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Figure 31-2: Boot from Flash Flow
31.4
Interrupts
Interrupts generated by S3 sub-system events can be routed to an Applications Processor (AP), or to the M4 in a standalone design. When routed to M4 - All interrupts to M4 will be connected to ME's NVIC. There are 2 levels of interrupt masking and clearing. One will be at the source of interrupts, and the other at the top-level interrupt controller. When routed to AP - The interrupt mechanism for the AP is the same as M4’s but it has a different mask. All interrupt sources are combined to single combined interrupt before being sent to the AP.
EOS S3 TRM (r1.01a) Confidential Page 292
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Table of contents
- 17 Introduction
- 17 EOS S3 SENSOR PROCESSING PLATFORM KEY FEATURES
- 17 Features List
- 22 THE S3 HIGH-LEVEL ARCHITECTURE
- 23 S3 block diagram with main sub-systems
- 24 The top-level internal system elements and peripherals in the S
- 24 List in alphabetical order
- 25 List by functional groups
- 27 Accessing elements and peripherals
- 27 Key blocks in the main sub-systems
- 27 Cortex-M4-F main modules
- 27 Voice / audio processor main modules
- 27 Sensor processor main modules
- 28 FPGA main modules
- 28 Communication Manager Modules
- 28 Buses in the S3: AHB, secondary buses, and bridges
- 29 Memory concepts in the S3 architecture
- 29 SRAM banks and their usage scenarios
- 29 Packet FIFOs
- 29 SRAM in the FPGA
- 29 Memory power domains and sleep modes
- 29 Support for designs with an Applications Processor
- 30 Support for standalone designs (Host Mode operation)
- 31 ARM Cortex-M4F Sub-System & Core IO
- 31 ARM CORTEX-M4F SUB-SYSTEM
- 31 Description
- 32 ARM Cortex-M4-F IP Configuration
- 33 ARM Cortex-M4-F Processor
- 33 Cortex-M4-F Processor Block Diagram
- 34 Cortex-M4-F Core Peripherals
- 34 Peripheral ID, Component ID, Designer ID, and Part and Revision Number
- 36 CPUID register
- 37 Buses
- 37 M4 AHB
- 37 AHB2APB bus bridges
- 38 Memory
- 38 Memory Map
- 41 Memory Address Decoding
- 44 M4 SRAM
- 45 SRAM Configuration
- 46 Registers
- 50 Memory Protection Unit (MPU)
- 51 MPU Registers
- 52 Nested Vectored Interrupt Controller (NVIC)
- 53 List of interrupts
- 53 NVIC Registers
- 54 Timers
- 54 M4 Timer
- 55 M4 Timer Registers
- 55 SysTick Timer
- 55 SysTick Register
- 56 Watchdog Timer (WDT)
- 56 WDT Registers
- 58 SYSTEM BUSES
- 58 M4 AHB bus
- 58 AON AHB bus
- 58 AHB2APB bus bridges
- 59 MEMORY
- 59 FIFOs
- 59 Packet FIFO
- 60 Registers
- 68 System DMA Controller (SDMA)
- 68 SDMA Registers
- 74 SDMA_BRIDGE Registers
- 76 VP DMAC
- 77 VP DMAC registers
- 79 INTERRUPT HARDWARE
- 79 Wake-up Interrupt Controller (WIC)
- 79 Registers
- 80 ON-CHIP LDO POWER REGULATION
- 80 Design case: Internal Voltages Supplied by Two LDOs
- 81 Design case: Internal Voltages Supplied by Single LDO
- 82 Design case: Internal Voltages Supplied by External Source
- 83 POWER DOMAINS IN THE S
- 83 Main power domains in the S
- 84 AON A0 Always ON power domain
- 84 A1 domain
- 84 M4 power domain
