWM3
To turn off OUT4, we recommend to use the setting 'HS Off' (OUT4_1 = 0, OUT4_2 = 0)
13
12
OUT4 Select mode of OUT4
OUT4_2 OUT4_1
0
0
0
1
1 0
1 1
Mode
HS off
HS on
HS controlled by PWM4
Active and standby mode
HS cyclic on with Timer 2
11 OUTHS_EXT Extended function of OUTHS; see table OUTHS
78/98 Doc ID 16363 Rev 4
L99PM62XP
Table 76.
Control register 1, bits (continued)
Bit Name
10 OUT3 Select mode of OUT3
OUT3
0 Select FSO
Comment
Mode
Active and standby mode
1 Select PWM3
9 OUT2 Select mode of OUT2
OUT2
0
1
Mode
Select PWM2 Active and
Select timer2 standby mode
8 OUT1 Select mode of OUT1
OUT1
0
1
Mode
Select PWM1 Active and
Select timer1 standby mode
7
6
REL2 Select mode of REL2
REL2
0
1
REL2 off
REL2 on
REL1 Select mode of REL1
REL1
0
1
REL1 off
REL1 on
Mode
Active and standby mode
Active mode
Mode
Active and standby mode
Active mode
ST SPI
Doc ID 16363 Rev 4 79/98
ST SPI
Table 76.
Control register 1, bits (continued)
Bit Name
5
4
V
2
V
2_2
0
V
2_1
0
0
1
1
1
0
1
Comment
V
2
OFF in all modes
V
2
ON in active mode; OFF in V
1
/V
BAT standby mode
V
2
V
ON in Active/V
BAT
1
standby mode; OFF in
standby mode
V
2
ON in all modes
L99PM62XP
3
2
RES Reserved
STBY_SEL Select standby mode
0
1
V
BAT
standby mode
V
1 standby mode
1 GO_STBY Execute standby mode
0 No action
1 Execute standby mode
0 TRIG Trigger Bit for Watchdog
Control register 2
Table 77.
Control register 2: command and data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 0 0 0 1 0 Data, 8bit
2 nd
data byte
Data, 8 bit
Table 78.
Control register 2, data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Defaults 0 0 0 0 0 0 0 0 0 1 1 1
Function Res Res
Wu3
Filt_MSB
Wu3
Filt_LSB
WU2
Filt_MSB
WU2
Filt_LSB
WU1
Filt_MSB
WU1
Filt_LSB
Res
WU3
Pu/Pd
WU2
Pu/Pd
WU1
Pu/Pd
Res
WU3
EN
WU2
EN
WU1
EN
Group Wakeup control Wakeup control
80/98 Doc ID 16363 Rev 4
3
2
1
0
7
6
5
4
L99PM62XP
Table 79.
Control register 2, bits
Bit Name
15
14
13, 12
11, 10
9, 8
Res
Res
WU3_Filt
WU2_Filt
WU1_Filt
Reserved
Reserved
Wakeup filter configuration
MSB LSB
1
1
0
0
0
1
0
1
Res
WU3_Pu/Pd
WU2_Pu/Pd
WU1_Pu/Pd
Reserved
Pull up or pull down configuration
0 Pull down
1 Pull up
Res
WU3_EN
WU2_EN
WU1_EN
Reserved
Enable Wake up source
0
1
Disable
Enable
Comment
Static, 64 µs
Enabled with timer 2; 80 µs blank
Enabled with timer 2; 800 µs blank
Enabled with timer 1; 800 µs blank
ST SPI
Control register 3
Table 80.
Control register 3: command data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 0 0 0 1 1 Data, 8bit
2 nd
data byte
Data, 8 bit
Table 81.
Control register 3, data bytes
1 st
data byte <15:8>
Defaults 0
Function
Group
Res
T1
On
0
T1
Per
MSB
0
T1
Per
LSB
0
Res
Timer Settings
0
T2
On
0
T2
Per
MSB
0
T2
Per
LSB
Res
2 nd
data byte <7:0>
Res
0
WD time
MSB
0
WD time
LSB
1
LIN
WU
En
1
CAN
WU
En
Watchdog and cyclic wake up settings
0
Wake timer
En
0
Wake timer select
Doc ID 16363 Rev 4 81/98
ST SPI
Table 82.
