STMicroelectronics VND5E008MY-E Datasheet
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VND5E008MY-E Double channel high-side driver with analog current sense for automotive applications Datasheet - production data – Self limiting of fast thermal transients – Protection against loss of ground and loss of VCC – Thermal shutdown – Reverse battery protection with self switch on of the Power MOSFET – Electrostatic discharge protection PowerSSO-36 Features Applications Max transient supply voltage VCC 41 V Operating voltage range VCC 4.5 to 28 V Typ on-state resistance (per ch.) RON 8 mΩ Current limitation (typ) ILIMH 76 A Off-state supply current IS 2 µA(1) 1. Typical value with all loads connected • General – Inrush current active management by power limitation – Very low standby current – 3.0V CMOS compatible inputs – Optimized electromagnetic emissions – Very low electromagnetic susceptibility – Compliant with European directive 2002/95/EC – Proportional load current sense – High current sense precision for wide current range – Very low current sense leakage • Diagnostic functions – Current sense disable – Overload and short to ground (power limitation) indication – Thermal shutdown indication • Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation October 2013 This is information on a product in full production. • All types of resistive, inductive and capacitive loads Description The VND5E008MY-E is a double channel highside driver manufactured using STMicroelectronics® proprietary VIPower® M0-5 technology and housed in PowerSSO-36 package. The device is designed to drive 12 V automotive grounded loads, and to provide protection and diagnostics. It also implements a 3 V and 5 V CMOS compatible interface for the use with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto restart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel providing enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication and overtemperature indication. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to share the external sense resistor with similar devices. DocID018699 Rev 5 1/35 www.st.com Contents VND5E008MY-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.1 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.2 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.3 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 25 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 5 PowerSSO-36 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.2 PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2/35 DocID018699 Rev 5 VND5E008MY-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Current sense (8 V < VCC < 18 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 PowerSSO-36 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 DocID018699 Rev 5 3/35 3 List of figures VND5E008MY-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. 4/35 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 IOUT/ISENSE vs IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Maximum current sense ratio drift vs load current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Delay response time between rising edge of output current and rising edge of current sense (CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 TJ evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Low level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 High level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PowerSSO-36 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Rthj-amb vs PCB copper area in open box free air condition (one channel ON) . . . . . . . . 