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3. TECHNICAL BRIEF
3.9 Keypad Switches and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 15 switches (Normal Key 12EA, Volume up down side key, camera side key), connected in a matrix of 5 rows by 3 columns, as shown in Figure 3-11, which is connected independently. Functions, the row and column lines of the keypad are connected to ports of
AD6721. The columns are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6721 to identify the pressed key.
MAIN KEYPAD
CAMERA VOL_UP VOL_DOWN
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
R317 680
VA303
(15pF)
VA304
(50pF)
R309
100ohm
R310
100ohm
1
KEY300
VA301
R617
100ohm
VA302
R618
100ohm
2
KEY301
3
KEY302
R321 680
VA305 4
KEY303
5
KEY304
6
KEY305
R324 680
VA306
7
KEY306
8
KEY307
9
KEY308
R329 680
VA331 *
STAR
0
KEY309
#
SHARP
R333 680
VA332
UKEY_ROW0
UKEY_ROW1
UKEY_ROW2
UKEY_ROW3
UKEY_ROW4
KEY_COL0
KEY_COL1
KEY_COL2
R335
R336
R337
680
680
680
Figure 3-11. Keypad Switches and Scanning
LGE Internal Use Only - 32 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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Key Features
- Single SIM Silver
- 4.5 cm (1.77") 128 x 160 pixels
- Rear camera resolution (numeric): 1.3 MP
- Bluetooth
- FM radio
Related manuals
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Table of contents
- 4 1. INTRODUCTION
- 4 1.1 Purpose
- 4 1.2 Regulatory Information
- 6 1.3 Abbreviations
- 8 2. PERFORMANCE
- 8 2.1 H/W Features
- 9 2.2 Technical Specification
- 14 3. TECHNICAL BRIEF
- 14 3.1 Power Amplifier (SKY77318, U500)
- 16 3.2 Transceiver (AD6548, U501)
- 18 3.3 FEM for Triband(FL500)
- 19 3.4 26 26 MHz Clock (DCXO, X500)
- 25 3.6 Battery Charging Block
- 27 3.7 Display and Interface
- 29 3.8 Camera IC(AIT813G , U400)
- 31 3.9 Keypad Switches and Scanning
- 32 3.10 Microphone
- 32 3.11 Main Speaker
- 34 3.12 Headset Interface
- 35 3.13 Key Back-light Illumination
- 36 3.14 LCD Back-light Illumination
- 37 3.15 VIBRATOR
- 38 3.16 Bluetooth
- 39 3.17 Circuit Description
- 55 4. TROUBLE SHOOTING
- 55 4.1 RF Component
- 56 4.2 RX Trouble
- 61 4.3 TX Trouble
- 67 4.4 Power On Trouble
- 69 4.5 Charging Trouble
- 71 4.6 Vibrator Trouble
- 73 4.7 LCD Trouble
- 76 4.8 Camera Trouble
- 79 4.9 Speaker & Receiver Trouble
- 81 4.10 SIM Card Interface Trouble
- 83 4.11 Earphone Trouble
- 85 4.12 KEY backlight Trouble
- 87 4.13 Microphone Trouble
- 89 4.14 RTC Trouble
- 91 4.15 Slide on/off Trouble
- 93 5. DOWNLOAD
- 93 5.1 Download
- 99 6. BLOCK DIAGRAM
- 100 7. CIRCUIT DIAGRAM
- 108 8. BGA IC Pin Check
- 112 9. PCB LAYOUT
- 116 10. ENGINEERING MODE
- 117 10.1 BB Test [MENU 1]
- 119 10.2 RF Test [MENU 2]
- 119 10.3 MF mode [MENU 3]
- 120 10.4 Trace option [MENU 4]
- 120 10.5 Call timer [MENU 5]
- 120 10.6 Fact. Reset [MENU 6]
- 120 10.7 S/W version
- 121 11. STAND ALONE TEST
- 121 11.1 Introduction
- 121 11.2 Setting Method
- 122 11.3 Means of Test
- 124 12. AUTO CALIBRATION
- 124 12.1 Overview
- 124 12.2 Equipment List
- 125 12.3 Test Jig Operation
- 126 12.4 Procedure
- 129 12.5 AGC
- 129 12.6 APC
- 129 12.7 ADC
- 130 REPLACEMENT PART LIST
- 130 13.1 Exploded View
- 132 13.2 Replacement Parts
- 150 13.3 Accessory