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Table of contents
- 12 Description
- 15 Compatibility throughout the family
- 16 LQFP176 package
- 17 LQFP208 package
- 18 UFBGA176 package
- 19 TFBGA216 package
- 21 Functional overview
- 21 -M4 with FPU and embedded Flash and SRAM
- 21 Adaptive real-time memory accelerator (ART Accelerator™)
- 21 Memory protection unit
- 22 Embedded Flash memory
- 22 CRC (cyclic redundancy check) calculation unit
- 22 Embedded SRAM
- 22 Multi-AHB bus matrix
- 23 DMA controller (DMA)
- 24 Flexible memory controller (FMC)
- 25 Quad-SPI memory interface (QUADSPI)
- 25 LCD-TFT controller
- 25 DSI Host (DSIHOST)
- 27 Chrom-ART Accelerator™ (DMA2D)
- 27 Nested vectored interrupt controller (NVIC)
- 27 External interrupt/event controller (EXTI)
- 28 Clocks and startup
- 28 Boot modes
- 28 Power supply schemes
- 30 Power supply supervisor
- 30 Internal reset ON
- 30 Internal reset OFF
- 31 Voltage regulator
- 32 Regulator ON
- 33 Regulator OFF
- 35 Regulator ON/OFF and internal reset ON/OFF availability
- 35 Real-time clock (RTC), backup SRAM and backup registers
- 36 Low-power modes
- 37 operation
- 37 Timers and watchdogs
- 38 Advanced-control timers (TIM1, TIM8)
- 39 General-purpose timers (TIMx)
- 39 Basic timers TIM6 and TIM
- 39 Independent watchdog
- 39 Window watchdog
- 40 SysTick timer
- 40 Universal synchronous/asynchronous receiver transmitters (USART)
- 41 Serial peripheral interface (SPI)
- 42 Serial Audio interface (SAI1)
- 42 Audio PLL (PLLI2S)
- 42 Audio and LCD PLL(PLLSAI)
- 42 Secure digital input/output interface (SDIO)
- 43 Ethernet MAC interface with dedicated DMA and IEEE 1588 support
- 43 Controller area network (bxCAN)
- 44 Universal serial bus on-the-go full-speed (OTG_FS)
- 44 Universal serial bus on-the-go high-speed (OTG_HS)
- 45 Digital camera interface (DCMI)
- 45 Cryptographic accelerator
- 45 Random number generator (RNG)
- 45 General-purpose input/outputs (GPIOs)
- 46 Analog-to-digital converters (ADCs)
- 46 Temperature sensor
- 46 Digital-to-analog converter (DAC)
- 47 Serial wire JTAG debug port (SWJ-DP)
- 47 Embedded Trace Macrocell
- 48 Pinouts and pin description
- 84 Memory mapping
- 89 Electrical characteristics
- 89 Parameter conditions
- 89 Minimum and maximum values
- 89 Typical values
- 89 Typical curves
- 89 Loading capacitor
- 89 Pin input voltage
- 90 Power supply scheme
- 91 Current consumption measurement
- 91 Absolute maximum ratings
- 93 Operating conditions
- 93 General operating conditions
- 95 VCAP1/VCAP2 external capacitor
- 96 Operating conditions at power-up / power-down (regulator ON)
- 96 Operating conditions at power-up / power-down (regulator OFF)
- 96 Reset and power control block characteristics
- 98 Over-drive switching characteristics
- 98 Supply current characteristics
- 114 Wakeup time from low-power modes
- 115 External clock source characteristics
- 119 Internal clock source characteristics
- 120 PLL characteristics
- 123 PLL spread spectrum clock generation (SSCG) characteristics
- 124 MIPI D-PHY characteristics
- 127 MIPI D-PHY PLL characteristics
- 128 MIPI D-PHY regulator characteristics
- 129 Memory characteristics
- 131 EMC characteristics
- 132 Absolute maximum ratings (electrical sensitivity)
- 133 I/O current injection characteristics
- 134 I/O port characteristics
- 140 NRST pin characteristics
- 141 TIM timer characteristics
- 141 Communications interfaces
- 156 12-bit ADC characteristics
- 162 Temperature sensor characteristics
- 162 monitoring characteristics
- 162 Reference voltage
- 163 DAC electrical characteristics
- 165 FMC characteristics
- 185 Quad-SPI interface characteristics
- 186 Camera interface (DCMI) timing specifications
- 187 LCD-TFT controller (LTDC) characteristics
- 189 SD/SDIO MMC card host interface (SDIO) characteristics
- 191 RTC characteristics
- 192 Package information
- 192 LQFP100 package information
- 195 LQFP144 package information
- 198 WLCSP168 package information
- 200 UFBGA169 package information
- 203 LQFP176 package information
- 207 UFBGA(176+25) package information
- 208 LQFP208 package information
- 212 TFBGA216 package information
- 215 Thermal characteristics
- 216 Part numbering
- 217 Appendix A Recommendations when using internal reset OFF
- 217 Operating conditions
- 218 Revision history