Absolute maximum ratings (electrical sensitivity). STMicroelectronics STM32F479ZI, STM32F479VI, STM32F479BI, STM32F479II, STM32F479VG, STM32F479NG, STM32F479ZG, STM32F479AG, STM32F479NI, STM32F479AI
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Electrical characteristics STM32F479xx
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).
Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device are monitored while a simple application, executing EEMBC
?
code, is running. This emission test is compliant with SAE IEC61967-2 standard which specifies the test board and the pin loading.
S
EMI
Symbol Parameter
Table 54. EMI characteristics
Conditions
Monitored frequency band
Max vs. [f
HSE
/f
CPU
]
8/168 MHz 8/180 MHz
Peak level
V
DD
= 3.3 V, T
A
= 25 °C, TFBGA216 package, conforming to SAE J1752/3
EEMBC, ART ON, all peripheral clocks enabled, clock dithering disabled.
0.1 to 30 MHz
30 to 130 MHz
130 MHz to 1GHz
SAE EMI Level
V
DD
3.3 V, T
A
25 °C, TFBGA216 package, conforming to SAE J1752/3
EEMBC, ART ON, all peripheral clocks enabled, clock dithering enabled
0.1 to 30 MHz
30 to 130 MHz
130 MHz to 1GHz
SAE EMI level
3
5
3
8
2
2
4
10
3
-10
-15
0
2
2
1
10
Unit dBµV
-
dBµV
5.3.18 Absolute maximum ratings (electrical sensitivity)
Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test conforms to the ANSI/ESDA/JEDEC JS-001 and ANSI/ESD S5.3.1 standards.
132/220 DS11118 Rev 7
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Table of contents
- 12 Description
- 15 Compatibility throughout the family
- 16 LQFP176 package
- 17 LQFP208 package
- 18 UFBGA176 package
- 19 TFBGA216 package
- 21 Functional overview
- 21 -M4 with FPU and embedded Flash and SRAM
- 21 Adaptive real-time memory accelerator (ART Accelerator™)
- 21 Memory protection unit
- 22 Embedded Flash memory
- 22 CRC (cyclic redundancy check) calculation unit
- 22 Embedded SRAM
- 22 Multi-AHB bus matrix
- 23 DMA controller (DMA)
- 24 Flexible memory controller (FMC)
- 25 Quad-SPI memory interface (QUADSPI)
- 25 LCD-TFT controller
- 25 DSI Host (DSIHOST)
- 27 Chrom-ART Accelerator™ (DMA2D)
- 27 Nested vectored interrupt controller (NVIC)
- 27 External interrupt/event controller (EXTI)
- 28 Clocks and startup
- 28 Boot modes
- 28 Power supply schemes
- 30 Power supply supervisor
- 30 Internal reset ON
- 30 Internal reset OFF
- 31 Voltage regulator
- 32 Regulator ON
- 33 Regulator OFF
- 35 Regulator ON/OFF and internal reset ON/OFF availability
- 35 Real-time clock (RTC), backup SRAM and backup registers
- 36 Low-power modes
- 37 operation
- 37 Timers and watchdogs
- 38 Advanced-control timers (TIM1, TIM8)
- 39 General-purpose timers (TIMx)
- 39 Basic timers TIM6 and TIM
- 39 Independent watchdog
- 39 Window watchdog
- 40 SysTick timer
- 40 Universal synchronous/asynchronous receiver transmitters (USART)
- 41 Serial peripheral interface (SPI)
- 42 Serial Audio interface (SAI1)
- 42 Audio PLL (PLLI2S)
- 42 Audio and LCD PLL(PLLSAI)
- 42 Secure digital input/output interface (SDIO)
- 43 Ethernet MAC interface with dedicated DMA and IEEE 1588 support
- 43 Controller area network (bxCAN)
- 44 Universal serial bus on-the-go full-speed (OTG_FS)
- 44 Universal serial bus on-the-go high-speed (OTG_HS)
- 45 Digital camera interface (DCMI)
- 45 Cryptographic accelerator
- 45 Random number generator (RNG)
- 45 General-purpose input/outputs (GPIOs)
- 46 Analog-to-digital converters (ADCs)
- 46 Temperature sensor
- 46 Digital-to-analog converter (DAC)
- 47 Serial wire JTAG debug port (SWJ-DP)
- 47 Embedded Trace Macrocell
- 48 Pinouts and pin description
- 84 Memory mapping
- 89 Electrical characteristics
- 89 Parameter conditions
- 89 Minimum and maximum values
- 89 Typical values
- 89 Typical curves
- 89 Loading capacitor
- 89 Pin input voltage
- 90 Power supply scheme
- 91 Current consumption measurement
- 91 Absolute maximum ratings
- 93 Operating conditions
- 93 General operating conditions
- 95 VCAP1/VCAP2 external capacitor
- 96 Operating conditions at power-up / power-down (regulator ON)
- 96 Operating conditions at power-up / power-down (regulator OFF)
- 96 Reset and power control block characteristics
- 98 Over-drive switching characteristics
- 98 Supply current characteristics
- 114 Wakeup time from low-power modes
- 115 External clock source characteristics
- 119 Internal clock source characteristics
- 120 PLL characteristics
- 123 PLL spread spectrum clock generation (SSCG) characteristics
- 124 MIPI D-PHY characteristics
- 127 MIPI D-PHY PLL characteristics
- 128 MIPI D-PHY regulator characteristics
- 129 Memory characteristics
- 131 EMC characteristics
- 132 Absolute maximum ratings (electrical sensitivity)
- 133 I/O current injection characteristics
- 134 I/O port characteristics
- 140 NRST pin characteristics
- 141 TIM timer characteristics
- 141 Communications interfaces
- 156 12-bit ADC characteristics
- 162 Temperature sensor characteristics
- 162 monitoring characteristics
- 162 Reference voltage
- 163 DAC electrical characteristics
- 165 FMC characteristics
- 185 Quad-SPI interface characteristics
- 186 Camera interface (DCMI) timing specifications
- 187 LCD-TFT controller (LTDC) characteristics
- 189 SD/SDIO MMC card host interface (SDIO) characteristics
- 191 RTC characteristics
- 192 Package information
- 192 LQFP100 package information
- 195 LQFP144 package information
- 198 WLCSP168 package information
- 200 UFBGA169 package information
- 203 LQFP176 package information
- 207 UFBGA(176+25) package information
- 208 LQFP208 package information
- 212 TFBGA216 package information
- 215 Thermal characteristics
- 216 Part numbering
- 217 Appendix A Recommendations when using internal reset OFF
- 217 Operating conditions
- 218 Revision history