27 PowerSSO-36 thermal impedance junction ambient single pulse (one channel ON). . . . . 27 Thermal fitting model of a double channel HSD in PowerSSO-36 . . . . . . . . . . . . . . . . . . . 28 PowerSSO-36 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PowerSSO-36 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 PowerSSO-36 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 DocID018699 Rev 5 VND5E008MY-E 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram 9&& 5HYHUVH %DWWHU\ 3URWHFWLRQ 6LJQDO&ODPS &RQWURO'LDJQRVWLF 8QGHUYROWDJH ,1 &RQWURO'LDJQRVWLF 3RZHU &ODPS '5,9(5 ,1 &+ 921 /LPLWDWLRQ 2YHU WHPS &XUUHQW /LPLWDWLRQ &6B ',6 96(16(+ &6 &XUUHQW 6HQVH &6 &+ 287 )DXOW /2*,& 287 29(5/2$'3527(&7,21 $&7,9(32:(5/,0,7$7,21 *1' *$3*&)7 Table 1. Pin function Name VCC OUT1,2 Function Battery connection Power output GND Ground connection IN1,2 Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state CS1,2 Analog current sense pin, delivers a current proportional to the load current CS_DIS Active high CMOS compatible pin, to disable the current sense pin DocID018699 Rev 5 5/35 34 Block diagram and pin description VND5E008MY-E Figure 2. Configuration diagram (top view) 287 287 287 287 287 287 287 287 287 287 1& 1& ,1 1& &6 1& 1& &6B',6 287 287 287 287 287 287 287 287 287 287 1& 1& ,1 1& &6 1& 1& *1' 7$% 9&& ("1($'5 Table 2. Suggested connections for unused and not connected pins 6/35 Connection / pin Current Sense N.C. Output Input CS_DIS Floating Not allowed X X X X To ground Through 1 KΩ resistor X Not allowed Through 10 KΩ resistor Through 10 KΩ resistor DocID018699 Rev 5 VND5E008MY-E 2 Electrical specifications Electrical specifications Figure 3. Current and voltage conventions ,6 9&& 9)Q 287 &6B',6 9 &6' 9 287 , 6(16( ,,1 &6 ,1 9 ,1 9&& , 287 , &6' , 287 ,,1 9 6(16( 287 ,1 , 6(16( 9 ,1 *1' 9 287 &6 9 6(16( , *1' *$3*&)7 2.1 Absolute maximum ratings Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in table below for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. Absolute maximum rating Symbol Value Unit DC supply voltage 28 V Transient supply voltage (T<400ms, RLOAD > 0.5Ω) 41 V Reverse DC supply voltage 16 V Maximum supply voltage for full protection to short-circuit (acc. AEC-Q100-012) 18 V -IGND DC reverse ground pin current 200 mA IOUT DC output current Internally limited A -IOUT Reverse DC output current 50 A DC input current -1 to 10 mA DC current sense disable input current -1 to 10 mA VCC - 41 +VCC V V 260 mJ VCC VCCPK -VCC VCC_LSC IIN ICSD Parameter VCSENSE Current sense maximum voltage EMAX Maximum switching energy (single pulse) (L = 0.85 mH; RL = 0 Ω; Vbat = 13.5 V; Tjstart = 150 °C; IOUT = IlimL(Typ.)) DocID018699 Rev 5 7/35 34 Electrical specifications VND5E008MY-E Table 3. Absolute maximum rating (continued) Symbol Value Unit VESD Electrostatic discharge (Human Body Model: R = 1.5 KΩ; C = 100 pF) – VCC, OUTPUT – INPUT, CS_DIS – CURRENT SENSE 5000 4000 