8 Packaging. Infineon CY8C4045LQI-S412, CY8C4045LQI-S413, CY8C4025AZI-S413T, CY8C4024LQI-S412, CY8C4025AZQ-S403, CY8C4024LQI-S403T, CY8C4025LQI-S412, CY8C4025LQI-S402T, CY8C4045LQI-S411, CY8C4024AXI-S412

PSoC™ 4 MCU: PSoC™ 4000S

Based on Arm® Cortex®-M0+ CPU

Packaging

8 Packaging

The PSoC™ 4000S is offered in 48-pin TQFP, 40-pin QFN, 32-pin QFN, 24-pin QFN, 32-pin TQFP, and 25-ball WLCSP packages.

Package dimensions and Infineon drawing numbers are in the following table.

Table 37

Spec ID

BID20

BID27

BID34A

BID34

BID34G

BID34F

Package list

Package

48-pin TQFP

40-pin QFN

32-pin QFN

24-pin QFN

32-pin TQFP

25-ball WLCSP

Description

7 × 7 × 1.4 mm height with 0.5-mm pitch

6 × 6 × 0.6 mm height with 0.5-mm pitch

5 × 5 × 0.6 mm height with 0.5-mm pitch

4 × 4 × 0.6 mm height with 0.5-mm pitch

7 × 7 × 1.4 mm height with 0.8-mm pitch

2.02 × 1.93 × 0.48 mm height with 0.35-mm pitch

Package drawing

51-85135

001-80659

001-42168

001-13937

51-85088

002-09957

T

JC

T

JA

T

JC

Table 38

Parameter

T

A

T

J

T

JA

T

JC

T

JA

T

JC

T

JA

T

JC

T

JA

T

JC

T

JA

Package thermal characteristics

Description

Operating ambient temperature –

Operating junction temperature –

Package θ

JA

Package θ

JC

Package θ

JA

Package θ

JC

Package θ

JA

Package θ

JC

Package θ

JA

Package

48-pin TQFP

40-pin QFN

32-pin QFN

Package θ

JC

Package θ

JA

24-pin QFN

32-pin TQFP Package θ

JC

Package θ

JA

Package θ

JC

25-ball WLCSP

Table 39 Solder reflow peak temperature

Package Maximum peak temperature

All 260 °C

Min

–40

–40

–

–

–

–

–

–

Typ

25

–

73.5

33.5

17.8

2.8

20.8

5.9

21.7

5.6

29.4

3.5

40

0.5

–

–

–

–

–

–

–

–

Max Units

105 °C

125

–

–

°C

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

– °C/W

– °C/W

°C/W

°C/W

°C/W

°C/W

Maximum time at peak temperature

30 seconds

Datasheet 43 002-00123 Rev. *O

2022-07-28