- Computers & electronics
- Computer components
- System components
- Processors
- Intel
- AT80571RG0601ML
- Data Sheet
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Thermal Specifications and Design Considerations
Figure 15.
Thermal Monitor 2 Frequency and Voltage Ordering
T
TM2
f
MAX
f
TM2
VID
VID
TM2
Temperature
Frequency
VID
5.2.3
PROCHOT#
The PROCHOT# signal is asserted when a high temperature situation is detected, regardless of whether Thermal Monitor or Thermal Monitor 2 is enabled.
It should be noted that the Thermal Monitor 2 TCC cannot be activated using the ondemand mode. The Thermal Monitor TCC, however, can be activated through the use of the on-demand mode.
On-Demand Mode
The processor provides an auxiliary mechanism that allows system software to force the processor to reduce its power consumption. This mechanism is referred to as “On-
Demand” mode and is distinct from the Thermal Monitor feature. On-Demand mode is intended as a means to reduce system level power consumption. Systems using the processor must not rely on software usage of this mechanism to limit the processor temperature.
If bit 4 of the ACPI P_CNT Control Register (located in the processor
IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce its power consumption using modulation (starting and stopping) of the internal core clock, independent of the processor temperature. When using On-Demand mode, the duty cycle of the clock modulation is programmable using bits 3:1 of the same ACPI
P_CNT Control Register. In On-Demand mode, the duty cycle can be programmed from
12.5% on/87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be used in conjunction with the Thermal Monitor. If the system tries to enable On-
Demand mode at the same time the TCC is engaged, the factory configured duty cycle of the TCC will override the duty cycle selected by the On-Demand mode.
80 Datasheet
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Key Features
- IntelĀ® CeleronĀ® E3200 2.4 GHz
- 1 MB L2 LGA 775 (Socket T)
- Processor cores: 2 45 nm 64-bit 65 W
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Table of contents
- 9 Introduction
- 9 Terminology
- 10 Processor Terminology Definitions
- 11 References
- 13 Electrical Specifications
- 13 Power and Ground Lands
- 13 Decoupling Guidelines
- 13 VCC Decoupling
- 13 VTT Decoupling
- 14 FSB Decoupling
- 14 Voltage Identification
- 16 Reserved, Unused, and TESTHI Signals
- 16 Power Segment Identifier (PSID)
- 17 Voltage and Current Specification
- 17 Absolute Maximum and Minimum Ratings
- 18 DC Voltage and Current Specification
- 20 VCC Overshoot
- 21 Die Voltage Validation
- 21 Signaling Specifications
- 22 FSB Signal Groups
- 23 CMOS and Open Drain Signals
- 24 Processor DC Specifications
- 25 Platform Environment Control Interface (PECI) DC Specifications
- 26 GTL+ Front Side Bus Specifications
- 27 Clock Specifications
- 27 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
- 28 FSB Frequency Select Signals (BSEL[2:0])
- 29 Phase Lock Loop (PLL) and Filter
- 29 BCLK[1:0] Specifications
- 33 Package Mechanical Specifications
- 33 Package Mechanical Drawing
- 37 Processor Component Keep-Out Zones
- 37 Package Loading Specifications
- 37 Package Handling Guidelines
- 38 Package Insertion Specifications
- 38 Processor Mass Specification
- 38 Processor Materials
- 38 Processor Markings
- 39 Processor Land Coordinates
- 41 Land Listing and Signal Descriptions
- 41 Processor Land Assignments
- 64 Alphabetical Signals Reference
- 75 Thermal Specifications and Design Considerations
- 75 Processor Thermal Specifications
- 75 Thermal Specifications
- 78 Thermal Metrology
- 78 Processor Thermal Features
- 78 Thermal Monitor
- 80 On-Demand Mode
- 81 PROCHOT# Signal
- 81 THERMTRIP# Signal
- 82 Platform Environment Control Interface (PECI)
- 82 Introduction
- 82 TCONTROL and TCC activation on PECI-Based Systems
- 83 PECI Specifications
- 83 PECI Device Address
- 83 PECI Command Support
- 83 PECI Fault Handling Requirements
- 83 PECI GetTemp0() Error Code Support
- 85 Features
- 85 Power-On Configuration Options
- 85 Clock Control and Low Power States
- 86 Normal State
- 86 HALT and Extended HALT Powerdown States
- 86 HALT Powerdown State
- 87 Extended HALT Powerdown State
- 87 Stop Grant and Extended Stop Grant States
- 87 Stop-Grant State
- 88 Extended Stop Grant State
- 88 Stop Grant Snoop State, and Stop Grant Snoop State
- 88 HALT Snoop State, Stop Grant Snoop State
- 88 Extended HALT Snoop State, Extended Stop Grant Snoop State
- 88 Sleep State
- 89 Deep Sleep State
- 89 Deeper Sleep State
- 90 Technology
- 90 Processor Power Status Indicator (PSI) Signal
- 91 Boxed Processor Specifications
- 91 Introduction
- 92 Mechanical Specifications
- 92 Boxed Processor Cooling Solution Dimensions
- 93 Boxed Processor Fan Heatsink Weight
- 93 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
- 93 Electrical Requirements
- 93 Fan Heatsink Power Supply
- 95 Thermal Specifications
- 95 Boxed Processor Cooling Requirements
- 97 Variable Speed Fan
- 99 Debug Tools Specifications
- 99 Logic Analyzer Interface (LAI)
- 99 Mechanical Considerations
- 99 Electrical Considerations