2000 V V V VESD Charge device model (CDM-AEC-Q100-011) 750 V Junction operating temperature -40 to 150 °C Storage temperature -55 to 150 °C Max Value Unit 0.85 °C/W See Figure 33 in the Thermal section °C/W Tj Tstg 2.2 Parameter Thermal data Table 4. Thermal data Symbol 8/35 Parameter Rthj-case Thermal resistance junction-case (MAX) (with one channel ON) Rthj-amb Thermal resistance junction-ambient (MAX) DocID018699 Rev 5 VND5E008MY-E 2.3 Electrical specifications Electrical characteristics 8 V < VCC < 28 V; -40 °C < Tj < 150 °C, unless otherwise specified Table 5. Power section Symbol Parameter Test conditions VCC Operating supply voltage VUSD VUSDhyst Min. Typ. Max. Unit 4.5 13 28 V Undervoltage shutdown 3.5 4.5 V Undervoltage shutdown hysteresis 0.5 V 8 mΩ IOUT = 6 A; Tj = 25 °C RON RON REV Vclamp IS IL(off) On-state resistance IOUT = 6 A; Tj = 150 °C 15 mΩ IOUT = 6A; VCC = 5V; Tj = 25 °C 11 mΩ Reverse battery on-state resistance VCC = -13 V; IOUT = -6 A; Tj = 25 °C Clamp Voltage IS = 20 mA Supply current Off-state output current (2) 8 41 mΩ 46 52 V Off-state; VCC = 13 V; Tj = 25 °C; VIN = VOUT = VSENSE = VCSD = 0 V 2(1) 5(1) µA On-state; VCC = 13 V; VIN = 5 V; IOUT = 0 A 3.5 6.5 mA 0.01 3 µA 5 µA VIN = VOUT = 0 V; VCC = 13 V; Tj = 25 °C 0 VIN = VOUT = 0 V; VCC = 13 V; Tj = 125 °C 1. PowerMOS leakage included. 2. For each channel. Table 6. Switching (VCC = 13V; Tj = 25°C) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time RL = 2.2 Ω (see Figure 7) — 30 — µs td(off) Turn-off delay time RL = 2.2 Ω (see Figure 7) — 15 — µs Turn-on voltage slope RL = 2.2 Ω — See Figure 20 — V/µs Turn-off voltage slope RL = 2.2 Ω — See Figure 21 — V/µs WON Switching energy losses during twon RL = 2.2 Ω (see Figure 7) — 1.2 — mJ WOFF Switching energy losses during twoff RL = 2.2 Ω (see Figure 7) — 0.43 — mJ (dVOUT/dt) on (dVOUT/dt) off DocID018699 Rev 5 9/35 34 Electrical specifications VND5E008MY-E Table 7. Current sense (8 V < VCC < 18 V) Symbol K0 K1 dK1/K1(1) K2 dK2/K2(1) K3 dK3/K3(1) ISENSE0 10/35 Parameter Test conditions IOUT/ISENSE IOUT = 0.25 A; VSENSE = 0.5 V; Tj = -40 °C...150 °C IOUT/ISENSE IOUT = 6 A; VSENSE = 0.5 V Tj = -40 °C...150 °C Tj = 25 °C...150 °C IOUT = 6 A; VSENSE = 0.5 V Current sense ratio drift VCSD = 0 V; TJ= -40 °C to 150 °C IOUT = 10 A; VSENSE = 4 V Tj = -40 °C...150 °C Tj = 25 °C...150 °C IOUT/ISENSE IOUT = 10 A; VSENSE = 4 V; Current sense ratio drift VCSD = 0 V; Tj = -40 °C to 150 °C IOUT = 25 A; VSENSE = 4 V Tj = -40 °C...150 °C Tj = 25 °C...150 °C IOUT/ISENSE IOUT = 25 A; VSENSE = 4 V; Current sense ratio drift VCSD= 0V; Tj = -40 °C to 150 °C Analog sense leakage current Min. Typ. Max. 3658 6000 8926 3910 4336 6000 6000 8928 8044 -12 4948 5298 12 6000 6000 -7 5455 5535 % 7372 6762 7 6000 6000 Unit % 6762 6282 -5 5 % IOUT = 0 A; VSENSE = 0 V; VCSD = 5 V; VIN = 0 V; Tj = -40 °C...150 °C 0 1 µA VCSD = 0V; VIN = 5V; Tj = -40 °C...150 °C 0 2 µA IOUT = 6 A; VSENSE = 0 V; VCSD = VIN = 5 V 0 1 µA 5 VSENSE Max analog sense output voltage IOUT = 15 A; VCSD = 0 V VSENSEH Analog sense output voltage in overtemperature condition(2) VCC = 13 V; RSENSE = 10 KΩ 8 V ISENSEH Analog sense output current in overtemperature condition(2) VCC = 13 V; VSENSE = 5 V 9 mA tDSENSE1H Delay Response time from falling edge of