- Computers & electronics
- Computer components
- System components
- Processors
- Intel
- AT80571RG0601ML
- Data Sheet
advertisement
Electrical Specifications
Table 14.
2.8
2.8.1
GTL+ Bus Voltage Definitions
Symbol
GTLREF_PU
GTLREF_PD
R
TT
COMP[3:0]
COMP8
Parameter
GTLREF pull up on Intel ®
3 Series Chipset family boards
GTLREF pull down on
Intel ® 3 Series Chipset family boards
Termination Resistance
COMP Resistance
COMP Resistance
Min
57.6 * 0.99
100 * 0.99
45
49.40
24.65
Typ
57.6
100
Max
57.6 * 1.01
100 * 1.01
Units Notes 1
Ω
Ω
2
2
50
49.90
24.90
55
50.40
25.15
Ω
Ω
Ω
3
4
4
NOTES:
1.
2.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
GTLREF is to be generated from V
TT
by a voltage divider of 1% resistors. If an Adjustable
GTLREF circuit is used on the board (for Quad-Core processors compatibility) the two
3.
4.
GTLREF lands connected to the Adjustable GTLREF circuit require the following:
GTLREF_PU = 50 Ω, GTLREF_PD = 100 Ω.
R
TT
is the on-die termination resistance measured at V
TT
/3 of the GTL+ output driver.
COMP resistance must be provided on the system board with 1% resistors. COMP[3:0] and
COMP8 resistors are to V
SS
.
Clock Specifications
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor. As in previous generation processors, the processor’s core frequency is a multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its default ratio during manufacturing. The processor supports Half Ratios between 7.5 and 13.5, refer to
Table 15 for the processor supported ratios.
The processor uses a differential clocking implementation. For more information on the processor clocking, contact your Intel field representative.
Datasheet 27
advertisement
Key Features
- IntelĀ® CeleronĀ® E3200 2.4 GHz
- 1 MB L2 LGA 775 (Socket T)
- Processor cores: 2 45 nm 64-bit 65 W
Related manuals
advertisement
Table of contents
- 9 Introduction
- 9 Terminology
- 10 Processor Terminology Definitions
- 11 References
- 13 Electrical Specifications
- 13 Power and Ground Lands
- 13 Decoupling Guidelines
- 13 VCC Decoupling
- 13 VTT Decoupling
- 14 FSB Decoupling
- 14 Voltage Identification
- 16 Reserved, Unused, and TESTHI Signals
- 16 Power Segment Identifier (PSID)
- 17 Voltage and Current Specification
- 17 Absolute Maximum and Minimum Ratings
- 18 DC Voltage and Current Specification
- 20 VCC Overshoot
- 21 Die Voltage Validation
- 21 Signaling Specifications
- 22 FSB Signal Groups
- 23 CMOS and Open Drain Signals
- 24 Processor DC Specifications
- 25 Platform Environment Control Interface (PECI) DC Specifications
- 26 GTL+ Front Side Bus Specifications
- 27 Clock Specifications
- 27 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
- 28 FSB Frequency Select Signals (BSEL[2:0])
- 29 Phase Lock Loop (PLL) and Filter
- 29 BCLK[1:0] Specifications
- 33 Package Mechanical Specifications
- 33 Package Mechanical Drawing
- 37 Processor Component Keep-Out Zones
- 37 Package Loading Specifications
- 37 Package Handling Guidelines
- 38 Package Insertion Specifications
- 38 Processor Mass Specification
- 38 Processor Materials
- 38 Processor Markings
- 39 Processor Land Coordinates
- 41 Land Listing and Signal Descriptions
- 41 Processor Land Assignments
- 64 Alphabetical Signals Reference
- 75 Thermal Specifications and Design Considerations
- 75 Processor Thermal Specifications
- 75 Thermal Specifications
- 78 Thermal Metrology
- 78 Processor Thermal Features
- 78 Thermal Monitor
- 80 On-Demand Mode
- 81 PROCHOT# Signal
- 81 THERMTRIP# Signal
- 82 Platform Environment Control Interface (PECI)
- 82 Introduction
- 82 TCONTROL and TCC activation on PECI-Based Systems
- 83 PECI Specifications
- 83 PECI Device Address
- 83 PECI Command Support
- 83 PECI Fault Handling Requirements
- 83 PECI GetTemp0() Error Code Support
- 85 Features
- 85 Power-On Configuration Options
- 85 Clock Control and Low Power States
- 86 Normal State
- 86 HALT and Extended HALT Powerdown States
- 86 HALT Powerdown State
- 87 Extended HALT Powerdown State
- 87 Stop Grant and Extended Stop Grant States
- 87 Stop-Grant State
- 88 Extended Stop Grant State
- 88 Stop Grant Snoop State, and Stop Grant Snoop State
- 88 HALT Snoop State, Stop Grant Snoop State
- 88 Extended HALT Snoop State, Extended Stop Grant Snoop State
- 88 Sleep State
- 89 Deep Sleep State
- 89 Deeper Sleep State
- 90 Technology
- 90 Processor Power Status Indicator (PSI) Signal
- 91 Boxed Processor Specifications
- 91 Introduction
- 92 Mechanical Specifications
- 92 Boxed Processor Cooling Solution Dimensions
- 93 Boxed Processor Fan Heatsink Weight
- 93 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
- 93 Electrical Requirements
- 93 Fan Heatsink Power Supply
- 95 Thermal Specifications
- 95 Boxed Processor Cooling Requirements
- 97 Variable Speed Fan
- 99 Debug Tools Specifications
- 99 Logic Analyzer Interface (LAI)
- 99 Mechanical Considerations
- 99 Electrical Considerations