Intel

®

82599 10 GbE Controller—DC/AC Specification

A ux pow e r sta ble

V C C 3P 3 (3.3 V )

V C C 1P 2 (1.2 V )

LA N _P W R _ G O O D

M a in p ow er stab le

P E _ R S T _ N

M A IN _ P W R _ O K

T

3 _1

T lp g

M ain P ow e r sta ble

Figure 11-1 Power and Reset Sequencing

T m -per

Tm -ppo

T lp g-per

T per-m

T ppo-m

T lpg w

11.3.2 In-Rush Current

Note:

NICs should limit in-rush current to under 3A from 3.3V power supply and

2.1A from 12V power supply

11.4 DC/AC Specification

11.4.1 DC Specifications

Table 11-6 Power Summary for Dual Port Devices (82599ES, 82599EB)

Interface

Typical [W]

TTT, 60 °C, Vnom, 512 B

Security On

1

Maximum [W]

FFF, 125 °C, Vnom, 512 B

Security On

1

SP

2

DP

3

SP DP

KX 2.3

2.7

3.1

3.5

XAUI/KX4 3.3

4.5

4.0

5.2

SFI Optics

SFI Twinax

3.4

3.6

4.7

5.2

4.2

4.5

5.6

6.2

KR (IEEE) 3.3

4.5

4.1

5.4

1. The security engine in 10 GbE mode contributes 200 mW maximum power (180 mW typical power).

2. SP = Single port.

3. DP = Dual port.

922 331520-004

DC/AC Specification—Intel

®

82599 10 GbE Controller

Table 11-7 Power Summary for Single Port Device (82599EN)

Interface

Typical [W]

TTT, 60 °C, Vnom, 512 B

Security On

1

SP

2

Maximum [W]

FFF, 125 °C, Vnom, 512 B

Security On

1

SP

SFI Optics 3.4

4.2

SFI Twinax 3.6

4.5

1. The security engine in 10 GbE mode contributes 200 mW maximum power (180 mW typical power).

2. SP = Single port.

11.4.1.1 Current Consumption

The 82599 priorities for power reduction are as follows (in descending order):

• TDP: D0 active @ 10 GbE maximum load, fast silicon

• D0 idle: 10 GbE/1 GbE link and no activity

• D0 idle: 10 GbE/1 GbE link with one port disabled

• System sleep: D3cold with wake (link at 10 GbE or 1 GbE)

• System Sleep: D3cold without wake and without manageability

• Other states

The following tables list the targets for device power. The numbers listed apply to device current and power and do not include power losses on external components.

Table 11-8 D0a — Active Link - Both Ports Active; L0s and L1 Disabled

Parameter

3.3v Idd [mA]

1.2v Idd [mA]

1000 Mb/s

10 GbE (KX4,

CX4, XAUI)

10 GbE KR IEEE SFI Optics 10 GbE Twinax

Typ Max Typ Max Typ Max Typ Max Typ Max

42 42 42 42 62 64 126 126 126 126

2170 2810 3660 4380 3570 4330 3590 4350 4010 4790

Power [mW]

2700 3500 4500 5400 4500 5400 4700 5600 5200 6200

Notes:

1.

Typical conditions: typical material TJ = 60 °C, nominal voltages and continuous network traffic at link speed.

2.

Maximum conditions: fast material maximum operating temperature (TJ) values, typical voltage values and continuous network traffic at link speed.

3.

Maximum power at 110 

C is expected to be ~0.5 W less than the power at 123 

C

(max TJ).

4.

Power numbers are measured with security offload on. Disabling it reduces ~200 mW (max) and 180 mW (Typical).

331520-004 923

Intel

®

82599 10 GbE Controller—DC/AC Specification

Table 11-9 D0a — Active Link - Single Port Active; L0s and L1 Disabled

Parameter

3.3v Idd [mA]

1.2v Idd [mA]

1000 Mb/s

10 GbE (KX4,

CX4, XAUI)

10 GbE KR IEEE SFI Optics 10 GbE Twinax

Typ Max Typ Max Typ Max Typ Max Typ Max

42 42 42 42 53 53 84 84 84 84

1830 2460 2600 3240 2560 3260 2570 3270 2780 3490

Power [mW]

2300 3100 3300 4000 3300 4100 3400 4200 3600 4500

Notes:

1.

Typical conditions: typical material TJ = 60 °C, nominal voltages and continuous network traffic at link speed.

2.

Maximum conditions: fast material maximum operating temperature (TJ) values, typical voltage values and continuous network traffic at link speed.

3.

Maximum power at 110 

C is expected to be ~0.5 W less than the power at 123 

C

(max TJ).

4.

Power numbers are measured with security offload on. Disabling it reduces ~200 mW (max) and 180 mW (Typical).

Table 11-10 D0a — Idle Link - Both Ports Active, L0s and L1 Disabled, No Rx/Tx Traffic

Parameter

3.3v Idd [mA]

1.2v Idd [mA]

1000 Mb/s

10 GbE (KX4,

CX4, XAUI)

10 GbE KR IEEE SFI Optics 10 GbE Twinax

Typ Max Typ Max Typ Max Typ Max Typ Max

42 42 42 42 62 64 126 126 126 126

2110 2740 3070 3740 2930 3655 2950 3675 3770 4120

Power [mW]

2700 3400 3800 4600 3700 4600 4000 4800 4500 5400

Notes:

1.

