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TECHNICAL DESCRIPTION
4.2.7 Dark Current and MPP Mode
The silicon base of the CCD chip generates a so-called dark current. The dark current is material property of the silicon and it is due to spontaneous generation of electron-hole pairs in the silicon lattice due to thermal excitation. Cooling the CCD chip reduces the dark current. At the typical operating temperatures of –45 to –50ºC the dark current is <0.2 electrons/pix.s. The low dark current is archived by a special mode of operation of the CCD chip: The MPP mode. MPP stands for multi-pinned-phase and describes the fact, that each pixel has a special boron implant under a part of the active area, which pins the electrons under it without having to use the actual gates under tension used for the readout transfer.
4.2.8 Radiation Damage
CCD chips (as all unprotected Silicon devices) are sensitive to radiation damage. The glass taper, which is in front of the CCD absorbs all incoming radiation and thus protects the CCD from radiation damage.
4.2.9 Full Well Depth and 18-bit Digitisation
The full well depth is the number of electrons that a CCD pixel can hold. The typical value of the full well depth for a MPP mode operated CCD is 300-400k electrons for a single unbinned pixel. In order to take full advantage of the full well offered by the CCD chip the readout electronics have to match the resolution of the CCD chip: 16 bit readout (65k) is insufficient for this task. 18bit (262k) readout gives the best technically available match.
4.2.10 Anti-blooming
Scientific CCDs use 100% of their surface for image detection. If a very bright object is shines onto the CCD the full well of the chip may be exceeded and charges may spill (“bloom”) into neighbouring pixels. There are optical video CCD designs, which sacrifice a small part of the sensitive area to implement an anti-blooming gate, which takes off overflowing charges. For integrative flux measurement it is better to spill the signal (the integral stays correct) rather than loosing the charges in the anti-blooming gate (integral lost).
4.2.11 Vacuum
The CCD chip and the fibre optic taper are confined in a vacuum enclosure to isolate them thermally and to prevent condensation on the cold detector parts. Static vacuum degrades with time due to degassing of the components in the vacuum enclosure. The system is designed to maintain a sufficient vacuum level in the enclosure for at least 6 months. A bad vacuum can be recognized by the fact that the detector cannot be cooled to the set operating temperature of –45ºC (This can be monitored using the software program ODBench accessible through the plugin menu of
CrysAlis). Loss of vacuum is also indicated by a blinking green light (red light off) on the top of the
CCD detector.
Pumping the vacuum enclosure is a regular service task. A normal rotary vacuum pump is sufficient for this task (<0.04mbar).
4.2.12 Fast Shutter
The CCD X-ray detector is an integrative detector. The precision of the intensity measurement critically depends on the dose released by the X-ray shutter. The normal electro-magnetic shutters are too imprecise for this task. Specially designed fast and reproducible shutters have to be used.