CS_DIS pin VSENSE < 4V, 1.5A < IOUT < 25A ISENSE = 90% of ISENSE max (see Figure 4) 50 100 µs tDSENSE1L Delay Response time from rising edge of CS_DIS pin VSENSE < 4V, 1.5A < IOUT < 25A ISENSE = 10% of ISENSE max (see Figure 4) 5 20 µs DocID018699 Rev 5 V VND5E008MY-E Electrical specifications Table 7. Current sense (8 V < VCC < 18 V) (continued) Symbol Parameter tDSENSE2H Test conditions Delay Response time from rising edge of INPUT pin VSENSE < 4V, 1.5A < IOUT < 25A ISENSE = 90% of ISENSE max (see Figure 4) Delay response time between rising edge of ΔtDSENSE2H output current and rising edge of current sense tDSENSE2L Delay Response time from falling edge of INPUT pin Min. Typ. Max. Unit 70 300 µs 300 µs 250 µs VSENSE < 4 V, ISENSE = 90 % of ISENSEMAX, IOUT = 90 % of IOUTMAX IOUTMAX = 5 A (see Figure 10) VSENSE < 4V, 1.5A < IOUT < 25A ISENSE = 10% of ISENSE max (see Figure 4) 100 1. Parameter guaranteed by design; it is not tested. 2. Fault condition includes: power limitation and overtemperature. Table 8. Protections and diagnostics(1) Symbol Parameter Test conditions VCC = 13 V IlimH DC Short circuit current IlimL Short circuit current VCC = 13V; TR < Tj < TTSD during thermal cycling TTSD Shutdown temperature TR Reset temperature TRS Thermal reset of STATUS THYST VDEMAG VON Min. Typ. Max. Unit 53 76 106 A 106 A 5 V < VCC < 18 V 21 150 175 TRS + 1 TRS + 5 A 200 °C 135 Thermal hysteresis (TTSD-TR) °C 7 Turn-off output voltage IOUT = 2 A; VIN = 0; L = 6 mH clamp Output voltage drop limitation VCC29 IOUT = 0.4 A; Tj = -40 °C...150 °C (see Figure 9) °C VCC32 °C VCC36 25 V mV 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles Table 9. Logic inputs Symbol Parameter Test conditions VIL Input low level voltage IIL Low level input current VIH Input high level voltage VIN = 0.9 V DocID018699 Rev 5 Min. Typ. Max. Unit 0.9 V 1 μA 2.1 V 11/35 34 Electrical specifications VND5E008MY-E Table 9. Logic inputs (continued) Symbol Parameter Test conditions IIH High level input current VI(hyst) Input hysteresis voltage VICL CS_DIS low level voltage ICSDL Low level CS_DIS current VCSDH CS_DIS high level voltage ICSDH High level CS_DIS current VCSD(hyst CS_DIS hysteresis voltage Max. Unit 10 μA 0.25 V 5.5 IIN = -1 mA VCSDL Typ. VIN = 2.1 V IIN = 1 mA Input clamp voltage Min. 7 -0.7 V V 0.9 V 1 μA 2.1 V VCSD = 0.9 V VCSD = 2.1 V 10 0.25 μA V ) VCSCL CS_DIS clamp voltage ICSD = 1 mA 5.5 ICSD = -1 mA 7 -0.7 Figure 4. Current sense delay characteristics ,1387 &6B',6 /2$'&855(17 6(16(&855(17 W'6(16(+ W'6(16(/ W'6(16(+ W'6(16(/ $*9 12/35 DocID018699 Rev 5 V V VND5E008MY-E Electrical specifications Figure 5. IOUT/ISENSE vs IOUT Figure 6. Maximum current sense ratio drift vs load current dK/K [%] 20 15 10 A 5 0 -5 B -10 -15 -20 0 5 10 15 Iout [A] A: Max, Tj = -40 C to 150 C Note: 20 25 30 B: Min, Tj = -40 C to 150 C Parameter guaranteed by design; it is not tested. DocID018699 Rev 5 13/35 34 Electrical specifications VND5E008MY-E Table 10. Truth table Input Output Sense (Vcsd = 0V)(1) Normal operation L H L H 0 Nominal Overtemperature L H L L 0 VSENSEH Undervoltage L H L L 0 0 H X (no power limitation) Cycling (power limitation) Nominal Conditions Overload H VSENSEH Short circuit to GND (Power limitation) L H L L 0 VSENSEH Negative output voltage