Typical conditions: typical material TJ = 60 °C, nominal voltages and no network traffic.

2.

Maximum conditions: fast material maximum operating temperature (TJ) values, nominal voltages and no network traffic.

Table 11-11 Typical D3cold Wake Up Enable - One Port With Wakeup Enabled; Second Port

With Wakeup Disabled

Parameter

3.3v Idd [mA]

1.2v Idd [mA]

1000 Mb/s

Typ

31.5

1010.1

Max

31.5

1010.1

Power [mW]

1316.1

1316.1

Notes:

1.

In this measurement one port is set to D3 wake-up enabled and one port at D3 no wake up.

2.

Typical conditions: typical material TJ = 25, nominal voltages and no network traffic.

3.

TJ = 25, nominal voltages and no network traffic.

10 GbE (KX4, XAUI, CX4)

Typ Max

26.8

1291.5

1638.2

31.5

1396.5

1779.8

924 331520-004

DC/AC Specification—Intel

®

82599 10 GbE Controller

Table 11-12 Power Down

Parameter

3.3v Idd [mA]

1.2v Idd [mA]

IDDq (Tj = 123 °C) IDDq (Tj = 25 °C) D3cold No Wake Up

Typ Max Typ Max Typ Max

2

230

2

670

2

60

2

100

15.8

720.3

15.8

805.4

125 916.3

1018.4

Power [mW]

280 810 75

Notes:

1.

Typical conditions: typical material, nominal voltages and no network traffic.

2.

Maximum conditions: fast material, nominal voltages and no network traffic.

11.4.1.2 Digital I/O DC Specifications

Table 11-13 Digital Functional 3.3V I/O DC Electrical Characteristics

Symbol

VOH

VIL

Iil

PU

VOL

VOH led

VOL led

VIH

Parameter

Output High Voltage

Output Low Voltage

LED Output High Voltage

LED Output Low Voltage

Input High Voltage

Input Low Voltage

Input Current

Internal pull-up

Conditions

IOH = -8mA; VCC3P3 = Min

IOL = 8mA; VCC3P3=Min

IOL = 12mA; VCC3P3 = Min

IOL = 12mA; VCC3P3 = Min

VCC3P3 = Max; VIn = 3.6V/GND

Min

2.4

2.4

2.0

-0.3

Max

0.4

0.4

VCC3P3 + 0.3

0.8

15

34

Units

V

V

V

V

V

V



A

K 

Note

27

Cin Pin capacitance 7 pF [2]

Notes:

1.

Table 11-13 applies to PE_RST_N, LED0[3:0], LED1[3:0], LAN_PWR_GOOD, MAIN_PWR_OK, JTCK, JTDI, JTDO, JTMS,

SDP0[7:0], SDP1[7:0], FLSH_SI, FLSH_SO, FLSH_SCK, FLSH_CE_N, EE_DI, EE_DO, EE_SK, EE_CS_N, MDIO0, MDC1 and

MDIO1, LAN0_DIS_N, LAN1_DIS_N, AUX_PWR, OSC_SEL.

2.

Characterized not tested.

331520-004 925

Intel

®

82599 10 GbE Controller—DC/AC Specification

11.4.1.3 Open Drain I/O DC Specification

Table 11-14 Open Drain I/O DC Characteristics

Symbol

Vih

Vil

Ileakage

Vol

Parameter

Input High Voltage

Condition

Input Low Voltage

Output Leakage Current 0  Vin  VCC3P3 max

Output Low Voltage @ Ipullup = 4 mA

Min

VCC3P3 * 0.7

-0.3

-10

Max

VCC3P3 + 0.5

VCC3P3 * 0.3

10

0.4

Units

V

V

 A

V

Note

[2]

[5]

Ipullup

Cin

Current Sink

Input Pin Capacitance

Vol = 0.4V

4

7 mA pF

[4]

[3]

Ioffsmb Input leakage Current VCC3P3 off or floating -10 10  A [2]

Notes:

1.

Table 11-14 applies to SMBD, SMBCLK, SMBALRT _N, PE_WAKE_N, SCL0, SDA0, SCL1 and SDA1.

2.

Device must meet this specification whether powered or unpowered.

3.

Characterized, not tested.

4.

The IPULLUP max specification is determined primarily by the need to operate at a certain frequency with a certain capacitive load.

5.

OD no high output drive. VOL max=0.4V at 8mA, VOL max=0.2V at 0.1mA.

The buffer specification meets the SMBus specification requirements defined at: www.smbus.org

.

11.4.1.4 NC-SI I/O DC Specification

Table 11-15 NC-SI I/O DC Characteristics

Parameter

Bus High Reference

Signal Voltage Range

Input Low Voltage

Symbol

Vref

[1]

Vabs

Vil

Conditions

Input High Voltage

Output Low Voltage

Vih

Vol

Output High Voltage

Input High Current

Input Low Current

Voh

Iih

Iil

Iol = 4mA,

Vref= Vref min

Iol = -4mA,

Vref= Vref min

Vin = 3.6V,

Vref = 3.6V

Vin = 0V,

Vref min

to Vref max

Min.

3.0

-0.300

2.0

0

2.4

0

-20

Typ.

3.3

Max

3.46

3.765

0.8

0.4

Vref

200

0

V

 A

 A

Units

V

V

V

V

V

926 331520-004