Control register 3, bits
Bit Name
15
14
RES
T1_On
Reserved
Timer 1 “ON” time selections
0
1
10 ms
20 ms
13
12
11
10
7
6
9
8
Comment
T1_Per_MSB
T1_Per_LSB
Timer 1 period selection
MSB LSB
0
0
0
1
1 s
2 s
1
1
0
1
3 s
4 s
Timer 1 is restarted with a valid write command to control register 3
Res
T2_On Timer 2 “ON” time selection
0 0.1 ms
1 1 ms
T2_Per_MSB
T2_Per_LSB
Timer 2 period selection
Res
Res
MSB LSB
0
0
1
1
0
1
0
1
10 ms
50 ms
100 ms
200 ms
Timer 2 is restarted with a valid write command to control register 3
Reserved
Reserved
L99PM62XP
82/98 Doc ID 16363 Rev 4
L99PM62XP
Table 82.
Control register 3, bits (continued)
Bit Name
5
4
WD_time_MSB Trigger window selection
WD_time_LSB
MSB
0
0
1
1
LSB
0
1
0
1
10 ms
20 ms
50 ms
200 ms
Comment
ST SPI
3
2
LIN_WU_En Enable LIN as wake up source
0 Disabled
1 Enabled
CAN_WU_En Enable CAN as wake up source
0 Disabled
1 Enabled
1 Wake_timer_En
Enable wake up by timer from V
1 standby mode (Interrupt) or V
BAT standby Mode
(Nreset)
0 Disabled
1 Enabled
0 Wake_timer_select Timer selection for timer interrupt / wake-up of µC by timer
0
1
Timer 2
Timer 1
Control register 4
Table 83.
Control register 4: command and data bytes
Command byte 1 st
data byte x
Read/Write x
Address
0 0 0 1 0 0 Data, 8bit
2 nd
data byte
Data, 8 bit
Doc ID 16363 Rev 4 83/98
ST SPI L99PM62XP
Table 84.
Control register 4, data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Defaults
Group
0
Function RES I
CMP
0
OutHS
Rec
En
1
Vlock
Out_en
0
RES
Control (other)
1
LS
OV/UV shut down_en
0
V
1
Reset
Lev_2
0 1
V
1
Reset
Lev_1
LIN
Pu
En
1
Res
1
Lin
TxD
Tout
En
1
CAN
ACT
0
CAN
Loop
En
1
CAN
Patt.
wake
En
Transceiver settings
1 0
CAN split
On
CAN
Rec only
Table 85.
Control register 4, bits
Bit Name
15
14
Res
I cmp
Comment
Reserved; must be set to zero
V
1
load current supervision
0
Enabled; Watchdog is disabled in V
1
Standby when the
V
1loadcurrent
< I cmpthreshold
1
Disabled; Watchdog is automatically disabled when V
1 standby is entered
13 OUTHS_rec_en Overcurrent Auto recovery mode for OUTHS
0 Disabled
1 Enabled
12
11
10
Vlock_out_en Voltage lock out: OV/UV status
0
Over/under voltage status recovers automatically when condition disappears
1
Over/under voltage status is latched until a read and clear command is performed
Res
LS_OV/UV shut_down_en
Reserved
Shutdown of low-side drivers in case of over-/under voltage
0
1
No shutdown of low-sides in case of over/under voltage
Shutdown low-sides in case of over/under voltage
84/98 Doc ID 16363 Rev 4
L99PM62XP
Table 85.
Control register 4, bits (continued)
Bit Name
9
8
V1Reset_level_1 Select reset level
V1Reset_level_2
V1RSTlev_2
1
1
0
0
V1RSTlev_1
0
1
0
1
Comment
V1 reset level
4.6 V
4.35 V
4.1 V
3.8 V
ST SPI
7 LIN_PU_EN Enable internal Lin pull up
0
1
No LIN master pull-up
LIN master pull-up
6
5
Res Must be written to ‘1’
Lin_TxD_Tout_En Enable / disable monitoring via TxD
0 No TxD monitoring
1
TxD monitoring; LIN transmitter is switched off if TXDL is dominant for t > 12 ms
4 CAN_ACT Activate CAN transceiver
0
1
CAN transceiver deactivated
CAN transceiver activated
Active mode
3 CAN_Loop_En Enable looping of CANTX to CANRXD in V
1
standby0
0 No looping
1 TXDC is looped to RXDC in V
1
standby
2 CAN_Patt_wake_En Enable pattern wake up for CAN
0
1
No pattern wake up
Pattern wake up
1 CAN_split_On Enable SPLIT termination for CAN
0
1
Split termination disabled
Split termination enabled
Active mode
Doc ID 16363 Rev 4 85/98
ST SPI
Table 85.