- 84 M4 SRAMs power domain
- 85 SRAM Power Domains
- 86 CLOCK OSCILLATORS, SYSTEM CLOCKS, AND TIMERS
- 86 Introduction
- 86 Oscillators
- 86 The Slow Oscillator
- 86 Design using crystal
- 86 Design using external clock instead of crystal
- 87 The Fast Oscillator
- 87 Frequency selection
- 87 Selection of source for internal HSO_Clock
- 88 CLOCK DOMAINS, CLOCK CHAINS, AND THE CRU
- 88 Clock sources
- 88 Clock divider chains and the CRU
- 93 Clock Gating
- 93 Clock Reset Unit
- 93 CRU Control Register Background Information
- 96 CRU Registers
- 112 Core Special IO Functions & GPIO
- 112 CORE SPECIAL IO FUNCTIONS & GPIO OVERVIEW
- 113 COMMUNICATION MANAGER (CM) SUB-SYSTEM
- 113 CM Architecture
- 113 Top Level Controller in the CM
- 114 Communication Manager DMA controller
- 114 Communication Manager Theory of Operation
- 115 SPI_SLAVE INTERFACE IN THE CM
- 115 Introduction
- 115 Architecture
- 115 Usage Roles
- 116 SPI Interface Protocol for the SPI_Slave block
- 116 Basic Read/Write Transfers
- 117 Device ID Read
- 118 Transfer Types
- 118 Transfers to TLC Local Registers
- 118 Transfers from Packet FIFOs
- 118 Transfers to M4 Memory Address Space
- 118 Basic AHB Transfer Restrictions
- 119 AHB Memory Read
- 119 AHB Memory Burst Write
- 120 AHB Memory Burst Read
- 121 Communication Manager Components Registers
- 124 UART registers
- 133 CLOCKING AND TIMING ELEMENTS
- 133 RTC (Real Time Clock)
- 133 RTC Registers
- 133 SPT (Simple Periodic Timer)
- 134 Error Correction for 1mS Timer
- 135 Timeout Event Counter
- 135 Time Stamp Counters
- 135 PMU and FFE Wakeup
- 136 Registers for SPT and RTC
- 144 ANALOG IP (AIP) BLOCK
- 144 Real time clock
- 144 HS_OSC
- 144 AIP group registers
- 151 ANALOG-TO-DIGITAL CONVERTER (ADC)
- 151 Overview
- 151 Functional Description
- 151 PCB Layout Recommendations
- 152 Example Application
- 152 ADC Registers
- 153 S3 GPIO
- 153 IO Mux and GPIO Introduction
- 153 IO Mux Overview
- 154 How to Select Output Function
- 158 Selecting an Input Function
- 161 IOMux Assignments
- 170 GPIO Registers
- 211 PAD_x CTRL register Description
- 212 Voice / Audio Processing subsystem
- 212 VOICE / AUDIO PROCESSING SUB-SYSTEM
- 212 Introduction
- 212 General characteristics
- 213 Power
- 213 List of operating modes
- 213 Application example in system with Application Processor
- 214 Sub-system Architecture
- 214 Voice / Audio Processing sub-system internal block diagram
- 215 Pulse Density Modulation (PDM) Interface
- 215 S) Interface
- 215 Low-Power Sound Detect (LPSD)
- 216 PDM Internal CODEC Mode
- 217 PDM External CODEC Mode
- 218 PDM VoiceQ Mode
- 219 S Direct Mode
- 219 S Sub-Sample Mode
- 220 Voice / audio processing sub-system registers
- 225 Sensor Processing Hub Sub-system
- 225 SENSOR PROCESSING HUB SUB-SYSTEM
- 225 Introduction
- 225 Sensor Processing Hub Sub-System Architecture
- 225 Block diagram
- 226 Key elements in the Sensor Processing Hub sub-system
- 226 AHB master bridge for the Sensor Processing Hub
- 226 Related system components: Packet FIFO
- 227 General characteristics
- 227 Key functional characteristics
