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Intel
®
82599 10 GbE Controller—PCI-Express* (PCIe*)
• PM_Enter_L1
• PM_Enter_L23
• InitFC1-P
• InitFC1-NP
• InitFC1-Cpl
• InitFC2-P
• InitFC2-NP
• InitFC2-Cpl
• UpdateFC-P
• UpdateFC-NP
Note:
UpdateFC-Cpl is not sent because of the infinite FC-Cpl allocation.
3.1.5.3 Transmit EDB Nullifying (End Bad)
If retrain is necessary, there is a need to guarantee that no abrupt termination of the Tx packet happens. For this reason, early termination of the transmitted packet is possible.
This is done by appending the EDB to the packet.
3.1.6 Physical Layer
3.1.6.1 Link Speed
The 82599 supports PCIe V2.0 (2.5GT/s or 5GT/s). The following configuration controls link speed:
• PCIe
Supported Link Speeds
bit — Indicates the link speeds supported by the 82599.
Loaded from the PCIe
Link Speed
field in the EEPROM.
EEPROM Word Offset
(Starting at Odd
Word)
Allow PCIe
V2.0(Default)
2*N+1 0x094
2*N+2 0x0000
Force PCIe
V2.0 Setting
0x0100
Description
MORIA6 register offset (lower word).
Disabling PCIe V2.0 is controlled by setting bit[8] in this register.
When the bit is set the 82599 does not advertise PCIe V2.0 linkspeed support.
• PCIe
Current Link Speed
bit — Indicates the negotiated Link speed.
• PCIe
Target Link Speed
bit — used to set the target compliance mode speed when software is using the
Enter Compliance
bit to force a link into compliance mode. The default value is the highest link speed supported defined by the previous
Supported
Link Speeds
.
76 331520-004
PCI-Express* (PCIe*)—Intel
®
82599 10 GbE Controller
The 82599 does not initiate a hardware autonomous speed change.
The 82599 supports entering compliance mode at the speed indicated in the
Target Link
Speed
field in the PCIe Link Control 2 register. Compliance mode functionality is controlled via the PCIe Link Control 2 register.
3.1.6.2 Link Width
• The 82599 supports a maximum link width of x8, x4, x2, or x1 as determined by the
PCIe Analog Configuration Module in the EEPROM and can be set as follows. Note that these settings might not be needed during normal operation:
EEPROM Word Offset
(Starting at Odd
Word)
Enable x8
Setting
(Default)
Limit to x4
Setting
Limit to x2
Setting
Limit to x1
Setting
2*N+1 0x094
Description
MORIA6 register offset (lower word).
2*N+2 0x0000 0x00F0 0x00FC 0x00FE Lanes can be disabled by setting bits[7:0] in this offset. Having bit[X] set causes laneX to be disabled, resulting in narrower link widths (bits per lane).
The maximum link width is loaded into the
Max Link Width
field of the PCIe Capability register (LCAP[11:6]). Hardware default is the x8 link.
During link configuration, the platform and the 82599 negotiate on a common link width.
The link width must be one of the supported PCIe link widths (x1, 2x, x4, x8), such that:
• If Maximum Link Width = x8, then the 82599 negotiates to either x8, x4, x2 or x1
1
• If Maximum Link Width = x4, then the 82599 negotiates to either x4 or x1
• If Maximum Link Width = x1, then the 82599 only negotiates to x1
The 82599 does not initiate a hardware autonomous link width change.
Note:
Some PCIe x8 slots are actually configured as x4 slots. These slots have insufficient bandwidth for full 10 GbE line rate with dual port 10 GbE devices. If a solution suffers bandwidth issues when both 10 GbE ports are active, it is recommended to verify that the PCIe slot is indeed a true PCIe x8.
3.1.6.3 Polarity Inversion
If polarity inversion is detected, the receiver must invert the received data.
During the training sequence, the receiver looks at symbols 6-15 of TS1 and TS2 as the indicators of lane polarity inversion (D+ and D- are swapped). If lane polarity inversion occurs, the TS1 symbols 6-15 received are D21.5 as opposed to the expected D10.2.