Control register 4, bits (continued)
Bit
0
Name
CAN_Rec_only
Comment
Enable CAN receive only mode
0 CAN in transceiver mode
1 CAN in receive only mode
L99PM62XP
Active mode
Control register 5
Table 86.
Control register 5: command and data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 0 0 1 0 1 Data, 8bit
2 nd
data byte
Data, 8 bit
Table 87.
Control register 5, data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Defaults 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0
Function Res
PWM2
Off-
DC
PWM2
Off-
DC
PWM2
Off-
DC
PWM2
Off-
DC
PWM2
Off-
DC
PWM2
Off-
DC
PWM2
Off-
DC
PWM
Freq
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
PWM1
ON-DC
Group PWM2 setting PWM1 setting
Table 88.
Control register 5, bits
Bit Name
15 Reserved; must be set to zero
14
RES
PWM2_
Off_DC_6
13
PWM2_
Off_DC_5
PWM2
OFF_
DC_6
PWM2
OFF_
DC_5
PWM2
OFF_
DC_4
PWM2
OFF_
DC_3
12
11
10
9
8
PWM2_
Off_DC_4
PWM2_
Off_DC_3
PWM2_
Off_DC_2
PWM2_
Off_DC_1
PWM2_
Off_DC_0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
Comment
PWM2
OFF_
DC_2
1
0
0
0
...
PWM2
OFF_
DC_1
PWM2
OFF_
DC_0
1
1
0
0
1
0
1
0
PWM duty cycle
0%, HS OFF
98.5%
99.25%
100% HS ON
86/98 Doc ID 16363 Rev 4
L99PM62XP
Table 88.
Control register 5, bits (continued)
Bit Name
7
PWM_
FREQ
Select PWM frequency
0
1
128 Hz
256 Hz
Comment
6
5
4
3
2
1
0
PWM1_
ON_DC_6
PWM1_
ON_DC_5
PWM1
ON_
DC_6
PWM1
ON_
DC_5
PWM1
ON_
DC_4
PWM1
ON_
DC_3
PWM1
ON_
DC_2
PWM1
ON_
DC_1
PWM1
ON_
DC_0
PWM1_
ON_DC_4
PWM1_
ON_DC_3
PWM1_
ON_DC_2
PWM1_
ON_DC_1
PWM1_
ON_DC_0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
...
1
1
0
0
1
0
1
0
PWM duty cycle
100%, HS ON
1.5%
0.75%
0% HS OFF
ST SPI
Control register 6
Table 89.
Control register 6: command and data bytes
Command byte 1 st
data byte
Read/Write x x 0 0
Address
0 1 1 0 Data, 8bit
2 nd
data byte
Data, 8 bit
Table 90.
Control register 6, data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Defaults 1 1 1 1 1 1 1 0 0 0 0 0 0 0
Function Res
PWM4
Off_
DC_6
PWM4
Off_
DC_5
PWM4
Off_
DC_4
PWM4
Off_
DC_3
PWM4
Off_
DC_2
PWM4
Off_
DC_1
PWM4
Off_
DC_0
Res
PWM3
ON_
DC_6
PWM3
ON_
DC_5
PWM3
ON_
DC_4
PWM3
ON-DC_3
PWM3
ON_
DC_2
PWM3
ON_
DC_1
PWM3
ON_
DC_0
Group PWM4 setting PWM3 setting
Doc ID 16363 Rev 4 87/98
ST SPI L99PM62XP
Table 91.