- 228 Power
- 229 SENSOR PROCESSING HUB THEORY OF OPERATION
- 229 Control and Flow
- 229 Operating flow
- 231 SM Mailboxes
- 231 Sampling and Timing
- 231 Time Stamping
- 232 FLEXIBLE FUSION ENGINE (FFE)
- 232 Architecture of the FFE
- 233 µDSP general functions
- 233 Instruction Memory
- 233 Data Memory
- 233 Theory of operation for the FFE
- 233 Power control
- 234 Mailboxes
- 234 Data handling
- 235 SENSOR MANAGERS
- 235 Sensor Manager Internal Architecture
- 235 Sensor Manager Memory
- 235 Structure of Sensor Manager memory
- 236 Related system elements
- 236 Wishbone Bus
- 236 C interfaces
- 237 C Master
- 237 SPI_0_Master
- 238 SPI_0_MASTER
- 238 Architecture and Operation
- 239 I/O signals for the SPI_0_Master block
- 240 Master / slave clocking
- 240 SPI Transactions
- 240 SPI Write Cycle
- 241 SPI Read Cycle
- 241 SPI Multiple Read Cycle
- 242 SPI 3 wire configuration
- 242 SPI corner cases
- 242 Clock Phase and Polarity Controls
- 242 Transfer Format for CPHA
- 245 SPI_0_Master Registers
- 245 Address Map
- 245 Register Descriptions
- 245 Register: SPI Baud Register LSB (SPIBR LSB) (Offset 0x00)
- 245 Register: SPI Baud Register MSB (SPIBR MSB) (Offset 0x01)
- 246 SPI Configuration Register (offset 0x02)
- 247 SPI Configuration Register (SPICR) (Offset 0x02)
- 248 Transmit Register (Offset 0x03) - Write only
- 248 Receive Register (Offset 0x03) -Read Only
- 248 SPI Command (Transfer) Register (Offset 0x04) -Write Only
- 249 SPI Interrupt / Status Register (Offset 0x04) -Read Only
- 249 Slave Select Register (Offset 0x05)
- 250 SPI bit / clock control register (Offset 0x06)
- 250 Number of SPI clocks required after CSn is de-activated (Offset 0x07)
- 251 Programming
- 251 SPI Host Operation
- 251 Read Operation
- 252 Write Operation
- 253 SENSOR SUB-SYSTEM REGISTERS
- 253 FFE registers
- 261 FPGA Sub-system
- 261 FPGA SUB-SYSTEM
- 261 Introduction
- 261 Power
- 261 Sub-system Architecture
- 261 FPGA sub-system components
- 262 Functional Description
- 262 Logic Cell
- 263 RAM/FIFO
- 266 FIFO Controller
- 270 Distributed Clock Networks
- 270 Global Clocks
- 273 Configurable Input/Output Signals
- 274 Multipliers
- 275 Interface to the On-Chip Programmable Logic
- 275 S3 Platform Interface
- 276 FPGA Use
- 276 FPGA Configuration Control
- 276 FPGA sub-system registers
- 277 Debug
- 277 M4-F DEVELOPMENT AND DEBUG SUPPORT ELEMENTS
- 277 Integrated Configurable Debug
- 277 Serial Wire Debug port (SWD)
- 277 Debug Configuration
- 278 Debug Bootstrap Configuration
- 278 Companion/High-Level O/S Host Configuration (Application Processor in System)
- 278 Host Configuration (the EOS S3 system operating as Host)
- 279 DAP accessible ROM table
- 279 AHB-AP
- 279 Instrumentation Trace Macrocell (ITM)
- 279 ITM Registers
- 281 Data Watchpoint and Trace (DWT)
- 281 Registers
- 283 Flash Patch and Breakpoint Unit (FPB)
- 283 FPB Registers
- 284 Trace Port Interface Unit (TPIU)
- 284 TPIU Registers
- 285 Misc. Resources
- 285 EFUSE
- 285 eFuse Registers
- 287 System Considerations
- 287 SYSTEM CONFIGURATION FOR START-UP