Version 1.4 Xcalibur_Manual_v1.4
Page 18
Xcalibur
USER MANUAL
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Table of contents
- 10 1. Health and Safety Information
- 10 1.1 General
- 11 1.2 Electrical Safety
- 11 1.2.1 Potential Electrical Hazards
- 11 1.2.2 Recommended Precautions
- 11 1.2.3 First Aid
- 12 1.3 Mechanical Handling Safety
- 12 1.4 Safe Mechanical Practice
- 12 1.5 Moving Parts
- 12 1.6 X-ray Radiation
- 13 1.7 Extreme Temperatures
- 14 1.8 Vacuum
- 14 1.9 High Pressures
- 14 1.10 Hazardous or Toxic Materials
- 14 1.11 Modifications and Service
- 15 2. Introduction
- 15 2.1 Scope
- 15 2.2 How To Use This Manual
- 15 2.3 System Overview
- 16 3. Specifications
- 16 3.1 Environmental Requirements
- 16 3.2 Services
- 16 3.2.1 Electrical Supply
- 16 3.2.2 Water Cooling
- 17 3.2.3 Helium Gas Supply (where applicable)
- 17 3.3 Performance Data
- 17 3.3.1 X-ray Tube (Typical Operating Conditions)
- 18 3.3.2 Sapphire 2 CCD Detector
- 19 3.3.3 Sapphire 3 CCD Detector
- 20 3.3.4 Onyx CCD Detector
- 20 Onyx CCD Detector Theta and Resolution Ranges
- 21 3.3.5 PC CCD Interface
- 21 3.3.6 Four-circle Kappa Geometry X-ray Goniometer
- 22 4.4 Electrical Data
- 23 4. Technical Description
- 23 4.1 Overview
- 24 4.2 CCD Detector Technology
- 25 4.2.1 Beryllium Window
- 26 4.2.2 Phosphor
- 26 4.2.3 Taper
- 26 4.2.4 CCD
- 26 4.2.5 Readout Speed
- 26 4.2.6 Binning
- 27 4.2.7 Dark Current and MPP Mode
- 27 4.2.8 Radiation Damage
- 27 4.2.9 Full Well Depth and 18-bit Digitisation
- 27 4.2.10 Anti-blooming
- 27 4.2.11 Vacuum
- 27 4.2.12 Fast Shutter
- 28 4.2.13 Zingers and Cosmic Ray Events
- 28 4.3 Four-Circle Kappa Geometry Goniometer
- 29 4.4 X-ray Generator
- 30 4.5 Software
- 30 4.5.1 Directory Structure
- 31 4.5.2 Basic Menu Philosophy
- 31 4.6 KMW200CCD Chiller
- 31 4.7 KMW3000C Chiller
- 31 4.8 Low Temperature Option
- 31 4.9 Safety Features
- 32 5. Handling, Installation, Storage and Transit Information
- 32 5.1 Reception and Handling
- 32 5.1.1 Delivery
- 32 5.1.2 Unpacking
- 33 5.1.3 Mechanical Handling
- 33 5.1.3.1 Weights, Dimensions and Lifting Points
- 34 Delivery
- 34 5.2 Installation and Setting to Work
- 34 5.2.1 Preparation of Site and Services
- 34 5.2.1.1 Environmental Requirements
- 34 5.2.1.2 System Layout
- 35 5.2.1.3 Electrical Services
- 36 5.2.1.4 Water Supply
- 36 5.2.1.5 Low Temperature Option
- 36 5.2.1.6 CCD Camera Pumping
- 36 5.2.1.7 Helijet Option
- 37 5.2.2 Setting to Work
- 37 5.2.2.1 Equipment Required
- 37 5.2.2.2 Personnel Required for Installation
- 37 5.2.2.3 Setting up Procedures
- 39 Storage
- 40 6. Operation
- 40 6.1 Controls and Indicators
- 41 6.2 Initial Switch on Procedure
- 42 6.3 X-ray Tube Warm-up Procedure
- 43 6.4 Software
- 43 6.4.1 Software Updates
- 44 6.4.2 Software Installation
- 44 6.4.2.1 MGC interface software
- 45 6.4.2.2 CrysAlis Software
- 45 6.4.3 Changing Machine Correction and Set-up Files
- 46 6.5 Normal Operation
- 46 6.5.1 General Commands
- 48 6.5.2 Changing Xcalibur Settings
- 52 6.5.3 Standard Diffraction Experiment
- 52 6.5.3.1 Crystal Mounting and Alignment
- 54 6.5.3.2 Diffraction Photographs to Determine Crystal Quality
- 55 6.5.3.3 Unit Cell Determination
- 57 6.5.3.4 Data Collection
- 58 6.5.3.5 Data Processing and Reduction