Control register 6, bits
Bit Name
15
14
RES
PWM4_
Off_DC_6
Reserved; must be set to zero
13
PWM4_
Off_DC_5
Comment
PWM4
OFF_
DC_6
PWM4
OFF_
DC_5
PWM4
OFF_
DC_4
PWM4
OFF_
DC_3
PWM4
OFF_
DC_2
PWM4
OFF_
DC_1
PWM4
OFF_
DC_0
12
11
10
9
8
PWM4_
Off_DC_4
PWM4_
Off_DC_3
PWM4_
Off_DC_2
PWM4_
Off_DC_1
PWM4_
Off_DC_0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
...
1
1
0
0
1
0
1
0
PWM4 duty cycle
0%, HS OFF
98.5%
99.25%
100% HS ON
7
6
2
1
4
3
0
5
RES
PWM3_
ON_DC_6
Reserved; must be set to zero
PWM3_
ON_DC_5
PWM3
ON_
DC_6
PWM3
ON_
DC_5
PWM3
ON_
DC_4
PWM3
ON_
DC_3
PWM3
ON_
DC_2
PWM3
ON_
DC_1
PWM3
ON_
DC_0
PWM3 duty cycle
PWM3_
ON_DC_4
PWM3_
ON_DC_3
PWM3_
ON_DC_2
PWM3_
ON_DC_1
PWM3_
ON_DC_0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
...
1
1
0
0
1
0
1
0
100%, HS ON
1.5%
0.75%
0% HS OFF
88/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI
Table 92.
Overview of status register data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Function
Group
OL
HS
OL
OUT4
OL
OUT3
OL
OUT2
OL
OUT1
Diagnosis 1
UV
Status register 1, data <15:0>
V
2 fail
V
2 short
OV
OC
HS
OC
Out4
OC
Out3
OC
OUT2
Diagnosis 2
Status register 2, data <15:0>
OC
Out1
OC
Rel2
OC
Rel1
Function
WU3 state
WU2 state
WU1 state
Group
WU3 wake
WU2 wake
WU1
Wake
Wake
CAN
Wake
LIN
Wake
Timer int
LIN perm.
dom.
LIN
TxD perm dom.
LIN perm.
rec.
CAN
RxD perm rec.
CAN perm.
rec.
CAN perm.
dom.
CAN
TxD perm dom
Diagnosis 3 Diagnosis 4
Status register 3, data <15:0>
Function TSD1 TW
Device state
Device state
V
1 fail
V
1 restart
V
1 restart
V
1 restart
WD fail
Group Diagnosis 5
WD fail
WD fail
WD fail
Forced sleep
WD
Forced sleep
TSD2
SHTV1
WD timer state
Diagnosis 6
WD timer state
Table 93.
Global status register
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Hex value
Active high/low
Default value in normal mode - after correct WD trigger or after read & clear on error flags
Power ON
Power ON weak battery
(7)
Communication error
Vs over or under-voltage
WD failure
High
0
1
1
1
1
1
High
0
1
0
0
0
0
Low
1
0
1
1
0
0
High High High High High
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0
0
1
0
0
20
C0
A2
A1
80
82
Doc ID 16363 Rev 4 89/98
ST SPI
Table 93.
Global status register (continued)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
L99PM62XP
Hex value
SPI error (DI stuck)
TSD1
TSD2
1
1
1
0
0
0
1
1
1
0
0
1
0
1
1
0
0
0
0
0
0
1
0
1
A1
A8
B9
V
1 fail 1 0 1 0 0 1 0 0 A4
Other device failure
(8)
1 0 1 0 0 0 0 0 A0
1.
The following status bits are reported in the global error flag:
Global status register: Bits 0 - 6
Status register 1: Bits 0 – 10
Status register 3: Bits 2, 3, 15
2.
Invalid CLOCK COUNT.
3.
Cleared with CLR command on SR3.
4.
Cleared with “READ and CLEAR” on SR3 (-> TSD1).
5.
Diagnosis bit only, Vs Fail is not a fail-safe event; cleared by read&clear. Bit is automatically cleared at (Vs > VsUV) and.
(Vs < VsOV) if Vlock_out_en = 0.
6.
Cleared with a valid WD trigger (WD fail) or by clearing the corresponding status register related to failure.
7.
Slow Vs ramp-up (Vs undervoltage is filtered with 64 µs after Power-on reset).
8.
The global error flag is raised due to a failure condition which is not reported in the global status register. The Failure is reported in the status registers 1 – 3.
Status register 1
Table 94.