Similarly, if lane polarity inversion occurs, symbols 6-15 of the TS2 ordered set are D26.5 as opposed to the expected 5 D5.2. This provides the clear indication of lane polarity inversion.
1. See restriction in
.
331520-004 77
Intel
®
82599 10 GbE Controller—PCI-Express* (PCIe*)
3.1.6.4 L0s Exit Latency
The number of FTS sequences (N_FTS) sent during L0s exit is loaded from the EEPROM into an 8-bit read-only register.
3.1.6.5 Lane-to-Lane De-Skew
A multi-lane link can have many sources of lane-to-lane skew. Although symbols are transmitted simultaneously on all lanes, they cannot be expected to arrive at the receiver without lane-to-lane skew. The lane-to-lane skew can include components, which are less than one bit time, bit time units (400/200 ps for 2.5/5 Gb), or full symbol time units (4/2 ns). This type of skew is caused by the retiming repeaters' insert/delete operations.
Receivers use TS1 or TS2 or Skip Ordered Sets (SOS) to perform link de-skew functions.
The 82599 supports de-skew of up to 12 symbols time [48 ns for PCIe v2.0 (2.5GT/s) and 24 ns for PCIe V2.0 (5GT/s)].
3.1.6.6 Lane Reversal
Auto lane reversal is supported by the 82599 at its hardware default setting. The following lane reversal modes are supported:
• Lane configurations x8, x4, x2, and x1
• Lane reversal in x8 and in x4
• Degraded mode (downshift) from x8 to x4 to x2 to x1 and from x4 to x1, with one restriction — if lane reversal is executed in x8, then downshift is only to x1 and not to x4.
Figure 3-2 through Figure 3-5 shows the lane downshift in both regular and reversal connections as well as lane connectivity from a system level perspective.
Root
Complex
Root
Complex
Root
Complex
Downgrade to x4
Ethernet
Controller
Ethernet
Controller
Figure 3-2 Lane Downshift in an x8 Configuration
Downgrade to x1
Ethernet
Controller
78 331520-004
PCI-Express* (PCIe*)—Intel
®
82599 10 GbE Controller
Root
Complex
Root
Complex
Downgrade to x1
Ethernet
Controller
Ethernet
Controller
Figure 3-3 Lane Downshift in a Reversal x8 Configuration
Downgrade to x1
Ethernet Controller
Figure 3-4 Lane Downshift in a x4 Configuration
Ethernet Controller
Downgrade to x1
Ethernet Controller Ethernet Controller
Figure 3-5 Lane Downshift in an x4 Reversal Configuration
331520-004 79
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Table of contents
- 21 Scope
- 21 Product Overview
- 22 82599 Silicon/Software Features
- 23 System Configurations
- 24 External Interfaces
- 24 PCI-Express* (PCIe*) Interface
- 24 Network Interfaces
- 25 EEPROM Interface
- 26 Serial Flash Interface
- 26 SMBus Interface
- 26 NC-SI Interface
- 26 MDIO Interfaces
- 27 I2C Interfaces
- 27 Software-Definable Pins (SDP) Interface (General-Purpose I/O)
- 28 LED Interface
- 28 Features Summary
- 33 Overview of New Capabilities Beyond the
- 33 Security
- 33 Transmit Rate Limiting
- 33 Fibre Channel over Ethernet (FCoE)
- 34 Performance
- 35 Rx/Tx Queues and Rx Filtering
- 35 Interrupts
- 35 Virtualization
- 36 Double VLAN
- 37 Time Sync — IEEE 1588 — Precision Time Protocol (PTP)
- 37 Conventions
- 37 Terminology and Acronyms
- 37 Byte Count
- 37 Byte Ordering
- 38 Register/Bit Notations
- 38 References