- 59 6.5.3.5.1 Orientation Matrix
- 60 6.5.3.5.2 Run List
- 61 6.5.3.5.3 Scan Width
- 61 6.5.3.5.4 Background Evaluation
- 62 6.5.3.5.5 Special Corrections
- 63 6.5.3.5.6 Outlier Rejection
- 64 6.5.3.5.7 Output Format
- 65 6.5.3.6 Changing the Output Format from Data Reduction
- 66 6.5.3.7 Absorption Correction
- 74 6.5.3.8 GRAL - Space Group Determination
- 80 6.5.3.9 Structure Solution and Refinement
- 80 6.5.4 Ewald explorer
- 86 6.5.5 Dc Movie - Replay of Data Collection Movie
- 87 6.5.6 Reconstruction of Precession Photographs
- 91 6.5.7 Dc opti - Optimisation of Data Collection Strategy
- 96 6.5.8 Indexing and Data Reduction of Incommensurate Samples
- 97 6.5.9 Indexing and Data Reduction of Twinned Samples
- 99 6.5.10 Extracting Data from Powder Samples
- 100 6.5.11 Refining of Machine Parameter File
- 103 6.5.12 Glossary of CrysAlis Commands
- 110 6.6 Normal Shutdown
- 110 6.7 Emergency Shutdown
- 111 6.7.1 Emergency Shutdown Procedure
- 112 7. Mechanical Changeover of Detectors and X-ray Sources
- 112 7.1 Interchange of CCD Detectors
- 112 7.1.1 Installation of a Sapphire 2 and Sapphire 3 CCD detectors
- 113 7.1.2 Removal of a Sapphire 2 and Sapphire 3 CCD detectors
- 113 7.1.3 Installation of the Onyx CCD camera
- 116 7.1.4 Removal of the Onyx CCD camera
- 117 7.2 Procedure for Interchange of the Molybednum and Copper Enhance X-ray Source
- 121 8. Maintenance Schedules
- 121 8.1 Introduction
- 121 8.2 Weekly Maintenance Schedule
- 121 8.3 Monthly Maintenance Schedule
- 122 8.4 Six Monthly Maintenance Schedule
- 122 8.5 Yearly Maintenance Schedule
- 123 8.6 10,000 Hours Maintenance Schedule
- 124 9. Maintenance Instructions
- 124 9.1 Special Tools
- 124 9.2 Refining the Machine Parameter File
- 125 9.3 Changing the X-ray Tube of Enhance
- 126 9.4 Changing the X-ray Tube of Enhance ULTRA
- 128 9.5 X-ray Beam Stop Alignment
- 129 9.6 Changing the Collimator of Enhance
- 130 9.7 Changing the Collimator of Enhance Ultra
- 130 9.8 Aligning the X-ray Collimator of Enhance
- 130 9.9 Aligning the Enhance X-ray Source
- 133 9.10 Aligning the Enhance Ultra X-ray Source
- 133 9.10.1 X-ray Beam Alignment of Enhance Ultra
- 135 9.10.2 Optic Alignment of Enhance Ultra
- 136 9.10.3 Collimator Alignment of Enhance Ultra
- 136 9.10.4 Aligning the beam to the centre of the goniometer – Enhance Ultra
- 137 9.11 Checking the Door Safety Interlocks
- 137 9.12 Checking the Emergency stop
- 138 9.13 Checking the X-ray Radiation Levels
- 138 9.14 CCD Detector – Pumping Out Vacuum
- 140 9.15 Dismantling Xcalibur
- 143 10. Trouble Shooting
- 146 11. Spares
- 148 12. Disposal Instructions
- 148 12.1 X-ray Tube and CCD Detector
- 148 12.2 Third Party Equipment
- 149 13. Additional Information
- 149 13.1 Third Party Information
- 150 13.2 Drawings
- 150 13.2.1 Mechanical Drawings
- 150 Xcalibur Suggested Layout
- 150 System and Component Dimensions
- 152 13.2.2 Electrical Drawings
- 154 14. CE Conformity notice
- 155 Appendices
- 155 Appendix 1 X-ray Tubes Wave Lengths
- 155 Appendix 2 Standard Crystal Parameters
- 155 Appendix 3 Temperature Scales Conversion
- 155 Appendix 4 Maintenance Records
- 160 Appendix 5 Example of Local Rules for the Xcalibur System Set Up at Oxford Diffraction