Status register 1: command and data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 1 0 0 0 1
Bit <15:8>
Data, 8bit
2 nd
data byte
Bit<7:0>
Data, 8 bit
Table 95.
Status register 1, data bytes
1 st
data byte <15:8>
Function
Group
OL
HS
OL
OUT4
OL
OUT3
OL
OUT2
Diagnosis 1
OL
OUT1
UV
V
2 fail
V
2 short
OV
OC
HS
OC
Out4
2 nd
data byte <7:0>
OC
Out3
OC
OUT2
Diagnosis 2
OC
Out1
OC
Rel2
OC
Rel1
90/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI
Table 96.
Status register 1, bits
Bit Name Comment
15
14
13
12
11
10
OL_HS
OL_OUT4
OL_OUT3
OL_OUT2
OL_OUT1
UV
Open-load event occurred since last read out
Information storage
Bit is latched until a “read and clear” access
Under voltage event on V
S occurred since last read out
VLOCKOUTEN
(CR4)
0
1
Information storage automatically reset when UV condition disappears
Bit is latched until a “read and clear” access
8
7
9 V
2
_fail
V
2
_short
V
2
fail (V
2
< 2 V for t> 2 µs) event occurred since last readout
Bit is latched until a “Read and clear” access
V
2
short (V
2
< 2 V for t > 4ms during start up) event occurred since last readout
Bit is latched until a “Read and clear” access
OV
VLOCKOUTEN
(CR4)
Information storage
Over voltage event on V
S occurred since last read out
0
1 automatically reset when OV condition disappears
Bit is latched until a “read and clear” access
6
5
4
3
2
1
0
OC_HS
OC_OUT4
OC_OUT3
OC_OUT2
OC_OUT1
OC_REL2
OC_REL1
Over current event occurred since last read out
Bit is latched until a “read and clear” access
Doc ID 16363 Rev 4 91/98
ST SPI L99PM62XP
Status register 2
Table 97.
Status register 2: command and data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 1 0 0 1 0
Bit <15:8>
Data, 8bit
2 nd
data byte
Bit<7:0>
Data, 8 bit
Table 98.
Status register 2, data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Function
WU3 state
WU2 state
WU1 state
WU3 wake
WU2 wake
WU1 wake
Wake
CAN
Wake
LIN
Wake
Timer int
LIN perm.
dom.
LIN
TxD perm dom.
LIN perm.
rec.
CAN
RxD perm rec.
CAN perm.
rec.
CAN perm.
dom.
CAN
TxD perm dom
Group Diagnosis 3 Diagnosis 4
11
10
9
8
7
6
15
14
13
12
Table 99.
Status register 2, bits
Bit Name
5
4
3
2
1
0
Comment Information storage
WU3_state
WU2_state
WU1_state
WU3_wake
State of WUx input; “Live bits” not clearable
WU2_wake
WU1_wake
WAKE_CAN
WAKE_LIN
Wake_TIMER_int
LIN_perm_DOM
Shows wake up source (‘1’ = wake-up)
LIN_TxD_perm_DOM
LIN_perm_REC
CAN_RxD_perm_rec
LIN bus is dominant for t > 12 ms
TxDL pin is dominant for t > 12 ms;
Transmitter is disabled
LIN bus does not follow TxDL within
40 µs; Transmitter is disabled
RxDC has not followed TxDC for 4 times;
Transmitter is disabled
Bits are latched until a “Read and clear” access
CAN_perm_REC
CAN has not followed TxDC for 4 times;
Transmitter is disabled
CAN bus is dominant for t > 700 µs CAN_perm_DOM
CAN_TxD_perm_DOM
TxDC pin is dominant for t > 700 µs;
Transmitter is disabled
92/98 Doc ID 16363 Rev 4
L99PM62XP ST SPI
Status register 3
Table 100. Status register 3: command and data bytes
Command byte 1 st
data byte x
Read/write x
Address
0 1 0 0 1 1
Bit <15:8>
Data, 8bit
2 nd
data byte
Bit<7:0>
Data, 8 bit
Table 101. Status register 3, data bytes
1 st
data byte <15:8> 2 nd
data byte <7:0>
Function TSD1 TW
Device state_2
Device state_1
V
1 fail
V
1 restart_2
V
1 restart_1
V
1 restart_0
WD fail_3
WD fail_2