- 41 Architecture and Basic Operation
- 41 Transmit (Tx) Data Flow
- 42 Receive (Rx) Data Flow
- 43 Pin Assignment
- 43 Signal Type Definition
- 44 PCIe Symbols and Pin Names
- 47 EEPROM
- 47 Serial Flash
- 48 SMBus
- 49 NC-SI
- 50 Software Defined Pins (SDPs)
- 51 RSVD and No Connect Pins
- 53 Miscellaneous
- 54 Power Supplies
- 55 Pull-Ups
- 58 Ball Out — Top Level
- 61 PCI-Express* (PCIe*)
- 61 Overview
- 64 General Functionality
- 64 Host Interface
- 68 Transaction Layer
- 75 Link Layer
- 76 Physical Layer
- 80 Error Events and Error Reporting
- 86 Performance Monitoring
- 87 SMBus
- 87 Channel Behavior
- 87 SMBus Addressing
- 88 SMBus Notification Methods
- 90 Receive TCO Flow
- 91 Transmit TCO Flow
- 93 Concurrent SMBus Transactions
- 93 SMBus ARP Functionality
- 97 LAN Fail-Over Through SMBus
- 97 Network Controller — Sideband Interface (NC-SI)
- 97 Electrical Characteristics
- 98 NC-SI Transactions
- 98 EEPROM
- 98 General Overview
- 98 EEPROM Device
- 98 EEPROM Vital Content
- 99 Software Accesses
- 99 Signature Field
- 100 Protected EEPROM Space
- 101 EEPROM Recovery
- 102 EEPROM Deadlock Avoidance
- 103 VPD Support
- 104 Flash
- 104 Flash Interface Operation
- 105 Flash Write Control
- 105 Flash Erase Control
- 105 Flash Access Contention
- 106 Configurable I/O Pins — Software-Definable Pins (SDP)
- 109 Network Interface (MAUI Interface)
- 110 10 GbE Interface
- 121 GbE Interface
- 123 SGMII Support
- 125 Auto Negotiation For Backplane Ethernet and Link Setup Features
- 129 Transceiver Module Support
- 130 Management Data Input/Output (MDIO) Interface
- 136 Ethernet Flow Control (FC)
- 146 Inter Packet Gap (IPG) Control and Pacing
- 147 MAC Speed Change at Different Power Modes
- 151 Power Up
- 151 Power-Up Sequence
- 152 Power-Up Timing Diagram
- 155 Reset Operation
- 155 Reset Sources
- 158 Reset in PCI-IOV Environment
- 159 Reset Effects
- 162 Queue Disable
- 163 Function Disable
- 163 General
- 163 Overview
- 165 Control Options
- 165 Event Flow for Enable/Disable Functions
- 166 Device Disable
- 166 Overview
- 167 BIOS Disable of the Device at Boot Time by Using the Strapping Option
- 167 Software Initialization and Diagnostics
- 167 Introduction
- 167 Power-Up State
- 168 Initialization Sequence
- 169 100 Mb/s, 1 GbE, and 10 GbE Link Initialization
- 170 Initialization of Statistics
- 170 Interrupt Initialization
- 171 Receive Initialization
- 175 Transmit Initialization
- 176 FCoE Initialization Flow
- 177 Virtualization Initialization Flow
- 180 DCB Configuration
- 191 Security Initialization
- 193 Alternate MAC Address Support
- 195 Power Targets and Power Delivery
- 195 Power Management
- 195 Introduction to the 82599 Power States
- 196 Auxiliary Power Usage
- 196 Power Limits by Certain Form Factors
- 197 Interconnects Power Management
- 199 Power States
- 204 Timing of Power-State Transitions
- 208 Wake Up
- 208 Advanced Power Management Wake Up
- 208 ACPI Power Management Wake Up
- 209 Wake-Up Packets
- 215 Wake Up and Virtualization
- 217 EEPROM General Map
- 219 EEPROM Software
- 219 SW Compatibility Module — Word Address 0x10-0x
- 219 PBA Number Module — Word Address 0x15-0x
- 220 iSCSI Boot Configuration — Word Address 0x