clamp L L 0 1. If the VCSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents and external circuit. Figure 7. Switching characteristics 9287 W:RQ W:RII G9287GWRII G9287GWRQ WU WI W ,1387 WGRQ WGRII W *$3*&)7 14/35 DocID018699 Rev 5 VND5E008MY-E Electrical specifications Figure 8. Delay response time between rising edge of output current and rising edge of current sense (CS enabled) 9,1 ǻW'6(16(+ W ,287 ,2870$; ,2870$; W ,6(16( ,6(16(0$; ,6(16(0$; W *$3*&)7 Figure 9. Output voltage drop limitation 9&&9287 7M & 7M & 7M & 921 ,287 9215217 $*9 DocID018699 Rev 5 15/35 34 Electrical specifications VND5E008MY-E Table 11. Electrical transient requirements (part 1) ISO 7637-2: 2004(E) Test levels(1) Number of pulses or test times Burst cycle/pulse repetition time Delays and impedance Test pulse III IV 1 -75 V -100 V 5000 pulses 0.5 s 5s 2 ms, 10 Ω 2a +37 V +50 V 5000 pulses 0.2 s 5s 50 µs, 2 Ω 3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω 3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω 4 -6 V -7 V 1 pulse 100 ms, 0.01 Ω 5b(2) +65 V +87 V 1 pulse 400 ms, 2 Ω 1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b. 2. Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy allows PowerMOS to be cyclically switched on during load dump, so distributing the load dump energy along the time and to transfer a part of it to the load. Table 12. Electrical transient requirements (part 2) Test level results(1) ISO 7637-2: 2004(E) Test pulse III IV 1 C C 2a C C 3a C C 3b C C 4 C C 5b(2)(3) C C 1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b 2. Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy allows PowerMOS to be cyclically switched on during load dump, so distributing the load dump energy along the time and to transfer a part of it to the load. 3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 3: Absolute maximum rating. Table 13. Electrical transient requirements (part 3) 16/35 Class Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. DocID018699 Rev 5 VND5E008MY-E 2.4 Electrical specifications Waveforms Figure 10. Normal operation 1RUPDORSHUDWLRQ ,1387 1RPLQDOORDG 1RPLQDOORDG ,287 96(16( 9&6B',6 $*9 Figure 11. Overload or short to GND 2YHUORDGRU6KRUWWR*1' ,1387 3RZHU/LPLWDWLRQ , /LP+! 7KHUPDOF\FOLQJ , /LP/! ,287 96(16( 9&6B',6 $*9 DocID018699 Rev 5 17/35 34 Electrical specifications VND5E008MY-E Figure 12. Intermittent overload ,QWHUPLWWHQW2YHUORDG ,1387 2YHUORDG ,/LP+ ! ,/LP/ ! 1RPLQDOORDG ,287 96(16(+ ! 96(16( 9&6B',6 $*9 Figure 13. TJ evolution in overload or short to GND 7- HYROXWLRQLQ 2YHUORDGRU6KRUWWR*1' ,1387 6HOIOLPLWDWLRQRIIDVWWKHUPDOWUDQVLHQWV 776' 7+<67 75 7-B67$57 7,/LP+! 3RZHU/LPLWDWLRQ ,/LP/ ,287 $*9 18/35 DocID018699 Rev 5 VND5E008MY-E 2.5 Electrical specifications Electrical characteristics curves Figure 14. Off-state output current Figure 15. High level input current ,ORII>Q$@ ,LK>X$@ 9LQ 9 7F> &@ 7F> &@ *$3*&)7 *$3*&)7 Figure 16. Input clamp voltage Figure 17. Input high level voltage 9LFO>9@ 9LK>9@ ,LQ P$ 7F> &@ 7F> &@ *$3*&)7 *$3*&)7 Figure 18. Input low level voltage Figure 19. Input hysteresis voltage 9LO>9@ 9LK\VW>9@ 7F> &@ 7F> &@ *$3*&)7 DocID018699 Rev 5 *$3*&)7 19/35 34 Electrical specifications VND5E008MY-E Figure 20. On-state resistance vs Tcase 5RQ>P2KP@ Figure 