WD fail_1
WD fail_0
Forced sleep
WD
Forced sleep
TSD2
SHTV1
WD timer state_1
WD timer state_0
Group Diagnosis 5 Diagnosis 6
11
10
9
8
7
6
5
4
Table 102. Status register 3, bits
Bit Name
15
14
13
TSD1
TW
Comment
Thermal warning / shutdown1 occurred since last readout
State from which the device woke up
12
Device_state
Device state_2
0
0
1
1
Device state_1
0
1
0
1
State from which the device woke up
Active
V
1
standby
V
BAT
standby
Flash
Information storage
Bit is latched until a
“read and clear access”
Bit is latched until a
“read and clear access” after a “read and clear access”, the device state is updated after a wake up, device state is
01: V
1
standby or
10: V
BAT
standby
V
1
_fail
V
1
_restart_2
V
1
_restart_1
V
1
_restart_0
WD_fail_3
WD_fail_2
WD_fail_1
WD_fail_0
V
1
fail (V
1
< 2 V for t > 2 µs) event occurred since last read out
Bit is latched until a
“read and clear access”
Number of TSD2 events which caused a restart of V regulator
(7 TSD2 events forces the device into V
BAT
standby)
1
Bits are not clearable; is cleared automatically if no additional TSD2 event occurs within 1 min.
Number of missing watchdog triggers
(15 missing watchdog trigger forces the device into V
BAT standby)
Bits are not clearable; is cleared with a proper
Watchdog trigger
Doc ID 16363 Rev 4 93/98
ST SPI L99PM62XP
Table 102. Status register 3, bits (continued)
Bit Name Comment Information storage
3 Forced_sleep_WD
Device was forced to V
BAT
standby mode because of multiple watchdog errors
2
Forced_sleep_TSD
2_SHTV
1
Device was forced to V
BAT
standby or multiple thermal shutdown events or a short on V
1
during startup.
1 WD_timer_state_1 Status of watchdog counter of selected watchdog timing
Bits are latched until a read and clear access
0 WD_timer_state_0
WD_timer_state_1 WD_timer_state_0 Counter
Bits are not clearable
0
0
1
0
1
1
0 – 33%
33 – 66%
66 – 100%
94/98 Doc ID 16363 Rev 4
L99PM62XP
7
Package and packing information
Package and packing information
7.1 ECOPACK
®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
7.2 PowerSSO-36 package information
Figure 39.
PowerSSO-36 package dimensions
AG00066V1
Doc ID 16363 Rev 4 95/98
Package and packing information h k
G
H e e3
F
A
A2 a1 b c
D
E
S
T
U
X
Y
L
M
N
O
Q
Table 103. PowerSSO-36 mechanical data
Symbol
Min.
—
10.1
—
0°
—
—
—
2.15
2.15
0
0.18
0.23
10.10
7.4
—
—
—
4.1
6.5
0.55
—
—
—
—
Millimeters
Typ.
—
—
—
—
0.5
8.5
2.3
—
—
—
—
—
—
—
2.9
3.65
1.0
—
—
—
4.3
-
1.2
0.8
L99PM62XP
Max.
0.1
10.5
0.4
8°
—
—
—
2.45
2.35
0.1
0.36
0.32
10.50
7.6
—
—
—
4.7
7.1
0.85
—
10°
—
—
96/98 Doc ID 16363 Rev 4
L99PM62XP Revision history
Table 104. Document revision history
Date Revision
14-Dec-2009
18-Dec-2009
29-Nov-2011
19-Sep-2013
1
2
3
4
Change
Initial release.
Updated
Table 5: Fail safe conditions and exit modes
.
Table 12: Supply and supply monitoring
:
– Updated I
V(BAT)CS and I
V(BAT)CW max value from 110µA to 125µA
:
– Updated t d
ON min value from 10µs to 5µs.
Table 20: Outputs (OUT1...4) :
– Updated I
OLD
min value from 1mA to 0.9mA and max value from
4mA to 4.5mA
– Added t
CSNfail parameter.
Updated footnote on
Updated
Figure 39: PowerSSO-36 package dimensions
Updated
Table 103: PowerSSO-36 mechanical data
Updated disclaimer.
Doc ID 16363 Rev 4 97/98
L99PM62XP
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