- 223 Software Reserved Word — PXE VLAN Configuration Pointer — Word Address 0x
- 224 VPD Module Pointer — Word Address 0x2F
- 224 EEPROM PXE Module — Word Address 0x30-0x
- 227 Alternate Ethernet MAC Address — Word Address 0x
- 227 Checksum Word Calculation (Word 0x3F)
- 229 Word Address 0x
- 229 Software Reserved Word 16 — Alternate SAN MAC Block Pointer — Word Address 0x
- 230 Software Reserved Word 17 — Active SAN MAC Block Pointer — Word Address 0x
- 231 EEPROM Hardware Sections
- 231 EEPROM Hardware Section — Auto-Load Sequence
- 231 EEPROM Init Module
- 233 PCIe Analog Configuration Module
- 234 Core 0/1 Analog Configuration Modules
- 235 PCIe General Configuration Module
- 244 PCIe Configuration Space 0/1 Modules
- 246 LAN Core 0/1 Modules
- 249 MAC 0/1 Modules
- 255 CSR 0/1 Auto Configuration Modules
- 257 Firmware Module
- 257 Test Configuration Module
- 258 Common Firmware Parameters — (Global MNG Offset 0x3)
- 259 Pass Through LAN 0/1 Configuration Modules
- 268 Sideband Configuration Module
- 270 Flexible TCO Filter Configuration Module
- 272 NC-SI Microcode Download Module
- 272 NC-SI Configuration Module
- 277 Receive Functionality
- 278 Packet Filtering
- 282 Rx Queues Assignment
- 310 MAC Layer Offloads
- 310 Receive Data Storage in System Memory
- 310 Legacy Receive Descriptor Format
- 313 Advanced Receive Descriptors
- 323 Receive Descriptor Fetching
- 323 Receive Descriptor Write-Back
- 324 Receive Descriptor Queue Structure
- 327 Header Splitting
- 330 Receive Checksum Offloading
- 333 SCTP Receive Offload
- 334 Receive UDP Fragmentation Checksum
- 335 Transmit Functionality
- 335 Packet Transmission
- 344 Transmit Contexts
- 345 Transmit Descriptors
- 361 TCP and UDP Segmentation
- 369 Transmit Checksum Offloading in Non-segmentation Mode
- 373 Interrupts
- 373 Interrupt Registers
- 377 Interrupt Moderation
- 381 TCP Timer Interrupt
- 381 Mapping of Interrupt Causes
- 388 802.1q VLAN Support
- 388 802.1q VLAN Packet Format
- 388 802.1q Tagged Frames
- 389 Transmitting and Receiving 802.1q Packets
- 390 802.1q VLAN Packet Filtering
- 390 Double VLAN and Single VLAN Support
- 394 Direct Cache Access (DCA)
- 395 PCIe TLP Format for DCA
- 397 Data Center Bridging (DCB)
- 397 Overview
- 400 Transmit-side Capabilities
- 413 Receive-Side Capabilities
- 417 LinkSec
- 418 Packet Format
- 418 LinkSec Header (SecTag) Format
- 420 LinkSec Management – KaY (Key Agreement Entity)
- 421 Receive Flow
- 424 Transmit Data Path
- 425 LinkSec and Manageability
- 425 Key and Tamper Protection
- 426 LinkSec Statistics
- 428 Time SYNC (IEEE1588 and 802.1AS)
- 428 Overview
- 428 Flow and Hardware/Software Responsibilities
- 430 Hardware Time Sync Elements
- 433 Time Sync Related Auxiliary Elements
- 434 PTP Packet Structure
- 437 7.10 Virtualization
- 437 Overview
- 441 PCI-SIG SR-IOV Support
- 452 Packet Switching
- 463 Virtualization of Hardware
- 464 7.11 Receive Side Coalescing (RSC)
- 466 Packet Viability for RSC Functionality
- 468 Flow Identification and RSC Context Matching
- 470 Processing New RSC
- 470 Processing Active RSC
- 472 Packet DMA and Descriptor Write Back
- 474 RSC Completion and Aging
- 476 7.12 IPsec Support
- 476 Overview