- 287 System design modes
- 287 Selecting system design mode on boot
- 287 Configuration for debugging
- 288 Configuring to identify that M4 Serial Wire Debugger is present
- 288 Configuring M4 Serial Wire Debug Port pin assignment
- 288 Configuring clock oscillators
- 288 Boot-time configuration for use of internal HS_Osc or external driver for HS_Osc
- 289 I/O configuration
- 289 LDO configuration
- 289 FPGA configuration
- 290 RESET, START-UP, AND INTERRUPTS
- 290 Reset
- 291 Startup flow for Companion Mode
- 291 Startup flow for Host Mode
- 291 Host mode boot load from external flash
- 292 Interrupts
- 293 Functions of the NVIC and WIC interrupt controllers
- 293 Interrupt Sources
- 294 POWER MODES
- 294 Introduction
- 295 Power Modes in the S
- 295 Comparison of Power Modes
- 297 Methods for entering Low Power Modes
- 297 Software sources for initiating low-power modes
- 299 Hardware sources for initiating low-power modes
- 299 Methods for exiting Low Power Modes
- 300 Software sources for exiting low power mode
- 301 Hardware sources for exiting low power mode
- 302 M4 Sub-System Low Power Modes
- 302 M4-F Sleep Modes
- 303 M4 SRAM power domains and sleep Modes
- 303 M4 SRAM Sleep Modes: LPMF and LPMH
- 304 M4 Power Domain Configuration
- 304 M4 Power Domain Status
- 304 M4 Entering Low Power Mode
- 304 M4 Exiting Low Power Mode
- 304 M4 SRAM Power Domain Configuration
- 304 M4 SRAM Power Domain Status
- 304 M4 SRAM Entering Low Power Mode
- 305 M4 SRAM Exiting Low Power Mode
- 305 Voice (Audio) Sub-System Low Power Modes
- 305 Entry to a Low Power State
- 305 Exiting from a Low Power State
- 305 Voice (Audio) Sub-System SRAM Low Power Modes
- 305 Entry to a Low Power State
- 305 Exiting a Low Power State
- 305 FPGA (FB) Sub-System Low Power Modes
- 307 Sensor Processing (FFE) Sub-System Low Power Modes
- 307 SDMA Low Power Mode
- 308 THE CONFIGURATION MANAGER SUB-SYSTEM
- 308 Introduction
- 308 Configuration sub-system architecture
- 309 Configuration State Machine General Operation
- 309 Read Header Contents from Flash
- 310 Boot SPI
- 310 Deep Sleep Mode
- 310 Software Considerations
- 311 Configuration DMA
- 312 How to Start a DMA
- 312 How to Stop an Active DMA Transfer
- 313 SPI MASTER
- 314 SPI Master
- 314 SPI Transfer Modes
- 315 Transmit and Receive
- 315 Transmit Only
- 315 Receive Only
- 315 EEPROM Read
- 316 SPI Flash Command Write
- 318 SPI Flash Page Write
- 319 Sytem Clocks
- 319 CLOCK SETUP
- 319 Change the Oscillator Frequency
- 321 Oscillator Programming Table
- 322 Setup the Clock Source
- 325 Setup the Divider
- 333 Enable the Clock Gate
- 339 FUNCTIONAL DOMAIN CLOCK SETUP
- 340 Setup PKFB clocks
- 340 Setup Fabric clocks
- 342 Setup Voice Subsystem clocks
- 342 Setup SDMA clocks
- 343 Setup M4 clocks
- 343 Setup A1 CfgSM Clocks
- 345 Setup Analog-to-Digital Convertor
- 347 Setup I2S Slave Clock
- 350 Setup M4 Peripheral Clocks
- 351 HOW TO BRING CLOCK OUT TO DEBUG PIN
- 353 SOFTWARE RESETS
- 357 TERMINOLOGY AND CONVENTIONS
- 357 Glossary of terms
- 361 Structure of a register definition
- 363 REFERENCE DOCUMENTS