Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data

STM8S103x Package characteristics

11.1.4 UFQFPN package mechanical data

Figure 47.

20-lead, ultra thin, fine pitch quad flat no-lead package outline (3 x 3)

L4 b

5

1

20

L3

D e

10

11

L1 e

L2

E

15

16

A3

A1

A ddd

103_A0A5_ME

1.

Drawing is not to scale

Table 55.

20-lead, ultra thin, fine pitch quad flat no-lead package (3 x 3) package

mechanical data mm inches

(1)

Dim.

Min Typ Max Min Typ Max

A3 e

L1

L2

D

E

A

A1

L3

L4 b ddd

0.500

0.000

0.500

0.300

0.180

0.050

3.000

3.000

0.550

0.020

0.152

0.500

0.550

0.350

0.150

0.200

0.250

0.600

0.050

0.600

0.400

0.300

0.0197

0.0000

0.0197

0.0118

0.0071

0.0020

1.

Values in inches are converted from mm and rounded to 4 decimal digits.

0.1181

0.1181

0.0217

0.0008

0.0060

0.0197

0.0217

0.0138

0.0059

0.0079

0.0098

0.0236

0.0020

0.0236

0.0157

0.0118

15441 Rev 3 87/95

Package characteristics

Figure 48.

Recommended footprint for on-board emulation

0.5mm

0.8mm

[0.032"]

4mm

[0.157"]

0.5mm

1.65mm [0.065"]

0.3mm [0.012"]

4mm [0.157"]

0.9mm

[0.035"]

ai15319

Bottom view

1.

Drawing is not to scale

Figure 49.

Recommended footprint without on-board emulation

STM8S103x

88/95

1.

Drawing is not to scale

2.

Dimensions are in millimeters

15441 Rev 3