- 476 Hardware Features List
- 479 Software/Hardware Demarcation
- 480 IPsec Formats Exchanged Between Hardware and Software
- 484 TX SA Table
- 485 TX Hardware Flow
- 487 AES-128 Operation in Tx
- 489 RX Descriptors
- 489 Rx SA Tables
- 492 RX Hardware Flow without TCP/UDP Checksum Offload
- 493 RX Hardware Flow with TCP/UDP Checksum Offload
- 493 AES-128 Operation in Rx
- 495 7.13 Fibre Channel over Ethernet (FCoE)
- 495 Introduction
- 496 FCoE Transmit Operation
- 502 FCoE Receive Operation
- 518 7.14 Reliability
- 518 Memory Integrity Protection
- 518 PCIe Error Handling
- 519 Address Regions
- 519 Memory-Mapped Access
- 520 I/O-Mapped Access
- 522 Registers Terminology
- 523 Device Registers — PF
- 523 MSI-X BAR Register Summary PF
- 523 Registers Summary PF — BAR
- 543 Detailed Register Descriptions — PF
- 734 Device Registers — VF
- 734 Registers Allocated Per Queue
- 734 Non-Queue Registers
- 735 MSI—X Register Summary VF — BAR
- 737 Registers Summary VF — BAR
- 739 Detailed Register Descriptions —VF
- 749 PCI Compatibility
- 750 Configuration Sharing Among PCI Functions
- 752 PCIe Register Map
- 752 Register Attributes
- 752 PCIe Configuration Space Summary
- 754 Mandatory PCI Configuration Registers — Except BARs
- 757 Subsystem ID Register (0x2E; RO)
- 757 Cap_Ptr Register (0x34; RO)
- 758 Mandatory PCI Configuration Registers — BARs
- 759 PCIe Capabilities
- 765 MSI-X Capability
- 770 VPD Registers
- 771 PCIe Configuration Registers
- 782 PCIe Extended Configuration Space
- 783 Advanced Error Reporting Capability (AER)
- 788 Serial Number
- 790 Alternate Routing ID Interpretation (ARI) Capability Structure
- 791 IOV Capability Structure
- 798 Virtual Functions Configuration Space
- 800 Mandatory Configuration Space
- 802 PCI Capabilities
- 805 10.1 Platform Configurations
- 805 On-Board BMC Configurations
- 806 82599 NIC
- 806 10.2 Pass Through (PT) Functionality
- 807 DMTF NC-SI Mode
- 809 SMBus Pass Through (PT) Functionality
- 813 10.3 Manageability Receive Filtering
- 813 Overview and General Structure
- 815 L2 EtherType Filters
- 815 VLAN Filters - Single and Double VLAN Cases
- 816 L3 and L4 Filters
- 818 Manageability Decision Filters
- 820 Possible Configurations
- 822 10.4 LinkSec and Manageability
- 823 Handover of LinkSec Responsibility Between BMC and Host
- 825 10.5 Manageability Programming Interfaces
- 825 NC-SI Programming
- 874 SMBus Programming
- 911 Manageability Host Interface
- 915 Software and Firmware Synchronization
- 919 11.1 Introduction
- 919 11.2 Operating Conditions
- 919 Absolute Maximum Ratings
- 920 Recommended Operating Conditions
- 920 11.3 Power Delivery
- 920 Power Supply Specifications
- 922 In-Rush Current
- 922 11.4 DC/AC Specification
- 922 DC Specifications
- 927 Digital I/F AC Specifications
- 938 PCIe Interface AC/DC Specification
- 938 Network (MAUI) Interface AC/DC Specification
- 940 SerDes Crystal/Reference Clock Specification
- 946 11.5 Package
- 946 Mechanical
- 946 Thermal
- 946 Electrical
- 947 Mechanical Package
- 947 11.6 Devices Supported
- 947 Flash
- 948 EEPROM
- 949 12.1 Connecting the PCIe Interface
- 949 Link Width Configuration
- 950 Polarity Inversion and Lane Reversal