21. On-state resistance vs VCC 5RQ>P2KP@ ,RXW $ 9FF 9 7F & 7F & 7F & 7F & 7F> &@ 9FF>9@ *$3*&)7 *$3*&)7 Figure 22. Undervoltage shutdown Figure 23. ILIMH vs Tcase 9XVG>9@ ,OLPK>$@ 9FF 9 7F> &@ *$3*&)7 *$3*&)7 Figure 24. Turn-on voltage slope Figure 25. Turn-off voltage slope G9RXWGW2Q>9PV@ G9RXWGW2II>9PV@ 9FF 9 5O ȍ 9FF 9 5O ȍ 7F> &@ 7F> &@ *$3*&)7 20/35 7F> &@ DocID018699 Rev 5 *$3*&)7 VND5E008MY-E Electrical specifications Figure 26. CS_DIS clamp voltage Figure 27. Low level CS_DIS voltage 9FVGFO>9@ 9FVGO>9@ ,LQ P$ 7F> &@ 7F> &@ *$3*&)7 *$3*&)7 Figure 28. High level CS_DIS voltage 9FVGK>9@ 7F> &@ *$3*&)7 DocID018699 Rev 5 21/35 34 Application information 3 VND5E008MY-E Application information Figure 29. Application schematic 9 9&& 5SURW &6B',6 'OG P& 5SURW ,,1387 287387 5SURW &855(176(16( *1' 56(16( &H[W *$3*&)7 Note: Channel 2 has the same internal circuit as channel 1. 3.1 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCCPK max rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 3.2 MCU I/Os protection When negative transients are present on the VCC line, the control pin is pulled negative to approximately -1.5 V. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/O pins from latching-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (input levels compatibility) with the latch-up limit of microcontroller I/Os. Equation 1 -VCCpeak / Ilatchup ≤ Rprot ≤ (VOHμC - VIH) / IIHmax Calculation example: For VCCpeak = - 1.5 V; Ilatchup ≥ 20 mA; VOHμC ≥ 4.5 V 75 Ω ≤ Rprot ≤ 240 kΩ. Recommended values: Rprot =10 kΩ, CEXT =10 nF. 22/35 DocID018699 Rev 5 VND5E008MY-E 3.3 Application information Current sense and diagnostic The current sense pin performs a double function (see Figure 30: Current sense and diagnostic): • Current mirror of the load current in normal operation, delivering a current proportional to the load one according to a known ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5V minimum (see parameter VSENSE in Table 7: Current sense (8 V < VCC < 18 V)). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 7: Current sense (8 V < VCC < 18 V)). • Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Table 10: Truth table): – Power limitation activation – Overtemperature A logic level high on CS_DIS pin sets at the same time all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices. DocID018699 Rev 5 23/35 34 Application information VND5E008MY-E Figure 30. Current sense and diagnostic 9%$7 9&& 0DLQ026Q 9 2YHUWHPSHUDWXUH ,287.; ,6(16(+ 3ZUB/LP 287Q 96(16(+ &6B',6 &855(17 6(16(Q *1' /RDG 53527 7RX&$'& 56(16( 96(16( *$3*&)7 24/35 DocID018699 Rev 5 VND5E008MY-E 3.4 Application information Maximum demagnetization energy (VCC = 13.5V) Figure 31. Maximum turn-off current versus inductance ,$ 91'(0< 6LQJOH 3XOVH 5HSHWLWLYHSXOVH7MVWDUW & 5HSHWLWLYHSXOVH7MVWDUW & /P+ ("1($'5 A: Tjstart = 150°C single pulse B: Tjstart = 100°C repetitive pulse C: Tjstart = 125°C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL = 0 Ω. In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. DocID018699 Rev 5 25/35 34 Package and PCB thermal data VND5E008MY-E 4 Package and PCB thermal data 4.1 PowerSSO-36 thermal data Figure 32. PowerSSO-36 PC board $*9 Note: Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/-10 %; Board double layer; Board dimension 129 mm x 60 mm; Board Material FR4; Cu thickness 0.070 mm; Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/-0.08 mm; Cu thickness on vias 0.025 mm; Footprint dimension 4.1 mm x 6.5 mm) 26/35 DocID018699 Rev 5 VND5E008MY-E Package and PCB thermal data Figure 33. Rthj-amb vs PCB copper area in open box free air condition (one channel ON) 57+MDPE 57+MBDPE&: 57+MDPE 3&%&XKHDWVLQNFPA *$3*&)7 Figure 34. PowerSSO-36 thermal impedance junction ambient single pulse (one channel ON) =7+&: &X FP &X FP &X IRRWSULQW 7LPHV ("1($'5 DocID018699 Rev 5 27/35 34 Package and PCB thermal data VND5E008MY-E Figure 35. Thermal fitting model of a double channel HSD in PowerSSO-36 *$3*&)7 Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. Equation 2: pulse calculation formula Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ ) where δ = tp ⁄ T Table 14. Thermal parameter 28/35 Area/island (cm2) Footprint R1 = R7 (°C/W) 0.05 R2 = R8 (°C/W) 0.3 R3 (°C/W) 5 R4 (°C/W) 8 R5 (°C/W) 2 8 18 10 10 R6 (°C/W) 27 23 14 C1 = C7 (W.s/°C) 0.004 C2 = C8 (W.s/°C) 0.008 C3 (W.s/°C) 0.04 C4 (W.s/°C) 0.5 C5 (W.s/°C) 1 2 2 C6 (W.s/°C) 3 6 9 DocID018699 Rev 5 VND5E008MY-E Package information 5 Package information 5.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID018699 Rev 5 29/35 34 Package information 5.2 VND5E008MY-E PowerSSO-36 mechanical data Figure 36. PowerSSO-36 package dimensions ("1($'5 30/35 DocID018699 Rev 5 VND5E008MY-E Package information Table 15. PowerSSO-36 mechanical data millimeters Symbol Min Typ Max A 2.15 — 2.47 A2 2.15 — 2.40 a1 0 — 0.075 b 0.18 — 0.36 c 0.23 — 0.32 D 10.10 — 10.50 E 7.4 — 7.6 e — 0.5 — e3 — 8.5 — G — — 0.1 G1 — — 0.06 H 10.1 — 10.5 h — — 0.4 L 0.55 — 0.85 N — — 10 deg X 4.1 — 4.7 Y 6.5 — 7.1 DocID018699 Rev 5 31/35 34 Package information 5.3 VND5E008MY-E Packing information Figure 37. PowerSSO-36 tube shipment (no suffix) Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) & % 49 1225 532 3.5 13.8 0.6 All dimensions are in mm. $ Figure 38. PowerSSO-36 tape and reel shipment (suffix “TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 100 30.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing All dimensions are in mm. W P0 (± 0.1) P D (± 0.05) D1 (min) F (± 0.1) K (max) P1 (± 0.1) 24 4 12 1.55 1.5 11.5 2.85 2 End Start Top cover tape No components Components No components 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed GAPGCFT00003 32/35 DocID018699 Rev 5 VND5E008MY-E 6 Order codes Order codes Table 16. Device summary Order codes Package PowerSSO-36 Tube Tape and reel VND5E008MY-E VND5E008MYTR-E DocID018699 Rev 5 33/35 34 Revision history 7 VND5E008MY-E Revision history Table 17. Document revision history 34/35 Date Revision Changes 20-Apr-2011 1 Initial release. 27-Apr-2011 2 Updated Table 8: Protections and diagnostics: – IlimH: updated test condition 13-July-2012 3 Updated Figure 36: PowerSSO-36 package dimensions 18-Sep-2013 4 Updated Disclaimer. 25-Oct-2013 5 Updated footnote 2 into the Table 11: Electrical transient requirements (part 1) and Table 12: Electrical transient requirements (part 2). DocID018699 Rev 5 VND5E008MY-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID018699 Rev 5 35/35 35 ">
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