- 950 PCIe Reference Clock
- 950 PCIe Analog Bias Resistor
- 950 Miscellaneous PCIe Signals
- 950 PCIe Layout Recommendations
- 951 12.2 Connecting the MAUI Interfaces
- 951 MAUI Channels Lane Connections
- 951 MAUI Bias Resistor
- 951 XAUI, KX/KR, BX4, CX4, BX and SFI+ Layout Recommendations
- 952 Board Stack-Up Example
- 952 Trace Geometries
- 953 Other High-Speed Signal Routing Practices
- 956 Reference Planes
- 958 Dielectric Weave Compensation
- 959 Impedance Discontinuities
- 959 Reducing Circuit Inductance
- 960 Signal Isolation
- 960 Power and Ground Planes
- 966 KR and SFI+ Recommended Simulations
- 967 Additional Differential Trace Layout Guidelines for SFI+ Boards
- 969 12.3 Connecting the Serial EEPROM
- 969 Supported EEPROM Devices
- 969 12.4 Connecting the Flash
- 970 Supported Flash Devices
- 970 12.5 SMBus and NC-SI
- 972 12.6 NC-SI
- 972 NC-SI Design Requirements
- 974 NC-SI Layout Requirements
- 978 12.7 Resets
- 979 12.8 Connecting the MDIO Interfaces
- 979 12.9 Connecting the Software-Definable Pins (SDPs)
- 980 12.10 Connecting the Light Emitting Diodes (LEDs)
- 980 12.11 Connecting Miscellaneous Signals
- 980 LAN Disable
- 981 BIOS Handling of Device Disable
- 982 12.12 Oscillator Design Considerations
- 982 Oscillator Types
- 983 Oscillator Solution
- 983 Oscillator Layout Recommendations
- 983 Reference Clock Measurement Recommendations
- 983 12.13 Power Supplies
- 984 Power Supply Sequencing
- 984 Power Supply Filtering
- 985 Support for Power Management and Wake Up
- 985 12.14 Connecting the JTAG Port
- 987 13.1 Thermal Considerations
- 988 13.2 Importance of Thermal Management
- 988 13.3 Packaging Terminology
- 989 13.4 Thermal Specifications
- 990 13.5 Case Temperature
- 990 13.6 Thermal Attributes
- 990 Designing for Thermal Performance
- 990 Model System Definition
- 991 Package Thermal Characteristics
- 992 13.7 Thermal Enhancements
- 992 13.8 Clearances
- 994 13.9 Default Enhanced Thermal Solution
- 995 13.10 Extruded Heatsinks
- 996 13.11 Attaching the Extruded Heatsink
- 996 Clips
- 996 Thermal Interface (PCM45 Series)
- 996 Avoid Damaging Die-Side Capacitors with Heat Sink Attached
- 997 Maximum Static Normal Load
- 998 13.12 Reliability
- 998 Thermal Interface Management for Heat-Sink Solutions
- 999 13.13 Measurements for Thermal Specifications
- 999 Case Temperature Measurements
- 1000 Attaching the Thermocouple (No Heatsink)
- 1000 Attaching the Thermocouple (Heatsink)
- 1001 13.14 Heatsink and Attach Suppliers
- 1002 13.15 PCB Guidelines
- 1003 14.1 Link Loopback Operations
- 1016 15.1 Register Attributes
- 1017 Legacy Packet Formats
- 1017 ARP Packet Formats
- 1019 IP and TCP/UDP Headers for TSO
- 1025 Magic Packet
- 1025 SNAP Packet Format
- 1025 Packet Types for Packet Split Filtering
- 1026 Type 1.1: Ethernet (VLAN/SNAP) IP Packets
- 1034 Type 2: Ethernet, Ipv
- 1037 Type 3: Reserved
- 1037 Type 4: NFS Packets
- 1042 IPsec Formats Run Over the Wire
- 1042 AH Formats
- 1046 ESP Formats
- 1051 BCN Frame Format
- 1052 FCoE Framing
- 1052 FCoE Frame Format
- 1055 FC Frame Format
- 1063 Background
- 1064 Location in the NVM
- 1063 375 mA
- 1063 20 mA
- 1063 375 mA
- 1063 20 mA
- 1064 Section